WO2013029207A1 - 一种模组化的led灯具 - Google Patents

一种模组化的led灯具 Download PDF

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Publication number
WO2013029207A1
WO2013029207A1 PCT/CN2011/001679 CN2011001679W WO2013029207A1 WO 2013029207 A1 WO2013029207 A1 WO 2013029207A1 CN 2011001679 W CN2011001679 W CN 2011001679W WO 2013029207 A1 WO2013029207 A1 WO 2013029207A1
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WO
WIPO (PCT)
Prior art keywords
led
heat sink
led lamp
component
constant current
Prior art date
Application number
PCT/CN2011/001679
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English (en)
French (fr)
Inventor
刘红涛
Original Assignee
东莞泰德照明科技有限公司
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Publication date
Application filed by 东莞泰德照明科技有限公司 filed Critical 东莞泰德照明科技有限公司
Priority to US13/638,374 priority Critical patent/US20140160761A1/en
Publication of WO2013029207A1 publication Critical patent/WO2013029207A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present invention relates to the field of LED luminaires, and in particular to a modular LED luminaire. Background technique
  • LED is the abbreviation of English ight emi tt ing diode. Its basic structure is an electroluminescent semiconductor material placed on a leaded shelf and then sealed with epoxy resin to protect the interior. The role of the core wire. LED has the advantages of long life, low energy consumption, small size, fast response, anti-shock resistance, low temperature, and low pollution. Its application field is extremely broad. According to preliminary calculations, the electricity saved by LED lighting in China in the future is equivalent to the annual power generation of the Three Gorges Power Station.
  • the technical problem to be solved by the present invention is to provide a modular LED lamp, which overcomes the failure of the prior art LED lamp core components to be modularized, resulting in complicated production process, complicated assembly, high production cost and LED Defects that are difficult to repair.
  • a modular LED lamp comprising an LED component, an LED driving circuit component, a heat sink, and a connection base, wherein the LED component is placed inside the heat sink An upper end, the LED driving circuit component is disposed at an inner lower end of the heat sink, the LED component and the LED driving circuit component are connected by a wire, and the LED driving circuit component and the terminal of the connecting base are connected by a wire, The connecting base is fixedly connected to the heat sink.
  • the modular LED luminaire further includes an optical component, the optical component being fixedly coupled to the heat sink.
  • the modular LED luminaire further includes a decorative casing that covers the optical component and is fixedly coupled to the heat sink.
  • the modular LED lamp further includes an LED component tablet, and the LED component tablet is placed above the LED component.
  • the modular LED luminaire, wherein the optical component comprises an optical component, light The heat sink is threaded and the optical accessory is secured.
  • the modular LED lamp, wherein the optical component is set as a diffusion sheet, a lens or a reflector.
  • the modular LED luminaire, wherein the decorative casing is screwed to the heat sink through an outer connecting screw of the heat sink.
  • the modular LED luminaire, wherein the LED component has a luminous flux output of 100 lm to 2500 lm.
  • the modular LED lamp wherein the LED driving circuit component realizes a high voltage input adjustable constant current output, a high voltage input non-adjustable constant current output, a low voltage input adjustable constant current output, a low voltage input non-adjustable constant current output, Constant current input parallel protection adjustable rectification output or constant current input parallel protection non-adjustable flow output.
  • the modular LED lamp wherein the connection base is adapted to El l, E12, E14, E17, E26, E27, E39, E40, GU6. 5, GU10, GU24, GZ10, G9, G12, GX8. 5, GX53 or GY6. 35 standard lamp holder.
  • the present invention simplifies the design of an LED lamp by modularizing the core components of the LED lamp, separately packaging the LED chip to form an LED component, and separately packaging the LED driving circuit to form an LED driving circuit component, thereby greatly simplifying the design of the LED lamp.
  • the production process thereby reducing the production cost, and easily determining the fault location of the product during the use of the LED luminaire product, facilitating maintenance, and having no need to relinquishly dispose of the integrally packaged components, the invention greatly advances the advancement of the LED luminaire technology.
  • FIG. 1 is a schematic view of a modular LED lamp assembly of the present invention
  • FIG. 2 is a partial exploded view of a modular LED lamp of the present invention
  • FIG. 3 is a schematic diagram of an LED component of the present invention
  • FIG. 4 is a block diagram of an LED driving circuit for realizing a high-voltage input constant current output according to the present invention
  • FIG. 6 is a block diagram of an LED driving circuit for realizing a low-voltage input adjustable constant current output according to the present invention
  • FIG. 7 is a block diagram of an LED driving circuit for realizing a low-voltage input non-adjustable constant current output according to the present invention
  • FIG. 8 is a block diagram of an LED driving circuit for realizing constant current input parallel protection adjustable rectification output according to the present invention
  • FIG. 9 is a block diagram of an LED driving circuit for realizing constant current input parallel protection non-adjustable flow output according to the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION The present invention will be further described in detail below based on the accompanying drawings and embodiments:
  • the modular LED lamp of the present invention comprises an LED component 4, LED driver circuit assembly 6, heat sink 5, connection base 7, LED assembly 4 is placed at the upper end of the heat sink 5, LED drive circuit assembly 6 is placed at the lower end of the heat sink 5, LED assembly 4 and LED drive circuit assembly 6 through the wire 61
  • the wire 62 is connected, and the LED drive circuit assembly 6 and the terminal 71 of the connection base 7 are connected by a wire 63 and a wire 64, and the connection base 7 is fixedly connected to the heat sink 5.
  • the luminous flux output of the LED assembly 4 is set to 10 G lm to 2500 lm.
  • connection base 7 is adapted to the lamp holders of El l, E12, E14, E17, E26, E27, E39, E40, GU6. 5, GU10, GU24, GZ10, G9, G12, GX8. 5, GX53 or GY6.
  • the modular LED lamp of the present invention further includes an optical component that is fixedly coupled to the heat sink 5.
  • the optical component of the present invention comprises an optical component 2, an optical accessory fixing cover 1, and the optical component fixing cover 1 is screwed to the heat sink 5 through the inner connecting screw 52 of the heat sink 5 and fixes the optical component 2, and the other of the present invention
  • the optical accessory fixing cover 1 is screwed to the heat sink 5 through the outer connecting screw 51 of the heat sink 5.
  • the optical component 2 is set as a diffusing film, a lens or a reflector, and the diffusing film, the lens or the reflector can be designed into various light-emitting angles, so that the modular LED lamp of the present invention realizes the light distribution output of different beam angles.
  • the modular LED lamp of the present invention further includes a decorative casing 8 that covers the optical component and is screwed to the heat sink 5 through the outer connecting screw 51 of the heat sink 5.
  • the decorative casing 8 may be made of glass, metal, plastic, ceramic or the like.
  • the modular LED lamp of the present invention further includes an LED component tablet 3, and the LED component tablet 3 is placed above the LED component 4.
  • the connecting wire 61 is connected to the negative electrode pad 41 of the LED chip, and the connecting wire 62 is connected to the positive electrode pad 42 of the LED chip to complete the electrical connection between the LED driving circuit assembly 6 and the LED assembly 4.
  • the LED driving circuit mode of the invention has high voltage input constant current (adjustable or non-adjustable) output, low voltage input constant current (adjustable or non-adjustable) output, constant current input parallel protection rectification output, and the like is used to adapt to different application occasions. , including dimming applications and non-dimming applications.
  • the LED driving circuit shown in FIG. 4 realizes the adjustable constant current output of the rolling input; the LED driving circuit shown in FIG.
  • the LED driving circuit shown in FIG. 6 realizes the low-voltage input. Adjust the constant current output; as shown in Figure 7, the LED drive circuit realizes the low-voltage input without adjustable constant current output; as shown in Figure 8, the LED drive circuit realizes the constant current input parallel protection adjustable rectification output; The drive circuit realizes constant current input parallel protection and non-adjustable flow output.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种模组化的LED灯具，包括LED组件（4）、LED驱动电路组件（6）、散热器（5）、连接底座（7）。LED组件（4）置于散热器（5）内侧上端。LED驱动电路组件（6）置于散热器（5）内侧下端。LED组件（4）和LED驱动电路组件（6）通过导线（61、62）连接。LED驱动电路组件(6）和连接底座（7）的端子（71）通过导线（63、64）连接。连接底座（7）与散热器（5）固定连接。

Description

一种模组化的 LED灯具 技术领域 本发明涉及 LED灯具技术领域，具体涉及一种模组化的 LED灯具。 背景技术
50年前人们已经了解半导体材料可产生光线的基本知识， 第一 个商用二极管产生于 I960年。 LED是英文 l ight emi tt ing diode (发 光二极管）的缩写， 它的基本结构是一块电致发光的半导体材料， 置 于一个有引线的架子上， 然后四周用环氧树脂密封， 起到保护内部芯 线的作用。 LED具有寿命长、 耗能少、 体积小、 响应快、 抗震抗低温、 污染小等突出的优点， 其应用领域极为广阔。 初步计算， 未来中国每 年釆用 LED照明节省的电力相当于三峡电站全年的发电量，同时可减 少 8000万吨 C02、 65万吨 S02和 32万吨 N02的排放， 称之为 "人类 照明史上的革命" 并不为过。 现有技术的 LED灯具核心部件未能模组化， LED芯片和驱动电路 一体封装， 因此有如下的缺点： 1、 LED芯片和驱动电路一体设置导 致生产工艺复杂， 装配繁瑣， 生产成本高。 2、 LED芯片和驱动电路 一体设置一旦产品出现故障， 很难判断故障位置， 并且无论是 LED芯 片损坏还是驱动电路故障， 很难进行维修， 只能将整个封装体废弃， 造成巨大的浪费。 发明内容 本发明要解决的技术问题是提供一种模组化的 LED灯具，克服现 有技术的 LED灯具核心部件未能模组化， 导致生产工艺复杂， 装配繁 瑣， 生产成本高的缺陷以及 LED灯具难以维修的缺陷。 本发明为解决上述技术问题所釆用的技术方案为： 一种模组化的 LED灯具， 包括 LED组件、 LED驱动电路组件、 散 热器、 连接底座， 所述 LED组件置于所述散热器内侧上端， 所述 LED 驱动电路组件置于所述散热器内侧下端，所述 LED组件和所述 LED驱 动电路组件通过导线连接，所述 LED驱动电路组件和所述连接底座的 端子通过导线连接， 所述连接底座与所述散热器固定连接。 所述的模组化的 LED灯具， 其中还包括光学组件，所述光学组件 与所述散热器固定连接。 所述的模组化的 LED灯具， 其中还包括装饰外壳，所述装饰外壳 罩住所述光学组件并与所述散热器固定连接。 所述的模组化的 LED灯具， 其中还包括 LED组件压片， 所述 LED 组件压片置于所述 LED组件的上方。 所述的模组化的 LED灯具， 其中所述光学组件包括光学配件、 光 所述散热器螺紋连接并对所述光学配件进行固定。 所述的模组化的 LED灯具， 其中所述光学配件设为漫射片、透镜 或者反光罩。 所述的模组化的 LED灯具，其中所述装饰外壳通过所述散热器的 外连接螺口与所述散热器螺紋连接。 所述的模组化的 LED灯具，其中所述 LED组件的光通量输出设为 100 lm至 2500 lm。 所述的模组化的 LED灯具，其中所述 LED驱动电路组件实现高压 输入可调恒流输出、 高压输入不可调恒流输出、低压输入可调恒流输 出、低压输入不可调恒流输出、 恒流输入并联保护可调整流输出或者 恒流输入并联保护不可调整流输出。 所述的模组化的 LED灯具， 其中所述连接底座适配 El l、 E12、 E14、 E17、 E26、 E27、 E39、 E40、 GU6. 5、 GU10、 GU24、 GZ10、 G9、 G12、 GX8. 5、 GX53或者 GY6. 35标准的灯座。 本发明的有益效果： 本发明通过对 LED 灯具核心部件进行模组 化，将 LED芯片单独封装，构成 LED组件，将 LED驱动电路单独封装， 构成 LED驱动电路组件， 大大简化了 LED灯具的设计、 生产工艺， 因 此降低了生产成本，而且在 LED灯具产品使用过程中容易判断产品的 故障位置， 方便维修， 不必无奈地废弃一体封装的部件， 本发明大大 推进了 LED灯具技术的进步。 附图说明 本发明包括如下附图： 图 1为本发明模组化的 LED灯具装配后示意图； 图 2为本发明模组化的 LED灯具分拆零件图；
图 3为本发明 LED组件示意图； 图 4为本发明实现高压输入可调恒流输出的 LED驱动电路框图； 图 5为本发明实现高压输入不可调恒流输出的 LED驱动电路框 图；
图 6为本发明实现低压输入可调恒流输出的 LED驱动电路框图； 图 7为本发明实现低压输入不可调恒流输出的 LED驱动电路框 图；
图 8为本发明实现恒流输入并联保护可调整流输出的 LED驱动电 路框图；
图 9为本发明实现恒流输入并联保护不可调整流输出的 LED驱动 电路框图。 具体实施方式 下面根据附图和实施例对本发明作进一步详细说明：
如图 1和图 2所示， 本发明模组化的 LED灯具包括 LED组件 4、 LED驱动电路组件 6、 散热器 5、 连接底座 7 , LED组件 4置于散热器 5内侧上端， LED驱动电路组件 6置于散热器 5内侧下端， LED组件 4 和 LED驱动电路组件 6通过导线 61、 导线 62连接， LED驱动电路组 件 6和连接底座 7的端子 71通过导线 63、 导线 64连接， 连接底座 7 与散热器 5固定连接。 LED组件 4的光通量输出设为 10G lm至 2500 lm。 连接底座 7适配 El l、 E12、 E14、 E17、 E26、 E27、 E39、 E40、 GU6. 5、 GU10、 GU24、 GZ10、 G9、 G12、 GX8. 5、 GX53或者 GY6. 35标准的灯座。 本发明模组化的 LED灯具还包括光学组件，光学组件与散热器 5固定 连接。 本发明光学组件包括光学配件 2、 光学配件固定盖 1 , 光学配 件固定盖 1通过散热器 5的内连接螺口 52与散热器 5螺紋连接并对 光学配件 2进行固定，本发明的另外一种实施方式是光学配件固定盖 1通过散热器 5的外连接螺口 51与散热器 5螺紋连接。 光学配件 2 设为漫射片、 透镜或者反光罩， 漫射片、 透镜或者反光罩可以设计成 各种不同的出光角度，从而使本发明模组化的 LED灯具实现不同光束 角的配光输出。 本发明模组化的 LED灯具还包括装饰外壳 8， 装饰外 壳 8罩住光学组件并通过散热器 5的外连接螺口 51与散热器 5螺紋 连接。 装饰外壳 8可以是玻璃、 金属、 塑胶、 陶瓷等材料。 本发明模 组化的 LED灯具还包括 LED组件压片 3 , LED组件压片 3置于 LED组 件 4的上方。
如图 3所示， 连接线 61连接 LED芯片负极焊点 41 , 连接线 62 连接 LED芯片正极焊点 42完成 LED驱动电路组件 6和 LED组件 4的 电气连接。 本发明 LED驱动电路方式有高压输入恒流（可调或不可调）输出、 低压输入恒流（可调或不可调）输出、 恒流输入并联保护整流输出三 类方式用来适应不同的应用场合，包括调光应用和不调光应用。 如图 4所示的 LED驱动电路实现髙压输入可调恒流输出；如图 5所示的 LED 驱动电路实现高压输入不可调恒流输出；如图 6所示的 LED驱动电路 实现低压输入可调恒流输出；如图 7所示的 LED驱动电路实现低压输 入不可调恒流输出；如图 8所示的 LED驱动电路实现恒流输入并联保 护可调整流输出；如图 9所示的 LED驱动电路实现恒流输入并联保护 不可调整流输出。 本领域技术人员不脱离本发明的实质和精神，可以有多种变形方 案实现本发明， 以上所述仅为本发明较佳可行的实施例而已， 并非因 此局限本发明的权利范围，凡运用本发明说明书及附图内容所作的等 效结构变化， 均包含于本发明的权利范围之内。

Claims

杈利要求书
1、 一种模组化的 LED灯具， 其特征在于： 包括 LED组件、 LED 驱动电路组件、 散热器、 连接底座， 所述 LED组件置于所述散热器内 侧上端， 所述 LED驱动电路组件置于所述散热器内侧下端， 所述 LED 组件和所述 LED驱动电路组件通过导线连接，所述 LED驱动电路组件 和所述连接底座的端子通过导线连接 /所述连接底座与所述散热器固 定连接。
2、 根据杈利要求 1所述的模组化的 LED灯具， 其特征在于： 还 包括光学组件， 所述光学组件与所述散热器固定连接。
3、 根据权利要求 2所述的模组化的 LED灯具， 其特征在于： 还 包括装饰外壳，所述装饰外壳罩住所述光学组件并与所述散热器固定 连接。
4、 根据权利要求 3所述的模组化的 LED灯具， 其特征在于： 还 包括 LED组件压片， 所述 LED组件压片置于所述 LED组件的上方。
5、 根据权利要求 4所述的模组化的 LED灯具， 其特征在于： 所 述光学组件包括光学配件、 光学配件固定盖， 所述光学配件固定盖通 过所述散热器的内连接螺口与所述散热器螺紋连接并对所述光学配 件进行固定。
6、 根据权利要求 5所述的模组化的 LED灯具， 其特征在于： 所 述光学配件设为漫射片、 透镜或者反光罩。
7、 根据权利要求 6所述的模组化的 LED灯具， 其特征在于： 所 述装饰外壳通过所述散热器的外连接螺口与所述散热器螺紋连接。
8、 根据权利要求 7所述的模组化的 LED灯具， 其特征在于： 所 述 LED组件的光通量输出设为 100 lm至 2500 lm。
9、 根据权利要求 8所述的模组化的 LED灯具， 其特征在于： 所 述 LED驱动电路组件实现高压输入可调恒流输出、高压输入不可调恒 流输出、 低压输入可调恒流输出、 低压输入不可调恒流输出、 恒流输 入并联保护可调整流输出或者恒流输入并联保护不可调整流输出。
10、 根据权利要求 9所述的模组化的 LED灯具， 其特征在于： 所 述连接底座适配 Ell、 E12、 E14、 E17、 E26、 E27、 E39、 E40、 GU6. 5、 GU10、 GU24、 GZ10、 G9、 G12、 GX8. 5、 GX53或者 GY6. 35标准的灯座。
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