JPH088306A - Tab tape applied with adhesive - Google Patents

Abstract

PURPOSE:To ensure stabilized adhesion by setting the ratio of (curing reaction heating value of an adhesive layer abutting on a protective film)/(curing reaction heating value of an adhesive layer abutting on a flexible insulating film) higher than 1 thereby preventing foaming during the step for heating the adhesive. CONSTITUTION:An adhesive layer 2, comprising at least two layers, is sandwiched between a basic material, i.e., a flexible insulating film 1, and a protective film 3. In such tape, the ratio of (curing reaction heating value of an adhesive layer 2 abutting on the protective film 3)/(curing reaction heating value of the adhesive layer 2 abutting on the flexible insulating film 1) is set higher than 1. Consequently, when the TAB tape applied with adhesive is laminated on a copper foil, foaming can be prevented during the heating step of adhesive and thereby insufficient adhesion can be prevented without sacrifice of conventionally required reliability, chemical resistance, etc., even if the lamination is effected under low temperature and low pressure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape with an adhesive used for a tape for mounting a semiconductor integrated circuit (hereinafter referred to as "TAB tape") called a TAB (Tape Automated Bonding) system. . Above all,
It exhibits excellent performance in a tape processing operation such as a laminating step for adhering a tape with an adhesive for TAB and a copper foil.

[0002]

2. Description of the Prior Art The basic structure of a TAB tape is, as shown in FIG. 2, usually based on a flexible insulating film 1 made of polyimide or the like as a base material, on which a mixed system of polyamide resin and epoxy resin ("polyamide / polyamide / Abbreviated as "epoxy", and hereinafter "□□□ / △△△ system" means a mixed system of □□□ and Δ △△) Through a thermosetting adhesive 2 such as an adhesive. It consists of a conductor such as copper foil bonded together. These adhesives are required to have various properties such as adhesiveness, insulation reliability and chemical resistance.

The adhesive tape for TAB is usually produced by the following method.

First, an adhesive resin mixed solution is applied to the first release film and dried, and then a second release film is attached to the first release film if necessary. Next, slit to a target width. This is placed on a flexible insulating film such as polyimide that is slit in advance to a desired width, and the first or second
Peel off the release film and stick the adhesive side. As another method, directly on the flexible insulating film,
A release film (protective film) may be laminated by applying and drying the adhesive resin mixed solution in a predetermined width.

Each of the adhesive tapes for TAB produced by the above method has a structure in which a flexible insulating film, an adhesive and a protective film are laminated in this order, but the protective film is dustproof or easy to handle. It is used for the purpose of. As the protective film, polyethylene, polypropylene, polyethylene terephthalate, polyphenylene sulfide, etc. are preferably used.

On the other hand, a TAB tape for mounting an IC is manufactured by using the above-described adhesive-attached tape through the following steps, and the IC is mounted on the TAB tape thus obtained.

Punching process for sprocket holes, device holes, etc., protective film removal / copper foil laminating process, adhesive heat curing process, photoresist coating / pattern exposure / development process, copper foil pattern etching process, photoresist stripping process, ( If necessary, solder resist application process), plating process (tin, solder, gold, etc.).

In the copper foil laminating step, as a condition for laminating the tape with the adhesive for TAB and the copper foil, usually, in order to remove the moisture in the flexible insulating film or the adhesive, the adhesive for TAB is attached before lamination. 18 tapes
Vacuum drying for more than an hour or heating (preheating) the adhesive tape for TAB at 50 to 200 ° C. for 30 to 120 seconds immediately before laminating, and then increasing the temperature to 140 to 1
Lamination is performed under the conditions of 60 ° C. and a pressure of 3 to 4 kg / cm.

On the other hand, conventionally, as a TAB adhesive for a TAB tape, a polyamide / epoxy-based adhesive (JP-A-53-1) is used.
No. 34365, Japanese Patent Publication No. 58-30755),
Polyamide / epoxy / polyparavinylphenol system (JP-A-2-15664), polyamide / epoxy / phenol system (JP-A-2-143447, JP-A-3-217035), and a multilayer adhesive layer. An example of using a structured product (Japanese Patent Laid-Open No. 3-225935) is known in recent years. Due to the demand for small, thin, lightweight, and high-performance packages for electronic devices, high integration of electronic components,
High reliability and high density have been especially demanded, and thus TAB tapes are also required to have strict dimensional accuracy. Therefore, in order to obtain highly reliable dimensional accuracy in the TAB tape, it is necessary to perform the laminating step of adhering the adhesive tape for TAB and the copper foil under a laminating condition of lower temperature and lower pressure than ever before. A tape with an adhesive for TAB that can handle this is needed, and in order to produce a TAB tape with strict dimensional accuracy, in the copper foil laminating process, the purpose is to reduce the expansion and contraction of the film due to moisture and heat as much as possible. Eliminates heating of the adhesive tape just prior to vacuum drying and laminating and lower temperature (120
Lamination under the conditions of (° C. or less) and pressure (2 Kg / cm or less) has become necessary.

[0010]

However, the conventionally known polyamide / epoxy system (JP-A-53-53)
No. 134365, Japanese Patent Publication No. 58-30755), polyamide / epoxy / polyparavinylphenol system (JP-A-2-15664), polyamide / epoxy / phenol system (JP-A-2-143447, JP-A-3-14347). No. 217035), or a TAB adhesive having a multilayer structure of an adhesive layer (Japanese Patent Laid-Open No. 3-225935), and a TAB tape for high-density packaging that requires strict dimensional accuracy. In order to produce, when the metal foil is laminated under the condition of low temperature and low pressure, the adhesive is not sufficiently embedded in the unevenness of the copper foil, resulting in problems such as poor adhesion or during the adhesive heating step after lamination. Moisture in the flexible insulating film causes foaming in the adhesive, resulting in poor appearance and poor adhesion at the foamed part. It was often a to inhibit the stability of the adhesive strength.

Therefore, an object of the present invention is to laminate a tape with an adhesive for TAB and a copper foil at a low temperature,
Even when laminated under a low pressure condition, foaming or adhesive failure may occur during the heating process of the adhesive without impairing the insulation reliability and chemical resistance required conventionally. It is another object of the present invention to provide a tape with an adhesive for TAB that can obtain a TAB tape with high reliability and dimensional accuracy.

[0012]

The object of the present invention is as follows.
A tape having an adhesive for TAB, which has a basic structure in which a flexible insulating film, a thermosetting adhesive layer composed of at least two layers, and a protective film are laminated in this order,
The thermosetting adhesive layer composed of at least two layers comprises at least an adhesive layer in contact with the protective film and an adhesive layer in contact with the flexible insulating film, and (curing of the adhesive layer in contact with the protective film Reaction heat value) /
The adhesive tape for TAB is characterized in that the ratio of (the amount of heat generated by the curing reaction of the adhesive layer in contact with the flexible insulating film) exceeds 1.

Further, a schematic cross section showing one embodiment of the adhesive tape for TAB according to the present invention is as shown in FIG.
Cover film 3 based on flexible insulating film 1
And an adhesive layer 2 composed of at least two layers. In addition, the adhesive layer of the schematic diagram is shown to consist of two layers.

As the flexible insulating film used in the present invention, a so-called heat resistant film such as polyimide, polyetherimide, aromatic polyamide, or polyethylene terephthalate, or a composite material such as flexible epoxy / glass cloth can be used. .

As the thermosetting adhesive composed of at least two layers in the present invention, (the heat of curing reaction of the adhesive layer in contact with the protective film) / (curing of the adhesive layer in contact with the flexible insulating film) It is necessary that the ratio of the reaction heat value) exceeds 1. Further, it is preferably 1.05 or more, more preferably 1.1 or more. The ratio of (the amount of heat generated by the curing reaction of the adhesive layer in contact with the protective film) / (the amount of heat generated by the curing reaction of the adhesive layer in contact with the flexible insulating film) is 1
In the following cases, foaming occurs in the adhesive during the adhesive heating step when laminated with the copper foil without vacuum drying and heating immediately before lamination. In the thermosetting adhesive layer composed of at least two layers, the ratio of (thickness of the adhesive layer in contact with the protective film) / (thickness of the adhesive layer in contact with the flexible insulating film) is The range is preferably from 0.1 to 1.5, more preferably from 0.2 to 1.2. If it exceeds 1.5, the adhesive tends to foam during the adhesive heating step. Furthermore, the adhesive layer in contact with the protective film is made of a mixture of a thermoplastic resin and a thermosetting resin, and the weight composition ratio of the thermoplastic resin / thermosetting resin in the adhesive is 0.5 to 1.5. And the heat value of the curing reaction of the adhesive layer in contact with the protective film is 30 to 2
It is preferably in the range of 00 mJ / g, 60 to 10
The range of 0 mJ / g is more preferable. When the weight composition ratio of the thermoplastic resin / thermosetting resin is less than 0.5 or exceeds 1.5, sufficient properties such as insulation reliability and chemical resistance required for the TAB tape are obtained. I can't get it. Further, if the heat of curing reaction of the adhesive in contact with the protective film is high, foaming is likely to occur in the adhesive during the adhesive heating process, and if the heat of reaction is too low, the adhesive sufficiently flows into the unevenness of the copper foil. No, it tends to cause poor adhesion.

The adhesive layer in contact with the flexible insulating film is made of a mixture of a thermoplastic resin and a thermosetting resin, and the weight composition ratio of thermoplastic resin / thermosetting resin in the adhesive is high. It is in the range of 0.2 to 3.5, and the calorific value of the curing reaction of the adhesive layer in contact with the protective film is 70 mJ /
It is preferably g or less, and more preferably 60 mJ / g or less. When the heating value of the curing reaction exceeds 70 mJ / g, it is not preferable because foaming is likely to occur in the adhesive during the adhesive heating step.

Various methods can be adopted as a method for controlling the amount of heat generated by the curing reaction of the adhesive layer.

(1) The adhesive composition of each layer is the same, and the adhesive layer of each layer is heat-treated at different temperatures for the same time or at the same heat-treatment temperature for different times, respectively, to cure the adhesive. A method of controlling the reaction heat value.

(2) The amount and / or type of the thermosetting resin of the adhesive layer of each layer is changed so that the heat of curing reaction of each layer of the adhesive of each layer is different even at the same temperature and the same treatment time. By controlling the amount of heat of curing reaction of the adhesive layer of each layer.

The heat treatment condition for controlling the heat generation amount of the curing reaction of the adhesive is preferably heat treatment at 100 ° C. or lower. This is because if the reaction rate of the adhesive is controlled by heat treatment at 100 ° C or more, the heat treatment time becomes extremely short, and it is difficult to practically control the heat generation amount of the curing reaction as desired. In order to make it easy, it is more preferable to heat-treat at a temperature of 90 ° C. or lower,
The range of 40 to 80 ° C is practically used. If it is 40 ° C. or lower, heat treatment for a long time is required to accelerate the reaction heat, so that productivity is lowered. The atmosphere for the heat treatment is not particularly limited, but from the practical point of view, an atmosphere selected from air, nitrogen, oxygen and argon, or a mixed atmosphere is preferable. Also, the amount of curing agent in each adhesive layer,
As a method of controlling by changing the amount of catalyst, the amount of cured resin, or each type, the amount and type are not limited as long as the characteristics of the adhesive are not deteriorated.

In the present invention, the heat value of the curing reaction means the heat of the thermosetting resin and the uncured portion obtained during the initial temperature rise from room temperature to 300 ° C. in a nitrogen atmosphere in differential scanning calorimetry. The value obtained as the peak area amount.

Of the adhesives used in the present invention, the adhesive layer in contact with the protective film can be used without particular limitation as long as it is a thermoplastic resin or a thermosetting resin. The thermoplastic resin is preferably a polyamide resin, a polyacrylonitrile butadiene copolymer, a polyimide resin, a novolac type phenol resin, a polyester resin, a polyurethane resin, a polystyrene resin, an alkyd resin, or a single or mixture selected from silicone resins. Can be used. The thermosetting resin is preferably an epoxy resin, a resol type phenol resin, a polyimide resin or a butyral resin. Further, as a thermoplastic resin, it has a low softening point due to low temperature processability.
It is preferably 50 ° C. or less, and it is necessary that the TAB tape has high adhesive strength at high temperature, and that the thermosetting resin can be cured at low temperature and has excellent chemical resistance. Therefore, a polyamide resin is more preferably used as the thermoplastic resin, and an epoxy resin is more preferably used as the thermosetting resin. Furthermore, it is preferable that a phenol resin is contained in order to improve the overall characteristics. Polyamide resin has, among other things, three carbon atoms as the acid component of the raw material of the polyamide resin.
A dicarboxylic acid of 6 (so-called “dimmer acid” -containing one (so-called “dimer acid-based polyamide resin”) is preferable. Polyamide resin generally has a large water absorption rate, and therefore tends to have a low insulation resistance. This is because the use of dimer acid makes it possible to reduce the water absorption and increase the electric insulation when the degree of polymerization is high, and to make the adhesive easy to process into a flexible insulating film. Therefore, the type of the solvent is not particularly limited, but it is preferable that the solvent can be dissolved in the solvent.

As the adhesive layer in contact with the flexible insulating film, a thermoplastic resin and a thermosetting resin may be used alone, but the adhesiveness with the flexible insulating film is not limited. A mixture of a thermoplastic resin and a thermosetting resin is preferable in order to obtain the required higher properties as the TAB tape.

In addition, inorganic fine particles such as silica and alumina, or a known thermosetting resin curing agent such as amine and acid anhydride is added to at least one of the adhesive layers within a range that does not deteriorate the properties of the adhesive. Is also good.

The adhesive tape for TAB according to the present invention can also be used as an adhesive for FPC boards, fixing tapes for lead frames, coverlays, LOCs, heat spreaders and the like.

[0026]

EXAMPLES The contents of the present invention will be described in detail below with reference to examples.

The adhesive strength test in this example was conducted as follows.

<Measurement of Adhesive Strength> TAB tape for performance examination: conductor width 200 μm Measuring instrument: tensile tester manufactured by Orientec Co., Ltd. A conductor is peeled in 90 ° direction at a speed of 50 mm / min, and the peeling force at that time is measured. Generally, 1.0K
g / cm or more is required.

Example 1 The adhesive composition on the side in contact with the protective film having the following composition was dissolved in a methanol / monochlorobenzene mixed solution so that the solid concentration was 20% by weight, and then the polyethylene terephthalate film 1 to be the protective film was prepared. , Apply so that the dry film thickness is 8 μm, and use an air oven 1
After drying at 00 ° C. for 1 minute and at 180 ° C. for 2 minutes, the second protective film 1 was laminated and the adhesive tape 1 was prepared.

<Adhesive composition in contact with protective film> Polyamide resin 50 parts by weight (Henkel's "Macromelt 6900", dimer acid and hexamethylenediamine are the main components) Epoxy resin 30 parts by weight (Okaka Shell Ep828) Resol type phenol resin 20 parts by weight (PS2780 manufactured by Gunei Chemical Co., Ltd.) 4,4′-diaminodiphenyl sulfone 3 parts by weight

Next, the adhesive composition on the side in contact with the flexible insulating film having the following composition was dissolved in a methanol / monochlorobenzene mixed solution so as to have a solid content concentration of 20% by weight as described above, and then a polyethylene terephthalate film was prepared. It is applied to 2 so that the dry film thickness is 10 μm, and is dried at 100 ° C. for 1 minute and 180 ° C. for 2 minutes by using an air oven, and then the second protective film 2 is attached to the adhesive tape 2
It was created.

<Adhesive Composition in Contact with Flexible Insulating Film> Polyamide resin 50 parts by weight (“Macromelt 6900” manufactured by Henkel) Epoxy resin 40 parts by weight (Ep828 manufactured by Yuka Shell Co., Ltd.) Resol-type phenol resin 10 parts by weight (PS2780 manufactured by Gunei Chemical Co., Ltd.) 2-ethylimidazole 1 part by weight

Next, each of the adhesive tapes 1 and 2 was heat-treated at 60 ° C. for a predetermined time by using an air oven so that the curing reaction heat value shown in Table 1 was obtained. The adhesive tapes 1 and 2 thus obtained were bonded by thermocompression bonding while peeling off the second protective films 1 and 2, respectively. Next, the polyethylene terephthalate film 2 was peeled off, and a 75 μm-thick polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) was laminated by thermocompression bonding to prepare a tape with an adhesive for TAB.

The obtained tape with adhesive for TAB was used as 23
After conditioning the humidity for 24 hours under the conditions of ℃ and 65%, while peeling off the polyethylene terephthalate film 1, it was laminated with a 35 μm-thick electrolytic copper foil by roll lamination under the conditions of preheating room temperature, temperature of 120 ° C. and pressure of 1 Kg / cm. It was Subsequently, heat treatment was performed in an air oven under the conditions of 80 ° C. × 3 hours, 100 ° C. × 5 hours, and 150 ° C. × 5 hours to cure the adhesive.

A TAB tape for performance study was prepared using the obtained TAB tape.

Example 2 Table 1 shows the adhesive composition of each layer shown below, the thickness of each layer, and the curing reaction calorific value of the adhesive in contact with the protective film and the adhesive in contact with the flexible insulating film. Except for the above, the T for performance study is the same as in Example 1.
AB tape was made.

<Adhesive composition in contact with protective film> Polyamide resin 50 parts by weight (Henkel "Macromelt 6900") Epoxy resin 30 parts by weight (Yuka Shell Co. Ep828) Novolac phenolic resin 20 parts by weight Chemical company PSM4326) 4,4'-diaminodiphenyl sulfone 3 parts by weight

<Adhesive Composition in Contact with Flexible Insulating Film> 50 parts by weight of polyamide resin (“Macromelt 6900” manufactured by Henkel) Epoxy resin 40 parts by weight (Ep828 manufactured by Yuka Shell Co., Ltd.) 20 parts by weight of resol type phenolic resin (PS2780 manufactured by Gunei Chemical Co., Ltd.) 4,4′-diaminodiphenyl sulfone 3 parts by weight

Example 3 Regarding the adhesive in contact with the protective film and the adhesive in contact with the flexible insulating film, the adhesive composition shown below was used, and the heat generation amount of curing reaction shown in Table 1 A TAB tape for performance study was prepared in the same manner as in Example 1 except for the thickness of each layer.

<Adhesive composition in contact with protective film and adhesive composition in contact with flexible insulating film> 50 parts by weight of polyamide resin (“Macromelt 6900” manufactured by Henkel) Epoxy resin 30 parts by weight (Ep828 manufactured by Yuka Shell Co., Ltd.) ) Resol-type phenol resin 20 parts by weight (PS2780 manufactured by Gunei Chemical Co., Ltd.) 4,4'-diaminodiphenyl sulfone 3 parts by weight

Example 4 The adhesive composition on the side in contact with the protective film having the following composition was dissolved in a methanol / monochlorobenzene mixed solution so that the solid concentration was 20% by weight, and then the polyethylene terephthalate film 1 to be the protective film was prepared. , Apply so that the dry film thickness is 8 μm, and use an air oven 1
After drying at 00 ° C for 1 minute and at 180 ° C for 2 minutes, the side of the side contacting with the flexible insulating film having the following composition dissolved in a methanol / monochlorobenzene mixed solution so that the solid content concentration becomes 25% by weight. The adhesive composition was applied and dried at 100 ° C. for 1 minute and 180 ° C. for 2 minutes using an air oven, and then the second protective film 1 was attached. Next, the second protective film 1 was peeled off, and the laminated adhesive tape 3 was prepared by thermocompression bonding. Next, while peeling off the polyethylene terephthalate film 2, a 75 μm thick polyimide film (“UPILEX” 7 manufactured by Ube Industries, Ltd.)
5S) was attached by thermocompression bonding to prepare a tape with an adhesive for TAB. The obtained tape with adhesive for TAB was used to prepare a TAB tape for performance examination in the same manner as in Example 1.

<Adhesive composition in contact with protective film> Polyamide resin 50 parts by weight ("Macromelt 6900" manufactured by Henkel) Epoxy resin 20 parts by weight (Ep828 manufactured by Yuka Shell Co., Ltd.) Resol type phenolic resin 30 parts by weight (Kunei) Chemical company PS2780)

<Adhesive Composition in Contact with Flexible Insulating Film> 50 parts by weight of polyamide resin (“Macromelt 6900” manufactured by Henkel) Epoxy resin 40 parts by weight (Ep828 manufactured by Yuka Shell Co., Ltd.) 20 parts by weight of novolac type phenolic resin (PSM4326 manufactured by Gunei Chemical Co., Ltd.) 4, 4′-diaminodiphenyl sulfone 5 parts by weight

Comparative Examples 1 to 3 In the same manner as in Example 1 except that the thickness and curing reaction calorific value of the adhesive in contact with the protective film and the adhesive in contact with the flexible insulating film are shown in Table 1. A TAB tape for performance study was prepared.

Example 5 The TAB tapes obtained in Examples 1 to 4 and Comparative Examples 1 to 3 were tested by the above-mentioned method for measuring the adhesive strength and the presence or absence of foaming. The results are shown in Table 1.

[0046]

[Table 1]

As shown in Examples and Comparative Examples, for example, T
Using the conventional tape with adhesive for TAB proposed as an adhesive for AB, 24
After conditioning the humidity for a while, preheat room temperature, temperature 120 ℃,
It is laminated with an electrolytic copper foil having a thickness of 35 μm by a roll laminating method under a pressure of 1 Kg / cm, and then in an air oven at 80 ° C. × 3 hours, 100 ° C. × 5 hours, 150 ° C.
When the adhesive is cured by heat treatment under the condition of 5 ° C. × 5 hours, the adhesive strength is 0. because foaming occurs in the adhesive.
While it is unstable at 2 to 1.2 Kg / cm, when the thermosetting adhesive layer composed of at least two layers of the present invention is used, there is no foaming and it is stable at 1.0 Kg / cm or more. The dramatic effect of adhesive strength is observed. Further, the chemical resistance, electric insulation and the like required for the adhesive for TAB tape must be maintained in a well-balanced manner, but the adhesive of the present invention is also at a satisfactory level in these performances. Confirmed, TAB
It has been found that it can play a very important role industrially in the mounting field.

[0048]

EFFECTS OF THE INVENTION According to the present invention, a tape with an adhesive agent for TAB, which does not cause foaming during the heating process of the adhesive agent, can obtain a stable adhesive force, and can obtain a TAB tape with high reliability dimensional accuracy. Can be provided. Such TAB
The TAB tape made from the adhesive adhesive tape as a raw material has characteristics such as chemical resistance and insulating property similar to the conventional ones, and it is possible to obtain electronic components with high dimensional accuracy requiring high reliability. Therefore, it is a high-quality product that can be used as an electronic device application requiring a high-density package.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing one embodiment of a tape with an adhesive for TAB according to the present invention.

FIG. 2 is a schematic cross-sectional view showing the basic structure of a TAB tape.

[Explanation of symbols]

 1: Flexible insulating film 2: Adhesive 3: Protective film 4: Conductor

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location C09J 7/02 JKD JKE JKL JKT JKU JLE

Claims (9)

[Claims] 1. A TAB adhesive tape comprising a flexible insulating film, a thermosetting adhesive layer composed of at least two layers, and a protective film, which are laminated in this order, and is composed of at least two layers. The thermosetting adhesive layer is composed of at least an adhesive layer in contact with the protective film and an adhesive layer in contact with the flexible insulating film, and the (heat amount of curing reaction of the adhesive layer in contact with the protective film) /
A tape with an adhesive for TAB, characterized in that the ratio of (the amount of heat generated by the curing reaction of the adhesive layer in contact with the flexible insulating film) exceeds 1. 2. Among thermosetting adhesive layers composed of at least two layers, (thickness of adhesive layer in contact with the protective film) / (thickness of adhesive layer in contact with the flexible insulating film) The tape with adhesive for TAB according to claim 1, wherein the ratio is in the range of 0.1 to 1.5. 3. The adhesive layer in contact with the protective film comprises a mixture of a thermoplastic resin and a thermosetting resin, and the weight composition ratio of the thermoplastic resin / the thermosetting resin is 0.5 to 1.
5. The adhesive tape for TAB according to claim 1, wherein the adhesive layer in contact with the protective film has a heat value of curing reaction in the range of 30 to 200 mJ / g. 4. The adhesive layer in contact with the flexible insulating film is made of a mixture of a thermoplastic resin and a thermosetting resin, and the weight composition ratio of the thermoplastic resin / the thermosetting resin is 0.
2. The adhesive tape for TAB according to claim 1, wherein the adhesive layer in the range of 2 to 3.5 has a curing reaction heat value of 70 mJ / g or less in contact with the flexible insulating film. . 5. The adhesive tape for TAB according to claim 1, wherein the thermoplastic resin of the adhesive layer in contact with the protective film contains a polyamide resin as an essential component. 6. The tape with adhesive for TAB according to claim 1, wherein the thermosetting resin of the adhesive layer in contact with the protective film contains an epoxy resin as an essential component. 7. The adhesive tape for TAB according to claim 1, wherein the adhesive layer in contact with the protective film contains a phenol resin as an essential component. 8. The adhesive tape for TAB according to claim 5, wherein the polyamide resin of the adhesive layer in contact with the protective film contains a dicarboxylic acid having 36 carbon atoms as an essential component. 9. The tape with adhesive for TAB according to claim 1, wherein the protective film is polyethylene, polypropylene, polyethylene terephthalate or polyphenylene sulfide.