CN102202458A - Flexible printed circuit board with reinforced plate and manufacture method thereof - Google Patents
Flexible printed circuit board with reinforced plate and manufacture method thereof Download PDFInfo
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- CN102202458A CN102202458A CN2011100705085A CN201110070508A CN102202458A CN 102202458 A CN102202458 A CN 102202458A CN 2011100705085 A CN2011100705085 A CN 2011100705085A CN 201110070508 A CN201110070508 A CN 201110070508A CN 102202458 A CN102202458 A CN 102202458A
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Abstract
The invention provides a flexible printed circuit board with a reinforced plate and a manufacture method thereof capable of being applied to a quick forming mode and with excellent adhesion. The circuit board is provided with: a flexible printed circuit board (2) provided with: an installation region (2a) and an installation region (2b) comprising welding parts (22a, 22b) formed on the surface of a base film (21); a wiring region (2c) disposed to be clamped by the installation region (2a) and the installation region (2b), and comprising wiring patterns (22) electrically connecting the welding part (22a) of the installation region (2a) to the welding part (22b) of the installation region (2b); a propylene adhesive layer (3) formed at the back of the base film (21) of the installation regions (2a, 2b) of the flexible printed circuit board (2); and an aluminum reinforced plate (4) provided with chemical synthetic protective film (4a) comprising zirconium oxide on a surface opposite to the flexible printed circuit board (2), and adhered onto the base film (21) via the propylene adhesive layer (3).
Description
Technical field
The present invention relates to flexible printed circuit substrate and manufacture method thereof with stiffener.
Background technology
On hard disk drive (following only be called " HDD "), be assembled with the actuator (actuator) that keeps magnetic head element portion.This actuator is that rotate at the center with the rotation axis, thus, magnetic head element portion is positioned on the desirable recording track on the disk.In the FPC unit that is fixed with the signal transmission of carrying out between magnetic head element portion and the control circuit on this actuator.The preamplifier IC that this FPC unit has flexible printed circuit substrate (following only be called " FPC substrate ") and installs at the predetermined welding disk of this FPC substrate.
The signal that the FPC substrate carries out between control circuit and the preamplifier IC transmits.The preamplifier IC utilization is called as the transmission wiring of bend (flexure) and is connected with magnetic head element portion, utilizes bend to send magnetic head element portion (for example, with reference to patent documentation 1) to from the electric current of preamplifier IC output.
In recent years, because the high speed of HDD, the transmission speed of data significantly accelerates.Follow in this, the caloric value of preamplifier IC increases.Therefore, as the heat radiation countermeasure, the stiffener (for example, with reference to patent documentation 2) that is made of the good metal of thermal conductivity is set at the back side of the FPC substrate that preamplifier IC is installed.As such stiffener, the stiffener that common employing is made of aluminium (below, be called " aluminium stiffener ").
For with making the FPC substrate of band stiffener on the stacked FPC of the being bonded in substrate of this aluminium stiffener, can adopt various bonding agents such as propylene class, epoxies, polyurethanes.Require in HDD purposes etc. to use propylene class bonding agent under the situation of purity (purity) of degasification characteristic etc.Propylene class bonding agent is identified as the standard bonding agent in the purposes of HDD etc., also good aspect the non-polluting of periphery.
In order to be bonded on the FPC substrate the aluminium stiffener is stacked, need pressurize and the punching press of heating is handled to the FPC substrate stacked together and aluminium stiffener via bonding agent.
For propylene class bonding agent, in order to manifest sufficient bonding force, aspect material behavior, the punching press of the time of need carrying out long (for example, 45～120 minutes) is handled.Herein, the mode of the punching press processing that the time of carrying out like this is long is called " long-time molding mode ".Be used to carry out the decompressor price comparison height that punching press is handled, the quantity of introducing is limited.Therefore, when decompressor is occupied for a long time because of 1 punching press processing, there is the problem of the production efficiency decline of the FPC substrate of being with stiffener.
On the other hand, there is relatively short mode of punching press processing time (below, be called " rapid shaping mode ") in above-mentioned relatively long-time molding mode.In this rapid shaping mode, the time that punching press is handled is short time (about below 10 minutes), after punching press is handled, is called as the heat treatment of back cured.The situation that the punching press of briquetting pressure during the punching press of rapid shaping mode is handled and forming temperature and long-time molding mode is handled much at one.Back cured after punching press is handled is for example being carried out more than 150 ℃ and under the condition more than 2 hours.
Under the situation of rapid shaping mode, the punching press processing time is short, so, can in handling, 1 punching press not occupy decompressor for a long time.In addition, after punching press is handled, when from decompressor, taking out the FPC substrate, do not need to reduce the temperature of FPC substrate.That is, can be omitted in needed temperature-fall period in the long-time molding mode and carry out the back cured of subsequent processing.Therefore, the holding time of decompressor further shortens.In addition, for the back cured, for example use a plurality of baking ovens to walk abreast and carry out, thereby can handle in a large number.Therefore,, compare, have the such advantage of production efficiency of the FPC substrate that can increase substantially the band stiffener with long-time molding mode according to the rapid shaping mode.
But, in the past under the situation of using the rapid shaping mode, owing to lack pressing time (punching press processings), so, can not guarantee the suitable curing condition of propylene class bonding agent.Consequently, there are the following problems: even if after having carried out back cured, can not obtain sufficient cementability.In addition, the known in the past method that has the cementation effect of bringing by alligatoring to improve cementability by surface of aluminum plate, still, even under the situation of this method of use, can not obtain sufficient adhesion strength (below, be called " tearing intensity ") at normality (under the ambient temperature and moisture).
And then, the FPC substrate of the band stiffener that produces for the rapid shaping mode by in the past, under the moist environment of one of environment for use that can be assumed to the FPC substrate, the cementability of aluminium stiffener and FPC substrate descends significantly.That is, in the prior art, also there is the problem of water-fast cementability difference.
Patent documentation 1: TOHKEMY 2007-287197 communique
Patent documentation 2: TOHKEMY 2002-314207 communique.
Summary of the invention
The present invention is in view of the above problems and proposes, and its purpose is to provide the flexible printed circuit substrate and the manufacture method thereof that can be applied to the good band stiffener of rapid shaping mode and cementability.
According to first mode of the present invention, a kind of flexible printed circuit substrate with stiffener is provided, have: flexible printed circuit substrate, the wiring pattern that has basement membrane and form at least one face of described basement membrane; Metallic plate is strengthened described flexible printed circuit substrate, contains zirconic chemical synthesis diaphragm having with the opposed mask of described flexible printed circuit substrate, and is bonded on the described basement membrane via propylene class bond layer.
According to second mode of the present invention, a kind of flexible printed circuit substrate with stiffener is provided, have: flexible printed circuit substrate has: first installation region and second installation region, contain the welding disk that forms on the surface of basement membrane; Wiring zone, being provided with by the mode of described first installation region and the second installation region clamping, and, comprise the wiring that the described welding disk with the described welding disk of described first installation region and described second installation region is electrically connected; Propylene class bond layer is formed on the back side of the described basement membrane of described first installation region and/or described second installation region; The aluminium stiffener contains zirconic chemical synthesis diaphragm having with the opposed mask of described flexible printed circuit substrate, and is bonded on the described basement membrane via described propylene class bond layer.
According to Third Way of the present invention; a kind of manufacture method of the flexible printed circuit substrate with stiffener is provided; contain zirconic chemical synthesis diaphragm in the formation of the surface of aluminium sheet; the described aluminium sheet that will be formed with described chemical synthesis diaphragm is layered on the plastic film of flexible printed circuit substrate with the mode that described propylene class bond layer contacts with described chemical synthesis diaphragm via propylene class bonding agent; thus; formation via described propylene class bonding agent stacked the duplexer that forms of described aluminium sheet and described plastic film; use decompressor to carry out the punching press of described duplexer heating and pressurization is handled; use bake oven device, during growing, carry out back cured described duplexer heating than described punching press processing.
In the present invention, will be formed with the stiffener that the metallic plate that contains zirconic chemical synthesis diaphragm is used as flexible printed circuit substrate on the surface.Metallic plate with this chemical synthesis diaphragm is bonded on the flexible printed circuit substrate via propylene class bond layer.In the heat treated that makes propylene class adhesive hardens, contain hydroxyl and carboxyl in the propylene class bonding agent or hydroxyl generation chemical reaction in the zirconic chemical synthesis diaphragm.Thus, form firm chemical bond to high-density.This chemical bond constitutes the crosslinked of the interface of crossing over chemical synthesis diaphragm and propylene class bond layer.Therefore, according to the present invention, even under the situation that adopts the rapid shaping mode, also can access high-adhesive-strength.
And then for constituting above-mentioned crosslinked chemical bond, bonding force is strong, and the influence of the hydroxyl that is not subjected to hydrone and is had is even thereby also can guarantee sufficient cementability under moist environment.That is,, can access high water-fast cementability according to the present invention.
Description of drawings
Fig. 1 (a) is the cutaway view of FPC substrate of the band stiffener of embodiments of the present invention, (b) is the upward view of FPC substrate of the band stiffener of embodiments of the present invention.
Fig. 2 is the amplification view of the A part of Fig. 1 (a).
Fig. 3 (a) is the cutaway view of FPC unit of the band stiffener of embodiments of the present invention, (b) is the cutaway view of FPC unit of band stiffener of the variation of embodiments of the present invention.
Fig. 4 is used to illustrate the figure that tears experiment.
Fig. 5 is the figure that is used to illustrate the surface state of tearing the aluminium stiffener after the experiment.
Wherein, description of reference numerals is as follows:
The FPC substrate of 1 band stiffener
2 FPC substrates (single face FPC substrate)
The two-sided FPC substrate of 2'
2a, 2b installation region
2c connects up regional
21 basement membranes (base film)
22,22A, 22B wiring pattern
22a, 22b welding disk
23,23A, 23B bond layer
24,24A, 24B coverlay (cover film)
3 propylene class bond layers
4 aluminium stiffeners
4a chemical synthesis diaphragm
100, the FPC unit of 200 band stiffeners
101 preamplifier IC
102 solder materials.
Embodiment
Below, describe with reference to the FPC unit of accompanying drawing the band stiffener of embodiments of the present invention.In addition, the inscape with same function is marked identical Reference numeral, and omit detailed explanation.Accompanying drawing is schematic figure, and ratio of the relation of thickness and planar dimension, the thickness of each layer etc. is different with reality.
Use Fig. 1 that the FPC substrate of the band stiffener of embodiments of the present invention is described.Fig. 1 (a) is the cutaway view of FPC substrate 1 of the band stiffener of expression present embodiment, and Fig. 1 (b) is the upward view of the FPC substrate 1 of expression band stiffener.
The FPC substrate 1 of band stiffener has: FPC substrate 2 has wiring pattern on the surface; Propylene class bond layer 3 is arranged on the back side of FPC substrate 2; Aluminium stiffener 4 is attached to the back side of FPC substrate 2 via this propylene class bond layer 3.
From Fig. 1 (a) and Fig. 1 (b) as can be known, FPC substrate 2 is made of installation region 2a, 2b and wiring zone 2c.Installation region 2a, 2b have welding disk 22a, the 22b that is used to install electronic unit.The regional 2c that connects up is provided with in the mode that is mounted regional 2a and installation region 2b clamping, and, have the wiring that is used to carry out the signal transmission between installation region 2a and the installation region 2b.
Propylene class bond layer 3 is arranged between the basement membrane 21 and aluminium stiffener 4 of FPC substrate 2.This propylene class bond layer 3 is to utilize pressurized treatments and heat treated and the adhesive hardens of propylene class is formed.
As described later in detail, aluminium stiffener 4 be will utilize the zirconia synthetic liquid implemented aluminium sheet that chemical synthesis handles and be processed into predetermined shape and form.Therefore, for aluminium stiffener 4, with FPC substrate 2 opposed masks the zirconia of containing (ZrO is being arranged at least
2) chemical synthesis diaphragm 4a.
From Fig. 1 (a) and Fig. 1 (b) as can be known, aluminium stiffener 4 is attached to the back side of the FPC substrate 2 of installation region 2a, 2b via propylene class bond layer 3.That is,, aluminium stiffener 4 is attached to the back side of FPC substrate 2 with chemical synthesis diaphragm 4a and the mode that propylene class bond layer 3 contacts.This aluminium stiffener 4 is brought into play function as the stiffener that FPC substrate 2 is strengthened, make the FPC substrate 2 of installation region 2a, 2b not bend, and, bring into play function as the heating panel that the heating of the electronic unit installed at welding disk 22a, 22b is dispelled the heat.In addition, do not attach aluminium stiffener 4 at the back side of FPC substrate 2 of the regional 2c of wiring.Like this, the regional 2c that connects up has pliability.
Then, the detailed structure to FPC substrate 2 describes.
From Fig. 1 (a) as can be known, FPC substrate 2 have the basement membrane 21 that constitutes by plastic film, the wiring pattern 22 that forms at the single face of this basement membrane 21, the coverlay 24 that constitutes by plastic film that is provided with via bond layer 23.
Coverlay 24 is via the wiring pattern 22 of bond layer 23 insulation coverings except welding disk 22a, 22b.In addition, as the material of this bond layer 23, can use various bonding agents such as propylene class, epoxies, polyurethanes.As mentioned above, preferably use at propylene class bonding agent good aspect the non-polluting of periphery.
In addition, as basement membrane 21 and coverlay 24 employed plastic films, can enumerate polyimide film, polyester film, Polyethylene Naphthalate film, poly (ether sulfone) film, polyetherimde films, polyether-ether-ketone film, poly-parabanic acid film etc.
Then, use Fig. 2 at length the adhering state of FPC substrate 2 and aluminium stiffener 4 to be described.The amplification view of A part this Fig. 2 presentation graphs 1(a).
As shown in Figure 2, be formed with on the surface of aluminium stiffener 4 and contain zirconic chemical synthesis diaphragm 4a.And, be bonded in mode on the propylene class bond layer 3 with chemical synthesis diaphragm 4a, aluminium stiffener 4 is attached on the basement membrane 21 via propylene class bond layer 3.In addition, say more scrupulously, be formed with aluminium hydrous oxide layer (not shown) naturally, on this aluminium hydrous oxide layer, be formed with chemical synthesis diaphragm 4a on the surface of aluminium stiffener 4.
Near the interface (Al/Ad) of propylene class bond layer 3 and chemical synthesis diaphragm 4a, be formed with firm chemical bond (crosslinked) in the mode of crossing over this interface.Its reason is described.
There is hydroxyl (OH yl) to high-density on the surface of containing zirconic chemical synthesis diaphragm 4a.When being used for that aluminium stiffener 4 is bonded in heat treated on the FPC substrate 2, chemical reaction takes place in the carboxyl (COOH yl) or the hydroxyl (OH yl) that are contained in the hydroxyl on chemical synthesis diaphragm 4a surface and the propylene class bonding agent that is coated on the basement membrane 21.The result of this chemical reaction (dehydration in conjunction with) is, at the near interface of chemical synthesis diaphragm 4a and propylene class bond layer 3, forms to high-density with " C(=O)-O-", " O-" and waits crosslinked that the key by firm represented forms.Therefore, the adhesive strength between aluminium stiffener 4 and the FPC substrate 2 becomes big.
Then, the structure of FPC unit to the band stiffener describes.
The cutaway view of the FPC unit 100 of Fig. 3 (a) expression band stiffener.For the FPC unit 100 of this band stiffener, use solder material 102 preamplifier IC 1Ol to be installed on welding disk 22a, the 22a of installation region 2a of FPC substrate 1 of band stiffener.In the FPC unit 100 of this band stiffener, the heating of preamplifier IC 1Ol is dispelled the heat by the aluminium stiffener 4 that the back side attached at the FPC of installation region 2a substrate 2.
More than, the FPC substrate 1 of the band stiffener of present embodiment and the FPC unit 100 of band stiffener are illustrated.
In addition, the FPC substrate of band stiffener is not limited to said structure.
For example, aluminium stiffener 4 also can only be arranged on the back side of basement membrane 21 of any one party of installation region 2a or installation region 2b.
In addition, replace only being formed with the FPC substrate 2 of wiring, also can use the two-sided FPC substrate 2' that is formed with wiring at the surface and the back side of basement membrane 21 at the single face of basement membrane 21.Fig. 3 (b) is illustrated in the cutaway view of the FPC unit 200 of the band stiffener when using two-sided FPC substrate 2'.Two-sided FPC substrate 2' has wiring pattern 22A and the 22B that forms at the surface and the back side of basement membrane 21 respectively.Wiring pattern 22A and 22B are respectively by the coverlay 24A and the 24B insulation protection that are provided with via bond layer 23A and 23B.
In addition, shown in Fig. 3 (b), aluminium stiffener 4 also can not stackedly be bonded on the basement membrane 21, and via propylene class bond layer 3 stacked being bonded on the coverlay 24B.
In addition, also can replace coverlay 24, the predetermined part of the seal coat drape line pattern 22 that constitutes with resin by the varnish shape.This seal coat both can use printing process to form desirable pattern-like, perhaps also can use the light processing method that has adopted photoresist to form.Under situation about making with the light processing method, apply photosensitive resin molding in the predetermined part of basement membrane 21 and wiring pattern 22, then, this resin molding is exposed, develops, be patterned into desirable shape, thus, the formation seal coat.As the advantage of using seal coat, can enumerate following advantage: compare with coverlay, can carry out high-precision composition.Therefore, can accurately for example peristome etc. be formed on desirable position.In addition, as required, also can use coverlay and seal coat simultaneously.For example, the part that requires high-precision composition is used seal coat, part is in addition used coverlay, thereby can enhance productivity.
Below, embodiments of the invention are narrated.Manufacture method to the FPC substrate of the band stiffener of present embodiment describes, and then, the measurement result of tearing intensity experiment is described.
At first, prepare single face at the basement membrane of polyimides via the stacked copper-clad plate that Copper Foil is arranged of bonding agent.Then, at lamination in this copper-clad plate behind the dry film (dry film), expose, develop.Thus, in copper-clad plate, formed the resist of predetermined negative pattern (negative pattern).Then, this resist as mask, is carried out etching to the Copper Foil of copper-clad plate, form wiring pattern.Then, prepare to be coated with the coverlay of bonding agent, at the predetermined part formation peristome of this coverlay at the single face of polyimide film.Then, with the stacked coverlay that is provided with peristome of the mode of drape line pattern.At this moment, the mode laminated cover film of the part that need expose corresponding to welding disk etc. with the peristome of coverlay.Through above-mentioned operation, produce the FPC substrate of present embodiment.Then, the manufacture method to the aluminium stiffener describes.
At first, prepare aluminium sheet, remove then at the oleaginous material (ungrease treatment) of the surface attachment of this aluminium sheet, after aluminium sheet is washed, be impregnated in the alkaline solution, remove the alumina layer (alkaline ungrease treatment) that forms naturally on the surface of aluminium sheet and follow, water is impregnated in the zirconia synthetic liquid of faintly acid (about pH=5～6) after aluminium sheet is cleaned.As the zirconia synthetic liquid, can use the zirconium compounds that does not add phosphoric acid.This zirconium compounds that does not add phosphoric acid for example adds hydrofluoric acid and forms in fluorine zirconic acid (perhaps its ammonia salt)
Then, from the zirconia synthetic liquid, mention aluminium sheet and the washing after, in baking oven, carry out drying.Through operation before this, obtain being formed with the aluminium sheet that contains zirconic chemical synthesis diaphragm on the surface.These the two kinds of samples of sample that in the chemical synthesis diaphragm, contain the sample of silica and do not contain silica have been made herein.The reason of doing like this is, in the purposes of FPC substrate, exists requirement to contain the situation of silicon in order to obtain rust-proof effect, on the other hand, also has the situation that requires not contain silicon.
After above-mentioned chemical synthesis is handled, be determined at the thickness of the chemical synthesis diaphragm that the surface of aluminium sheet forms, consequently, with whether to contain silica irrelevant, the thickness of chemical synthesis diaphragm is 5nm.
In order to compare with the aluminium sheet of having implemented the chemical synthesis processing, prepared not carry out the aluminium sheet that chemical synthesis handles (below, be called " aluminium sheet is untreated ") and carried out the aluminium sheet that boehmite (boehmite) handles (below, be called " boehmite processing aluminium sheet ").In addition, the aluminium sheet that is untreated above-mentioned ungrease treatment and alkaline ungrease treatment have also been implemented.In addition, to handle be to utilize hot water about 80 ℃～90 ℃ the surface of aluminium sheet to be carried out the processing of oxidation to boehmite.
Measure the thickness of these alumina layers that form on the surface of the aluminium sheet of usefulness relatively, consequently, be 6nm in the aluminium sheet that is untreated, handling in the aluminium sheet at boehmite is 238nm.
In addition, the thickness of above-mentioned chemical synthesis diaphragm and alumina layer all is the value of utilizing sweep type TEM (Scanning Transmission Electron Microscope:STEM) to measure.
Then, 4 kinds of above-mentioned aluminium sheets (chemical synthesis that the chemical synthesis that contains silica handles aluminium sheet, do not contain silica handles aluminium sheet, be untreated aluminium sheet and boehmite handle aluminium sheet) are struck out predetermined shape respectively, as the aluminium stiffener that is used to be attached on the FPC substrate.
Then, the FPC substrate made as mentioned above and aluminium stiffener are carried out via propylene class bonding agent stacked, thus, the duplexer that has formed FPC substrate and aluminium stiffener stacked and form.Then, use decompressor etc. to carry out the punching press of duplexer heating and pressurization is handled.The rapid shaping mode that adopts is handled in this punching press, is that lMPa, temperature are that 190 ℃, time are to implement under 5 minutes the condition at pressure.Then, use bake oven device etc., in back cured (temperature: 180 ℃ to carry out during longer than the punching press processing duplexer is heated; Time: 3 hours).
Through above-mentioned operation, finish stacked respectively 4 kinds of samples of being with the FPC substrate of stiffeners that are bonded with above-mentioned 4 kinds of aluminium stiffeners.Below, for convenience of explanation, to use the FPC substrate of the band stiffener of the aluminium sheet that carries out zirconia chemical synthesis processing (containing silica) to be called type A, to use the FPC substrate of the band stiffener of the aluminium sheet that carries out zirconia chemical synthesis processing (not containing silica) to be called type B, to use the FPC substrate of the band stiffener of the aluminium sheet that is untreated to be called Type C, the FPC substrate that has used boehmite to handle the band stiffener of aluminium sheet has been called type D.
Below, the evaluation experimental of tearing intensity (peel strength) that the FPC substrate of these band stiffeners is implemented is described.
The evaluation experimental of tearing intensity is that benchmark carries out with IPC standard (TM650 2.4.9.).Measuring temperature is 25 ℃, and peeling rate is 50(mm/ minute), as shown in Figure 4, under the aluminium stiffener of FPC substrate that will the band stiffener is fixed on state on the platform, to tear 90 ° of (directly among Fig. 4) pullings of angle FPC substrate.
The result of experiment of tearing intensity is illustrated in the table 1.
Table 1
" before installing " in the his-and-hers watches 1, the condition of " back is installed " describe." install before " is that the result without the FPC substrate of the band stiffener of the state of superheating process has been estimated in expression.On the other hand, the result with the FPC substrate of the equal heat treated band stiffener of the thermal process of following to the installation of FPC substrate with parts has been implemented in " install back " expression.As the thermal process of following being installed, supposing the solder reflow operation and owe dress (underfill) operation with parts.Specifically, suppose the solder reflow operation, carry out 220 ℃, 5 minutes heat treatment after, suppose and owe to adorn operation, carry out 165 ℃, 30 minutes heat treatment.
" dry (Dry) " and the condition of " moistening (Soak) " in the his-and-hers watches 1 describe." dry (Dry) " is illustrated in situation about experimentizing under the ambient temperature and moisture, and " moistening (soak) " expression is immersed in situation about experimentizing after (50 ℃, 1 hour) in the warm water with sample.In addition, " on average " in the table 1 and " σ " are the mean value of tearing intensity and the standard deviations of being measured (σ).Sample number is 6 (N=6)
" peeling off the interface " in the his-and-hers watches 1 describes.Be somebody's turn to do the state of peeling off the interface after experiment is torn in " peeling off the interface " expression.There are following three kinds of situations in the state of peeling off the interface: the peeling off of the interface (Al/Ad) of aluminium stiffener (Al) and propylene class bond layer (Adhesive), peeling off and both mixing (Mixture) at the interface (FPC/Ad) of the basement membrane of FPC substrate and propylene class bond layer.Fig. 5 illustrates the state of tearing the aluminium stiffener surface after the experiment.Fig. 5 (a) is illustrated in the situation that peel off at the Al/Ad interface, and Fig. 5 (b) is illustrated in the situation that peel off at the FPC/Ad interface, and Fig. 5 (c) is illustrated in both interfaces and mixes situation about peeling off.Peel off at the weak relatively interface of adhesive strength and take place.Thereby, be A1/Ad if peel off the interface, then the bonding force at the aluminium stiffener and the interface of propylene class bond layer is compared with the bonding force at the interface of propylene class bond layer with the FPC substrate, and is relatively low.On the other hand, be FPC/Ad if peel off the interface, then the bonding force at the aluminium stiffener and the interface of propylene class bond layer is compared with the bonding force at the interface of propylene class bond layer with the FPC substrate, and is higher relatively.
As shown in table 1, for having implemented type A and type B that the zirconia chemical synthesis is handled, the mean value of the peel strength of " before installing " and " back is installed " is all high, and deviation is also little.And then " back is installed " relatively, peel strength improves with " installing preceding ".Consider that its reason is, the chemical reaction of the reactive group (carboxyl, hydroxyl) in reactive group in the chemical synthesis diaphragm (hydroxyl) and the propylene class bond layer further carries out owing to suppose the heat treatment of installing component, and crosslink density uprises.
And then about having implemented type A and the type B that the zirconia chemical synthesis is handled, under moist environment, peel strength does not descend yet, can access with normal wet environment under the peel strength of same degree.This results from, and the bonding force that constitutes crosslinked chemical bond is strong, and this key can not be subjected to invading the influence of the moisture of bonding interface under moist environment.That is, constitute crosslinked key and have the stronger bonding force of reactivity than the hydroxyl that is had with hydrone, therefore, the FPC substrate of the band stiffener of type A and type B adhesive strength under moist environment does not reduce yet.
On the other hand, as known from Table 1, when the Type C of the aluminium sheet that is untreated had been used in observation, under the state of " before installing ", peeling off the interface was FPC/Ad interface or mixing (mixture).But, under the state of " back is installed ", to peel off at the A1/Ad interface, the adhesive strength between aluminium stiffener and the propylene class bond layer is lower.And then under the moist environment of " back is installed " state, average peel strength is 352, compares significantly with the state of " before installing " to descend.Consider that its reason is, hydrone is invaded the bonding interface between aluminium stiffener and the propylene class bond layer, and this hydrone reacts with the chemical bond of performance adhesive strength, and thus, crosslink density reduces.
In addition, for having used boehmite to handle the type D of aluminium sheet, under the state before installation, peel off the adhesive strength height between aluminium stiffener and the propylene class bond layer at the FPC/Ad interface.But as shown in table 1, under the moist environment of the state after the installation, the standard deviation of peel strength is 123, and deviation is bigger, instability.This means that tear the little sample of intensity and become many, productivity ratio descends.
From the evaluation result of above-mentioned peel strength as can be known, implemented in use under the situation of the type A of the aluminium stiffener that the zirconia chemical synthesis handles and type B, with whether to contain silica irrelevant, under any condition (" before installing ", " back is installed ", " drying ", " moistening "), can both stablize to obtain abundant peel strength.Thus, according to present embodiment, verified the FPC substrate of the band stiffener of performance sufficient adhesion strength under the environment that can access supposition in actual applications.
More than, embodiments of the present invention and embodiment are illustrated.As mentioned above, in embodiments of the present invention, the metallic plate that is made of aluminium is implemented chemical synthesis handle, form on its surface and contain zirconic chemical synthesis diaphragm.Then, will implement the metallic plate that chemical synthesis handles via propylene class bonding agent is bonded on the FPC substrate.Then, the punching press of carrying out the short time of rapid shaping mode is handled and the back cured.Thus, contain hydroxyl and the carboxyl in the propylene class bonding agent or the hydroxyl generation chemical reaction on zirconic chemical synthesis diaphragm surface, consequently, form firm key to high-density.This key constitutes the crosslinked of the interface of crossing over chemical synthesis diaphragm and propylene class bond layer.Consequently, according to the present invention, even under the situation that adopts the rapid shaping mode, also can access high adhesive strength.
And then the bonding force that constitutes aforesaid crosslinked key is strong, the influence of the hydroxyl that is not subjected to hydrone and is had, so, under moist environment, also can guarantee sufficient cementability.That is,, can access high water-fast cementability according to the present invention.
In addition, chemical synthesis of the present invention is not handled can cause bad influence to environment as having used chromic chromate processing, and it is no problem to utilize on industry.
In addition, in the above description, the FPC substrate as the band stiffener has exemplified the FPC unit that is used for HDD, and still, the present invention is not limited to this, can be applicable to the FPC substrate of the band stiffener of any purposes.
In addition, in the above description, used aluminium sheet as stiffener, still, the present invention is not limited to this, also can use and can carry out other metallic plates that the zirconia chemical synthesis is handled.
Based on above-mentioned record, if perhaps those skilled in the art then can expect effect of appending of the present invention or various distortion, still, mode of the present invention is not limited to above-mentioned execution mode.In the scope of the content that does not break away from the technical scheme defined and notion thought of the present invention that derives from its equivalent and aim, can carry out variously appending, changing and the part deletion.
Claims (10)
1. the flexible printed circuit substrate with stiffener is characterized in that, has:
Flexible printed circuit substrate, the wiring pattern that has basement membrane and form at least one face of described basement membrane;
Metallic plate is strengthened described flexible printed circuit substrate, contains zirconic chemical synthesis diaphragm having with the opposed mask of described flexible printed circuit substrate, and is bonded on the described basement membrane via propylene class bond layer.
2. the flexible printed circuit substrate of band stiffener as claimed in claim 1 is characterized in that,
Described metallic plate is an aluminium sheet.
3. the flexible printed circuit substrate of band stiffener as claimed in claim 1 or 2 is characterized in that,
Described chemical synthesis diaphragm contains silicon.
4. the flexible printed circuit substrate of band stiffener as claimed in claim 1 is characterized in that,
Described metallic plate is bonded on the diaphragm that described wiring pattern insulation is covered rather than is bonded on the described basement membrane.
5. the flexible printed circuit substrate with stiffener is characterized in that, has:
Flexible printed circuit substrate has: first installation region and second installation region, contain the welding disk that forms on the surface of basement membrane; Wiring zone, being provided with by the mode of described first installation region and the second installation region clamping, and, comprise the wiring that the described welding disk with the described welding disk of described first installation region and described second installation region is electrically connected;
Propylene class bond layer is formed on the back side of the described basement membrane of described first installation region and/or described second installation region;
The aluminium stiffener contains zirconic chemical synthesis diaphragm having with the opposed mask of described flexible printed circuit substrate, and is bonded on the described basement membrane via described propylene class bond layer.
6. the flexible printed circuit substrate of band stiffener as claimed in claim 5 is characterized in that,
Described chemical synthesis diaphragm contains silica.
7. as the flexible printed circuit substrate of claim 5 or 6 described band stiffeners, it is characterized in that,
Has the preamplifier IC that is installed on the described weld part.
8. the manufacture method with the flexible printed circuit substrate of stiffener is characterized in that,
Contain zirconic chemical synthesis diaphragm in the formation of the surface of aluminium sheet,
The described aluminium sheet that will be formed with described chemical synthesis diaphragm is layered on the plastic film of flexible printed circuit substrate with the mode that described propylene class bond layer contacts with described chemical synthesis diaphragm via propylene class bonding agent; thus; formation via described propylene class bonding agent stacked the duplexer that forms of described aluminium sheet and described plastic film
Use decompressor to carry out the punching press of described duplexer heating and pressurization is handled,
Use bake oven device, during growing, carry out back cured described duplexer heating than described punching press processing.
9. the manufacture method of the flexible printed circuit substrate of band stiffener as claimed in claim 8 is characterized in that,
Described chemical synthesis diaphragm is to form by described aluminium sheet being impregnated into added in the ammonia salt of fluorine zirconic acid or fluorine zirconic acid in the zirconia synthetic liquid that does not add phosphoric acid that hydrofluoric acid forms.
10. as claimed in claim 8 or 9 with the manufacture method of the flexible printed circuit substrate of stiffener, it is characterized in that,
As described plastic film, use polyimide film, polyester film, Polyethylene Naphthalate film, poly (ether sulfone) film, polyetherimde films, polyether-ether-ketone film or poly-parabanic acid film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010066135A JP5627906B2 (en) | 2010-03-23 | 2010-03-23 | Flexible printed circuit board with reinforcing plate and manufacturing method thereof |
| JP2010-066135 | 2010-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102202458A true CN102202458A (en) | 2011-09-28 |
| CN102202458B CN102202458B (en) | 2016-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110070508.5A Active CN102202458B (en) | 2010-03-23 | 2011-03-23 | Flexible printed circuit substrate with reinforcing plate and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5627906B2 (en) |
| CN (1) | CN102202458B (en) |
| TW (1) | TWI486103B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103561546A (en) * | 2013-11-10 | 2014-02-05 | 大连吉星电子有限公司 | Flexible printed circuit board and metal sheet hot-pressing attaching process |
| CN105530757A (en) * | 2014-09-29 | 2016-04-27 | 深圳崇达多层线路板有限公司 | Aluminum-based flexible circuit board manufacturing method |
| US11657841B2 (en) | 2021-06-23 | 2023-05-23 | Western Digital Technologies, Inc. | Flexible printed circuit offset finger stiffener |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105578728B (en) * | 2016-01-29 | 2018-04-06 | 上海温良昌平电器科技股份有限公司 | A kind of whole plate aluminium FPC and preparation technology with bearing bed signaling transfer point |
| CN105578729B (en) * | 2016-01-29 | 2018-04-06 | 上海温良昌平电器科技股份有限公司 | A kind of whole plate aluminium reinforcing flexible wiring board and technique |
| KR101832689B1 (en) * | 2016-08-12 | 2018-02-27 | 송인실 | Flexible illumination panel using rigid substrate |
| KR102045939B1 (en) * | 2018-02-01 | 2019-11-18 | 주식회사 테디코리아 | Manufacturing method of lens film for flexible illumination panel and flexible illumination panel having the same |
| JP7385177B2 (en) * | 2020-03-11 | 2023-11-22 | ウシオ電機株式会社 | Mirror device and light source device having the mirror device |
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| CN103561546A (en) * | 2013-11-10 | 2014-02-05 | 大连吉星电子有限公司 | Flexible printed circuit board and metal sheet hot-pressing attaching process |
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| CN105530757A (en) * | 2014-09-29 | 2016-04-27 | 深圳崇达多层线路板有限公司 | Aluminum-based flexible circuit board manufacturing method |
| CN105530757B (en) * | 2014-09-29 | 2018-05-11 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of aluminum-base flexible circuit board |
| US11657841B2 (en) | 2021-06-23 | 2023-05-23 | Western Digital Technologies, Inc. | Flexible printed circuit offset finger stiffener |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5627906B2 (en) | 2014-11-19 |
| TWI486103B (en) | 2015-05-21 |
| TW201218872A (en) | 2012-05-01 |
| CN102202458B (en) | 2016-11-23 |
| JP2011199126A (en) | 2011-10-06 |
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