CN111446235B - Luminous body and luminous module - Google Patents
Luminous body and luminous module Download PDFInfo
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- CN111446235B CN111446235B CN202010251019.9A CN202010251019A CN111446235B CN 111446235 B CN111446235 B CN 111446235B CN 202010251019 A CN202010251019 A CN 202010251019A CN 111446235 B CN111446235 B CN 111446235B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 238000005538 encapsulation Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of LED packaging, and provides a luminous body and a luminous module, wherein the luminous body comprises: the lower surface of the integrated circuit chip is provided with a plurality of electrical contacts; the pin electrode layer is provided with a plurality of pin electrodes, the pin electrode layer is arranged on the lower surface of the integrated circuit chip, the arrangement positions of the pin electrodes respectively correspond to the arrangement positions of the electrical contacts, at least part of the pin electrodes are respectively provided with a protruding part, and the protruding parts protrude out of the periphery of the lower surface of the integrated circuit chip; a plurality of light emitting chips disposed on an upper surface of the integrated circuit chip and electrically connected to the integrated circuit chip through the protruding portions, respectively; the packaging structure wraps the plurality of light-emitting chips and the integrated circuit chip and is connected with the pin electrode layer; the light-emitting module comprises the light-emitting body; the luminous body and the luminous module provided by the invention have the following advantages: the luminous body can be made smaller, and the volume of the luminous body is reduced.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a luminous body and a luminous module.
Background
An LED (Light Emitting Diode) is a solid semiconductor device capable of converting electric energy into visible Light, can directly convert electric energy into Light, and is a green energy source. With the continuous improvement of scientific technology and living standards of people, the application field of the LED is more and more extensive, in order to save the design space of the LED, the design of an IC (Integrated Circuit) chip at the application end is gradually changed from the outside of the LED to the inside of the LED and the way is gradually becoming the mainstream of the market, but as the space is too small, the IC chip is still packaged in the LED without a way, and the use of the LED in some special fields and occasions is greatly limited.
Disclosure of Invention
The invention aims to provide a luminous body and a luminous module so as to solve the technical problem of large LED packaging size in the prior art.
In order to achieve the above object, the present invention adopts a technical solution that is a light emitting body, including:
an integrated circuit chip having an upper surface and a lower surface, the lower surface having a plurality of electrical contacts;
a pin electrode layer having a plurality of pin electrodes, the pin electrode layer being disposed on the lower surface of the integrated circuit chip and the arrangement positions of the plurality of pin electrodes respectively corresponding to the arrangement positions of the plurality of electrical contacts, at least some of the plurality of pin electrodes each having a protruding portion protruding from the periphery of the lower surface of the integrated circuit chip;
a plurality of light emitting chips disposed on the upper surface of the integrated circuit chip and each electrically connected to the integrated circuit chip through the protruding portion; and
and the packaging structure wraps the plurality of light-emitting chips and the integrated circuit chip and is connected with the pin electrode layer.
In one embodiment, the light emitting body further includes a support, a receiving cavity is formed on the support, the support has a plurality of metal wires, the metal wires form the pin electrode layer, the pin electrode layer is exposed in the receiving cavity, and the packaging structure fills the receiving cavity.
In one embodiment, the plurality of pin electrodes penetrate through the pin electrode layer, upper surfaces of the plurality of pin electrodes are exposed out of the upper surface of the pin electrode layer and are electrically connected with the plurality of electrical contacts, respectively, and lower surfaces of the plurality of pin electrodes are exposed out of the lower surface of the pin electrode layer.
In one embodiment, the light emitting body further includes a support having a plurality of metal wires, the package structure includes an inner package layer for wrapping the plurality of light emitting chips and the integrated circuit chip and an outer package layer for wrapping the inner package layer, the lower surface of the pin electrode is connected to the plurality of metal wires, and a portion of the plurality of pin electrodes protrudes out of the periphery of the lower surface of the inner package layer and is wrapped by the outer package layer for connecting the plurality of metal wires.
In one embodiment, the light emitting chip is electrically connected to the protruding portions of the lead electrodes through bonding wires, and the bonding wires are wrapped by the encapsulation structure.
In one embodiment, the light emitting chips are electrically connected to the protruding portions of the pin electrodes through metal pillars, wherein the package structure has an inner package layer and an outer package layer, the inner package layer wraps the metal pillars and the integrated circuit chip, and the outer package layer is a light-transmitting layer, wraps the light emitting chips and is located on the outer package layer.
In one embodiment, a peripheral region of the pin electrode layer protrudes from a periphery of the lower surface of the integrated circuit chip, and the package structure is bonded to the peripheral region of the pin electrode layer.
In one embodiment, the pin electrode layer has a sheet region surrounding the pin electrodes, the upper surfaces of the pin electrodes protrude from the upper surface of the sheet region, and the lower surfaces of the pin electrodes are flush with the lower surface of the sheet region.
Another objective of the present invention is to provide a light emitting module, which includes a circuit board and the above light emitting body disposed on the circuit board.
Another object of the present invention is to provide a light emitting module, which comprises
A plurality of integrated circuit chips, said integrated circuit chips having an upper surface and a lower surface, said lower surface of said integrated circuit chips having a plurality of electrical contacts;
a circuit board having a plurality of setting areas, wherein a plurality of pin electrodes are arranged in the setting areas, the lower surface of the integrated circuit chip is arranged in the setting areas, the setting positions of the plurality of pin electrodes in the setting areas respectively correspond to the setting positions of the plurality of electrical contacts of the integrated circuit chip, at least part of the plurality of pin electrodes in the setting areas respectively have protruding parts, and the protruding parts protrude out of the periphery of the lower surface of the integrated circuit chip;
a plurality of light emitting chip groups having a plurality of light emitting chips, the plurality of light emitting chips of the light emitting chip groups being disposed on the upper surface of the integrated circuit chip and each being electrically connected to the integrated circuit chip through the protruding portion of the pin electrode in the disposition region; and
and the packaging structure wraps the plurality of luminous chip groups and the plurality of integrated circuit chips and is connected with the circuit board.
The light-emitting body and the light-emitting module provided by the invention have the beneficial effects that:
compared with the prior art, the luminous body does not have a support substrate on the structure, so the thickness of the luminous body can be thinner, and meanwhile, the integrated circuit chip, the pin electrode layer and the luminous chip are stacked, so the transverse size of the luminous body is reduced, and the volume of the luminous body is also reduced, so the luminous body can be smaller through the design of the luminous body.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a cross-sectional view of a luminaire provided in accordance with an embodiment of the present invention;
FIG. 2 is a top view of a luminaire provided in accordance with an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a luminaire provided in accordance with another embodiment of the present invention;
FIG. 4 is a cross-sectional view of a luminaire provided in accordance with another embodiment of the present invention;
FIG. 5 is a cross-sectional view of a luminaire provided in accordance with another embodiment of the present invention;
fig. 6 is a top view of a first light emitting module according to another embodiment of the invention;
fig. 7 is a top view of a second light emitting module according to another embodiment of the invention;
FIG. 8 is an enlarged view at "A" of FIG. 6;
FIG. 9 is an enlarged view at "B" of FIG. 7;
fig. 10 is a cross-sectional view of a light emitting module according to another embodiment of the invention.
The figures are numbered:
an integrated circuit chip-1; an electrical contact-11;
a pin electrode layer-2; a pin electrode-21; lamina region-22;
a light emitting chip-3;
a package structure-4; inner packaging layer-41; an outer encapsulation layer-42;
a bonding wire-5;
a metal column-6;
a circuit board-7;
a light emitter-8; an FDI pin 81; a VDD pin 82; a GND pin 83; a DIN pin 84; a DO pin 85;
a bracket 9; the metal wiring 91.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "fixed" or "disposed" to another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the invention, and do not indicate that the device or assembly must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the invention.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
as shown in fig. 1 and fig. 2, an illuminant 8 provided by an embodiment of the present invention includes:
an integrated circuit chip 1 having an upper surface and a lower surface, the lower surface having a plurality of electrical contacts 11;
a pin electrode layer 2 having a plurality of pin electrodes 21, the pin electrode layer 2 being disposed on the lower surface of the integrated circuit chip 1, the arrangement positions of the plurality of pin electrodes 21 respectively corresponding to the arrangement positions of the plurality of electrical contacts 11 of the integrated circuit chip 1, at least some of the plurality of pin electrodes 21 each having a protruding portion protruding from the periphery of the lower surface of the integrated circuit chip 1;
a plurality of light emitting chips 3 disposed on the upper surface of the integrated circuit chip 1 and electrically connected to the integrated circuit chip 1 through corresponding protruding portions, respectively, to be controlled by the integrated circuit chip 1; and
the packaging structure 4 wraps the light-emitting chips 3 and the integrated circuit chip 1, and the packaging structure 4 is connected with the pin electrode layer 2, wherein the packaging structure 4 is cured transparent packaging adhesive and is used for protecting the light-emitting chips 3 and the integrated circuit chip 1 and enabling light energy of the light-emitting chips 3 to be emitted out of the light-emitting body 8.
The luminous body 8 provided by the embodiment has the beneficial effects that:
compared with the prior art, the light-emitting body 8 of the invention does not have a support substrate on the structure, so the thickness can be thinner, and meanwhile, the integrated circuit chip 1, the pin electrode layer 2 and the light-emitting chip 3 are stacked, so the transverse size of the light-emitting body 8 is reduced, and the volume of the light-emitting body 8 is also reduced, therefore, the light-emitting body 8 can be made smaller through the design of the invention.
In addition, the protruding portion facilitates the electrical connection between the light emitting chip 3 and the lead electrode 21 of the lead electrode layer 2, so that the light emitting chip 3 is controlled by the integrated circuit chip 1, and the manufacturing process is simple and convenient.
The lead electrode layer 2 is in a shape of a diaphragm, and the plurality of lead electrodes 21 are made of metal materials, either pure metals or alloy materials, preferably copper; the package structure 4 includes, but is not limited to, one or a mixture of silicon glue and epoxy glue.
Specifically, an adhesive is disposed between the plurality of electrical contacts 11 of the integrated circuit chip 1 and the pin electrodes 21. It is understood that the adhesive can be disposed such that the electrical contacts 11 of the integrated circuit chip 1 are firmly attached to the lead electrodes 21 and electrically connected to each other.
Finely, the adhesive comprises silver paste, flux and solder paste.
As shown in fig. 3, in an embodiment, the light emitter 8 further includes a support 9, a receiving cavity is formed on the support 9, the support 9 has a plurality of metal wires 91, and the plurality of metal wires 91 form the lead electrode layer 2, the lead electrode layer is exposed in the receiving cavity, and the package structure 4 fills the receiving cavity.
As shown in fig. 4, the light emitter 8 further includes a support 9, the support 9 has a plurality of metal wires 91, the package structure 4 includes an inner package layer 41 for wrapping the plurality of light emitting chips 3 and the integrated circuit chip 1 and an outer package layer 42 for wrapping the inner package layer 41, the lower surface of the lead electrode 21 is connected with the plurality of metal wires 91, part of the plurality of lead electrodes 21 protrudes from the periphery of the lower surface of the inner package layer 41, the plurality of metal wires 91 for connecting with the portion, for example, the metal wires 91 connected with the portion through the bonding wires 5, and the lead electrode 21 protruding from the periphery of the lower surface of the inner package layer 41 is wrapped by the outer package layer 42.
In one embodiment, the light emitting chip 3 is electrically connected to the protruding portions of the lead electrodes 21 through the bonding wires 5, and the bonding wires 5 are wrapped by the encapsulation structure 4, for example, the inner encapsulation layer 41 as shown in fig. 4. In this embodiment, the light emitting chip 3 is electrically connected to the protruding portion of the lead electrode 21 through the bonding wire 5, and the structure is simple, stable and reliable, and the bonding wire 5 is wrapped by the packaging structure 4, so that the stability of the bonding wire 5 is improved.
Specifically, the bonding wire 5 includes one or a mixture of pure gold wire, aluminum wire, copper wire, or iron wire, and the like.
In one embodiment, the plurality of lead electrodes 21 penetrate the lead electrode layer 2, the upper surfaces of the plurality of lead electrodes 21 are exposed on the upper surface of the lead electrode layer 2 and are electrically connected to the corresponding electrical contacts 11, and the lower surfaces of the plurality of lead electrodes 21 are exposed on the lower surface of the lead electrode layer 2 for electrically connecting to an external circuit board. It can be understood that the upper surface of the pin electrode 21 is used to electrically connect the electrical contacts 11 of the integrated circuit chip 1, and the lower surface of the pin electrode 21 is used to electrically connect the external circuit board, and this design enables the integrated circuit chip 1, the pin electrode layer 2 and the external circuit board to be stacked, so that the lateral size of the whole light emitter 8 can be reduced, and the volume of the light emitter 8 can be reduced.
As shown in fig. 5, in one embodiment, the light emitting chip 3 is electrically connected to the protruding portion of the pin electrode 21 through the metal post 6.
The package structure 4 has an inner package layer 41 and an outer package layer 42, a metal circuit connected to the metal pillar 6 can be disposed on the upper surface of the inner package layer 41, and the plurality of light emitting chips 3 are disposed on the upper surface of the inner package layer 41 and electrically connected to the metal circuit, so as to facilitate installation. The inner packaging layer 41 wraps the metal posts 6 and the integrated circuit chip 1, in the embodiment, the metal posts 6 penetrate the inner packaging layer 41, and two ends of the metal posts are respectively and electrically connected with the light-emitting chip 3 and the protruding parts of the pin electrodes 21; the outer packaging layer 42 is a light-transmitting layer, wraps the light-emitting chips 3 and is located on the inner packaging layer 41. In the present embodiment, the metal posts 6 and the integrated circuit chip 1 are supported by the inner encapsulation layer 41 to have a predetermined mechanical strength, and the light emitting chip 3 is fixed by the outer encapsulation layer 42.
In one embodiment, the peripheral region of the pin electrode layer 2 protrudes from the periphery of the lower surface of the integrated circuit chip 1, and the package structure 4 is bonded to the peripheral region of the pin electrode layer 2. It is understood that the encapsulation structure 4 can further increase the stability of the pin electrode layer 2 by bonding the surrounding area.
In one embodiment, the lead electrode layer 2 has a sheet region 22 surrounding the plurality of lead electrodes 21, the upper surfaces of the plurality of lead electrodes 21 protrude beyond the upper surface of the sheet region 22, and the lower surfaces of the plurality of lead electrodes 21 are flush with the lower surface of the sheet region 22. It will be appreciated that by staggering the top surface of the pin electrode 21 and the pad layer 22, the pin electrode 21 is electrically connected to the plurality of electrical contacts 11 of the integrated circuit chip 1, i.e., the process is facilitated.
In one embodiment, the plurality of light emitting chips 3 includes a red light emitting chip 3, a green light emitting chip 3, and a blue light emitting chip 3. In this embodiment, the integrated circuit chip 1 controls the operating states of the red light emitting chip 3, the green light emitting chip 3 and the blue light emitting chip 3, so that the light emitting body 8 emits lights with different colors to meet the requirements of users.
As shown in fig. 6 to 9, the present embodiment further provides a light emitting module, which includes a circuit board 7 and a plurality of light emitters 8 disposed on the circuit board 7.
It can be understood that the light-emitting body 8 can be formed into a whole light-emitting body 8 alone and then arranged on the circuit board 7, or the integrated circuit chip 1 and the light-emitting chip 3 can be sequentially stacked on the circuit board 7 and then electrically connected by the bonding wire 5, and finally the integrated circuit chip 1, the light-emitting chip 3 and the bonding wire 5 are packaged by the packaging structure 4. Wherein the material of the circuit board 7 can be glass or a printed circuit board.
Specifically, fig. 6 shows that the circuit board 7 is provided with the light emitters 8 of 1 by 4 specifications, fig. 7 shows that the circuit board 7 is provided with the light emitters 8 of 3 by 3 specifications, the pin electrodes 21 of the pin electrode layer 2 of each light emitter 8 include an FDI pin 81, a VDD pin 82, a GND pin 83, a DIN pin 84 and a DO pin 85, the FDI pin 81 is used for backup signal input, the VDD pin 82 is used for power input, the GND pin 83 is used for ground connection, the DIN pin 84 is used for signal input, and the DO pin 85 is used for signal output, so that the light emitters 8 are electrically connected with the circuit board 7 through the pin electrodes 21 to obtain required electrical signals from the circuit board 7.
As shown in fig. 2 and 10, the present embodiment further provides another light emitting module, which integrates the plurality of light emitters 8 and the circuit board 7 into a whole to form a light emitting module with a display function, including:
the integrated circuit comprises a plurality of integrated circuit chips 1, wherein each integrated circuit chip 1 is provided with an upper surface and a lower surface, and the lower surface of each integrated circuit chip 1 is provided with a plurality of electrical contacts 11;
a circuit board 7 having a plurality of setting areas 71, wherein the setting areas 71 have a plurality of pin electrodes 21 therein, the lower surface of the integrated circuit chip 1 is disposed in the setting areas 71 and the setting positions of the plurality of pin electrodes 21 in the setting areas 71 respectively correspond to the setting positions of the plurality of electrical contacts 11 of the integrated circuit chip 1, at least some of the plurality of pin electrodes 21 in the setting areas 71 each have a protruding portion protruding from the periphery of the lower surface of the integrated circuit chip 1;
the light-emitting chips 3 are arranged on the upper surface of the integrated circuit chip 1 and are respectively electrically connected with the integrated circuit chip 1 through the protruding parts of the pin electrodes 21 in the arrangement area 71; and
and the packaging structure 4 wraps the plurality of light-emitting chip 3 groups and the plurality of integrated circuit chips 1 and is connected with the circuit board 7.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A light emitter, comprising:
an integrated circuit chip having an upper surface and a lower surface, the lower surface having a plurality of electrical contacts;
a pin electrode layer having a plurality of pin electrodes, the pin electrode layer being disposed on the lower surface of the integrated circuit chip and the arrangement positions of the plurality of pin electrodes respectively corresponding to the arrangement positions of the plurality of electrical contacts, at least some of the plurality of pin electrodes each having a protruding portion protruding from the periphery of the lower surface of the integrated circuit chip, the plurality of pin electrodes penetrating through the pin electrode layer, the upper surfaces of the plurality of pin electrodes being exposed on the upper surface of the pin electrode layer and respectively electrically connected to the plurality of electrical contacts, the lower surfaces of the plurality of pin electrodes being exposed on the lower surface of the pin electrode layer;
a plurality of light emitting chips disposed on the upper surface of the integrated circuit chip and each electrically connected to the integrated circuit chip through the protruding portion; and
and the packaging structure wraps the plurality of light-emitting chips and the integrated circuit chip and is connected with the pin electrode layer.
2. The light emitter according to claim 1, wherein the light emitter further comprises a support, a receiving cavity is formed on the support, the support has a plurality of metal wires, and the metal wires form the pin electrode layer, the pin electrode layer is exposed in the receiving cavity, and the package structure fills the receiving cavity.
3. The light emitter according to claim 1, wherein the light emitter further comprises a support having a plurality of metal wires, the package structure comprises an inner package layer for wrapping the plurality of light emitting chips and the integrated circuit chip and an outer package layer for wrapping the inner package layer, the lower surface of the pin electrode is connected to the plurality of metal wires, and a portion of the plurality of pin electrodes protrudes from a periphery of a lower surface of the inner package layer and is wrapped by the outer package layer for connecting to the plurality of metal wires.
4. The light emitter according to claim 1, wherein the light emitting chip is electrically connected to the protruding portions of the lead electrodes through bonding wires, the bonding wires being wrapped by the encapsulation structure.
5. The light emitter according to claim 1, wherein the light emitting chips are electrically connected to the protruding portions of the lead electrodes through metal posts, and wherein the package structure has an inner package layer and an outer package layer, the inner package layer covers the metal posts and the ic chip, and the outer package layer is a light-transmitting layer covering the light emitting chips and located on the outer package layer.
6. The light emitter according to claim 1, wherein a peripheral region of the lead electrode layer protrudes from a periphery of the lower surface of the integrated circuit chip, and the encapsulation structure is bonded to the peripheral region of the lead electrode layer.
7. The light emitter according to claim 1, wherein the lead electrode layer has a sheet region surrounding the plurality of lead electrodes, an upper surface of the plurality of lead electrodes protrudes from an upper surface of the sheet region, and lower surfaces of the plurality of lead electrodes are flush with a lower surface of the sheet region.
8. A light emitting module comprising a wiring board and a plurality of the light emitting bodies according to any one of claims 1 to 7 provided on the wiring board.
9. A light emitting module is characterized by comprising
A plurality of integrated circuit chips, said integrated circuit chips having an upper surface and a lower surface, said lower surface of said integrated circuit chips having a plurality of electrical contacts;
a circuit board having a plurality of setting areas, wherein a plurality of pin electrodes are arranged in the setting areas, the lower surface of the integrated circuit chip is arranged in the setting areas, the setting positions of the plurality of pin electrodes in the setting areas respectively correspond to the setting positions of the plurality of electrical contacts of the integrated circuit chip, at least part of the plurality of pin electrodes in the setting areas respectively have protruding parts, and the protruding parts protrude out of the periphery of the lower surface of the integrated circuit chip;
a plurality of light emitting chip groups having a plurality of light emitting chips, the plurality of light emitting chips of the light emitting chip groups being disposed on the upper surface of the integrated circuit chip and each being electrically connected to the integrated circuit chip through the protruding portion of the pin electrode in the disposition region; and
and the packaging structure wraps the plurality of luminous chip groups and the plurality of integrated circuit chips and is connected with the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109113460A TWI753408B (en) | 2020-01-19 | 2020-04-22 | A light-emitting body and light-emitting module |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020100611208 | 2020-01-19 | ||
| CN202010061120 | 2020-01-19 |
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| Publication Number | Publication Date |
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| CN111446235A CN111446235A (en) | 2020-07-24 |
| CN111446235B true CN111446235B (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010251019.9A Active CN111446235B (en) | 2020-01-19 | 2020-04-01 | Luminous body and luminous module |
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| CN (1) | CN111446235B (en) |
| TW (1) | TWI753408B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114067723B (en) * | 2020-07-27 | 2023-06-20 | 北京芯海视界三维科技有限公司 | Light-emitting module and display device |
| CN113990212A (en) * | 2020-07-27 | 2022-01-28 | 北京芯海视界三维科技有限公司 | Light-emitting module and display device |
| CN114005376A (en) * | 2020-07-27 | 2022-02-01 | 北京芯海视界三维科技有限公司 | Light-emitting module and display device |
| CN112786576A (en) * | 2020-12-31 | 2021-05-11 | 深圳市天成照明有限公司 | LED with built-in digital chip and packaging process thereof |
| TWI835452B (en) * | 2022-12-07 | 2024-03-11 | 友達光電股份有限公司 | Light emitting device and manufacturing method thereof |
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| CN201651936U (en) * | 2010-04-23 | 2010-11-24 | 矽格微电子(无锡)有限公司 | LED packaging structure provided with glass cover |
| TWI479641B (en) * | 2010-09-20 | 2015-04-01 | 英特明光能股份有限公司 | Light emitting device and manufacturing method thereof |
| US8461669B2 (en) * | 2010-09-20 | 2013-06-11 | Monolithic Power Systems, Inc. | Integrated power converter package with die stacking |
| US9543282B2 (en) * | 2013-11-18 | 2017-01-10 | Stmicroelectronics Pte Ltd. | Optical sensor package |
| CN108074918B (en) * | 2016-11-18 | 2019-11-29 | 光宝光电(常州)有限公司 | Raw doctor's sensor mould group of optical profile type and preparation method thereof |
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| TWM570532U (en) * | 2018-08-31 | 2018-11-21 | 大陸商弘凱光電（深圳）有限公司 | Illumination module |
| CN109801894A (en) * | 2018-12-28 | 2019-05-24 | 华进半导体封装先导技术研发中心有限公司 | Chip-packaging structure and packaging method |
| CN209880656U (en) * | 2019-07-05 | 2019-12-31 | 上海先方半导体有限公司 | LED array packaging structure |
| CN111370395B (en) * | 2020-03-24 | 2022-12-23 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of heart rate module and wearable device |
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| TW202129998A (en) | 2021-08-01 |
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