CN102239578B - Led组件 - Google Patents

Led组件 Download PDF

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Publication number
CN102239578B
CN102239578B CN200980148279.5A CN200980148279A CN102239578B CN 102239578 B CN102239578 B CN 102239578B CN 200980148279 A CN200980148279 A CN 200980148279A CN 102239578 B CN102239578 B CN 102239578B
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CN
China
Prior art keywords
led
layer
light
filter layer
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980148279.5A
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English (en)
Chinese (zh)
Other versions
CN102239578A (zh
Inventor
H-H.贝希特尔
M海德曼
P.J.施密特
T.迪德里希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN102239578A publication Critical patent/CN102239578A/zh
Application granted granted Critical
Publication of CN102239578B publication Critical patent/CN102239578B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Electroluminescent Light Sources (AREA)
CN200980148279.5A 2008-12-02 2009-11-27 Led组件 Active CN102239578B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08170458.7 2008-12-02
EP08170458 2008-12-02
PCT/IB2009/055380 WO2010064177A1 (en) 2008-12-02 2009-11-27 Led assembly

Publications (2)

Publication Number Publication Date
CN102239578A CN102239578A (zh) 2011-11-09
CN102239578B true CN102239578B (zh) 2015-06-03

Family

ID=42035569

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980148279.5A Active CN102239578B (zh) 2008-12-02 2009-11-27 Led组件

Country Status (8)

Country Link
US (2) US8957439B2 (enExample)
EP (1) EP2374165B1 (enExample)
JP (1) JP5558483B2 (enExample)
KR (1) KR101654514B1 (enExample)
CN (1) CN102239578B (enExample)
RU (1) RU2512091C2 (enExample)
TW (1) TWI538259B (enExample)
WO (1) WO2010064177A1 (enExample)

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EP2482350A1 (en) * 2011-02-01 2012-08-01 Koninklijke Philips Electronics N.V. LED assembly comprising a light scattering layer
JP2012186414A (ja) * 2011-03-08 2012-09-27 Toshiba Corp 発光装置
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JP6139071B2 (ja) * 2012-07-30 2017-05-31 日亜化学工業株式会社 発光装置とその製造方法
KR20140028964A (ko) * 2012-08-31 2014-03-10 일진엘이디(주) 발광 분포가 우수한 반도체 발광소자
US9644817B2 (en) * 2013-02-09 2017-05-09 Hisham Menkara Phosphor sheets
US9966511B2 (en) * 2013-04-25 2018-05-08 Koninklijke Philips N.V. Light emitting diode component
TWI511338B (zh) * 2013-12-17 2015-12-01 Ind Tech Res Inst 發光裝置
DE102014112973A1 (de) * 2014-09-09 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
KR20160149363A (ko) 2015-06-17 2016-12-28 삼성전자주식회사 반도체 발광소자
KR102415331B1 (ko) 2015-08-26 2022-06-30 삼성전자주식회사 발광 소자 패키지, 및 이를 포함하는 장치
KR101739851B1 (ko) * 2015-10-30 2017-05-25 주식회사 썬다이오드코리아 파장변환구조체를 포함하는 발광 소자
JP6524904B2 (ja) 2015-12-22 2019-06-05 日亜化学工業株式会社 発光装置
US20190081218A1 (en) * 2016-01-28 2019-03-14 Corning Incorporated Methods for dispensing quantum dot materials
JP2018022844A (ja) 2016-08-05 2018-02-08 日亜化学工業株式会社 発光装置及び発光装置の製造方法
KR101888083B1 (ko) * 2016-11-17 2018-08-13 엘지전자 주식회사 차량용 램프
FR3062459B1 (fr) * 2017-02-01 2021-03-19 Schneider Electric Ind Sas Dispositif a fonction de signalisation lumineuse
CN109411590B (zh) * 2017-08-17 2020-01-07 光宝光电(常州)有限公司 发光二极管结构及发光单元
EP3457444A1 (en) * 2017-09-19 2019-03-20 ams AG Phosphor-converted light-emitting device
US11302248B2 (en) 2019-01-29 2022-04-12 Osram Opto Semiconductors Gmbh U-led, u-led device, display and method for the same
US11271143B2 (en) 2019-01-29 2022-03-08 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
JP7604394B2 (ja) 2019-04-23 2024-12-23 エイエムエス-オスラム インターナショナル ゲーエムベーハー Ledモジュール、ledディスプレイモジュール、および当該モジュールを製造する方法
US11538852B2 (en) 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
KR20220007069A (ko) * 2019-05-14 2022-01-18 오스람 옵토 세미컨덕터스 게엠베하 광전자 부품, 픽셀, 디스플레이 조립체, 및 방법
JP7594578B2 (ja) 2019-09-20 2024-12-04 エイエムエス-オスラム インターナショナル ゲーエムベーハー 光電子構造素子、半導体構造およびそれらに関する方法
JP7332881B2 (ja) 2019-09-30 2023-08-24 日亜化学工業株式会社 発光装置
CN114651323A (zh) 2019-10-29 2022-06-21 奥斯兰姆奥普托半导体股份有限两合公司 光电装置
US12040317B2 (en) 2019-12-06 2024-07-16 Osram Opto Semiconductors Gmbh Optoelectronic device
DE102020103070A1 (de) 2020-02-06 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung optoelektronischer bauelemente und optoelektronisches bauelement
WO2021204652A1 (de) * 2020-04-08 2021-10-14 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und beleuchtungsvorrichtung
DE102021123818A1 (de) * 2021-09-15 2023-03-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes halbleiterbauteil, verfahren zur auswahl eines dielektrischen schichtenstapels und verfahren zur auswahl eines konversionsmaterials
JP7755522B2 (ja) * 2022-03-14 2025-10-16 スタンレー電気株式会社 半導体発光装置およびそれを備えた車両用灯具
US20250362438A1 (en) * 2024-05-21 2025-11-27 Creeled, Inc. Long-pass filter structures for light-emitting diodes

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US20030030060A1 (en) * 2001-08-07 2003-02-13 Tadahiro Okazaki White semiconductor light-emitting device
CN1419300A (zh) * 2001-11-14 2003-05-21 株式会社西铁城电子 发光二极管装置
US20040238837A1 (en) * 2001-03-15 2004-12-02 Osram Opto Semiconductors Gmbh Radiation-emitting optical component
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US20060202105A1 (en) * 2005-03-14 2006-09-14 Lumileds Lighting U.S., Llc Wavelength-converted semiconductor light emitting device
CN1835257A (zh) * 2005-03-18 2006-09-20 斯坦雷电气株式会社 发光器件

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US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
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US6744077B2 (en) * 2002-09-27 2004-06-01 Lumileds Lighting U.S., Llc Selective filtering of wavelength-converted semiconductor light emitting devices
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US20030030060A1 (en) * 2001-08-07 2003-02-13 Tadahiro Okazaki White semiconductor light-emitting device
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EP1571715A1 (en) * 2004-03-04 2005-09-07 Nan Ya Plastics Corporation Method for producing white light emission by means of secondary light exitation and its product
US20060202105A1 (en) * 2005-03-14 2006-09-14 Lumileds Lighting U.S., Llc Wavelength-converted semiconductor light emitting device
CN1835257A (zh) * 2005-03-18 2006-09-20 斯坦雷电气株式会社 发光器件

Also Published As

Publication number Publication date
CN102239578A (zh) 2011-11-09
TWI538259B (zh) 2016-06-11
RU2512091C2 (ru) 2014-04-10
TW201027810A (en) 2010-07-16
JP5558483B2 (ja) 2014-07-23
KR101654514B1 (ko) 2016-09-07
US20110220953A1 (en) 2011-09-15
US8957439B2 (en) 2015-02-17
US20150162503A1 (en) 2015-06-11
WO2010064177A1 (en) 2010-06-10
KR20110103994A (ko) 2011-09-21
RU2011127140A (ru) 2013-01-10
EP2374165A1 (en) 2011-10-12
JP2012510716A (ja) 2012-05-10
EP2374165B1 (en) 2019-01-09

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Eindhoven, Netherlands

Patentee after: KONINKLIJKE PHILIPS N.V.

Address before: Eindhoven, Netherlands

Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20200710

Address after: Holland Schiphol

Patentee after: KONINKLIJKE PHILIPS NV

Address before: Eindhoven, Netherlands

Patentee before: KONINKLIJKE PHILIPS N.V.

TR01 Transfer of patent right