CN102181899A - 电解铜箔双面同步粗化的方法及设备 - Google Patents
电解铜箔双面同步粗化的方法及设备 Download PDFInfo
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- CN102181899A CN102181899A CN 201110110917 CN201110110917A CN102181899A CN 102181899 A CN102181899 A CN 102181899A CN 201110110917 CN201110110917 CN 201110110917 CN 201110110917 A CN201110110917 A CN 201110110917A CN 102181899 A CN102181899 A CN 102181899A
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- Prior art keywords
- copper foil
- groove
- electrolytic copper
- alligatoring
- solution
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 239000011889 copper foil Substances 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000007788 roughening Methods 0.000 title abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 239000000243 solution Substances 0.000 claims description 23
- 230000001360 synchronised effect Effects 0.000 claims description 21
- 239000008151 electrolyte solution Substances 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 230000003064 anti-oxidating effect Effects 0.000 claims description 7
- 210000005056 cell body Anatomy 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000009713 electroplating Methods 0.000 abstract description 7
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 239000003792 electrolyte Substances 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 210000004027 cell Anatomy 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000011326 mechanical measurement Methods 0.000 description 3
- 230000003245 working effect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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CN2011101109173A CN102181899B (zh) | 2011-04-29 | 2011-04-29 | 电解铜箔双面同步粗化及固化的方法及设备 |
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CN2011101109173A CN102181899B (zh) | 2011-04-29 | 2011-04-29 | 电解铜箔双面同步粗化及固化的方法及设备 |
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CN102181899A true CN102181899A (zh) | 2011-09-14 |
CN102181899B CN102181899B (zh) | 2012-08-22 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104911661A (zh) * | 2015-07-07 | 2015-09-16 | 安徽铜冠铜箔有限公司 | 一种减少铜箔毛面铜粉的表面处理装置 |
CN105408525A (zh) * | 2013-07-23 | 2016-03-16 | Jx日矿日石金属株式会社 | 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法 |
CN110344105A (zh) * | 2019-08-05 | 2019-10-18 | 中色奥博特铜铝业有限公司 | 一种压延铜箔的双面表面处理方法 |
CN111485260A (zh) * | 2020-04-30 | 2020-08-04 | 广东嘉元科技股份有限公司 | 二次电池用低翘曲电解铜箔、制造方法 |
CN113819955A (zh) * | 2021-10-19 | 2021-12-21 | 九江德福科技股份有限公司 | 一种电子电路铜箔表面金属离子含量的测定方法 |
CN117156708A (zh) * | 2023-10-30 | 2023-12-01 | 江苏汉印机电科技股份有限公司 | 一种覆铜板铜箔在阻焊喷印前的表面处理设备 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107022778B (zh) * | 2017-03-12 | 2019-04-12 | 山东金盛源电子材料有限公司 | 一种四面镀镍电解铜箔的方法及应用该方法生产的极耳 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0709494A2 (en) * | 1994-10-06 | 1996-05-01 | Circuit Foil Japan Co., Ltd. | Method of surface-roughening treatment of copper foil |
JP2001308477A (ja) * | 2000-04-26 | 2001-11-02 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔、キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板 |
CN2478709Y (zh) * | 2001-01-21 | 2002-02-27 | 北京远创铜箔设备有限公司 | 铜箔生产联合机 |
CN101067211A (zh) * | 2007-02-06 | 2007-11-07 | 湖北中科铜箔科技有限公司 | 电解铜箔表面处理机列传动的控制方法 |
CN201144294Y (zh) * | 2007-12-14 | 2008-11-05 | 华南师范大学 | 金属箔带材电镀系统 |
-
2011
- 2011-04-29 CN CN2011101109173A patent/CN102181899B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0709494A2 (en) * | 1994-10-06 | 1996-05-01 | Circuit Foil Japan Co., Ltd. | Method of surface-roughening treatment of copper foil |
JP2001308477A (ja) * | 2000-04-26 | 2001-11-02 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔、キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板 |
CN2478709Y (zh) * | 2001-01-21 | 2002-02-27 | 北京远创铜箔设备有限公司 | 铜箔生产联合机 |
CN101067211A (zh) * | 2007-02-06 | 2007-11-07 | 湖北中科铜箔科技有限公司 | 电解铜箔表面处理机列传动的控制方法 |
CN201144294Y (zh) * | 2007-12-14 | 2008-11-05 | 华南师范大学 | 金属箔带材电镀系统 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105408525A (zh) * | 2013-07-23 | 2016-03-16 | Jx日矿日石金属株式会社 | 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法 |
CN105408525B (zh) * | 2013-07-23 | 2019-03-08 | Jx日矿日石金属株式会社 | 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法 |
CN104911661A (zh) * | 2015-07-07 | 2015-09-16 | 安徽铜冠铜箔有限公司 | 一种减少铜箔毛面铜粉的表面处理装置 |
CN110344105A (zh) * | 2019-08-05 | 2019-10-18 | 中色奥博特铜铝业有限公司 | 一种压延铜箔的双面表面处理方法 |
CN110344105B (zh) * | 2019-08-05 | 2020-10-09 | 中色奥博特铜铝业有限公司 | 一种压延铜箔的双面表面处理方法 |
CN111485260A (zh) * | 2020-04-30 | 2020-08-04 | 广东嘉元科技股份有限公司 | 二次电池用低翘曲电解铜箔、制造方法 |
CN113819955A (zh) * | 2021-10-19 | 2021-12-21 | 九江德福科技股份有限公司 | 一种电子电路铜箔表面金属离子含量的测定方法 |
CN113819955B (zh) * | 2021-10-19 | 2024-04-12 | 九江德福科技股份有限公司 | 一种电子电路铜箔表面金属离子含量的测定方法 |
CN117156708A (zh) * | 2023-10-30 | 2023-12-01 | 江苏汉印机电科技股份有限公司 | 一种覆铜板铜箔在阻焊喷印前的表面处理设备 |
CN117156708B (zh) * | 2023-10-30 | 2024-01-23 | 江苏汉印机电科技股份有限公司 | 一种覆铜板铜箔在阻焊喷印前的表面处理设备 |
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Denomination of invention: Method for synchronously roughening both surfaces of electrolytic copper foil and equipment thereof Effective date of registration: 20161219 Granted publication date: 20120822 Pledgee: Meixian Hakka Village Bank Co., Ltd. Pledgor: Guangdong Jiayuan Technology Co., Ltd. Registration number: 2016990001129 |
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Date of cancellation: 20180930 Granted publication date: 20120822 Pledgee: Meixian Hakka Village Bank Co., Ltd. Pledgor: Guangdong Jiayuan Technology Co., Ltd. Registration number: 2016990001129 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Method for synchronously roughening both surfaces of electrolytic copper foil and equipment thereof Effective date of registration: 20181207 Granted publication date: 20120822 Pledgee: Meixian Hakka Village Bank Co., Ltd. Pledgor: Guangdong Jiayuan Technology Co., Ltd. Registration number: 2018440000357 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Date of cancellation: 20190426 Granted publication date: 20120822 Pledgee: Meixian Hakka Village Bank Co., Ltd. Pledgor: Guangdong Jiayuan Technology Co., Ltd. Registration number: 2018440000357 |