CN102202458B - Flexible printed circuit substrate with reinforcing plate and manufacture method thereof - Google Patents
Flexible printed circuit substrate with reinforcing plate and manufacture method thereof Download PDFInfo
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- CN102202458B CN102202458B CN201110070508.5A CN201110070508A CN102202458B CN 102202458 B CN102202458 B CN 102202458B CN 201110070508 A CN201110070508 A CN 201110070508A CN 102202458 B CN102202458 B CN 102202458B
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Abstract
The present invention provides flexible printed circuit substrate and the manufacture method thereof that can apply to rapid shaping mode and the excellent band reinforcing plate of cementability.This circuit substrate has: flexible printed circuit substrate (2), has: installation region (2a) and installation region (2b), containing the weld part (22a, 22b) being formed on the surface of basement membrane (21)；Wiring area (2c), is set to mounted region (2a) and installation region (2b) clamping, including the wiring pattern (22) that the weld part (22a) of installation region (2a) and the weld part (22b) of installation region (2b) are electrically connected；Propylene class bond layer (3), is formed at the back side of the basement membrane (21) of the installation region (2a, 2b) of flexible printed circuit substrate (2)；Aluminium reinforcing plate (4), has containing zirconic chemical synthesis diaphragm (4a) at the mask opposed with flexible printed circuit substrate (2), is bonded on basement membrane (21) via propylene class bond layer (3).
Description
Technical field
The present invention relates to the flexible printed circuit substrate with reinforcing plate and manufacture method thereof.
Background technology
Hard disk drive (hereinafter referred merely to as " HDD ") is assembled with the actuator keeping magnetic head element portion
(actuator).This actuator rotates centered on rotary shaft, thus, by being wished that magnetic head element portion is positioned on disk
In the recording track hoped.This actuator is fixed with the FPC that the signal carrying out between magnetic head element portion and control circuit transmits
Unit.This FPC unit has flexible printed circuit substrate (hereinafter referred merely to as " FPC substrate ") and predetermined at this FPC substrate
The preamplifier IC that welding disk is installed.
The signal transmission that FPC substrate is controlled between circuit and preamplifier IC.Preamplifier IC utilizes and is claimed
Transmission for bend (flexure) connects up and is connected with magnetic head element portion, utilizes bend will export from preamplifier IC
Electric current send magnetic head element portion (for example, referring to patent document 1) to.
In recent years, due to the high speed of HDD, the transmission speed of data significantly accelerates.It is accompanied by this, preamplifier IC
Caloric value increases.Accordingly, as heat radiation countermeasure, arrange by thermal conductivity at the back side of the FPC substrate being provided with preamplifier IC
The reinforcing plate (for example, referring to patent document 2) that good metal is constituted.As such reinforcing plate, generally employing is made up of aluminium
Reinforcing plate (hereinafter referred to as " aluminium reinforcing plate ").
In order to this aluminium reinforcing plate lamination adhesive is manufactured the FPC substrate with reinforcing plate on FPC substrate, third can be used
The various bonding agents such as alkenes, epoxies, polyurethanes.Require the feelings of the purity (purity) of outgassing properties etc. in HDD purposes etc.
Under condition, use propylene class bonding agent.Propylene class bonding agent is identified as standard bonding agent in the purposes of HDD etc., to periphery
Non-polluting aspect also excellent.
In order to by aluminium reinforcing plate lamination adhesive on FPC substrate, need to the FPC base stacked together via bonding agent
Plate and aluminium reinforcing plate carry out the stamping process pressurizeed and heat.
For propylene class bonding agent, in order to manifest sufficient bonding force, in terms of material behavior, need the time of carrying out
The stamping process of long (for example, 45～120 minutes).Herein, the mode by the stamping process long time that so carries out
It is referred to as " long-time molding mode ".Decompressor price comparison for carrying out stamping process is high, and the quantity of introducing is limited.Cause
This, when decompressor is because, when 1 time stamping process is occupied for a long time, the production efficiency that there is the FPC substrate with reinforcing plate declines
Problem.
On the other hand, relatively above-mentioned long-time molding mode, exist stamping process time comparatively short mode (following,
It is referred to as " rapid shaping mode ").In this rapid shaping mode, the time making stamping process is that the short time, (10 minutes with bottom left
Right), after stamping process, the heat treatment of solidification process after being referred to as.Shaping in the stamping process of rapid shaping mode
Pressure and forming temperature are almost identical with the situation of the stamping process of long-time molding mode.At rear solidification after stamping process
Reason is for example carried out more than 150 DEG C and under conditions of more than 2 hours.
In the case of rapid shaping mode, the stamping process time is short, so, will not be long-time in 1 stamping process
Occupy decompressor.In addition, after stamping process, when taking out FPC substrate from decompressor, it is not necessary to reduce FPC substrate
Temperature.That is, the rear solidification process that temperature-fall period required in long-time molding mode can be omitted in and carry out subsequent processing.
Therefore, the holding time of decompressor shortens further.Additionally, for rear solidification is processed, such as use multiple baking oven simultaneously
Row is carried out such that it is able to process in a large number.Therefore, according to rapid shaping mode, compared with long-time molding mode, there is energy
Enough increase substantially the such advantage of production efficiency of the FPC substrate with reinforcing plate.
But, in the past in the case of applying rapid shaping mode, owing to pressing time (stamping process) is short, so, no
It is able to ensure that the suitable curing condition of propylene class bonding agent.As a result, there are the following problems: even if having carried out at rear solidification
After reason, sufficient cementability can not be obtained.Additionally, be known to by the cementation effect brought by the roughening of surface of aluminum plate in the past
The method that should improve cementability, but, even if in the case of using the method, can not be at normality (under ambient temperature and moisture)
Obtain sufficient adhesive strength (hereinafter referred to as " tear strength ").
And then, for the FPC substrate of the band reinforcing plate being produced by conventional rapid shaping mode, can be false
Under the moist environment of one of the use environment being set to FPC substrate, the cementability of aluminium reinforcing plate and FPC substrate significantly declines.That is,
In the prior art, the problem that there is also water-fast cementability difference.
Patent document 1: Japanese Unexamined Patent Publication 2007-287197 publication
Patent document 2: Japanese Unexamined Patent Publication 2002-314207 publication.
Content of the invention
The present invention proposes in view of the above problems, its object is to offer can be applied to rapid shaping mode and
The flexible printed circuit substrate of the excellent band reinforcing plate of cementability and manufacture method thereof.
According to the 1st aspect of the present invention, a kind of flexible printed circuit substrate with reinforcing plate is provided, has: flexible printing
Circuit substrate, has basement membrane and the wiring pattern being formed at least one face of described basement membrane；Metallic plate, to described flexible print
Brush circuit substrate is strengthened, and has at the mask opposed with described flexible printed circuit substrate and protects containing zirconic chemical synthesis
Cuticula, and be bonded on described basement membrane via propylene class bond layer.
According to the 2nd aspect of the present invention, a kind of flexible printed circuit substrate with reinforcing plate is provided, has: flexible printing
Circuit substrate, has: the first installation region and the second installation region, containing the welding disk being formed on the surface of basement membrane；Wiring
Region, is arranged in the way of being clamped by described first installation region and the second installation region, and, including by described first peace
The wiring of the described welding disk electrical connection of the described welding disk in dress region and described second installation region；Propylene class bond layer,
It is formed at the back side of the described basement membrane of described first installation region and/or described second installation region；Aluminium reinforcing plate, with
The opposed mask of described flexible printed circuit substrate has containing zirconic chemical synthesis diaphragm, and via described propylene class
Bond layer is bonded on described basement membrane.
According to the 3rd aspect of the present invention, provide the manufacture method of a kind of flexible printed circuit substrate with reinforcing plate,
The surface of aluminium sheet is formed contains zirconic chemical synthesis diaphragm, will be formed with the described aluminium sheet of described chemical synthesis diaphragm
It is layered in flexibility via propylene class bonding agent in the way of described chemical synthesis diaphragm contacts with described propylene class bond layer
On the plastic foil of tellite, thus, formation has been laminated described aluminium sheet and described plastics via described propylene class bonding agent
The duplexer of film, uses decompressor to carry out the stamping process to the heating of described duplexer and pressurization, uses baking oven to fill
Put, carry out the rear solidification process to the heating of described duplexer in the period longer than described stamping process.
In the present invention, the metallic plate being formed with on surface containing zirconic chemical synthesis diaphragm is used as flexibility print
The reinforcing plate of brush circuit substrate.The metallic plate with this chemical synthesis diaphragm is bonded in flexible print via propylene class bond layer
On brush circuit substrate.In the heating making propylene class bonding agent harden, containing in zirconic chemical synthesis diaphragm
Hydroxyl and the carboxyl in propylene class bonding agent or hydroxyl generation chemical reaction.Thus, firm chemical bond is formed to high-density.Should
Chemical bond constitutes the crosslinking at the interface crossing over chemical synthesis diaphragm and propylene class bond layer.Therefore, according to the present invention, even if
In the case of using rapid shaping mode, it is also possible to obtain high-adhesive-strength.
And then, for constituting above-mentioned crosslinked chemical bond, bonding force is strong, the hydroxyl not had by hydrone
Impact, even if thus can also ensure that sufficient cementability under moist environment.That is, in accordance with the invention it is possible to obtain high resistance to
Water cementability.
Brief description
Fig. 1 (a) is the sectional view of the FPC substrate of the band reinforcing plate of embodiments of the present invention, and (b) is the enforcement of the present invention
The upward view of the FPC substrate of the band reinforcing plate of mode.
Fig. 2 is the amplification view of the part A of Fig. 1 (a).
Fig. 3 (a) is the sectional view of the FPC unit of the band reinforcing plate of embodiments of the present invention, and (b) is the enforcement of the present invention
The sectional view of the FPC unit of the band reinforcing plate of the variation of mode.
Fig. 4 is the figure tearing experiment for explanation.
Fig. 5 is the figure of the surface state of the aluminium reinforcing plate after tearing experiment for explanation.
Wherein, description of reference numerals is as follows:
The 1 FPC substrate with reinforcing plate
2 FPC substrates (one side FPC substrate)
2' two-sided FPC substrate
2a, 2b installation region
2c wiring area
21 basement membranes (base film)
22nd, 22A, 22B wiring pattern
22a, 22b welding disk
23rd, 23A, 23B bond layer
24th, 24A, 24B cover layer (cover film)
3 propylene class bond layers
4 aluminium reinforcing plates
4a chemical synthesis diaphragm
100th, the 200 FPC unit with reinforcing plate
101 preamplifier IC
102 solder materials.
Detailed description of the invention
Below, referring to the drawings the FPC unit of the band reinforcing plate of embodiments of the present invention is illustrated.Additionally, to tool
There is the reference that the inscape mark of equal function is identical, and omit detailed description.Accompanying drawing is schematically to scheme, thickness
Different with real from the relation of planar dimension, the ratio etc. of the thickness of each layer.
The FPC substrate using the band reinforcing plate to embodiments of the present invention for the Fig. 1 illustrates.Fig. 1 (a) is to represent this reality
Executing the sectional view of the FPC substrate 1 of the band reinforcing plate of mode, Fig. 1 (b) is the upward view representing the FPC substrate 1 with reinforcing plate.
FPC substrate 1 with reinforcing plate has: FPC substrate 2, has wiring pattern on surface；Propylene class bond layer 3, if
Put the back side at FPC substrate 2；Aluminium reinforcing plate 4, is attached to the back side of FPC substrate 2 via this propylene class bond layer 3.
Knowable to Fig. 1 (a) and Fig. 1 (b), FPC substrate 2 is made up of installation region 2a, 2b and wiring area 2c.Installing zone
Territory 2a, 2b have welding disk 22a, 22b for installing electronic unit.Wiring area 2c is with mounted region 2a and installation region
The mode of 2b clamping is arranged, and, have for carrying out the wiring that the signal between installation region 2a and installation region 2b transmits.
Propylene class bond layer 3 is arranged between the basement membrane 21 of FPC substrate 2 and aluminium reinforcing plate 4.This propylene class bond layer
3 are to utilize pressurized treatments and heating and make the bonding agent of propylene class harden.
As described later in detail, aluminium reinforcing plate 4 is processed utilizing zirconium oxide synthetic liquid to implement chemical synthesis
Aluminium sheet is processed into predetermined shape.Therefore, for aluminium reinforcing plate 4, at least at the mask opposed with FPC substrate 2
Have containing zirconium oxide (ZrO2) chemical synthesis diaphragm 4a.
Knowable to Fig. 1 (a) and Fig. 1 (b), aluminium reinforcing plate 4 via propylene class bond layer 3 be attached to installation region 2a,
The back side of the FPC substrate 2 of 2b.That is, in the way of chemical synthesis diaphragm 4a contacts with propylene class bond layer 3, aluminium is strengthened
Plate 4 is attached to the back side of FPC substrate 2.This aluminium reinforcing plate 4 function as the reinforcing plate that FPC substrate 2 is strengthened,
The FPC substrate 2 making installation region 2a, 2b does not bends, and, as to the ministry of electronics industry installed at welding disk 22a, 22b
Heat sink that the heating of part is dispelled the heat and function.Additionally, do not attach at the back side of the FPC substrate 2 of wiring area 2c
Aluminium reinforcing plate 4.So, wiring area 2c has pliability.
Then, the detailed construction of FPC substrate 2 is illustrated.
Knowable to Fig. 1 (a), FPC substrate 2 has what the 21st, the basement membrane being made up of plastic foil was formed at the one side of this basement membrane 21
The cover layer 24 being made up of plastic foil that the 22nd, wiring pattern is arranged via bond layer 23.
Wiring pattern 22 is made up of conductive materials such as copper (Cu).Use metal covering etch, semi-additive process or printing
This wiring pattern 22 is formed as predetermined circuit pattern shape by methods etc..Knowable to Fig. 1 (a), a part for wiring pattern 22 not by
Cover layer 24 covers, and constitutes welding disk 22a, 22b for installing electronic unit.Additionally, this wiring pattern 22 can be via viscous
Connect oxidant layer to be stacked on basement membrane 21, it is also possible to be layered in not via bonding agent on basement membrane 21.
Cover layer 24 covers the wiring pattern 22 in addition to welding disk 22a, 22b via bond layer 23 insulation.Additionally,
As the material of this bond layer 23, the various bonding agents such as propylene class, epoxies, polyurethanes can be used.As described above, it is excellent
Choosing uses propylene class bonding agent excellent in terms of the non-polluting to periphery.
Additionally, the plastic foil being used as basement membrane 21 and cover layer 24, polyimide film, polyester can be enumerated
Film, PEN film, poly (ether sulfone) film, polyetherimde films, polyether-ether-ketone film, poly-parabanic acid film etc..
Then, Fig. 2 is used to illustrate the adhering state of FPC substrate 2 and aluminium reinforcing plate 4 in detail.This Fig. 2 represents figure
The amplification view of part A 1(a).
As in figure 2 it is shown, be formed on the surface of aluminium reinforcing plate 4 containing zirconic chemical synthesis diaphragm 4a.Further, with
Chemical synthesis diaphragm 4a is bonded in the mode on propylene class bond layer 3, by aluminium reinforcing plate 4 via propylene class bond layer 3
It is attached on basement membrane 21.It additionally, say more scrupulously, is naturally formed with aluminium aqua oxidation nitride layer on the surface of aluminium reinforcing plate 4 and (does not schemes
Show), this aluminium aqua oxidation nitride layer is formed with chemical synthesis diaphragm 4a.
Near the interface (Al/Ad) of propylene class bond layer 3 and chemical synthesis diaphragm 4a, to cross over the side at this interface
Formula is formed with firm chemical bond (crosslinked).Its reason is illustrated.
There is hydroxyl (OH yl) on the surface containing zirconic chemical synthesis diaphragm 4a to high-density.Carry out for
During the heating being bonded in aluminium reinforcing plate 4 on FPC substrate 2, the hydroxyl on chemical synthesis diaphragm 4a surface be coated in base
There is chemical reaction in carboxyl (COOH yl) contained in the propylene class bonding agent on film 21 or hydroxyl (OH yl).This chemical reaction
The result of (dehydration combines) is, at the near interface of chemical synthesis diaphragm 4a and propylene class bond layer 3, to be formed to high-density
The crosslinking being become by firm key-like with the expression such as "-C(=O)-O-", "-O-".Therefore, between aluminium reinforcing plate 4 and FPC substrate 2
Adhesive strength become big.
Then, the structure of the FPC unit with reinforcing plate is illustrated.
Fig. 3 (a) represents the sectional view of the FPC unit 100 with reinforcing plate.FPC unit 100 for this band reinforcing plate
Saying, preamplifier IC 1Ol is arranged on the pad of the installation region 2a of the FPC substrate 1 with reinforcing plate by use solder material 102
On portion 22a, 22a.In the FPC unit 100 of this band reinforcing plate, the heating of preamplifier IC 1Ol is by installation region 2a
The aluminium reinforcing plate 4 that attached of the back side of FPC substrate 2 dispel the heat.
Above, the FPC substrate 1 of band reinforcing plate of present embodiment and the FPC unit 100 with reinforcing plate are said
Bright.
Additionally, the FPC substrate with reinforcing plate is not limited to said structure.
For example, aluminium reinforcing plate 4 also can be provided only on the basement membrane 21 of any one party of installation region 2a or installation region 2b
The back side.
In addition, replace the one side only at basement membrane 21 to be formed with the FPC substrate 2 of wiring, it is possible to use at the table of basement membrane 21
Face and the back side are formed with the two-sided FPC substrate 2' of wiring.Fig. 3 (b) represents the band reinforcing plate when using two-sided FPC substrate 2'
The sectional view of FPC unit 200.Two-sided FPC substrate 2' has the wiring diagram being formed respectively on the surface of basement membrane 21 and the back side
Case 22A and 22B.The cover layer 24A that wiring pattern 22A and 22B is arranged via bond layer 23A and 23B respectively with
And 24B insulation protection.
In addition, as shown in Figure 3 (b), aluminium reinforcing plate 4 also can not lamination adhesive on basement membrane 21, and glue via propylene class
Connect oxidant layer 3 lamination adhesive on cover layer 24B.
Alternatively, it is also possible to replace cover layer 24, cover wiring pattern 22 with the seal coat that the resin by varnish shape is constituted
Predetermined part.This seal coat both can use printing process to be formed as desired pattern-like, or also can use
The light processing method that have employed photoresist is formed.In the case of making by light processing method, at basement membrane 21 and wiring diagram
The predetermined photosensitive resin film of part coating of case 22, then, is exposed to this resin film, develops, be patterned into desired
Shape, thus, formed seal coat.As the advantage using seal coat, following advantage can be enumerated: compared with cover layer,
High-precision composition can be carried out.Therefore, it is possible to accurately such as opening portion etc. is formed at desired position.In addition,
As required, it is also possible to use cover layer and seal coat simultaneously.For example, covering is used to the part requiring high-precision composition
Coating, uses cover layer to part in addition such that it is able to improve production efficiency.
Below, embodiments of the invention are described.Manufacture method to the FPC substrate of the band reinforcing plate of the present embodiment
Illustrate, then, the measurement result that tear strength is tested is described.
First, the one side of the basement membrane at polyimides for the preparation is laminated with the copper-clad plate of Copper Foil via bond layer.Then, at this
It after copper-clad plate overlaminate dry film (dry film), is exposed, develops.Thus, copper-clad plate defines predetermined negative film
The resist of pattern (negative pattern).Then, using this resist as mask, the Copper Foil of copper-clad plate is lost
Carve, form wiring pattern.Then, prepare to be coated with the cover layer of bonding agent at the one side of polyimide film, at this cover layer
Predetermined part forms opening portion.Then, it is laminated in the way of covering wiring pattern and is provided with the cover layer of opening portion.Now,
Laminated cover film in the way of the opening portion of cover layer needs, corresponding to welding disk etc., the part exposed.Through above-mentioned operation, system
Produce the FPC substrate of the present embodiment.Then, the manufacture method of aluminium reinforcing plate is illustrated.
First, prepare aluminium sheet, remove this aluminium sheet surface attachment oleaginous material (ungrease treatment) then,
After washing aluminium sheet, being impregnated in alkaline solution, (alkalescence is de-for the alumina layer of the surface self-assembling formation at aluminium sheet for the removing
Fat process) it then, after aluminium sheet being cleaned by water, is impregnated into the zirconium oxide synthetic liquid of faintly acid (about pH=5～6)
In.As zirconium oxide synthetic liquid, the zirconium compounds not adding phosphoric acid can be used.This does not add the zirconium chemical combination of phosphoric acid
Thing e.g. adds hydrofluoric acid in fluorine zirconic acid (or its ammonia salt)
Then, it, after mentioning aluminium sheet from zirconium oxide synthetic liquid and washing, is dried in an oven.Through before this
Operation, obtains being formed with the aluminium sheet containing zirconic chemical synthesis diaphragm on surface.Herein, made chemical synthesis guarantor
Sample containing silica and the sample both samples not containing silica in cuticula.Reason for this is that, at FPC base
In the purposes of plate, there is, in order to obtain rust-proof effect, the situation that requirement contains silicon, on the other hand, there is also requirement and do not contain silicon
Situation.
After above-mentioned chemical synthesis is processed, measure the thickness of the chemical synthesis diaphragm being formed on the surface of aluminium sheet, its knot
Fruit is, unrelated with whether containing silica, the thickness of chemical synthesis diaphragm is 5nm.
In order to compare with the aluminium sheet implementing chemical synthesis process, prepare not carry out the aluminium of chemical synthesis process
Plate (hereinafter referred to as " untreated aluminium sheet ") and carried out aluminium sheet that boehmite (boehmite) processes (hereinafter referred to as " boehmite
Process aluminium sheet ").Additionally, also implement above-mentioned ungrease treatment and alkalescence ungrease treatment to untreated aluminium sheet.In addition, vigorous nurse
It is the process that the surface to aluminium sheet for the hot water utilizing 80 DEG C～about 90 DEG C aoxidizes that stone is processed.
Measure the thickness of these alumina layers being formed on the surface of the aluminium sheet comparing, as a result, at untreated aluminium
Being 6nm in plate, processing in aluminium sheet at boehmite is 238nm.
Additionally, the thickness of above-mentioned chemical synthesis diaphragm and alumina layer is all to utilize sweep type to pass through electronic display
The value that micro mirror (Scanning Transmission Electron Microscope:STEM) measures.
Then, by 4 kinds of above-mentioned aluminium sheets, (chemical synthesis containing silica processes aluminium sheet, the chemistry not containing silica
Synthesis processes aluminium sheet, untreated aluminium sheet and boehmite process aluminium sheet) strike out predetermined shape respectively, as being used for being attached to
Aluminium reinforcing plate on FPC substrate.
Then, FPC substrate fabricated as described above and aluminium reinforcing plate are laminated via propylene class bonding agent, thus,
Formed and be laminated FPC substrate and the duplexer of aluminium reinforcing plate.Then, use decompressor etc. carry out to duplexer heating with
And the stamping process of pressurization.This stamping process uses rapid shaping mode, pressure be lMPa, temperature be 190 DEG C, the time be 5
Implement under conditions of minute.Then, use baking oven device etc., carrying out to duplexer heating with the period longer than stamping process
Rear solidification processes (temperature: 180 DEG C；Time: 3 hours).
Through above-mentioned operation, completing lamination adhesive respectively has 4 kinds of FPC bases with reinforcing plate of above-mentioned 4 kinds of aluminium reinforcing plates
The sample of plate.Hereinafter, for convenience of description, will employ and carry out the aluminium sheet of zirconium oxide chemical synthesis process (containing silica)
FPC substrate with reinforcing plate is referred to as type A, will employ the aluminium sheet carrying out zirconium oxide chemical synthesis process (not containing silica)
The FPC substrate of band reinforcing plate be referred to as type B, the FPC substrate employing the band reinforcing plate of untreated aluminium sheet is referred to as Type C,
The FPC substrate employing the band reinforcing plate that boehmite processes aluminium sheet is referred to as type D.
Below, the evaluation experimental of the tear strength (peel strength) being implemented these FPC substrates with reinforcing plate is described.
The evaluation experimental of tear strength is carried out on the basis of IPC standard (TM650 2.4.9.).Measuring temperature is 25 DEG C,
Peeling rate is 50(mm/ minute), as shown in Figure 4, at the shape being fixed on the aluminium reinforcing plate of the FPC substrate with reinforcing plate on platform
Under state, pull FPC substrate to tear angle 90 ° (directly in Fig. 4).
The result of the experiment of tear strength is shown in Table 1 below.
Table 1
" before installation " in table 1, the condition of " after installation " are illustrated." before installation " is to represent to have rated without overheated
The result of the FPC substrate of the band reinforcing plate of status of processes.On the other hand, " after installation " represent implement with and parts to FPC
The result of the FPC substrate of the band reinforcing plate installing the equal heat treatment of adjoint thermal process of substrate.As with parts, companion is installed
With thermal process, it is assumed that solder reflow process and owe dress (underfill) operation.Specifically, it is assumed that solder reflow process,
Carry out 220 DEG C, after the heat treatment of 5 minutes, it is assumed that owe dress operation, carry out 165 DEG C, the heat treatment of 30 minutes.
The condition of " being dried (Dry) " and " moistening (Soak) " in table 1 is illustrated." being dried (Dry) " represents often
Situation about testing under temperature is often wet, " moistening (soak) " expression is immersed in sample in warm water and carries out reality after (50 DEG C, 1 hour)
Situation about testing.In addition, " averagely " and " σ " in table 1 is mean value and the standard deviation (σ) of measured tear strength.
Sample number is 6 (N=6)
" stripping interface " in table 1 is illustrated." stripping interface " shape peeling off interface after tearing experiment should be represented
State.There are following three kinds of situations in the state peeling off interface: at aluminium reinforcing plate (Al) and propylene class bond layer (Adhesive)
The stripping at interface (Al/Ad), in the stripping and two of the basement membrane of FPC substrate and the interface (FPC/Ad) of propylene class bond layer
The mixing (Mixture) of person.Fig. 5 illustrates the state on the aluminium reinforcing plate surface after tearing experiment.Fig. 5 (a) represents at Al/Ad interface
Peeling-off situation, Fig. 5 (b) represents the situation peeling-off at FPC/Ad interface, and Fig. 5 (c) represents mixed at both interfaces
Close peeling-off situation.Peel off and occur at the relatively weak interface of adhesive strength.Thus, if peeling off interface is A1/Ad, then aluminium
The bonding force phase of the bonding force at the interface of reinforcing plate and propylene class bond layer and FPC substrate and the interface of propylene class bond layer
Ratio, relatively low.On the other hand, if peeling off interface is FPC/Ad, then the interface of aluminium reinforcing plate and propylene class bond layer
Bonding force is compared with the bonding force at FPC substrate and the interface of propylene class bond layer, of a relatively high.
As shown in table 1, for implement zirconium oxide chemical synthesis process type A and type B, " before installation " and
The mean value of the peel strength of " after installation " is all high, and deviation is also little.And then, " after installation " compares with " before installation ", peels off
Intensity improves.Consider that its reason is, anti-in the reactive group (hydroxyl) in chemical synthesis diaphragm and propylene class bond layer
The chemical reaction of Ying Ji (carboxyl, hydroxyl) as it is assumed that the heat treatment of installing component and carry out further, crosslink density uprises.
And then, with regard to implementing type A and the type B that zirconium oxide chemical synthesis is processed, under moist environment, peel off strong
Degree does not also decline, and can obtain the peel strength with same degree under normal wet environment.This is due to the crosslinked chemical bond of composition
Bonding force is strong, and this key will not be affected by the moisture invading bonding interface under moist environment.That is, crosslinked key tool is constituted
Have the bonding force more higher than the reactivity of the hydroxyl being had with hydrone, therefore, the band reinforcing plate of type A and type B
FPC substrate adhesive strength under moist environment does not also reduce.
On the other hand, as known from Table 1, when observing the Type C employing untreated aluminium sheet, in the state of " before installation "
Under, peeling off interface is FPC/Ad interface or mixing (mixture).But, in the state of " after installation ", send out at A1/Ad interface
Raw stripping, the adhesive strength between aluminium reinforcing plate and propylene class bond layer is relatively low.And then, at the moistening ring of " after installation " state
Under border, mean peel strength is 352, significantly declines compared with the state of " before installation ".Considering that its reason is, hydrone is invaded
Entering the bonding interface between aluminium reinforcing plate and propylene class bond layer, this hydrone occurs anti-with the chemical bond playing adhesive strength
Should, thus, crosslink density reduces.
In addition, for employing type D of boehmite process aluminium sheet, in the state of in a pre-installation, at FPC/Ad circle
Face is peeling-off, and the adhesive strength between aluminium reinforcing plate and propylene class bond layer is high.But, as shown in table 1, after mounting
Under the moist environment of state, the standard deviation of peel strength is 123, and deviation is relatively big, unstable.It means that tear strength is little
Sample become many, productivity ratio decline.
Knowable to the evaluation result of above-mentioned peel strength, implement, using, the aluminium reinforcement that zirconium oxide chemical synthesis is processed
In the case of type A of plate and type B, unrelated with whether containing silica, any condition (" before installation ", " after installation ",
" be dried ", " moistening ") under can stably obtain abundant peel strength.Thus, according to the present embodiment, demonstrate and can obtain
The FPC substrate of the band reinforcing plate of sufficient adhesive strength is played in the environment of actual application supposes.
Above, embodiments of the present invention and embodiment are illustrated.As described above, the embodiment party of the present invention
In formula, chemical synthesis process is implemented to the metallic plate being made up of aluminium, formed on its surface containing zirconic chemical synthesis protection
Film.Then, it is bonded in the metallic plate implementing chemical synthesis process on FPC substrate via propylene class bonding agent.Then, carry out
The stamping process of the short time of rapid shaping mode and rear solidification process.Thus, containing zirconic chemical synthesis diaphragm
The hydroxyl on surface and the carboxyl in propylene class bonding agent or hydroxyl generation chemical reaction, as a result, form to high-density firmly
Key.This key constitutes the crosslinking at the interface crossing over chemical synthesis diaphragm and propylene class bond layer.As a result, according to this
Bright, even if in the case of using rapid shaping mode, it is also possible to obtain high adhesive strength.
And then, the bonding force of the key constituting aforesaid crosslinking is strong, is not affected by the hydroxyl that hydrone is had, so,
Sufficient cementability is can also ensure that under moist environment.That is, in accordance with the invention it is possible to obtain high water-fast cementability.
As employed chromic chromate and processing, environment will not be caused in addition, the chemical synthesis of the present invention is processed
Bad influence, is industrially used without problem.
Additionally, in the above description, as the FPC substrate with reinforcing plate, the FPC unit for HDD is illustrated, but
It is that the present invention is not limited to this, the FPC substrate of the band reinforcing plate of any purposes can be applicable to.
In addition, in the above description, employ aluminium sheet as reinforcing plate, but, the present invention is not limited to this, it is also possible to
Use can carry out other metallic plates of zirconium oxide chemical synthesis process.
Based on above-mentioned record, if those skilled in the art, then perhaps it is conceivable that the effect adding of the present invention or
Various deformation, but, the mode of the present invention is not limited to above-mentioned embodiment.In the content without departing from technical scheme defined
And various additional, change and portion can be carried out in the range of the idea of the invention thought that its equivalent is derived and objective
Divide and delete.
Claims (10)
1. the flexible printed circuit substrate with reinforcing plate, it is characterised in that have:
Flexible printed circuit substrate, has basement membrane and the wiring pattern being formed at least one face of described basement membrane；
Metallic plate, strengthens to described flexible printed circuit substrate, at the mask opposed with described flexible printed circuit substrate
Have containing zirconic chemical synthesis diaphragm, and be bonded on described basement membrane via propylene class bond layer.
2. the flexible printed circuit substrate with reinforcing plate as claimed in claim 1, it is characterised in that
Described metallic plate is aluminium sheet.
3. the flexible printed circuit substrate with reinforcing plate as claimed in claim 1 or 2, it is characterised in that
Described chemical synthesis diaphragm contains silica.
4. the flexible printed circuit substrate with reinforcing plate as claimed in claim 1, it is characterised in that
Described metallic plate is bonded on the diaphragm covering the insulation of described wiring pattern rather than is bonded on described basement membrane.
5. the flexible printed circuit substrate with reinforcing plate, it is characterised in that have:
Flexible printed circuit substrate, has: the first installation region and the second installation region, containing formed on the surface of basement membrane
Welding disk；Wiring area, is arranged in the way of being clamped by described first installation region and the second installation region, and, including
The wiring that the described welding disk of described first installation region and the described welding disk of described second installation region are electrically connected；
Propylene class bond layer, is formed at described first installation region and/or the described basement membrane of described second installation region
The back side；
Aluminium reinforcing plate, has containing zirconic chemical synthesis diaphragm at the mask opposed with described flexible printed circuit substrate,
And it is bonded on described basement membrane via described propylene class bond layer.
6. the flexible printed circuit substrate with reinforcing plate as claimed in claim 5, it is characterised in that
Described chemical synthesis diaphragm contains silica.
7. the flexible printed circuit substrate of the band reinforcing plate as described in claim 5 or 6, it is characterised in that
There is the preamplifier IC being arranged on described welding disk.
8. the manufacture method with the flexible printed circuit substrate of reinforcing plate, it is characterised in that
Formed on the surface of aluminium sheet and contain zirconic chemical synthesis diaphragm,
The described aluminium sheet of described chemical synthesis diaphragm will be formed with via propylene class bonding agent with described chemical synthesis diaphragm
The mode contacting with described propylene class bond layer is layered on the plastic foil of flexible printed circuit substrate, thus, formed via
Described propylene class bonding agent has been laminated described aluminium sheet and the duplexer of described plastic foil,
Decompressor is used to carry out the stamping process to the heating of described duplexer and pressurization,
Use baking oven device, carry out the rear solidification process to the heating of described duplexer in the period longer than described stamping process.
9. the manufacture method of the flexible printed circuit substrate with reinforcing plate as claimed in claim 8, it is characterised in that
Described chemical synthesis diaphragm is to the addition of hydrogen in the ammonia salt of fluorine zirconic acid or fluorine zirconic acid by being impregnated into described aluminium sheet
The zirconium oxide synthetic liquid not adding phosphoric acid of fluoric acid is formed.
10. the manufacture method of the flexible printed circuit substrate with reinforcing plate as claimed in claim 8 or 9, it is characterised in that
As described plastic foil, use polyimide film, polyester film, PEN film, poly (ether sulfone) film, polyetherimide
Amine film, polyether-ether-ketone film or poly-parabanic acid film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010066135A JP5627906B2 (en) | 2010-03-23 | 2010-03-23 | Flexible printed circuit board with reinforcing plate and manufacturing method thereof |
| JP2010-066135 | 2010-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102202458A CN102202458A (en) | 2011-09-28 |
| CN102202458B true CN102202458B (en) | 2016-11-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110070508.5A Active CN102202458B (en) | 2010-03-23 | 2011-03-23 | Flexible printed circuit substrate with reinforcing plate and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5627906B2 (en) |
| CN (1) | CN102202458B (en) |
| TW (1) | TWI486103B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103561546B (en) * | 2013-11-10 | 2016-05-18 | 大连吉星电子有限公司 | Flexible PCB and sheet metal heat pressing type attachment process |
| CN105530757B (en) * | 2014-09-29 | 2018-05-11 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of aluminum-base flexible circuit board |
| CN105578728B (en) * | 2016-01-29 | 2018-04-06 | 上海温良昌平电器科技股份有限公司 | A kind of whole plate aluminium FPC and preparation technology with bearing bed signaling transfer point |
| CN105578729B (en) * | 2016-01-29 | 2018-04-06 | 上海温良昌平电器科技股份有限公司 | A kind of whole plate aluminium reinforcing flexible wiring board and technique |
| KR101832689B1 (en) * | 2016-08-12 | 2018-02-27 | 송인실 | Flexible illumination panel using rigid substrate |
| KR102045939B1 (en) * | 2018-02-01 | 2019-11-18 | 주식회사 테디코리아 | Manufacturing method of lens film for flexible illumination panel and flexible illumination panel having the same |
| JP7385177B2 (en) * | 2020-03-11 | 2023-11-22 | ウシオ電機株式会社 | Mirror device and light source device having the mirror device |
| US11657841B2 (en) | 2021-06-23 | 2023-05-23 | Western Digital Technologies, Inc. | Flexible printed circuit offset finger stiffener |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01275036A (en) * | 1988-04-27 | 1989-11-02 | Mitsubishi Alum Co Ltd | Aluminium core metallic foil placed laminating plate and method thereof |
| JPH02183589A (en) * | 1989-01-10 | 1990-07-18 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JP2005101041A (en) * | 2003-09-22 | 2005-04-14 | Nitto Denko Corp | Wiring circuit board |
| JP2007009057A (en) * | 2005-06-30 | 2007-01-18 | Nitto Denko Corp | Adhesive composition and adhesive sheet |
| JP2007203615A (en) * | 2006-02-02 | 2007-08-16 | Furukawa Sky Kk | Resin-coated aluminum sheet and its manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170033A (en) * | 1993-12-14 | 1995-07-04 | Sony Chem Corp | Flexible circuit board with reinforcing sheet |
| JP4706361B2 (en) * | 2005-07-11 | 2011-06-22 | 株式会社明電舎 | System stabilization device |
| JP4579789B2 (en) * | 2005-08-09 | 2010-11-10 | 日新製鋼株式会社 | Surface-treated stainless steel sheet with excellent adhesion durability |
-
2010
- 2010-03-23 JP JP2010066135A patent/JP5627906B2/en active Active
-
2011
- 2011-03-17 TW TW100109128A patent/TWI486103B/en active
- 2011-03-23 CN CN201110070508.5A patent/CN102202458B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01275036A (en) * | 1988-04-27 | 1989-11-02 | Mitsubishi Alum Co Ltd | Aluminium core metallic foil placed laminating plate and method thereof |
| JPH02183589A (en) * | 1989-01-10 | 1990-07-18 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JP2005101041A (en) * | 2003-09-22 | 2005-04-14 | Nitto Denko Corp | Wiring circuit board |
| JP2007009057A (en) * | 2005-06-30 | 2007-01-18 | Nitto Denko Corp | Adhesive composition and adhesive sheet |
| JP2007203615A (en) * | 2006-02-02 | 2007-08-16 | Furukawa Sky Kk | Resin-coated aluminum sheet and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102202458A (en) | 2011-09-28 |
| JP5627906B2 (en) | 2014-11-19 |
| TWI486103B (en) | 2015-05-21 |
| TW201218872A (en) | 2012-05-01 |
| JP2011199126A (en) | 2011-10-06 |
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