CN102163599A - Light emitting diode (LED) encapsulation module - Google Patents
Light emitting diode (LED) encapsulation module Download PDFInfo
- Publication number
- CN102163599A CN102163599A CN2010106188603A CN201010618860A CN102163599A CN 102163599 A CN102163599 A CN 102163599A CN 2010106188603 A CN2010106188603 A CN 2010106188603A CN 201010618860 A CN201010618860 A CN 201010618860A CN 102163599 A CN102163599 A CN 102163599A
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- CN
- China
- Prior art keywords
- package module
- led package
- electrode
- led
- glue shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The invention relates to a semiconductor lighting technology, in particular to a light emitting diode (LED) encapsulation module. The LED encapsulation module comprises an LED chip and is characterized by comprising a copper column; the copper column is inserted into a plastic shell; the LED chip is arranged at the end of the upper surface of the copper column; the lower end face of the copper column is exposed from the lower surface of the plastic shell; the LED chip is exposed from the upper surface of the plastic shell; an electrode is clamped in the plastic shell, and the electrode is exposed from the upper surface of the plastic shell; the LED chip is connected with the electrode through a golden wire; the electrode extends out of the plastic shell so as to form another electrode of the LED encapsulation module; the extending parts form a bracket of various LED encapsulation modules; and the bracket forms a circuit of an LED encapsulation module array. The LED encapsulation module of which the structure is simple and the bracket is used as the circuit is provided.
Description
Technical field
The present invention relates to the semiconductor lighting technology, relate in particular to a kind of LED package module.
Background technology
The LED light fixture has the characteristics that the life-span is long, economize electric power, is applied to lighting field more and more widely.
Traditional LED package module generally is arranged on led chip on the substrate, and insulating barrier and circuit layer are set on substrate then.When each LED package module is formed light fixture, circuit need be set separately, or add the area of large substrates, to play mechanical connection and electrical connection effect.As Chinese patent literature CN101684899A in disclosed LED package used for illuminating on March 11st, 2010, comprise substrate and led chip, this substrate has solid crystal face and wiring side, it is characterized in that: described wiring mask has circuit pack and insulated part, described circuit pack constitutes the circuit on the described substrate, and described circuit pack and described insulated part constitute the top layer of described wiring side; Described led chip is arranged at described solid crystal face; This LED package module also comprises the transducing layer, and described transducing layer is arranged at described wiring side and is covered in outside described circuit pack and the insulated part; Described transducing layer is made up of the mixture of thermal conductive insulation glue and nano TiO 2 and nano SnO 2.The invention provides the high LED package module of a kind of front radiating efficiency.
The defective of prior art is conspicuous, a large amount of on the one hand substrate, its complex structure, cost height of using.
Summary of the invention
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art part and provide a kind of simple for structure with the LED package module of support as circuit.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of LED package module, comprise led chip, it is characterized in that: also comprise the copper post, the copper post is arranged in the glue shell, and led chip is arranged at the end of copper post upper surface, and expose from the lower surface of glue shell copper post lower surface, led chip exposes from the upper surface of glue shell, folder is established electrode in the glue shell, and electrode also exposes from the upper surface of glue shell, is connected by gold thread between led chip and the electrode; Described electrode extends to outside the described glue shell, constitutes the electrode of other LED package module again, and described extension constitutes the support between the LED package module; Described support forming circuit.
The LED package module is characterized in that: described copper post has step, and described step is defined as big end and small end with the copper post, the small end of led chip setting and copper post.
The LED package module is characterized in that: have the column counterbore above the described glue shell, counterbore has the bottom of level, and described led chip and electrode expose from glue shell upper surface and be meant that led chip and electrode expose from the bottom of counterbore.
The LED package module is characterized in that: described electrode only connects the position of gold thread and exposes from described glue shell upper surface; Described electrode level is located in the glue shell.
The LED package module is characterized in that: the led chip exiting surface is by the mode fluorescent material that to be coated with no shadow glue be solvent of spraying.
A kind of LED package module array, comprise the LED package module, its feature comprises led chip at the LED package module, also comprises the copper post, and the copper post is arranged in the glue shell, led chip is arranged at the end of copper post upper surface, expose from the lower surface of glue shell copper post lower surface, and led chip exposes from the upper surface of glue shell, and folder is established electrode in the glue shell, electrode also exposes from the upper surface of glue shell, is connected by gold thread between led chip and the electrode; Described electrode extends to outside the described glue shell, constitutes the electrode of other LED package module again, and described extension constitutes the support between each LED package module; Described circuit that is configured to LED package module array.
LED package module array is characterized in that, is connected in series between each LED package module, or is connected in parallel between each LED package module.
LED package module array is characterized in that, is connected in parallel into earlier modular unit between each LED package module, and each modular unit is connected in series again.
LED package module array is characterized in that, is connected by the injection moulding framework with glue shell one between the LED package module.
A kind of substantially as context and expressed LED package module and the LED Encapsulation Moulds array of accompanying drawing.
LED package module of the present invention, described electrode extend to outside the described glue shell, constitute the electrode of other LED package module again, and described extension constitutes the support between the LED package module; Described support forming circuit, compared with prior art, simple for structure.
Description of drawings
Fig. 1 is the schematic diagram of first embodiment of the invention.
Schematic diagram when Fig. 2 is the first embodiment of the invention belt supporting frame.
Fig. 3 is the schematic diagram of second embodiment of the invention.
Fig. 4 is the schematic diagram of third embodiment of the invention.
Fig. 5 is the schematic diagram of four embodiment of the invention.
Fig. 6 is the schematic diagram of fifth embodiment of the invention.
Fig. 7 is the schematic diagram of fifth embodiment of the invention.
Fig. 8 is the schematic diagram of sixth embodiment of the invention.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
With reference to figure 1, Fig. 2, first embodiment of the invention is a kind of LED package module, comprise led chip 103, also comprise copper post 101, copper post 101 is arranged in glue shell 104, led chip 103 is arranged at the end of copper post 101 upper surfaces, expose from the lower surface of glue shell 104 copper post 101 lower surfaces, led chip 103 exposes from the upper surface of glue shell 104, folder is established electrode 105 in the glue shell 104, also expose from the upper surface of glue shell 104 the inner of electrode 105, is connected by gold thread 106 between led chip 103 and electrode 105 the inners.In the present embodiment, described copper post 101 has step, and step is defined as big end and small end with copper post 101, and led chip 103 is arranged at the small end of copper post 101 by Au/Sn eutectic layer 102.In the present embodiment, led chip 106 exiting surfaces are the mode fluorescent material that to be coated with no shadow glue be solvent by spraying also.In the present embodiment, have the column counterbore above the described glue shell 104, counterbore has the bottom of level, and described led chip 103 and electrode 105 the inners are exposed from glue shell 104 upper surfaces and are meant that led chip 103 and electrode 105 the inners expose from the bottom of counterbore.In the present embodiment, the position that described electrode 105 only connects gold thread is that expose from described glue shell 104 upper surfaces electrode the inner.In the present embodiment, described electrode 105 levels are located in the glue shell 104.Refer again to Fig. 2, in the present embodiment, described electrode 105 extends to outside the described glue shell 105, constitutes the electrode of other LED package module again, and described extension constitutes the support 107 between the LED package module.
Fig. 3 to Fig. 8 shows of the present invention second to the 6th embodiment, be with the difference of first embodiment of the invention, the arrangement mode difference of each LED package module, the shape of support 107 and path are also inequality, and name can be series, parallel, string back and or earlier and the back string earlier between the led chip 103.
Claims (10)
1. LED package module, comprise led chip, it is characterized in that: also comprise the copper post, the copper post is arranged in the glue shell, and led chip is arranged at the end of copper post upper surface, and expose from the lower surface of glue shell copper post lower surface, led chip exposes from the upper surface of glue shell, folder is established electrode in the glue shell, and electrode also exposes from the upper surface of glue shell, is connected by gold thread between led chip and the electrode; Described electrode extends to outside the described glue shell, constitutes the electrode of other LED package module again, and described extension constitutes the support between the LED package module; Described support forming circuit.
2. LED package module according to claim 1 is characterized in that: described copper post has step, and described step is defined as big end and small end with the copper post, the small end of led chip setting and copper post.
3. LED package module according to claim 1 is characterized in that: have the column counterbore above the described glue shell, counterbore has the bottom of level, and described led chip and electrode expose from glue shell upper surface and be meant that led chip and electrode expose from the bottom of counterbore.
4. LED package module according to claim 1 is characterized in that: described electrode only connects the position of gold thread and exposes from described glue shell upper surface; Described electrode level is located in the glue shell.
5. LED package module according to claim 1 is characterized in that: the led chip exiting surface is by the mode fluorescent material that to be coated with no shadow glue be solvent of spraying.
6. LED package module array, comprise the LED package module, its feature comprises led chip at the LED package module, also comprises the copper post, and the copper post is arranged in the glue shell, led chip is arranged at the end of copper post upper surface, expose from the lower surface of glue shell copper post lower surface, and led chip exposes from the upper surface of glue shell, and folder is established electrode in the glue shell, electrode also exposes from the upper surface of glue shell, is connected by gold thread between led chip and the electrode; Described electrode extends to outside the described glue shell, constitutes the electrode of other LED package module again, and described extension constitutes the support between each LED package module; Described circuit that is configured to LED package module array.
7. LED package module array according to claim 6 is characterized in that, is connected in series between each LED package module, or is connected in parallel between each LED package module.
8. LED package module array according to claim 6 is characterized in that, is connected in parallel into earlier modular unit between each LED package module, and each modular unit is connected in series again.
9. LED package module array according to claim 6 is characterized in that, is connected by the injection moulding framework with glue shell one between the LED package module.
10. one kind substantially as context and expressed LED package module and the LED Encapsulation Moulds array of accompanying drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106188603A CN102163599A (en) | 2010-12-31 | 2010-12-31 | Light emitting diode (LED) encapsulation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106188603A CN102163599A (en) | 2010-12-31 | 2010-12-31 | Light emitting diode (LED) encapsulation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102163599A true CN102163599A (en) | 2011-08-24 |
Family
ID=44464732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106188603A Pending CN102163599A (en) | 2010-12-31 | 2010-12-31 | Light emitting diode (LED) encapsulation module |
Country Status (1)
| Country | Link |
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| CN (1) | CN102163599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103828045A (en) * | 2011-09-29 | 2014-05-28 | 奥斯兰姆奥普托半导体有限责任公司 | Led module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200969356Y (en) * | 2006-10-09 | 2007-10-31 | 华宏光电子(深圳)有限公司 | High power light-emitting diode |
| US20100065876A1 (en) * | 2007-03-30 | 2010-03-18 | Seoul Semiconductor Co., Ltd. | Led package with metal pcb |
| CN201430160Y (en) * | 2009-04-09 | 2010-03-24 | 博罗冲压精密工业有限公司 | High-efficiency heat dissipation type high-power LED bracket |
| CN201462504U (en) * | 2009-06-22 | 2010-05-12 | 嘉善华江电子科技有限公司 | Light emitting diode light source module |
| CN201590435U (en) * | 2010-01-08 | 2010-09-22 | 江苏奥雷光电有限公司 | LED encapsulation structure |
-
2010
- 2010-12-31 CN CN2010106188603A patent/CN102163599A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200969356Y (en) * | 2006-10-09 | 2007-10-31 | 华宏光电子(深圳)有限公司 | High power light-emitting diode |
| US20100065876A1 (en) * | 2007-03-30 | 2010-03-18 | Seoul Semiconductor Co., Ltd. | Led package with metal pcb |
| CN201430160Y (en) * | 2009-04-09 | 2010-03-24 | 博罗冲压精密工业有限公司 | High-efficiency heat dissipation type high-power LED bracket |
| CN201462504U (en) * | 2009-06-22 | 2010-05-12 | 嘉善华江电子科技有限公司 | Light emitting diode light source module |
| CN201590435U (en) * | 2010-01-08 | 2010-09-22 | 江苏奥雷光电有限公司 | LED encapsulation structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103828045A (en) * | 2011-09-29 | 2014-05-28 | 奥斯兰姆奥普托半导体有限责任公司 | Led module |
| CN103828045B (en) * | 2011-09-29 | 2016-12-07 | 奥斯兰姆奥普托半导体有限责任公司 | Led module |
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Application publication date: 20110824 |