JP2005042117A - Laminated board and multilayer printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide laminated boards, multilayer printed circuit boards, prepregs and electronic products using those, which have small in-plane thermal expansion coefficient and low elasticity thermal stress. <P>SOLUTION: The laminated board can carry semiconductor elements and has a resin part having a sea island structure and an insulating layer composed of a fabric-reinforcing material, wherein in-plane thermal expansion coefficient of the insulating layer is 3.0-10 ppm/K and glass-transition temperature of the insulating layer is 150-300°C. Thereby, the in-plane thermal expansion coefficient and the elastic modulus of the laminated board, multilayer printed circuit board and prepreg are much decreased and, thereby, thermal stress of the mounted surface is largely decreased. And the reliability upon the connection to mounted element such as an LSI can be notably enhanced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a laminated board and a multilayer printed circuit board on which a semiconductor element can be mounted.

  Examples of the low thermal expansion multilayer substrate include a substrate having a ceramic score layer, a substrate obtained by spraying ceramics on a copper foil, and the thermal expansion coefficient in the plane direction is 10 ppm / K or less. However, in the case of ceramics, there is a problem in drilling workability when forming a through hole. On the other hand, in an organic substrate, it is known that the thermal expansion coefficient can be reduced by mixing an inorganic filler into a resin system. However, in this case, the elastic modulus is increased, which is not necessarily sufficient for reducing the stress.

  Conventionally, it is known that a low elastic modulus can be achieved by adding a rubber component to a resin component of a laminate (Japanese Patent Laid-Open No. 61-100446). In this case, a flexible substrate having excellent flexibility and toughness is provided by compatibilizing the resin and the rubber component. However, in this case, there is an effect in reducing the elastic modulus, but the thermal expansion coefficient tends to increase.

  In addition, as an example of applying a resin component, which is a combination of a matrix resin component typified by sea-island structure, and other components having poor compatibility, to a laminate, a layer made of a resin component having a sea-island structure is formed only on the substrate surface. It has been proposed to achieve a reduction in thermal stress during mounting by reducing the elastic modulus (Japanese Patent Laid-Open No. 4-356995). However, in this method, it is difficult to reduce the coefficient of thermal expansion in the in-plane direction of the substrate, and the effect on the characteristics of the entire substrate is extremely small.

JP-A-61-100446 JP-A-4-356955

  An object of the present invention is to provide a laminated board, a multilayer printed circuit board, a prepreg, and an electronic product using them, which have a low coefficient of thermal expansion and a low elastic modulus and a low thermal stress.

  In order to achieve the above object, the present invention provides the following means. The first means is a laminate on which a semiconductor element can be mounted, the laminate having an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and heat in the in-plane direction of the insulating layer. A laminate having an expansion coefficient of 3.0 to 10 ppm / K and a glass transition temperature of an insulating layer of 150 to 300 ° C.

  A second means is a multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure and a woven fabric reinforcing material. A multilayer printed circuit board having a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K and a glass transition temperature of the insulating layer of 150 to 300 ° C.

  A third means is a laminated board on which a semiconductor element can be mounted, the laminated board having an insulating layer composed of a resin portion having a sea-island structure, an inorganic filler, and a woven fabric reinforcing material, and the in-plane of the insulating layer A laminate having a thermal expansion coefficient in the direction of 3.0 to 10 ppm / K and a glass transition temperature of the insulating layer of 150 to 300 ° C.

  A fourth means is a multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure, an inorganic filler, and a woven fabric reinforcing material. A multilayer printed circuit board characterized in that the thermal expansion coefficient in the in-plane direction of the insulating layer is 3.0 to 10 ppm / K, and the glass transition temperature of the insulating layer is 150 to 300 ° C.

  A fifth means is a prepreg formed by impregnating a woven fabric reinforcing material with a resin component, wherein the resin component includes a resin portion having a sea-island structure, and the coefficient of thermal expansion in the in-plane direction of the cured prepreg is 3.0 to 3.0. A prepreg characterized by 10 ppm / K 2 and a glass transition temperature of 150 to 300 ° C.

A sixth means is a prepreg obtained by impregnating a woven fabric reinforcing material with a resin component, wherein the resin component includes a resin portion having a sea-island structure and an inorganic filler having an average particle size of 0.1 to 15 μm, The coefficient of thermal expansion in the in-plane direction is 3.0 to 10 ppm / K, and the glass transition temperature is 150 to
A prepreg characterized by being 300 ° C.

  A seventh means is a memory card in which a memory element is surface-mounted on a circuit board, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material. A memory card having a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K and a glass transition temperature of the insulating layer of 150 to 300 ° C.

An eighth means is a computer including a multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the insulating layer The coefficient of thermal expansion in the in-plane direction is 3.0 to 10 ppm / K, the glass transition temperature of the insulating layer is 150 to 300 ° C., and the signal transmission delay time is 1 to 15 ns / m.

  Ninth means is a communication device including a circuit board on which a semiconductor element can be mounted, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the in-plane of the insulating layer A communication device characterized in that a thermal expansion coefficient in a direction is 3.0 to 10 ppm / K, a glass transition temperature of an insulating layer is 150 to 300 ° C., and a weight is 10 g to 30 kg.

A tenth means is an electronic device including a circuit board on which a semiconductor element can be mounted, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the in-plane of the insulating layer Coefficient of thermal expansion in the direction is 3.0 to 10 ppm / K, and the glass transition temperature of the insulating layer is 150 to
An electronic device characterized in that the volume occupied by the electronic device is 1 to 50% at 300 ° C.

  The eleventh means is a laminated plate formed by laminating and bonding at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, and the woven fabric reinforcing material is configured such that material properties exhibit anisotropy. The laminate is characterized in that the resin is a continuous layer that has a sea-island structure and prevents contact between the layers of the woven fabric reinforcing material.

  The twelfth means is a laminated plate formed by laminating and bonding at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, and the woven fabric reinforcing material is configured such that material properties are anisotropic. The resin has a sea-island structure and is a continuous layer that prevents contact between the layers of the woven fabric reinforcing material. The thermal expansion coefficient in the in-plane direction of the laminate is 3.0 to 10 ppm / K, and the glass transition temperature. Is a laminate having a temperature of 150 to 300 ° C.

  In the present invention, a semiconductor element is an element having terminals for forming ICs and LSIs such as memory, logic, custom, and power transistors on a wafer made of a semiconductor such as Si and GaAs, and connecting to leads, bumps, and the like. is there. The element includes a packaged state such as a state in which it is covered and sealed with bare, resin, ceramics, or the like, or a state in which tape automatic bonding (TAB) is performed.

  In the present invention, a laminate is a structure obtained by laminating at least one prepreg, sheet or the like obtained by impregnating a woven fabric reinforcing material with a resin component and then pressure bonding and molding. Woven fabric reinforcing materials include glass (E glass, S glass, D glass, Q glass, etc.), cloth made of inorganic fibers such as titanium, sheet, polyamide, polyamideimide, polyimide, liquid crystalline polymer, aramid, etc. There are cloth cloth and sheet made of fiber, cloth cloth made of carbon fiber, cloth made of inorganic fiber, organic fiber and carbon fiber, and sheet. In addition, depending on the purpose of electromagnetic shielding, radiation resistance, improvement of mechanical strength, imparting electrical conductivity, etc., at least one of a sheet or cloth made of metal fibers, or metal fibers and inorganic fibers, organic fibers, or carbon fibers is used. It is also possible to use a composite cloth or sheet.

  In the present invention, the multilayer printed circuit board is a circuit board having wiring for mounting the semiconductor element or the like, and two or more wiring layers are formed, and the wiring layers are connected through a through hole or the like. As the wiring layer, a metal foil made of copper, silver, gold, aluminum, chromium, molybdenum, tungsten, etc., a circuit formed by plating, vapor deposition, or the like is used. In particular, copper is preferable and copper foil is good.

  In the present invention, the proportion of the resin varnish impregnated with the woven fabric reinforcing material is about 10 to 70% by weight of the woven fabric reinforcing material and about 30 to 90% by weight in terms of solid content of the varnish with respect to the total amount of both. It is. If the varnish is small, it is difficult to obtain a good prepreg and film. If the varnish is too large, it is difficult to make the thermal expansion coefficient in the in-plane direction within the range of 3.0 to 10 ppm / K. In addition, the reinforcing effect is reduced.

  The laminate of the present invention is suitable for wiring, for example, as a flexible wiring board and as an insulating film between circuits. For example, the flexible wiring board is used for wiring as follows.

  First, a glass cloth is impregnated with a varnish obtained by dissolving a resin compound in an organic solvent. Next, the solvent is evaporated in the dryer and the curing reaction is advanced a little to make a prepreg as a B-stage (semi-cured state, melts when heated). Next, a metal foil such as copper foil or aluminum foil is laminated on both sides of the prepreg to form a sandwich, or a metal foil is laminated only on one side of the prepreg, and the metal foil is adhered by thermocompression bonding, and at the same time, the impregnating resin is cured. . Next, resist ink is apply | coated to a copper foil surface in circuit shape, and resist ink is dried. Next, the copper foil other than the circuit is etched with a ferric chloride aqueous solution or the like. Next, the resist ink is removed and washed using an organic solvent such as methylene chloride. Finally, it is placed in a solder bath, and solder is attached to the necessary locations to complete the circuit.

  In order to provide such a use, the flexible substrate of the present invention is generally marketed in a semi-cured state (prepreg) or in a cured state after thermocompression bonding of a metal foil. The flexible substrate of the present invention includes any of such a semi-cured state and a cured state.

  In the multilayer printed circuit board of the present invention, the varnish in which the resin component is dissolved is applied on the printed wiring board on which the circuit is formed, and then the solvent is evaporated in a dryer and the curing is slightly advanced to form a B-stage. Thereafter, a metal foil such as a copper foil or an aluminum foil is laminated, and hot-pressed and cured and bonded, and a circuit is subsequently formed by the above-described method to form a multilayer printed board.

  In the present invention, impregnation of the woven fabric reinforcing material with resin is carried out one or more times using a horizontal or / and vertical impregnation coating machine with a commonly used resin solution (varnish). It can be manufactured by doing. Further, the impregnation treatment can be performed by coating the resin from one side or both sides of the woven fabric reinforcing material. Further, the impregnation treatment can be performed by previously superposing a solid resin sheet on the woven fabric reinforcing material and then heating or / and heating. If the dried prepreg or impregnated sheet is sticky, a release sheet can be optionally used in an appropriate step. As the release sheet, a cellulose-based paper or film coated with a release agent, a polypropylene film, a polyvinyl alcohol film, or the like can be used.

  In the present invention, the resin portion having a sea-island structure includes two or more types of resins and compounds having poor compatibility, resins and resins, or phase-separated resins such as polymers obtained by copolymerizing components having poor compatibility. Or it is a resin composition. In the resin composition, it is desirable to use one component having a lower elastic modulus than other components.

  As the resin composition, one having at least one component incompatible and having a sea-island structure is selected and used. For example, epoxy resin, unsaturated polyester resin, epoxy-isocyanate resin, maleimide resin, maleimide-epoxy resin, cyanate ester resin, cyanate ester-epoxy resin, cyanate ester-maleimide resin, phenol resin, diallyl phthalate resin, urethane resin And various thermosetting resins such as cyanamide resin and maleimide-cyanamide resin.

Examples of the compound and resin that are incompatible with the resin and can form a sea-island structure include silicon-containing compounds, fluorine-containing compounds, and polymers thereof. Representative examples of silicon-containing compounds include organosiloxanes and organopolysiloxanes having functional groups such as amino groups, carboxyl groups, epoxy groups, hydroxyl groups, pyrimidine groups, and carboxylic acids at the terminals or side chains. Representative examples of fluorine-containing compounds include perfluoroethers having functional groups such as amino groups, carboxyl groups, epoxy groups, hydroxyl groups, pyrimidine groups, isocyanate groups, and carboxylic acids at the terminals or side chains, PTFE, PFA, FEP, and PCTFE. , ETFE, ECTFE, PVDF, PVF and the like. The molecular weight of the polymer is preferably 10 ³ to 10 ⁶ . The polymer is effective for lowering the elastic modulus.

  In the present invention, the above resin composition having excellent heat resistance is particularly preferable in order to achieve a glass transition temperature of 150 to 300 [deg.] C., such as laminates, insulating layers of multilayer printed circuit boards and prepregs. In the present invention, the incompatible form may be either a non-reactive type or a reactive type, but a reactive type is preferred from the viewpoint of imparting heat resistance. For example, when an epoxy compound and a silicon-containing compound are used, a silicon-containing compound having an epoxy group or a group having reactivity with a hydroxyl group and an epoxy compound may be pre-reacted in the solution when the varnish is prepared. it can. At this time, a curing agent, an inorganic filler, and a coupling agent can be added.

  In the present invention, the glass transition temperature of the insulating layer is preferably 150 to 300 ° C. When the glass transition temperature is 150 ° C. or lower, it becomes difficult to sufficiently cope with reliability tests (for example, high temperature storage, thermal shock test, etc.) of products such as laminated boards and multilayer printed circuit boards. In addition, at 300 ° C. or higher, it is difficult to impart flexibility, and problems such as cracking and molding processing occur in the product.

  In the present invention, the coefficient of thermal expansion in the in-plane direction is the coefficient of thermal expansion within the bonding surface of the laminate. There are three types of thermal expansion coefficients within the bonding surface. When the prepreg is manufactured, the direction in which tension is applied to the woven fabric reinforcement during the coating process is the X direction, the direction perpendicular to this is the Y direction, and the 45 ° oblique direction is the bias direction. Generally, the thermal expansion coefficient is in the order of Y direction> bias direction> X direction. The bias direction of 45 degrees obliquely has the least influence of the woven fabric reinforcing material and the lamination bonding process. In the present invention, the thermal expansion coefficient in the bias direction is defined as the thermal expansion coefficient in the in-plane direction.

In the present invention, the coefficient of thermal expansion in the in-plane direction is preferably in the range of 3.0 to 10 ppm / K. The coefficient of thermal expansion of the semiconductor element (for example, silicon) is 3.0 to 4.0 ppm / K. Further, the thermal expansion coefficient of the sealing resin in the resin-encapsulated semiconductor device is also slightly larger than the value of silicon. In order to improve the connection reliability between a semiconductor element and a laminated board (or multilayer printed circuit board), it is effective to reduce the thermal stress generated between them, and for that purpose, the laminated board (or multilayer printed circuit board) By setting the thermal expansion coefficient in the in-plane direction to a range of 3.0 to 10 ppm / K, the difference between the thermal expansion coefficient of the laminated plate and the semiconductor element can be reduced. In addition, since the multilayer printed circuit board according to the present invention has a low thermal expansion coefficient without using ceramics as a constituent component, it is excellent in drilling workability (1).

(2) Excellent through-hole connection reliability due to excellent adhesion to plating.

(3) Weight reduction is possible.

(4) Since a low modulus of elasticity can be achieved at the same time as a low coefficient of thermal expansion, many parts with different coefficients of thermal expansion can be mounted on the same surface. The difference in thermal expansion coefficient can be covered with a low elastic modulus.

(5) Large area substrates can be manufactured using the same technology as before.
Effects such as can be obtained.

  The present invention is composed of a resin and a woven fabric reinforcing material, and the resin portion has a sea-island structure, the thermal expansion coefficient in the in-plane direction is 3.0 to 10 ppm / K, and the glass transition temperature is 150 to 300 ° C. By surface-mounting various components such as semiconductor elements using the circuit board, the circuit board has excellent drillability compared to conventional ceramic-containing substrates that are low thermal expansion substrates for surface mounting. In addition, since the adhesion to the plating is stronger than that of ceramics, an excellent effect can be obtained regarding the reliability of the through hole. In general, a ceramic circuit board has a low adhesiveness with a resin, and thus there is a problem in reliability of the interface.

  Since the circuit board obtained according to the present invention does not have such a heterogeneous interface, a highly reliable memory card can be provided. In addition, since the elastic modulus of the sea-island structure does not contain ceramics and is lower than that of unmodified, the thermal stress generated even when various parts with different thermal expansion coefficients are simultaneously mounted is small and excellent in connection reliability. Multifunctional memory cards can be provided.

  The thermal expansion coefficient of the thin and highly integrated semiconductor device package is approximately 6 ppm / K, which is almost the same as that of silicon. Therefore, it is composed of a resin and a woven fabric reinforcing material, and the resin part has a sea-island structure, the coefficient of thermal expansion in the in-plane direction is 3.0 to 10 ppm / K, and the glass transition temperature is 150 to 300 ° C. By using the circuit board to be used, it becomes possible to surface-mount the low-expansion coefficient highly integrated semiconductor element with high density while maintaining connection reliability. As a result, the signal transmission distance can be shortened, and a computer having an excellent processing speed with a signal transmission delay time of 1 to 15 ns / m can be obtained. In addition, miniaturization can be achieved by high-density mounting, and a computer with excellent portability can be provided.

Moreover, this invention is comprised from resin and a woven fabric reinforcement material, The resin part has a sea-island structure, the coefficient of thermal expansion of an in-plane direction is 3.0-10 ppm / K, and a glass transition temperature is 150-300 degreeC. By using high-density surface mounting of components such as semiconductor elements using a circuit board characterized by the above, it is possible to reduce the size and weight of 10 g to 30 kg and obtain a communication device with excellent portability. . Typical communication devices include mobile phones and portable radio devices. In addition, the sea-island substrate is lower in weight and effective in reducing the weight than the ceramic-containing substrate. In addition, since the elastic modulus of the sea-island substrate is significantly lower than that of ceramic-containing substrates and unmodified substrates, the thermal stress that occurs even when various parts with different thermal expansion coefficients are simultaneously mounted is small, and communication with excellent connection reliability. Equipment can be provided.
Therefore, a wide variety of communication devices can be obtained according to the purpose.

  Moreover, this invention is comprised from resin and a woven fabric reinforcement material, The resin part has a sea-island structure, the coefficient of thermal expansion of an in-plane direction is 3.0-10 ppm / K, and a glass transition temperature is 150-300 degreeC. By using high-density surface mounting of components such as semiconductor elements using a circuit board characterized by this, the car electronics equipment constructed thereby can occupy a small volume and can be used at high temperatures such as in engine rooms. A device excellent in environmental resistance at high humidity can be provided. Typical examples of such car electronics equipment include an engine control device and a navigation device. These are required to be installed in limited places where the environment is severe. Therefore, equipment using circuit boards made of sea-island resin can be downsized by high-density mounting, and since it does not contain ceramic material, it has fewer heterogeneous interfaces and excellent connection reliability. Therefore, it is suitable for the car electronics field.

  In the present invention, the thermal expansion coefficient and the elastic modulus of the resin can be simultaneously reduced by making the resin component a sea-island structure, that is, a phase separation structure, in a laminated plate made of a resin and a reinforcing material. As a manifestation mechanism, in the case of a phase separation resin having an island structure with a low elastic modulus, the elastic modulus of the resin of the matrix layer becomes smaller due to the workability with the island portion. Regarding the thermal expansion coefficient in the in-plane direction, the thermal expansion of the matrix crushes the island portion, and as a result, the thermal expansion of the entire resin is considered to be apparently small. In addition, the phase separation structure can simultaneously reduce both of these characteristics by various expression mechanisms.

  All of its expression mechanisms have not been fully elucidated.

  By reducing the in-plane thermal expansion coefficient and elastic modulus of the laminated board, multilayer printed circuit board, and prepreg, the thermal stress on the mounting surface can be significantly reduced, and the connection reliability with the mounted product can be greatly improved.

  Next, based on an Example, this invention is demonstrated in detail.

(Example 1)
88 parts by weight of a phenol novolac resin (Mitsui Toatsu, XL225-3L) as a curing agent and 100 parts by weight of an epoxy compound (Dainippon Ink Chemical Co., Ltd. EXA-1514), and amine-modified dimethylsiloxane (Tisso, PS513) 10 parts by weight was added to methyl ethyl ketone to prepare a varnish having a solid content of 50% by weight. Using this varnish, E glass cloth (100 μm thick) was impregnated and dried at 120 ° C. for 10 minutes to remove the solvent to obtain a prepreg. The resin content of the obtained prepreg was 70% by weight.

A copper foil (18 μm thick) was stacked on both sides of the obtained prepreg and heated and pressed by a press to obtain a laminate. The pressing conditions were a two-step reaction at 130 ° C. for 30 minutes and 180 ° C. for 60 minutes. The pressure was 20 kg / cm ² . The copper foil peel strength of the obtained laminate and the coefficient of thermal expansion in the in-plane direction after etching the copper foil were determined by the TMA method. For measuring the elastic modulus of the resin portion, resin powder was taken from the prepreg, and a resin plate was produced under the same press conditions as the laminated plate. The elastic modulus at room temperature of this sample was determined by viscoelasticity measurement.

(Example 2)
55 parts by weight of phenol novolac (Hitachi Kasei, H100) as a curing agent for 100 parts by weight of an epoxy compound (oilized shell, YX4000H), and 15 parts by weight of epoxy-modified polydimethylsiloxane (Toray Silicon, SF8413) as a low elastic modulus component The part was used as a resin component. At this time, as a preliminary reaction, a curing agent and an epoxy-modified polydimethylsiloxane were reacted in advance at 90 ° C. for 30 minutes in methyl isobutyl ketone. After cooling to room temperature, an epoxy compound was added to obtain a varnish having a solid content of 50% by weight. The obtained varnish was impregnated and coated on S glass cloth (70 μm thickness), and the solvent was removed by drying at 140 ° C. for 10 minutes to obtain a prepreg.

  A laminate and a resin plate were produced from the obtained prepreg in the same manner as in Example 1, and the characteristics were evaluated.

(Example 3)
100 parts by weight of maleimide compound (Mitsui Toatsu, bis (4-maleimidophenyl) methane) and 38 parts by weight of amine compound (Seika Wakayama, 2,2-bis (4- (4-aminophenoxy) phenyl) propane)) The resin component was 5 parts by weight of amine-modified polydimethylsiloxane (Tore Silicon, SF8418). As a preliminary reaction, 50 parts by weight of maleimide compound and amine-modified polydimethylsiloxane were reacted in dimethylformamide at 110 ° C. for 20 minutes, and the remaining maleimide compound and 50 parts by weight of amine compound were further reacted for 20 minutes to obtain a solid content of 40% by weight. The varnish was obtained. Further, 20 parts by weight of a fused silica filler (average particle size 10 μm) was dispersed and mixed with this. The obtained varnish was impregnated with D glass cloth (80 μm thick), and the solvent was removed by drying at 140 ° C. for 5 minutes and 145 ° C. for 5 minutes to obtain a prepreg.

  A laminate was prepared from the obtained prepreg in the same manner as in Example 1, and the characteristics were evaluated. The molding conditions were 130 ° C. for 30 minutes and 200 ° C. for 60 minutes.

(Example 4)
72 parts by weight of orthocresol novolak (Nippon Kayaku, OCN7000) as a curing agent and 100 parts by weight of an epoxy compound (Oilized shell, YX4000H), and both terminal carboxylic acid-modified perfluoroether (Monteferros, ZDIAC-2000) 10 parts by weight was used as the resin component. At this time, 1 part by weight of imidazole (Shikoku Chemicals, 2E4MZ) was added as a curing accelerator. A varnish having a solid content of 60% by weight was prepared using acetone as a solvent. The obtained varnish was impregnated with polyaramid cloth (70 μm thickness), and the solvent was removed by drying at 110 ° C. for 10 minutes and 120 ° C. for 15 minutes to obtain a prepreg.

  A laminate was prepared from the obtained prepreg in the same manner as in Example 1, and the characteristics were evaluated. The molding conditions were 130 ° C. for 30 minutes and 200 ° C. for 60 minutes.

(Comparative Example 1)
Using the epoxy compound of Example 1 and a phenol-based curing agent, a laminate and a resin plate having a uniform resin portion without a sea-island structure were produced except for polydimethylsiloxane, and the characteristics were evaluated.

(Comparative Example 2)
Using the maleimide compound, the amine compound, and the fused silica filler of Example 3, a laminate and a resin plate having a uniform resin portion without a sea-island structure were produced except for polydimethylsiloxane, and the characteristics were evaluated.

  Further, 100 device packages were each surface-mounted by soldering on a printed wiring board in which a predetermined circuit was formed on a copper clad laminate combined with a copper foil. Soldering was performed by heating reflow with a far infrared heater. This mounted product was tested for 100 cycles according to the MIL standard, and the number of defects in the solder joint after completion was measured.

(Example 5)
FIG. 1 shows the configuration of the laminate of the present invention.

  It can be obtained by laminating and bonding two prepregs dried by impregnating a woven fabric reinforcing material 1 with a resin portion 2 having a sea-island structure. In this configuration, since the woven fabric reinforcing material is present in all in the in-plane direction, the effect of reducing the coefficient of thermal expansion due to the sea-island structure in the in-plane direction can be maximized.

  There is no problem of adhesion at the interface between different phases in the composite material because the sea-island structure organic resin matrix exists continuously between the reinforcing materials.

(Comparative Example 3)
FIG. 2 shows the configuration of a conventional laminate.

  In this configuration, there is an effect of reducing the coefficient of thermal expansion in the in-plane direction.

(Comparative Example 4)
FIG. 3 shows a configuration of a conventional laminated board.

  In this configuration, the woven fabric reinforcing material is present as an independent body, and is isotropic throughout the laminate. Therefore, the effect of lowering the coefficient of thermal expansion due to the interaction with the sea-island structure cannot be fully utilized in the in-plane direction.

(Examples 6 to 8)
88 parts by weight of phenol novolak resin (Mitsui Toatsu, XL225-3L) as a curing agent and 100 parts by weight of an epoxy compound (Dainippon Ink Chemical, EXA-1514), and an amino group-terminated perfluoroether as a low elastic modulus component A varnish having a solid content of 50% by weight was prepared by adding 10, 20, and 50 parts by weight of a compound (manufactured by Mitsui Fluorochemical Co., Ltd.) to methyl ethyl ketone. Using this varnish, E glass cloth (100 μm thick) was impregnated and dried at 120 ° C. for 10 minutes to remove the solvent to obtain a prepreg. The resin content of the obtained prepreg was 70% by weight.

A copper foil (18 μm thick) was stacked on both sides of the obtained prepreg and heated and pressed by a press to obtain a laminate. The pressing conditions were a two-step reaction at 130 ° C. for 30 minutes and 180 ° C. for 60 minutes. The pressure was 20 kg / cm ² . The copper foil peel strength of the obtained laminate and the coefficient of thermal expansion in the in-plane direction after etching the copper foil were determined by the TMA method. For measuring the elastic modulus of the resin portion, resin powder was taken from the prepreg, and a resin plate was produced under the same press conditions as the laminated plate. The elastic modulus at room temperature of this sample was determined by viscoelasticity measurement.

Example 9
55 parts by weight of phenol novolak (Hitachi Kasei, H100) as a curing agent and 100 parts by weight of an epoxy compound (oilized shell, YX4000H), a carboxyl group-terminated perfluoroether compound (manufactured by Mitsui Fluorochemical Co., Ltd.) as a low elastic modulus component ) 15 parts by weight of resin component. At this time, as a preliminary reaction, a curing agent and an epoxy-modified polydimethylsiloxane were reacted in advance at 90 ° C. for 30 minutes in methyl isobutyl ketone. After cooling to room temperature, an epoxy compound was added to obtain a varnish having a solid content of 50% by weight. The obtained varnish is made of S glass cloth (70
A prepreg from which the solvent was removed by drying at 140 ° C. for 10 minutes was obtained.

  A laminate and a resin plate were produced from the obtained prepreg in the same manner as in Example 1, and the characteristics were evaluated.

The cross section of the laminated board of this invention is shown typically. The cross section of the conventional laminated board is shown typically. The cross section of the conventional laminated board is shown typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Woven fabric reinforcement, 2 ... Resin part which has sea island structure, 3 ... Dispersion (island) phase.

Claims (15)

  In a laminated board on which a semiconductor element can be mounted, the laminated board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the thermal expansion coefficient in the in-plane direction of the insulating layer is 3.0. A laminated board characterized by having a glass transition temperature of 10 to 10 ppm / K and an insulating layer having a glass transition temperature of 150 to 300 ° C.   In a multilayer printed circuit board on which a semiconductor element can be mounted, the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the in-plane direction of the insulating layer A multilayer printed circuit board having a coefficient of thermal expansion of 3.0 to 10 ppm / K and a glass transition temperature of an insulating layer of 150 to 300 ° C.   In a laminated plate on which a semiconductor element can be mounted, the laminated plate has an insulating layer composed of a resin portion having a sea-island structure, an inorganic filler, and a woven fabric reinforcing material, and a thermal expansion coefficient in an in-plane direction of the insulating layer The laminated board characterized by having a glass transition temperature of 150 to 300 ° C. of 3.0 to 10 ppm / K.   In a multilayer printed circuit board capable of mounting a semiconductor element, the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure, an inorganic filler, and a woven fabric reinforcing material. A multilayer printed circuit board having a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K and a glass transition temperature of the insulating layer of 150 to 300 ° C.   5. The laminated board and multilayer printed circuit board according to claim 1, wherein the resin portion having a sea-island structure contains an epoxy compound, at least one of a siloxane-containing compound and a fluorine-containing compound.   In a prepreg formed by impregnating a woven fabric reinforcing material with a resin component, the resin component includes a resin portion having a sea-island structure, and the coefficient of thermal expansion in the in-plane direction of the cured prepreg is 3.0 to 10 ppm / K. A prepreg having a transition temperature of 150 to 300 ° C.   In a prepreg formed by impregnating a woven fabric reinforcing material with a resin component, the resin component includes a resin portion having a sea-island structure and an inorganic filler having an average particle size of 0.1 to 15 μm, and is in the in-plane direction of the prepreg after curing. A prepreg having a coefficient of thermal expansion of 3.0 to 10 ppm / K and a glass transition temperature of 150 to 300 ° C.   In a memory card in which a memory element is mounted on a surface of a circuit board, the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the in-plane direction of the insulating layer A memory card having a coefficient of thermal expansion of 3.0 to 10 ppm / K and a glass transition temperature of an insulating layer of 150 to 300 ° C.   In a computer including a multilayer printed circuit board on which a semiconductor element can be mounted, the multilayer printed circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the insulating layer extends in the in-plane direction. A computer having a coefficient of thermal expansion of 3.0 to 10 ppm / K, a glass transition temperature of an insulating layer of 150 to 300 ° C., and a signal transmission delay time of 1 to 15 ns / m. In a communication device including a circuit board on which a semiconductor element can be mounted, the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the thermal expansion coefficient in the in-plane direction of the insulating layer Is 3.0 to 10 ppm / K, the glass transition temperature of the insulating layer is 150 to 300 ° C., and the weight is 10 g to
A communication device characterized by being 30 kg.   In an electronic device including a circuit board on which a semiconductor element can be mounted, the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and the thermal expansion coefficient in the in-plane direction of the insulating layer An electronic device characterized by having a glass transition temperature of 150 to 300 ° C. and an occupied volume of the electronic device of 1 to 50%.   The electronic device according to claim 11, wherein the electronic device is an automotive electronic device.   The electronic device according to claim 11, wherein the electronic device is an acoustic device.   In a laminate obtained by laminating and bonding at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, the woven fabric reinforcing material is configured such that material properties are anisotropic, and the resin is a sea island A laminate having a structure and a continuous layer that prevents contact between layers of the woven fabric reinforcing material. In a laminate obtained by laminating and bonding at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, the woven fabric reinforcing material is configured such that material properties are anisotropic, and the resin is a sea island It is a continuous layer having a structure and preventing contact between the layers of the woven fabric reinforcing material, the thermal expansion coefficient in the in-plane direction of the laminate is 3.0 to 10 ppm / K, and the glass transition temperature is 150 to 300 ° C. The laminated board characterized by being.

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