CN102269361A - 一种模组化的led灯具 - Google Patents

一种模组化的led灯具 Download PDF

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CN102269361A
CN102269361A CN2011102469778A CN201110246977A CN102269361A CN 102269361 A CN102269361 A CN 102269361A CN 2011102469778 A CN2011102469778 A CN 2011102469778A CN 201110246977 A CN201110246977 A CN 201110246977A CN 102269361 A CN102269361 A CN 102269361A
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light fixture
led
led light
radiator
assembly
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罗辉
谢国瑞
时光
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DONGGUAN TIDA LIGHTING TECHNOLOGY Co Ltd
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DONGGUAN TIDA LIGHTING TECHNOLOGY Co Ltd
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Priority to CN2011102469778A priority Critical patent/CN102269361A/zh
Priority to PCT/CN2011/001679 priority patent/WO2013029207A1/zh
Priority to US13/638,374 priority patent/US20140160761A1/en
Publication of CN102269361A publication Critical patent/CN102269361A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明公开了一种模组化的LED灯具，包括LED组件、LED驱动电路组件、散热器、连接底座，所述LED组件置于所述散热器内侧上端，所述LED驱动电路组件置于所述散热器内侧下端，所述LED组件和所述LED驱动电路组件通过导线连接，所述LED驱动电路组件和所述连接底座的端子通过导线连接，所述连接底座与所述散热器固定连接。

Description

一种模组化的LED灯具
技术领域
本发明涉及LED灯具技术领域，具体涉及一种模组化的LED灯具。
背景技术
50年前人们已经了解半导体材料可产生光线的基本知识，第一个商用二极管产生于1960年。LED是英文light emitting diode（发光二极管）的缩写，它的基本结构是一块电致发光的半导体材料，置于一个有引线的架子上，然后四周用环氧树脂密封，起到保护内部芯线的作用。LED具有寿命长、耗能少、体积小、响应快、抗震抗低温、污染小等突出的优点，其应用领域极为广阔。初步计算，未来中国每年采用LED照明节省的电力相当于三峡电站全年的发电量，同时可减少8000万吨CO2、65万吨SO2和32万吨NO2的排放，称之为“人类照明史上的革命”并不为过。
现有技术的LED灯具核心部件未能模组化，LED芯片和驱动电路一体封装，因此有如下的缺点：1、LED芯片和驱动电路一体设置导致生产工艺复杂，装配繁琐，生产成本高。2、LED芯片和驱动电路一体设置一旦产品出现故障，很难判断故障位置，并且无论是LED芯片损坏还是驱动电路故障，很难进行维修，只能将整个封装体废弃，造成巨大的浪费。
发明内容
本发明要解决的技术问题是提供一种模组化的LED灯具，克服现有技术的LED灯具核心部件未能模组化，导致生产工艺复杂，装配繁琐，生产成本高的缺陷以及LED灯具难以维修的缺陷。
本发明为解决上述技术问题所采用的技术方案为：
一种模组化的LED灯具，包括LED组件、LED驱动电路组件、散热器、连接底座，所述LED组件置于所述散热器内侧上端，所述LED驱动电路组件置于所述散热器内侧下端，所述LED组件和所述LED驱动电路组件通过导线连接，所述LED驱动电路组件和所述连接底座的端子通过导线连接，所述连接底座与所述散热器固定连接。
所述的模组化的LED灯具，其中还包括光学组件，所述光学组件与所述散热器固定连接。
所述的模组化的LED灯具，其中还包括装饰外壳，所述装饰外壳罩住所述光学组件并与所述散热器固定连接。
所述的模组化的LED灯具，其中还包括LED组件压片，所述LED组件压片置于所述LED组件的上方。
所述的模组化的LED灯具，其中所述光学组件包括光学配件、光学配件固定盖，所述光学配件固定盖通过所述散热器的内连接螺口与所述散热器螺纹连接并对所述光学配件进行固定。
所述的模组化的LED灯具，其中所述光学配件设为漫射片、透镜或者反光罩。
所述的模组化的LED灯具，其中所述装饰外壳通过所述散热器的外连接螺口与所述散热器螺纹连接。
所述的模组化的LED灯具，其中所述LED组件的光通量输出设为100 lm至2500 lm。
所述的模组化的LED灯具，其中所述LED驱动电路组件实现高压输入可调恒流输出、高压输入不可调恒流输出、低压输入可调恒流输出、低压输入不可调恒流输出、恒流输入并联保护可调整流输出或者恒流输入并联保护不可调整流输出。
所述的模组化的LED灯具，其中所述连接底座适配E11、E12、E14、E17、E26、E27、E39、E40、GU6.5、GU10、GU24、GZ10、G9、G12、GX8.5、GX53或者GY6.35标准的灯座。
本发明的有益效果：本发明通过对LED灯具核心部件进行模组化，将LED芯片单独封装，构成LED组件，将LED驱动电路单独封装，构成LED驱动电路组件，大大简化了LED灯具的设计、生产工艺，因此降低了生产成本，而且在LED灯具产品使用过程中容易判断产品的故障位置，方便维修，不必无奈地废弃一体封装的部件，本发明大大推进了LED灯具技术的进步。 
附图说明
本发明包括如下附图：
图1为本发明模组化的LED灯具装配后示意图；
图2为本发明模组化的LED灯具分拆零件图；
图3为本发明LED组件示意图；
图4为本发明实现高压输入可调恒流输出的LED驱动电路框图；
图5为本发明实现高压输入不可调恒流输出的LED驱动电路框图；
图6为本发明实现低压输入可调恒流输出的LED驱动电路框图；
图7为本发明实现低压输入不可调恒流输出的LED驱动电路框图；
图8为本发明实现恒流输入并联保护可调整流输出的LED驱动电路框图；
图9为本发明实现恒流输入并联保护不可调整流输出的LED驱动电路框图。
具体实施方式
下面根据附图和实施例对本发明作进一步详细说明:
如图1和图2所示，本发明模组化的LED灯具包括LED组件4、LED驱动电路组件6、散热器5、连接底座7，LED组件4置于散热器5内侧上端，LED驱动电路组件6置于散热器5内侧下端，LED组件4和LED驱动电路组件6通过导线61、导线62连接，LED驱动电路组件6和连接底座7的端子71通过导线63、导线64连接，连接底座7与散热器5固定连接。LED组件4的光通量输出设为100 lm至2500 lm。连接底座7适配E11、E12、E14、E17、E26、E27、E39、E40、GU6.5、GU10、GU24、GZ10、G9、G12、GX8.5、GX53或者GY6.35标准的灯座。本发明模组化的LED灯具还包括光学组件，光学组件与散热器5固定连接。本发明光学组件包括光学配件2、光学配件固定盖1，光学配件固定盖1通过散热器5的内连接螺口52与散热器5螺纹连接并对光学配件2进行固定，本发明的另外一种实施方式是光学配件固定盖1通过散热器5的外连接螺口51与散热器5螺纹连接。光学配件2设为漫射片、透镜或者反光罩，漫射片、透镜或者反光罩可以设计成各种不同的出光角度，从而使本发明模组化的LED灯具实现不同光束角的配光输出。本发明模组化的LED灯具还包括装饰外壳8，装饰外壳8罩住光学组件并通过散热器5的外连接螺口51与散热器5螺纹连接。装饰外壳8可以是玻璃、金属、塑胶、陶瓷等材料。本发明模组化的LED灯具还包括LED组件压片3，LED组件压片3置于LED组件4的上方。
如图3所示，连接线61连接LED芯片负极焊点41，连接线62连接LED芯片正极焊点42完成LED驱动电路组件6和LED组件4的电气连接。
本发明LED驱动电路方式有高压输入恒流（可调或不可调）输出、低压输入恒流（可调或不可调）输出、恒流输入并联保护整流输出三类方式用来适应不同的应用场合，包括调光应用和不调光应用。如图4所示的LED驱动电路实现高压输入可调恒流输出；如图5所示的LED驱动电路实现高压输入不可调恒流输出；如图6所示的LED驱动电路实现低压输入可调恒流输出；如图7所示的LED驱动电路实现低压输入不可调恒流输出；如图8所示的LED驱动电路实现恒流输入并联保护可调整流输出；如图9所示的LED驱动电路实现恒流输入并联保护不可调整流输出。
本领域技术人员不脱离本发明的实质和精神，可以有多种变形方案实现本发明，以上所述仅为本发明较佳可行的实施例而已，并非因此局限本发明的权利范围，凡运用本发明说明书及附图内容所作的等效结构变化，均包含于本发明的权利范围之内。

Claims (10)

1.一种模组化的LED灯具，其特征在于：包括LED组件、LED驱动电路组件、散热器、连接底座，所述LED组件置于所述散热器内侧上端，所述LED驱动电路组件置于所述散热器内侧下端，所述LED组件和所述LED驱动电路组件通过导线连接，所述LED驱动电路组件和所述连接底座的端子通过导线连接，所述连接底座与所述散热器固定连接。
2.根据权利要求1所述的模组化的LED灯具，其特征在于：还包括光学组件，所述光学组件与所述散热器固定连接。
3.根据权利要求2所述的模组化的LED灯具，其特征在于：还包括装饰外壳，所述装饰外壳罩住所述光学组件并与所述散热器固定连接。
4.根据权利要求3所述的模组化的LED灯具，其特征在于：还包括LED组件压片，所述LED组件压片置于所述LED组件的上方。
5.根据权利要求4所述的模组化的LED灯具，其特征在于：所述光学组件包括光学配件、光学配件固定盖，所述光学配件固定盖通过所述散热器的内连接螺口与所述散热器螺纹连接并对所述光学配件进行固定。
6.根据权利要求5所述的模组化的LED灯具，其特征在于：所述光学配件设为漫射片、透镜或者反光罩。
7.根据权利要求6所述的模组化的LED灯具，其特征在于：所述装饰外壳通过所述散热器的外连接螺口与所述散热器螺纹连接。
8.根据权利要求7所述的模组化的LED灯具，其特征在于：所述LED组件的光通量输出设为100 lm至2500 lm。
9.根据权利要求8所述的模组化的LED灯具，其特征在于：所述LED驱动电路组件实现高压输入可调恒流输出、高压输入不可调恒流输出、低压输入可调恒流输出、低压输入不可调恒流输出、恒流输入并联保护可调整流输出或者恒流输入并联保护不可调整流输出。
10.根据权利要求9所述的模组化的LED灯具，其特征在于：所述连接底座适配E11、E12、E14、E17、E26、E27、E39、E40、GU6.5、GU10、GU24、GZ10、G9、G12、GX8.5、GX53或者GY6.35标准的灯座。
CN2011102469778A 2011-08-26 2011-08-26 一种模组化的led灯具 Pending CN102269361A (zh)

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CN2011102469778A CN102269361A (zh) 2011-08-26 2011-08-26 一种模组化的led灯具
PCT/CN2011/001679 WO2013029207A1 (zh) 2011-08-26 2011-10-08 一种模组化的led灯具
US13/638,374 US20140160761A1 (en) 2011-08-26 2011-10-08 Modular led light fixture

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CN2011102469778A CN102269361A (zh) 2011-08-26 2011-08-26 一种模组化的led灯具

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Application publication date: 20111207