CN102197466A - 具微筛孔网屏的紫外线传送微波反射器 - Google Patents

具微筛孔网屏的紫外线传送微波反射器 Download PDF

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Publication number
CN102197466A
CN102197466A CN2009801424446A CN200980142444A CN102197466A CN 102197466 A CN102197466 A CN 102197466A CN 2009801424446 A CN2009801424446 A CN 2009801424446A CN 200980142444 A CN200980142444 A CN 200980142444A CN 102197466 A CN102197466 A CN 102197466A
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CN
China
Prior art keywords
micromesh
reflector
micromesh screen
screen
electroforming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801424446A
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English (en)
Chinese (zh)
Inventor
T·A·恩古耶
Y-H·杨
S·巴录佳
T·诺瓦克
J·C·罗查-阿尔瓦雷斯
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Applied Materials Inc
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Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN102197466A publication Critical patent/CN102197466A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Overhead Projectors And Projection Screens (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
  • Optical Elements Other Than Lenses (AREA)
CN2009801424446A 2008-10-21 2009-10-20 具微筛孔网屏的紫外线传送微波反射器 Pending CN102197466A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/255,578 2008-10-21
US12/255,578 US20100096569A1 (en) 2008-10-21 2008-10-21 Ultraviolet-transmitting microwave reflector comprising a micromesh screen
PCT/US2009/061380 WO2010048227A2 (en) 2008-10-21 2009-10-20 Ultraviolet-transmitting microwave reflector comprising a micromesh screen

Publications (1)

Publication Number Publication Date
CN102197466A true CN102197466A (zh) 2011-09-21

Family

ID=42107915

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801424446A Pending CN102197466A (zh) 2008-10-21 2009-10-20 具微筛孔网屏的紫外线传送微波反射器

Country Status (6)

Country Link
US (1) US20100096569A1 (https=)
JP (1) JP2012506639A (https=)
KR (1) KR20110084261A (https=)
CN (1) CN102197466A (https=)
TW (1) TW201113950A (https=)
WO (1) WO2010048227A2 (https=)

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CN104979166A (zh) * 2014-04-10 2015-10-14 应用材料公司 具有辐射源补偿的基座
CN114208392A (zh) * 2019-08-20 2022-03-18 应用材料公司 用于使用微波能量来处理基板的方法和设备

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US8936709B2 (en) 2013-03-13 2015-01-20 Gtat Corporation Adaptable free-standing metallic article for semiconductors
US9318364B2 (en) 2014-01-13 2016-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device metallization systems and methods
US11380557B2 (en) * 2017-06-05 2022-07-05 Applied Materials, Inc. Apparatus and method for gas delivery in semiconductor process chambers
KR101987172B1 (ko) * 2017-07-28 2019-06-10 주식회사 선익시스템 박막 증착용 마스크 제조 방법 및 이를 통해 제작된 증착 마스크
KR102000672B1 (ko) * 2017-07-28 2019-07-17 주식회사 선익시스템 박막 증착용 마스크 제조 방법 및 이를 통해 제작된 증착 마스크
US11649560B2 (en) 2019-06-20 2023-05-16 Applied Materials, Inc. Method for forming silicon-phosphorous materials
US11670491B2 (en) * 2020-07-15 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Radio frequency screen for an ultraviolet lamp system
US12187626B2 (en) * 2021-09-20 2025-01-07 Sudhish Madapur SWAIN Apparatus and method for purifying water
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979166A (zh) * 2014-04-10 2015-10-14 应用材料公司 具有辐射源补偿的基座
CN114208392A (zh) * 2019-08-20 2022-03-18 应用材料公司 用于使用微波能量来处理基板的方法和设备
CN114208392B (zh) * 2019-08-20 2024-04-05 应用材料公司 用于使用微波能量来处理基板的方法和设备

Also Published As

Publication number Publication date
KR20110084261A (ko) 2011-07-21
JP2012506639A (ja) 2012-03-15
TW201113950A (en) 2011-04-16
WO2010048227A2 (en) 2010-04-29
US20100096569A1 (en) 2010-04-22
WO2010048227A3 (en) 2010-07-15

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: American California

Applicant after: Applied Materials Inc.

Address before: American California

Applicant before: Applied Materials Inc.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110921