CN102151986B - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
- Publication number
- CN102151986B CN102151986B CN201110031686.7A CN201110031686A CN102151986B CN 102151986 B CN102151986 B CN 102151986B CN 201110031686 A CN201110031686 A CN 201110031686A CN 102151986 B CN102151986 B CN 102151986B
- Authority
- CN
- China
- Prior art keywords
- laser
- laser beam
- laser light
- component
- separator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000926 separation method Methods 0.000 claims description 18
- 238000004581 coalescence Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 5
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 63
- 238000005520 cutting process Methods 0.000 description 41
- 238000003384 imaging method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910020177 SiOF Inorganic materials 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-019009 | 2010-01-29 | ||
| JP2010019009A JP5431989B2 (ja) | 2010-01-29 | 2010-01-29 | レーザー加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102151986A CN102151986A (zh) | 2011-08-17 |
| CN102151986B true CN102151986B (zh) | 2015-02-11 |
Family
ID=44433839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110031686.7A Active CN102151986B (zh) | 2010-01-29 | 2011-01-28 | 激光加工装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5431989B2 (ko) |
| KR (1) | KR20110089053A (ko) |
| CN (1) | CN102151986B (ko) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6261844B2 (ja) * | 2012-02-20 | 2018-01-17 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
| JP6022223B2 (ja) * | 2012-06-14 | 2016-11-09 | 株式会社ディスコ | レーザー加工装置 |
| JP5940906B2 (ja) | 2012-06-19 | 2016-06-29 | 株式会社ディスコ | レーザー加工装置 |
| KR20140036593A (ko) | 2012-09-17 | 2014-03-26 | 삼성디스플레이 주식회사 | 레이저 가공 장치 |
| TWI543833B (zh) | 2013-01-28 | 2016-08-01 | 先進科技新加坡有限公司 | 將半導體基板輻射開槽之方法 |
| JP6234312B2 (ja) * | 2014-04-11 | 2017-11-22 | 株式会社ディスコ | 積層基板の加工方法 |
| JP6802093B2 (ja) * | 2017-03-13 | 2020-12-16 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
| JP6935126B2 (ja) * | 2017-04-05 | 2021-09-15 | 株式会社ディスコ | ウェーハのレーザ加工方法 |
| DE102018205545A1 (de) * | 2018-04-12 | 2019-10-17 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung, Laserbearbeitungsmaschine und Verfahren zum Bearbeiten eines Werkstücks |
| JP2021009274A (ja) * | 2018-07-09 | 2021-01-28 | レーザーテック株式会社 | 光源、検査装置、ｅｕｖ光の生成方法及び検査方法 |
| CN114700628A (zh) * | 2022-06-06 | 2022-07-05 | 一道新能源科技(衢州)有限公司 | 一种聚焦激光双折射perc电池片开槽装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2800522B1 (fr) * | 1999-11-02 | 2002-01-25 | Automa Tech Sa | Dispositif d'elaboration d'une pluralite de faisceaux laser |
| JP4143391B2 (ja) * | 2002-12-02 | 2008-09-03 | Ｎｅｃエンジニアリング株式会社 | マルチビーム・マルチヘッド描画装置 |
| JP4736633B2 (ja) * | 2005-08-31 | 2011-07-27 | セイコーエプソン株式会社 | レーザ照射装置 |
| JP5192213B2 (ja) * | 2007-11-02 | 2013-05-08 | 株式会社ディスコ | レーザー加工装置 |
| JP5133033B2 (ja) * | 2007-11-26 | 2013-01-30 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
| JP2009248136A (ja) * | 2008-04-07 | 2009-10-29 | Miyachi Technos Corp | レーザ光分岐装置およびレーザ加工装置 |
| CN101614876B (zh) * | 2009-07-29 | 2011-09-28 | 中国人民解放军国防科学技术大学 | 一种光束任意整形新方法及装置 |
-
2010
- 2010-01-29 JP JP2010019009A patent/JP5431989B2/ja active Active
- 2010-12-08 KR KR1020100124837A patent/KR20110089053A/ko active Search and Examination
-
2011
- 2011-01-28 CN CN201110031686.7A patent/CN102151986B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5431989B2 (ja) | 2014-03-05 |
| CN102151986A (zh) | 2011-08-17 |
| KR20110089053A (ko) | 2011-08-04 |
| JP2011156551A (ja) | 2011-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102151986B (zh) | 激光加工装置 | |
| JP6022223B2 (ja) | レーザー加工装置 | |
| CN103252583B (zh) | 激光加工方法和激光加工装置 | |
| CN100488697C (zh) | 激光束加工机 | |
| CN103506758B (zh) | 激光加工装置 | |
| US10076805B2 (en) | Laser processing apparatus | |
| CN102626830B (zh) | 激光光线照射机构及激光加工装置 | |
| KR102303131B1 (ko) | 레이저 가공 장치 | |
| CN101172318A (zh) | 激光加工装置 | |
| US20120111840A1 (en) | Laser processing apparatus | |
| CN103223558A (zh) | 激光加工装置 | |
| JP2008110383A (ja) | レーザー加工装置 | |
| CN101890579A (zh) | 器件加工方法 | |
| JP2010194584A (ja) | レーザー加工装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |