CN102163587A - Interconnecting aluminum tape for packaging integrated circuit - Google Patents
Interconnecting aluminum tape for packaging integrated circuit Download PDFInfo
- Publication number
- CN102163587A CN102163587A CN2011100710740A CN201110071074A CN102163587A CN 102163587 A CN102163587 A CN 102163587A CN 2011100710740 A CN2011100710740 A CN 2011100710740A CN 201110071074 A CN201110071074 A CN 201110071074A CN 102163587 A CN102163587 A CN 102163587A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- interconnection
- aluminium strip
- chip
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The invention relates to an interconnecting aluminum tape for packaging an integrated circuit, and the interconnecting aluminum tape provided by the invention is used for interconnection of semiconductor power devices, integrated circuit modules, solar photocells, electrical power modules, chips and chips, chips and frameworks, or interiors of electronic components and leading wires. The interconnecting tape is an aluminum or aluminum alloy tape. By adopting tape-shaped connecting wires, the interconnecting aluminum tape has the high-toughness surface contact connection and is firm in connection, small in contact resistance, great in current carrying capacity, good in heat radiation performance, small in wire-to-wire capacitance and applicable to connection of devices with dense high frequency.
Description
Technical field
The present invention relates to the connecting line that uses in a kind of integrated circuit, especially a kind of connecting line of band shape.
Background technology
Along with the raising of development of science and technology and people's living standard, the volume of scientific and technological series products is also more and more littler, so integrated circuit is also given birth to because of fortune.In order further to dwindle the volume of integrated circuit, the common mode that adopts of the producer be by copper wire or other electric conductivities preferably silk thread connect between each module or the components and parts, to finish the mutual conduction between the each several part circuit.But because the external diameter of copper wire is thinner, length is also shorter, so conductivity has certain influence, and in order to address this problem, the general method of utilizing many connecting lines that adopts is to increase ampacity.So not only can increase technology cost, process, and copper wire can only be connection between points, make connect insecure.
Summary of the invention
The technical problem to be solved in the present invention is: propose a kind ofly to be used to be electrically connected, high-accuracy, integrated circuit encapsulation that the margin of tolerance is little is with the interconnection aluminium strip.
The technical solution adopted in the present invention is: a kind of integrated circuit encapsulation is used for the inside of semiconductor power device, integrated circuit modules, solar photocell, electric power module, chip and chip, chip and framework or electronic devices and components and the interconnection of lead-in wire with the interconnection aluminium strip.Described interconnection aluminium strip is aluminium and aluminum alloy strip.
The width of interconnection aluminium strip of the present invention is 0.05～8mm, and thickness is 0.02～1mm.
The two ends of described interconnection aluminium strip were overlapped in the inside and the lead-in wire of semiconductor power device, integrated circuit modules, solar photocell, electric power module, chip and chip, chip and framework or electronic devices and components when the present invention used.
The present invention has multiple manufacture craft, comprises banded separating and cutting process or monofilament cold-press process or monofilament drawing process.
The invention has the beneficial effects as follows: adopt banded connecting line, its face contact with high tenacity connects, and is connected firmly, and contact resistance is little, and ampacity is big, perfect heat-dissipating, and the line capacitance amount is little, is suitable for the close device of high frequency collection and connects.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a user mode structural representation of the present invention;
Among the figure: 1, module or electronic devices and components; 2, interconnection aluminium strip.
Embodiment
The present invention is further detailed explanation with preferred embodiment in conjunction with the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, basic structure of the present invention only is described in a schematic way, so it only show the formation relevant with the present invention.
As shown in Figure 1, a kind of integrated circuit encapsulation is used for the inside of semiconductor power device, integrated circuit modules, solar photocell, electric power module, chip and chip, chip and framework or electronic devices and components and the interconnection of lead-in wire with the interconnection aluminium strip.The two ends of described interconnection aluminium strip are overlapped in the inside and the lead-in wire of semiconductor power device, integrated circuit modules, solar photocell, electric power module, chip and chip, chip and framework or electronic devices and components.Described interconnection aluminium strip 2 is aluminium and aluminum alloy strip.The width of interconnection aluminium strip 2 is 0.05～8mm, and thickness is 0.02～1mm.
Described interconnection aluminium strip has multiple manufacture craft, comprises banded separating and cutting process or monofilament cold-press process or monofilament drawing process.
Banded separating and cutting process: utilize laser knife or other cutter sweeps to carry out cutting existing band integral body, to reach needed width of band and thickness;
Monofilament cold-press process: strip material or circle wire material are put into pressure roller and suppressed, to reach needed width of band and thickness;
Monofilament drawing process: strip material or circle wire material are put into draw-off gear, adjust the horizontal tension and the longitudinal tension force of draw-off gear, to reach needed width of band and thickness.
Just the specific embodiment of the present invention of describing in the above specification, various not illustrating is construed as limiting flesh and blood of the present invention, the person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence of an invention and scope.
Claims (5)
1. an integrated circuit encapsulation is used for the inside of semiconductor power device, integrated circuit modules, solar photocell, electric power module, chip and chip, chip and framework or electronic devices and components and the interconnection of lead-in wire with the interconnection aluminium strip.
2. an integrated circuit encapsulates with the interconnection aluminium strip, and it is characterized in that: described interconnection aluminium strip is aluminium and aluminum alloy strip.
3. integrated circuit encapsulation interconnection aluminium strip as claimed in claim 2, it is characterized in that: the width of described interconnection aluminium strip is 0.05～8mm, thickness is 0.02～1mm.
4. integrated circuit encapsulation interconnection aluminium strip as claimed in claim 2, it is characterized in that: the two ends of described interconnection aluminium strip are overlapped in the inside and the lead-in wire of semiconductor power device, integrated circuit modules, solar photocell, electric power module, chip and chip, chip and framework or electronic devices and components.
5. integrated circuit as claimed in claim 2 encapsulation is characterized in that with the interconnection aluminium strip: described interconnection aluminium strip is made by banded separating and cutting process or monofilament cold-press process or monofilament drawing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100710740A CN102163587A (en) | 2011-03-23 | 2011-03-23 | Interconnecting aluminum tape for packaging integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100710740A CN102163587A (en) | 2011-03-23 | 2011-03-23 | Interconnecting aluminum tape for packaging integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102163587A true CN102163587A (en) | 2011-08-24 |
Family
ID=44464727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100710740A Pending CN102163587A (en) | 2011-03-23 | 2011-03-23 | Interconnecting aluminum tape for packaging integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102163587A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1733467A (en) * | 2004-08-12 | 2006-02-15 | 肇庆市风华锂电池有限公司 | Aluminium-nickel metal welding bond and process for preparing the same |
| CN2906925Y (en) * | 2005-12-28 | 2007-05-30 | 勤益电子（上海）有限公司 | Semiconductor power crystal solder wire structure |
| CN201181700Y (en) * | 2008-04-03 | 2009-01-14 | 勤益股份有限公司 | Wire frame and electric connecting structure |
| CN101692444A (en) * | 2008-02-29 | 2010-04-07 | 株式会社瑞萨科技 | Semiconductor device |
| CN101828257A (en) * | 2008-08-05 | 2010-09-08 | 田中电子工业株式会社 | Aluminum ribbon for ultrasonic bonding |
-
2011
- 2011-03-23 CN CN2011100710740A patent/CN102163587A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1733467A (en) * | 2004-08-12 | 2006-02-15 | 肇庆市风华锂电池有限公司 | Aluminium-nickel metal welding bond and process for preparing the same |
| CN2906925Y (en) * | 2005-12-28 | 2007-05-30 | 勤益电子（上海）有限公司 | Semiconductor power crystal solder wire structure |
| CN101692444A (en) * | 2008-02-29 | 2010-04-07 | 株式会社瑞萨科技 | Semiconductor device |
| CN201181700Y (en) * | 2008-04-03 | 2009-01-14 | 勤益股份有限公司 | Wire frame and electric connecting structure |
| CN101828257A (en) * | 2008-08-05 | 2010-09-08 | 田中电子工业株式会社 | Aluminum ribbon for ultrasonic bonding |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203277411U (en) | Solar cell module | |
| CN204155931U (en) | A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element | |
| CN105280626A (en) | Ultra-small ultra-thin high-luminous-efficiency lateral-emission-type high-light white-light LED element | |
| CN105321937A (en) | Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element | |
| CN202003983U (en) | Interconnecting aluminium strip for packaging integrated circuit | |
| CN204155954U (en) | The highlighted white light LED element of a kind of extra small ultra-thin specular removal Quartering shot type | |
| CN102163587A (en) | Interconnecting aluminum tape for packaging integrated circuit | |
| CN206059901U (en) | A kind of high-power semiconductor laser | |
| US9741496B2 (en) | Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same | |
| CN201838584U (en) | Encapsulated triode | |
| CN204497239U (en) | Metallic packaging big current, high voltage, fast recovery diode | |
| CN210325794U (en) | High-voltage-resistance ultrafast-recovery semiconductor component with transient voltage suppression function | |
| CN202487575U (en) | Composite diode structure | |
| CN203260633U (en) | LED package structure requiring no welding line | |
| CN202647293U (en) | Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires | |
| CN208173687U (en) | A kind of composite bus bar | |
| CN206301840U (en) | A kind of straight cutting microminiature side-emitting LED infrared transmitting tube module | |
| CN205122630U (en) | Full high power density LED chip package structure of establishing ties | |
| CN202678306U (en) | Minitype packaging thyristor module | |
| CN206758285U (en) | Matrix array type stacked-type solid electrolytic capacitor encapsulating structure | |
| CN202695437U (en) | Thyristor module | |
| CN102208403B (en) | Half-bridge power module | |
| CN202695430U (en) | Packaging thyristor module | |
| CN201527975U (en) | Power transistor in copper wire structure | |
| CN202695434U (en) | Series module of thyristors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110824 |