JPH1140687A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device which is improved in mounting yield and connection reliability, etc. SOLUTION: A semiconductor device is constituted by mounting a semiconductor chip 21 on a resin substrate 23 which is formed in a square shape and made of an epoxy resin filled with glass filter and sticking a reinforcing plate 29 of stainless steel, etc., to the surface of the substrate 23, and the reinforcing plate 29 is composed of four platy reinforcing members 31 which are separately arranged by respectively aligning their corner sections with the four corner sections of the substrate 23 and have broad L-shapes. Therefore, even when the reinforcing plate 29 and the substrate 23 are returned to a room temperature after they are maintained at a high temperature for a fixed period of time for curing an adhesive at the time of sticking the plate 29 to the substrate 23, the warping of the substrate 23 caused by the temperature change and the difference between the coefficients of thermal expansion of the plate 29 and substrate 23 at the time of curing the adhesive becomes smaller, and the connection between the semiconductor chip 21 and substrate 23 becomes surer at the time of mounting the chip 21 on the substrate 23, because the substrate 23 is reinforced by the plate 29 which is only stuck to the four corner sections of the substrate 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a reinforcing plate is fixed to a substrate on which a semiconductor chip is mounted and reinforced.

[0002]

2. Description of the Related Art As is well known, a ball grid array (B)
2. Description of the Related Art A semiconductor device (hereinafter, referred to as BGA) of an all grid array (BGA) type package is a package having a large number of external connection terminals formed of spherical solder balls on the back surface of the package, and is capable of increasing the number of pins. It is widely used because of its high mounting yield. In such a BGA, wire bonding is usually used to connect the semiconductor chip to the substrate. However, in order to further increase the number of pins, TAB (TapeAuto) is used in the chip connection technology.
BGA using mated bonding or flip chip has also been developed.

[0003] The prior art will be described below with reference to the drawings. First, a first conventional example of a BGA using the TAB technique will be described with reference to FIGS. FIG. 10 is a longitudinal sectional view, and FIG. 11 is a transverse sectional view. 10 and 11, reference numeral 1 denotes a semiconductor chip, and a plurality of bumps 2 are provided on one surface thereof.
Is provided. 3 is a film, for example, 100 μm
A resin substrate 4 made of a square-shaped polyimide resin or the like formed in the following thickness, 4 is a lead formed by coating a copper foil or the like on the surface of the resin substrate 3, and 5 is arranged on the back surface. These are solder bumps for external connection. The semiconductor chip 1 is mounted on the resin substrate 3 by connecting the bumps 2 to the tips of the corresponding leads 4. The semiconductor chip 1 and the resin substrate 3 are coated with an epoxy resin sealing resin 6. ,
By curing, the connection portion between the bump 2 and the lead 4 is sealed and integrated.

[0004] Further, reference numeral 7 denotes a reinforcing plate made of, for example, stainless steel or copper, which is adhered to the surface of the resin substrate 3 with an epoxy resin adhesive 8. 3, it is formed in a rectangular frame shape so as to avoid the semiconductor chip 1 provided in the center portion of the resin substrate 3, and has the same frame width. When the reinforcing plate 7 is bonded, the adhesive 8 is left at a high temperature for a fixed time, for example, at 150 ° C. for one hour in order to cure the adhesive 8, and after the adhesive 8 is cured, the temperature is returned to normal temperature. Reference numeral 9 denotes a square cover plate made of stainless steel or copper, which is adhered to the upper surface of the reinforcing plate 7 with an adhesive 10. Note that a radiation fin (not shown) is fixed on the upper surface of the cover plate 9 when the heat generation amount of the semiconductor chip 1 is large, or the cover plate 9 is not provided when the heat generation amount is not large.

[0005] By fixing the reinforcing plate 7 to the resin substrate 3 as described above, the flexible resin substrate 3 is reinforced.
It is easy to handle at the time of transportation and installation, and reduces the occurrence of defects.

However, according to the above-mentioned prior art, when the reinforcing plate 7 is bonded to the resin substrate 3 with the adhesive 8, the resin substrate 3 to which the reinforcing plate 7 has been bonded at a high temperature for a certain period of time to cure the adhesive 8 is formed. It is held and returned to room temperature after the adhesive 8 is hardened, but the resin substrate 3 and the adhesive 8 or the thermal expansion coefficient between the resin substrate 3 and the reinforcing plate 7 are different, so that a problem of warpage occurs as a whole. Occurs. At this time, the reinforcing plate 7
Is larger than the thermal expansion coefficient of the resin substrate 3, the resin substrate 3 to which the reinforcing plate 7 is bonded
Are provided so as to be convex toward the lower side. As a result, the solder bumps 5 for external connection are arranged on a convex surface, and the height of the solder bumps 5 is not constant.
Reliable connection to a flat mounting surface becomes difficult, and there is a possibility that the mounting yield may be reduced or the reliability of the connection may be reduced.

Next, a BGA using flip chip technology
The second conventional example will be described with reference to FIGS. FIG. 12 is a longitudinal sectional view, FIG. 13 is a transverse sectional view, and FIG.
FIG. 4 is a diagram schematically showing a simulation result of warpage of the resin substrate to which the reinforcing plate is bonded. 12 to 14, reference numeral 11 denotes a semiconductor chip having relatively large power consumption, and a plurality of bumps 2 are provided on one surface thereof. 1
Reference numeral 2 denotes a resin substrate made of, for example, a square-shaped epoxy resin containing glass filler having a thickness of 400 μm or more, on the surface of which a plurality of pads 13 are provided, and on the back surface, an external connection Solder bumps 5 are arranged. And the semiconductor chip 11 is a resin substrate 12
The semiconductor chip 11 and the resin substrate 12 are mounted by connecting the bumps 2 to the corresponding pads 13 by soldering, and a gap between the two is filled with an epoxy resin-based sealing resin 14 and cured. Are integrated.

Reference numeral 15 denotes a reinforcing plate made of stainless steel, copper, or the like, which is bonded to the surface of the resin substrate 12 with an epoxy resin-based adhesive 8. The reinforcing plate 15 has an outer shape similar to that of the resin substrate 12. Same, resin substrate 12
Are formed in a rectangular frame shape so as to avoid the semiconductor chip 11 provided in the central portion of the frame, and have the same frame width.
When the reinforcing plate 15 is bonded, the adhesive 8 is left at a high temperature for a fixed time, for example, at 150 ° C. for 1 hour in order to cure the adhesive, and after the adhesive 8 is cured, the temperature is returned to normal temperature. A square cover plate 9 also made of stainless steel or copper is adhered to the upper surface of the reinforcing plate 15 and the semiconductor chip 11 by an adhesive 10. Fins are fixed.

[0009] However, in such a configuration,
Although the thickness of the resin substrate 12 is relatively thick and difficult to bend, when the reinforcing plate 15 is bonded to the resin substrate 12 with the adhesive 8, the reinforcing plate 15 is heated at a high temperature for a certain time to cure the adhesive 8. The bonded resin substrate 12 is held, and when the temperature of the adhesive 8 is returned to room temperature after curing, the thermal expansion coefficient between the resin substrate 12 and the adhesive 8 or between the resin substrate 12 and the reinforcing plate 15 is different. As in the first conventional example, there is a problem that the entire body is warped.

A simulation result of the warpage of the resin substrate 12 having the reinforcing plate 15 adhered to the upper surface is shown in FIG.
As shown in FIG. FIG. 14 shows a case where a reinforcing plate 15 having a thickness of 0.4 mm and a frame width of 8 mm is adhered and the
It shows a quarter portion of the 0 mm square resin substrate 12, in which the semiconductor chip 11 is omitted, and in a state in which the adhesive 8 is cured at a temperature of 150 ° C., the shape is shown by a two-dot chain line. However, when the temperature is lowered to 25 ° C., as shown by the solid line, the resin substrate 12 warps so as to be convex downward, and the size of the warpage at the corner is 81 μm. In the resin substrate 12 to which the warped reinforcing plate 15 is bonded, the solder bumps 5 for external connection are provided.
Are arranged on a convex surface, so that the height of the solder bumps 5 is not constant, and it is difficult to securely connect to a flat mounting surface by soldering, so that the mounting yield is reduced or the connection reliability is reduced. There is a possibility that it will decrease.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to reduce the amount of warpage of a resin substrate to which a reinforcing plate is adhered, and to mount the resin substrate. An object of the present invention is to provide a semiconductor device in which the yield is improved and the connection reliability during mounting is improved.

[0012]

According to the present invention, there is provided a semiconductor device comprising:
In a semiconductor device in which a semiconductor chip is mounted on a polygonal substrate and a reinforcing plate is fixed to the substrate surface, the reinforcing plate is unevenly distributed so that the fixing area to the substrate becomes larger on the corner side of the substrate. Further, the substrate is rectangular, and the reinforcing plate is formed only by reinforcing members respectively fixed near the four corners of the substrate. Yes, the reinforcing plate is characterized in that the reinforcing members at the four corners have the same shape, and the reinforcing plate has a frame shape having substantially the same outer shape as the substrate. Wherein the frame width is wider on the corner side of the substrate, and furthermore, the substrate is rectangular, and the reinforcing plates are respectively provided along both short sides of the substrate. With the reinforcing member fixed The reinforcing plate is further characterized in that the reinforcing members on both short sides have the same shape, and the width of the reinforcing member is increased on the corner side of the substrate. It is characterized by being formed.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

First, a BGA using flip chip technology
A first embodiment of a semiconductor device (hereinafter, referred to as BGA) of a die package will be described with reference to FIGS. 1 is a longitudinal sectional view, FIG. 2 is a transverse sectional view, FIG. 3 is a view schematically showing a simulation result of warpage of a resin substrate to which a reinforcing plate is adhered, and FIG. FIG.

1 to 4, reference numeral 21 denotes a square semiconductor chip having relatively large power consumption, and a plurality of bumps 22 are provided on one surface thereof. Reference numeral 23 denotes a resin substrate made of, for example, a glass filler-filled epoxy resin having a thickness of 1.0 mm and a square shape of 40 mm square, a plurality of pads 25 are provided on an upper surface 24, and a lower surface 26 is provided on a lower surface 26. Has a plurality of solder bumps 27 arranged for external connection.

The semiconductor chip 21 is mounted in a predetermined position on the resin substrate 23 by mounting the bumps 22 on the corresponding pads 25 and then connecting the bumps 22 by soldering such as by melting by reflow or the like. In addition, the semiconductor chip 21 and the resin substrate 23 are at
In the heated state, an epoxy resin-based sealing resin 28 is injected into a gap between the two, and the entire gap is filled by capillary action. Thereafter, the sealing resin 28 is heated at a temperature of 150 ° C. for 1 hour, and the sealing resin 28 is heated. It is integrated by curing.

Reference numeral 29 denotes a reinforcing plate having a thickness of 0.4 mm formed of, for example, stainless steel such as SUS304 or copper or the like, which is adhered to the upper surface 24 of the resin substrate 23 with an epoxy resin adhesive 30. . The reinforcing plate 29 is composed of a thick L-shaped plate-like reinforcing member 31 that is divided and arranged so as to match each corner with four corners of the resin substrate 23, and each reinforcing member formed in the same shape. Regarding the shape and dimensions of 31, the length a in the direction corresponding to the side of the resin substrate 23 at the time of arrangement is 12 mm, and the width b is 8 mm.

Then, the reinforcing plate 29 is bonded by bonding the reinforcing members 31 to the adhesive 30 at predetermined positions at the four corners of the resin substrate 23.
After the adhesive 30 is applied and placed, the adhesive 30 is heated and left at a high temperature for a fixed time, for example, at a temperature of 150 ° C. for 1 hour, and is returned to normal temperature after the adhesive 30 is cured. On the upper surfaces of the reinforcing plate 29 and the semiconductor chip 21, a square cover plate 32, which is the same as the resin substrate 23 also made of stainless steel or copper, is adhered by an adhesive 33. A radiation fin (not shown) is fixed to the fin.

In such a structure, since the thickness of the resin substrate 23 is relatively large and it is difficult to bend, the reinforcing plate 29 is used as the four reinforcing members 31 as four reinforcing members 31 of the resin substrate 23.
Even if the resin substrate 23 is divided and arranged at the corners, the resin substrate 23 is not easily deformed, is easy to handle at the time of transfer or installation, and the likelihood of occurrence of defects is reduced. Also, the reinforcing plate 29
Is bonded to the resin substrate 23 with the adhesive 30, the resin substrate 23 to which the reinforcing plate 29 is adhered is kept at a high temperature for a certain period of time for curing the adhesive 30, and is returned to room temperature after the adhesive 30 is cured. When the resin substrate 23 and the adhesive 30,
Alternatively, the entire board is warped due to a difference in thermal expansion coefficient between the resin substrate 23 and each reinforcing member 31 of the reinforcing plate 29.

However, as a result of the simulation, the warpage generated in the resin substrate 23 to which the reinforcing plate 29 made of the four reinforcing members 31 is adhered is as shown in FIG. That is, FIG. 3 shows a quarter portion of the resin substrate 23 to which the reinforcing plate 29 is adhered without the semiconductor chip 21. When the adhesive 30 is cured at a temperature of 150 ° C., it is indicated by a two-dot chain line. When the temperature is lowered to 25 ° C., the resin substrate 23 warps so as to be slightly convex downward as shown by a solid line. The warpage at the corners of the resin substrate 23 is very small at 12.3 μm. Since the amount of warpage of the resin substrate 23 is small as described above, the difference in height between the solder bumps 27 arranged on the lower surface 26 of the resin substrate 23 having a convex shape is small, and the solder bump 27 is also soldered to a flat mounting surface. The connection can be reliably performed, the mounting yield is improved, and the reliability of the connection is also improved.

In the first embodiment, the reinforcing plate 29 is divided into four thick L-shaped reinforcing members 31 and arranged at the four corners of the resin substrate 23. However, the present invention is not limited to this. However, for example, as shown in a modification shown in FIG.
Into four identical right-angled isosceles triangular plate-like reinforcing members 31a.
Even if the reinforcing members 31a are arranged at the four corners of the resin substrate 23, the same operation and effect as those of the first embodiment can be obtained.

Next, a BGA using flip chip technology
A second embodiment configured in the same manner as the first embodiment except that the configuration of the reinforcing plate is different will be described with reference to FIGS. FIG. 5 is a horizontal and vertical sectional view, FIG. 6 is a view schematically showing a simulation result of warpage of a resin substrate to which a reinforcing plate is adhered, and FIG. 7 is a horizontal sectional view of a first modified embodiment. FIG. 8 is a cross-sectional view of the second modification.
The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. A different configuration of the present embodiment will be described.

5 to 8, reference numeral 34 denotes a resin substrate 2
3 is a reinforcing plate having a thickness of 0.4 mm formed of, for example, stainless steel such as SUS304 or copper or the like, which is adhered to the upper surface 24 of the third member 3 with an epoxy resin adhesive.
The reinforcing plate 34 has the same outer shape as the resin substrate 23, and is formed in a square frame shape so as to avoid the semiconductor chip 21 provided at the central portion of the resin substrate 23, and the frame width c is formed at four corners. It has a wide portion 35 of 8 mm, and a narrow portion 36 having a narrower frame width and a frame width d of 2 mm than the wide portions 35 connected to these four wide portions 35. In other words, the reinforcing plate 34 has a wider frame width at the corner of the resin substrate 23, and the bonding area of the reinforcing plate 34 to the resin substrate 23 is larger at the corner.

The reinforcing plate 34 is bonded to the wide portion 35.
After applying an adhesive so as to match the four corners of the resin substrate 23 and placing the same, it is left to heat at a high temperature for a certain time, for example, at 150 ° C. for one hour to cure the adhesive, After the adhesive is cured, it is returned to room temperature. Also,
Although not shown, a square cover plate, which is the same as the resin substrate 23 made of stainless steel or copper, is adhered to the upper surfaces of the reinforcing plate 34 and the semiconductor chip 21 with an adhesive. Is fixed.

In such a structure, the thickness of the resin substrate 23 is relatively large and is hard to bend. Since the reinforcing plate 34 has a square frame shape, it is hard to bend and easily deformed during handling. Therefore, it is easier to handle at the time of transporting and assembling than in the first embodiment, and the possibility of occurrence of defects is reduced. Furthermore, while the first embodiment forms a reinforcing plate with four reinforcing members, the reinforcing plate 34 has a square frame shape, so that the time required for the bonding step of the reinforcing plate 34 can be reduced. . When the reinforcing plate 34 is bonded to the resin substrate 23 with an adhesive, the adhesive is cured for a certain period of time.
The resin substrate 23 to which the reinforcing plate 34 is bonded at a high temperature is held,
When the temperature of the adhesive is returned to room temperature after curing, the resin substrate 2
3 and an adhesive, or a difference in thermal expansion coefficient between the resin substrate 23 and the reinforcing plate 34 causes a warp as a whole.

However, as a result of the simulation, the warpage generated in the resin substrate 23 to which the reinforcing plate 34 composed of the wide portion 35 and the narrow portion 36 is adhered is as shown in FIG. That is, FIG. 6 shows a quarter of the resin substrate 23 to which the reinforcing plate 34 is adhered with the semiconductor chip 21 omitted, and in a state where the adhesive 30 is cured at a temperature of 150 ° C. The shape shown was changed to 25 ° C
When the temperature is lowered, the resin substrate 23 warps so as to be convex downward as indicated by the solid line. The size of the warp at the corner of the resin substrate 23 is 66.8 μm.
m is small. Thus, the resin substrate 23
Is small, the difference in height between the solder bumps arranged on the lower surface of the resin substrate 23 having a convex shape is small, and the connection by soldering can be relatively reliably performed even on a flat mounting surface. As a result, the mounting yield is improved, and the connection reliability is also improved.

In the second embodiment, the reinforcing plate 34 has the frame width changed in two steps of the wide portion 35 and the narrow portion 36. However, the present invention is not limited to this.
The reinforcement plate 34a is configured so that its frame width gradually increases toward the corners as in the first modification shown in FIG. 8, or the reinforcement plate 34b is attached to the frame as in the second modification shown in FIG. Even if it is configured such that the frame width is gradually increased toward the corner portion and the amplification portion 38 whose width is wider than the constant width portion 37 is provided on the corner portion side, The same operation and effect as those of the embodiment can be obtained. Further, the above-mentioned BGA is a BGA using the flip chip technology. However, the reinforcing plate formed in the same shape as the reinforcing plate 34 whose frame width changes in two stages of the wide portion 35 and the narrow portion 36 is formed by the TAB technology. When applied to the BGA used, the resin substrate is a thin film-shaped one and easily bends as it is, but the reinforcing plate fixed to the surface is square frame-shaped and the side portions of the resin substrate are also reinforced, so it is hard to bend. Become
It is not easily deformed at the time of handling, so that it is easy to handle at the time of transporting or assembling, and the possibility of occurrence of defects is reduced.

Next, a BGA using flip chip technology
The third embodiment will be described with reference to FIG. FIG. 9 is a cross-sectional view.

In FIG. 9, reference numeral 41 denotes a rectangular semiconductor chip having relatively large power consumption, which is not shown, and has a plurality of bumps provided on one surface thereof. Reference numeral 42 denotes a resin substrate made of epoxy resin containing glass filler formed in a rectangular shape. Similarly, although not shown, a plurality of pads are provided on the upper surface, and a plurality of solder bumps for external connection are provided on the lower surface. Are arranged.

The semiconductor chip 41 is mounted in a predetermined position on the resin substrate 42 in a face-down manner by placing bumps on corresponding pads and then connecting them by soldering such as by melting by reflow. Further, the epoxy resin sealing resin 43 is injected into the gap between the semiconductor chip 41 and the resin substrate 42 in a heated state at 60 ° C. to 70 ° C., and the entire gap is filled by capillary action. , Heated at a temperature of 150 ° C. for one hour,
Are integrated by curing.

Further, reference numeral 44 denotes an epoxy resin-based adhesive bonded only to both short sides of the upper surface of the resin substrate 42.
For example, it is a reinforcing plate formed of stainless steel such as SUS304 or copper. The reinforcing plate 44 is made of a reinforcing member 45 of the same shape which is divided and arranged on the upper surface of both short side portions of the resin substrate 42 so that the short side and the corners at both ends coincide with each other. A wide portion 46 having a right-angled triangle shape, and a narrow portion 47 at an intermediate portion where the wide portion 46 is continuously provided.
It is provided with. In this way, a portion where the reinforcing plate 44 is not fixed is formed at an intermediate portion between both long side portions of the resin substrate 42.

The reinforcing plate 44 is bonded to the reinforcing member 4.
After applying the adhesive to 5 and placing it on a predetermined position of the resin substrate 42, the adhesive was cured by leaving it at a high temperature for a certain period of time, for example, at 150 ° C. for 1 hour, to cure the adhesive. Later, it is returned to room temperature. On the upper surfaces of the reinforcing plate 44 and the semiconductor chip 41, a cover plate (not shown) having the same rectangular shape as the resin substrate 42 also made of stainless steel or copper is adhered by an adhesive. Are radiating fins (not shown).

In such a configuration, the thickness of the resin substrate 42 is relatively large and it is difficult to bend, and the reinforcing plate 44 is provided on the upper surface of both short side portions of the resin substrate 42.
Is provided, so that it is hardly bent and does not easily deform during handling. The reinforcing plate 44 is provided on both short sides of the resin substrate 42 with reinforcing members 45.
It is easier to handle at the time of transfer or incorporation than one that is configured to be divided and arranged so that each corner matches the four corners, and there is less possibility of occurrence of defects, etc. Furthermore, since it is constituted by the two reinforcing members 45, the time required for the bonding step of the reinforcing plate 44 can be reduced. In addition, the reinforcing plate 44 is bonded to the resin substrate 4 with an adhesive.
2, the resin substrate 42 to which the reinforcing plate 44 is adhered is kept at a high temperature for a certain period of time to cure the adhesive, and when the temperature is returned to normal temperature after the adhesive is cured, the resin substrate 42 and the adhesive Alternatively, the entire board may be warped due to a difference in thermal expansion coefficient between the resin substrate 42 and the reinforcing plate 44.

However, the warp that occurs in the resin substrate 42 in which the reinforcing plate 44 composed of the two reinforcing members 45 is adhered only to both short sides is a slightly downwardly warped warp. Since the reinforcing plate 44 is not fixed to the middle portion of the long side portion, the size is small. Since the amount of warpage of the resin substrate 42 is small, the resin substrate 4 having a convex shape is formed.
2, the difference in height of the solder bumps arranged on the lower surface is small,
The connection by soldering can be reliably performed even on a flat mounting surface, the mounting yield is improved, and the reliability of the connection is also improved.

In the third embodiment, the reinforcing member 45 of the reinforcing plate 44 is provided at both ends with the wide portions 4 each having a substantially right triangle shape.
6, the narrow portion 47 is provided in the middle portion. However, the present invention is not limited to this. Even if the wide portion 46 has a substantially rectangular shape wider than the narrow portion 47, Even with a shape having a frame width that gradually increases toward the corner, the same operation and effect as in the third embodiment can be obtained.

[0036]

As is apparent from the above description, in the present invention, since the reinforcing plate fixed to the resin substrate has a large fixing area at the corners, the amount of warpage of the resin substrate becomes small, and The yield is improved, and the reliability of connection at the time of mounting is improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention.

FIG. 2 is a cross-sectional view according to the first embodiment of the present invention.

FIG. 3 is a diagram schematically illustrating a warp simulation result of the resin substrate to which the reinforcing plate according to the first embodiment of the present invention is bonded.

FIG. 4 is a cross-sectional view of a modification according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a second embodiment of the present invention.

FIG. 6 is a view schematically showing a simulation result of warpage of a resin substrate to which a reinforcing plate according to a second embodiment of the present invention is bonded.

FIG. 7 is a cross-sectional view of a first modified example according to the second embodiment of the present invention.

FIG. 8 is a cross-sectional view of a second modification according to the second embodiment of the present invention.

FIG. 9 is a cross-sectional view showing a third embodiment of the present invention.

FIG. 10 is a longitudinal sectional view showing a first conventional example.

FIG. 11 is a cross-sectional view of the first conventional example.

FIG. 12 is a longitudinal sectional view showing a second conventional example.

FIG. 13 is a transverse sectional view of a second conventional example.

FIG. 14 is a diagram schematically showing a simulation result of warpage of a resin substrate to which a reinforcing plate according to a second conventional example is adhered.

[Explanation of symbols]

 21, 41 ... semiconductor chips 23, 42 ... resin substrates 28, 43 ... sealing resins 29, 29a, 34, 34a, 34b, 44 ... reinforcing plates 31, 31a, 45 ... reinforcing members 35, 46 ... wide portions 36, 47 ... Narrow width part 37 ... Constant width part 38 ... Amplifier part

Claims (6)

[Claims] 1. A semiconductor device comprising a semiconductor chip mounted on a polygonal substrate and a reinforcing plate fixed to the substrate surface, wherein the reinforcing plate has an area fixed to the substrate at a corner of the substrate. A semiconductor device characterized by being unevenly distributed so as to be larger on the side. 2. The semiconductor device according to claim 1, wherein the substrate has a rectangular shape, and the reinforcing plate is formed only by reinforcing members respectively fixed near four corners of the substrate. 3. The semiconductor device according to claim 2, wherein the reinforcing members at the four corners of the reinforcing plate have the same shape. 4. The semiconductor according to claim 1, wherein the reinforcing plate has a frame shape having substantially the same outer shape as that of the substrate, and the width of the frame is wider at a corner of the substrate. apparatus. 5. The semiconductor device according to claim 1, wherein the substrate has a rectangular shape, and the reinforcing plate is formed of reinforcing members fixed along both short sides of the substrate. 6. The reinforcing plate, wherein the reinforcing members on both short sides have the same shape, and the width of the reinforcing members is formed to be wider at the corners of the substrate. Item 5
13. The semiconductor device according to claim 1.