CN102151986B - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- CN102151986B CN102151986B CN201110031686.7A CN201110031686A CN102151986B CN 102151986 B CN102151986 B CN 102151986B CN 201110031686 A CN201110031686 A CN 201110031686A CN 102151986 B CN102151986 B CN 102151986B
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- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Abstract
The invention provides a laser processing device which is capable of forming a wide laser working groove and can carry out effective processing along processing lines. The laser processing device comprises a chuck workbench, a laser beam irradiating component and a process feeding component, wherein the laser beam irradiating component comprises a laser beam oscillating component for oscillating laser beams, and a condenser for gathering laser beams. The condenser comprises a laser beam separating component serially provided with separators with a wavelength plate and birefringent beam splitters and condenser lenses. The wavelength plate generates phase difference between the polarized light part of the laser light oscillated by the laser beam oscillating component and parallel to an optical axis and the polarized light part perpendicular to the optical axis. The birefringent beam splitters split laser light passing through the wavelength plate in a predetermined splitting angle, and the condenser lenses gather the laser lights split by the laser beam separating component. The birefringent beam splitters have different splitting angles.
Description
Technical field
The present invention relates to a kind of laser processing device, this laser processing device is applicable to irradiate laser beam to form laser processing groove along the spacing track formed on the surface of the machined objects such as semiconductor wafer.
Background technology
In semiconductor devices manufacturing process, form following semiconductor wafer: in this semiconductor wafer, on the surface of the semiconductor substrates such as silicon, the duplexer being laminated with dielectric film and functional membrane is utilized to be formed with the devices such as multiple IC (Integrated Circuit: integrated circuit), LSI (Large Scale Integration: large scale integrated circuit) in a matrix form.About the semiconductor wafer formed by this way, the segmentation preset lines division that above-mentioned devices use is referred to as spacing track is come, and by splitting along this spacing track described semiconductor wafer, thus produces device one by one.
The segmentation along spacing track of this semiconductor wafer utilizes the topping machanism being referred to as scribing machine (dicer) to carry out usually.This topping machanism possesses: chuck table, and this chuck table is for keeping the semiconductor wafer as machined object; Cutting member, this cutting member is for cutting the semiconductor wafer kept by this chuck table; And mobile member, this mobile member is used for making chuck table and cutting member relative movement.Cutting member comprises the rotary main shaft of High Rotation Speed and is assemblied in the cutting tool of this main shaft.Cutting tool is made up of the cutting edge of ring-type of discoid pedestal and the side peripheral part that is assemblied in this pedestal, cutting edge is such as approximately the diamond abrasive grain of 3 μm by adopting electroforming mode to fix particle diameter and is formed, and the thickness of cutting edge is formed as such as 20 μm ~ 30 μm.
Recently, in order to improve IC, the disposal ability of the devices such as LSI, the semiconductor wafer of following form is practical: in this semiconductor wafer, on the surface of the semiconductor substrates such as silicon, utilization is laminated with low dielectric constant insulator overlay film (Low-k film) and the duplexer of functional membrane defines semiconductor chip, described low dielectric constant insulator overlay film is by SiOF, the film of the inorganic matter classes such as BSG (SiOB) or as polyimide, the film of the organic matter class of the polymer films such as Parylene (parylene) class is formed, described functional membrane is for the formation of circuit.
In addition, following semiconductor wafer is also practical, this semiconductor wafer is configured to: arrange partly at the spacing track of semiconductor wafer and be referred to as testing element group (Test Element Group, TEG) metal pattern, was tested by the function of metal pattern to circuit before dividing semiconductor wafer.
Because above-mentioned Low-k film is different from the material of wafer with the material of testing element group (TEG), be therefore difficult to utilize cutting tool to cut simultaneously.That is, Low-k film is highly brittle as mica, and therefore, if utilize cutting tool to cut along spacing track, then Low-k film is peeled off, and there is this stripping and arrives device and device caused to the problem of fatal damage.In addition, because testing element group (TEG) is formed by metal, if therefore utilize cutting tool to carry out cutting, burr can be produced.
In order to eliminate the problems referred to above, propose there is following processing method: the Low-k film that will be formed spacing track by the spacing track irradiated with pulse laser light along semiconductor wafer or testing element group (TEG) removing being disposed in spacing track, and cutting tool is positioned at this region eliminating Low-k film or testing element group (TEG) and carries out cutting (such as with reference to patent document 1).
In addition, as the method being formed laser processing groove by the spacing track irradiated with pulse laser light along wafer along spacing track accurately, following laser processing is Patent Document 2 discloses: the focal point of pulse laser light is formed as oval following, along spacing track, the major axis in the focal point of this ellipse is positioned, and make focal point and wafer relatively carry out processing feeding along spacing track, increase the Duplication of focal point thus.
Patent document 1: Japanese Unexamined Patent Publication 2005-142398 publication
Patent document 2: Japanese Unexamined Patent Publication 2006-51517 publication
But, when Low-k film or testing element group (TEG) being removed by the spacing track irradiated with pulse laser light along wafer as the processing method disclosed in above-mentioned patent document 1, need to form the width laser processing groove wider than the thickness of cutting tool.Therefore, when the focal point diameter of laser beam is about 10 μm, have to repeatedly implement, along the laser light irradiation operation of spacing track irradiation laser beam, to there is the problem of producing rate variance at width.
In addition, by the focal point of laser beam being formed as implementing Laser Processing elliptically as the laser processing disclosed in above-mentioned patent document 2, the Duplication of focal point can be made to increase, but, because the Energy distribution of the laser beam of oval focal point on long axis direction presents Gaussian Profile, the effect of oval focal point therefore cannot be played in fact fully.
Summary of the invention
The present invention completes in view of the above fact, and major technique problem of the present invention is that providing a kind of can form the wide laser processing groove of width simultaneously and can implement the effective laser processing device processed along processing line.
In order to solve above-mentioned major technique problem, according to the present invention, provide a kind of laser processing device, described laser processing device possesses: chuck table, and this chuck table is for keeping machined object, laser light irradiation component, the machined object that this laser light irradiation component is used for being held in described chuck table irradiates laser beam, and processing feeding component, this processing feeding component is used for making described chuck table and described laser light irradiation component in the relative movement of processing direction of feed, the feature of described laser processing device is, described laser light irradiation component possesses: laser beam oscillating member, and this laser beam oscillating member is for vibrating laser beam, and concentrator, this concentrator coalescence can expose to the machined object being held in described chuck table for making from the vibrate laser beam that of described laser beam oscillating member, described concentrator comprises laser beam separating member and collector lens, described laser beam separating member is in series equipped with multiple separator, described separator comprises wavelength plate and birefringence mode beam splitter, described wavelength plate produces phase difference for making to utilize the vibrate polarized light component parallel with optic axis of the laser beam and the polarized light component vertical with optic axis of described laser beam oscillating member, described birefringence mode beam splitter is separated with predetermined separation angle for making the laser beam that have passed described wavelength plate, described collector lens is for making the multi-stripe laser convergence of rays after utilizing described laser beam separating member to be separated, the separation angle forming each birefringence mode beam splitter of described laser beam separating member is configured to different separation angle.
Above-mentioned laser beam separating member, by changing quantity or the interval of above-mentioned separator, adjusts the isolated quantity of multi-stripe laser light or the interval of focal point.
In addition, above-mentioned laser beam separating member is configured to: the focal point of multi-stripe laser light is positioned at the direction orthogonal with processing direction of feed.
In addition, above-mentioned laser beam separating member is configured to: the focal point of multi-stripe laser light is positioned at processing direction of feed.
Based in laser processing device of the present invention, concentrator coalescence can expose to the machined object being held in chuck table for making from the vibrate laser beam that of laser beam oscillating member, this concentrator comprises laser beam separating member and collector lens, described laser beam separating member is in series equipped with multiple separator, described separator comprises wavelength plate and birefringence mode beam splitter, described wavelength plate produces phase difference for the polarized light component parallel with optic axis of laser beam that make to utilize laser beam oscillating member to vibrate and and the polarized light component vertical with optic axis, described birefringence mode beam splitter is separated with predetermined separation angle for making the laser beam that have passed described wavelength plate, described collector lens is for making the multi-stripe laser convergence of rays after utilizing described laser beam separating member to be separated, each birefringence mode beam splitter forming laser beam separating member is configured to different separation angle, therefore, multi-stripe laser light after can being separated utilizing laser beam separating member is positioned at processing direction of feed or the direction orthogonal with processing direction of feed.Therefore, the wide laser processing groove of width can be formed by multi-stripe laser light simultaneously, in addition, by by utilize laser beam separating member be separated after multi-stripe laser light be positioned at processing direction of feed, the Duplication of focal point increases, thus can implement effective Laser Processing.
Accompanying drawing explanation
Fig. 1 is the stereogram of the laser processing device according to the present invention's formation.
Fig. 2 illustrates the laser beam oscillating member of laser light irradiation component and the block diagram of concentrator that form and be equipped in the laser processing device shown in Fig. 1.
Fig. 3 is the key diagram of the released state that the laser beam utilizing the laser beam separating member of the concentrator shown in pie graph 2 to realize is shown.
Fig. 4 is the key diagram of an example of the arrangement of the focal point that the laser beam after utilizing the laser beam separating member shown in Fig. 3 to be separated is shown.
Fig. 5 is the stereogram of other embodiments that the laser beam separating member forming the concentrator be equipped in the laser processing device shown in Fig. 1 is shown.
Fig. 6 is the exploded perspective view of the laser beam separating member shown in Fig. 5.
Fig. 7 is the key diagram of the released state that the laser beam utilizing the laser beam separating member shown in Fig. 5 and Fig. 6 to realize is shown.
Fig. 8 be illustrate a part for the separator of the laser beam separating member shown in pie graph 5 and Fig. 6 is removed after when the key diagram of released state of laser beam.
Fig. 9 is the stereogram of the semiconductor wafer as machined object.
Figure 10 is the broken section enlarged drawing of the semiconductor wafer shown in Fig. 9.
Figure 11 is the stereogram that the state via boundary belt, the semiconductor wafer shown in Fig. 9 being supported on ring-shaped frame is shown.
Figure 12 utilizes the laser processing device shown in Fig. 1 along the key diagram of the laser light irradiation operation of the spacing track formation laser processing groove of the semiconductor wafer shown in Fig. 9.
Figure 13 is the amplification view of the laser processing groove by the laser light irradiation operation shown in enforcement Figure 12 in semiconductor wafer formation.
Figure 14 is the key diagram of the cutting process cut off by semiconductor wafer along the laser processing groove formed by the laser light irradiation operation shown in Figure 12.
Figure 15 is the key diagram of the relation illustrated between laser processing groove in the cutting process shown in Figure 14 and cutting tool.
Figure 16 is the key diagram of the incision supplying position of the cutting tool illustrated in the cutting process shown in Figure 14.
Label declaration
2: stationary base; 3: chuck table mechanism; 36: chuck table; 37: processing feeding component; 38: the first index feed components; 4: laser light irradiation unit bearing mechanism; 43: the second index feed components; 5: laser light irradiation unit; 51: unit retainer; 52: laser light irradiation component; 53: pulse laser light oscillating member; 6: concentrator; 61: direction conversion mirror; 62: laser beam separating member; 621,622: separator; 621a, 622a: wavelength plate; 621b, 622b: birefringence mode beam splitter; 628: separator unit shell; 7: imaging member; 10: semiconductor wafer (machined object); 16: topping machanism; 161: the chuck table of topping machanism; 162: cutting tool.
Detailed description of the invention
Below, with reference to accompanying drawing, the preferred embodiment of the laser processing device formed according to the present invention is described in detail.
The stereogram of the laser processing device formed according to the present invention has been shown in Fig. 1.Laser processing device shown in Fig. 1 possesses: stationary base 2; Chuck table mechanism 3, this chuck table mechanism 3 is can be disposed in above-mentioned stationary base 2, for keeping machined object along the mode of processing direction of feed (X-direction) movement shown in arrow X; Laser light irradiation unit bearing mechanism 4, this laser light irradiation unit bearing mechanism 4 is can be disposed in stationary base 2 along the mode of index feed direction (Y direction) movement shown in the arrow Y orthogonal with X-direction; And laser light irradiation unit 5, this laser light irradiation unit 5 is can be disposed in above-mentioned laser light irradiation unit bearing mechanism 4 along the mode of focal position adjustment direction (Z-direction) movement shown in arrow Z.
Above-mentioned chuck table mechanism 3 possesses: pair of guide rails 31,31, and this pair of guide rails 31,31 is disposed in stationary base 2 along X-direction abreast; First sliding shoe 32, this first sliding shoe 32 is being disposed on above-mentioned guide rail 31,31 along the mode of X-direction movement; The second sliding shoe 33, this second sliding shoe 33 is being disposed on above-mentioned first sliding shoe 32 along the mode of Y direction movement; Supporting table 35, this supporting table 35 is bearing on above-mentioned the second sliding shoe 33 by cylinder part 34; And as the chuck table 36 of machined object retaining member.This chuck table 36 is formed by porous material, and has machined object holding surface 361, utilizes not shown attracting member to be remained on chuck table 36 by the such as discoid semiconductor wafer as machined object.Further, chuck table 36 rotates by means of the not shown pulse motor be disposed in cylinder part 34.Further, be equipped with binding clasp 362 at chuck table 36, this binding clasp 362 is for stationary ring framework, and this ring-shaped frame is for supporting semiconductor wafer described later.
Above-mentioned first sliding shoe 32 is provided with a pair directed groove 321,321 coordinated with above-mentioned pair of guide rails 31,31 at its lower surface, and, the pair of guide rails 322,322 formed abreast along Y direction is provided with at the upper surface of above-mentioned first sliding shoe 32.The first sliding shoe 32 formed by this way is configured to by making directed groove 321,321 coordinate with pair of guide rails 31,31, and can move along pair of guide rails 31,31 in Y direction.Chuck table mechanism 3 in illustrated embodiment possesses processing feeding component 37, and this processing feeding component 37 moves in X-direction along pair of guide rails 31,31 for making the first sliding shoe 32.Processing feeding component 37 comprises: external thread rod 371, and this external thread rod 371 to be disposed between above-mentioned pair of guide rails 31 and 31 and parallel with 31 with this pair of guide rails 31; And the drive source such as pulse motor 372, this drive source such as pulse motor 372 grade rotates for driving above-mentioned external thread rod 371.One end of external thread rod 371 is bearing in the drive tab 373 being fixed on above-mentioned stationary base 2 in the mode that can freely rotate, the other end of external thread rod 371 and the output shaft transmission of above-mentioned pulse motor 372 link.In addition, external thread rod 371 screws togather with the through internal thread hole being formed at not shown internal thread block, and above-mentioned internal thread block protrudes the central portion lower surface being arranged at the first sliding shoe 32.Therefore, by utilizing pulse motor 372 to drive external thread rod 371 to rotate and reverse, the first sliding shoe 32 moves along guide rail 31,31 in the processing direction of feed as X-direction.
Above-mentioned the second sliding shoe 33 is provided with a pair directed groove 331,331 at its lower surface, this a pair directed groove 331,331 coordinates with the pair of guide rails 322,322 of the upper surface being arranged at above-mentioned first sliding shoe 32, above-mentioned the second sliding shoe 33 is configured to by making above-mentioned directed groove 331,331 coordinate with pair of guide rails 322,322, and can move in Y direction.Chuck table mechanism 3 in illustrated embodiment possesses the first index feed component 38, and this first index feed component 38 moves in Y direction along the pair of guide rails 322,322 being arranged at the first sliding shoe 32 for making the second sliding shoe 33.First index feed component 38 comprises: external thread rod 381, and this external thread rod 381 to be disposed between above-mentioned pair of guide rails 322 and 322 and parallel with 322 with this pair of guide rails 322; And the drive source such as pulse motor 382, this drive source such as pulse motor 382 grade rotates for driving above-mentioned external thread rod 381.One end of external thread rod 381 is bearing in the drive tab 383 of the upper surface being fixed on above-mentioned first sliding shoe 32 in the mode that can freely rotate, the other end of external thread rod 381 and the output shaft transmission of above-mentioned pulse motor 382 link.In addition, external thread rod 381 screws togather with the through internal thread hole being formed at not shown internal thread block, and above-mentioned internal thread block protrudes the central portion lower surface being arranged at the second sliding shoe 33.Therefore, by utilizing pulse motor 382 to drive external thread rod 381 to rotate and reverse, the second sliding shoe 33 moves along guide rail 322,322 in the index feed direction as Y direction.
Above-mentioned laser light irradiation unit bearing mechanism 4 possesses: pair of guide rails 41,41, and this pair of guide rails 41,41 is disposed in stationary base 2 along Y direction abreast; And movable support pedestal 42, this movable support pedestal 42 is can be disposed on above-mentioned guide rail 41,41 in the mode of Y direction movement.This movable support pedestal 42 comprises: mobile support 421, and this moves support 421 can the mode of movement be disposed on guide rail 41,41; And department of assembly 422, this department of assembly 422 is installed on above-mentioned mobile support 421.Department of assembly 422 is provided with the pair of guide rails 423,423 extended in Z-direction abreast a side.Laser light irradiation unit bearing mechanism 4 in illustrated embodiment possesses the second index feed component 43, and this second index feed component 43 moves in Y direction along pair of guide rails 41,41 for making movable support pedestal 42.Second index feed component 43 comprises: external thread rod 431, this external thread rod 431 to be disposed between above-mentioned pair of guide rails 41,41 and with this pair of guide rails 41,41 parallel; And the drive source such as pulse motor 432, this drive source such as pulse motor 432 grade rotates for driving above-mentioned external thread rod 431.One end of external thread rod 431 is bearing in the not shown drive tab being fixed on above-mentioned stationary base 2 in the mode that can freely rotate, the other end of external thread rod 431 and the output shaft transmission of above-mentioned pulse motor 432 link.In addition, external thread rod 431 screws togather with the internal thread hole being formed at not shown internal thread block, and above-mentioned internal thread block protrudes the central portion lower surface being arranged at the mobile support 421 forming movable support pedestal 42.Therefore, by utilizing pulse motor 432 to drive external thread rod 431 to rotate and reverse, movable support pedestal 42 moves along guide rail 41,41 in the index feed direction as Y direction.
Laser light irradiation unit 5 in illustrated embodiment possesses unit retainer 51 and is installed on the laser light irradiation component 52 of this unit retainer 51.Unit retainer 51 is provided with a pair directed groove 511,511, this a pair directed groove 511,511 coordinates with the pair of guide rails 423,423 being arranged at above-mentioned department of assembly 422 in the mode that can slide, by making above-mentioned directed groove 511,511 coordinate with above-mentioned guide rail 423,423, unit retainer 51 is supported to move in Z-direction.
Illustrated laser light irradiation component 52 comprises the housing 521 of drum, and the housing 521 of this drum is fixed on said units retainer 51, and in fact flatly extends.In housing 521, be equipped with pulse laser light oscillating member 53 as illustrated in fig. 2.Pulse laser light oscillating member 53 comprises pulsed laser light line oscillator 531 and is attached to the repetition rate setting element 532 of this pulsed laser light line oscillator 531, and above-mentioned pulsed laser light line oscillator 531 is made up of YAG laser oscillator or YVO4 laser oscillator.Be directed to concentrator 6 from the pulse laser light oscillating member 53 pulse laser light LB that vibrates, this concentrator 6 is assemblied in the terminal part of above-mentioned housing 521.
Proceed to illustrate with reference to Fig. 2, the concentrator 6 in illustrated embodiment comprises direction conversion mirror 61, laser beam separating member 62 and collector lens 63.The laser beam LB that direction conversion mirror 61 vibrating from above-mentioned pulse laser light oscillating member 53 is i.e. laser beam separating member 62 travel direction conversion downward.
In the embodiment shown in figure 2, laser beam separating member 62 possesses 2 separators 621,622 in series arranged.These 2 separators 621,622 have wavelength plate 621a, 622a and birefringence mode beam splitter (beamsplitter) 621b, 622b respectively.Wavelength plate 621a, 622a make the polarized light component parallel with optic axis of laser beam LB and the polarized light component vertical with optic axis produce phase difference, described laser beam LB be vibrated by pulse laser light oscillating member 53 and utilization orientation conversion mirror 61 carried out direction change after laser beam LB.Birefringence mode beam splitter 621b, 622b are made up of Wollaston (Wollaston) polarization element etc., and they make the polarized light component parallel with optic axis of the pulse laser light LB that have passed wavelength plate 621a, 622a and the polarized light component vertical with optic axis be separated with predetermined separation angle respectively.In addition, the separation angle forming the birefringence mode beam splitter 621b of separator 621 and the birefringence mode beam splitter 622b of formation separator 622 is set to different values.In the illustrated embodiment, the separation angle forming the birefringence mode beam splitter 622b of separator 622 is set to the value less than the separation angle of the birefringence mode beam splitter 621b forming separator 621.Herein, with reference to Fig. 3, to utilizing laser beam separating member 62, the state that pulse laser light LB is separated into multiple optical axis is described.By above-mentioned pulse laser light oscillating member 53 vibrate and utilization orientation conversion mirror 61 carried out direction change after laser beam LB be separated into LB1x, LB1y by means of separator 621 with large separation angle, separated device 621 is separated into two-part LB1x, LB1y and is divided into LB2x, LB2y and LB2x, LB2y with less separation angle respectively by means of separator 622.Like this, by using 2 separators 621,622, the laser beam LB that vibrated can be separated into 4 laser beams by pulse laser light oscillating member 53.Therefore, if use 3 separators, 8 laser beams can be separated into, if use 4 separators, 16 laser beams can be separated into, if use 5 separators, 32 laser beams can be separated into.
Proceed to illustrate with reference to Fig. 2,4 laser beams LB2x, LB2y and LB2x being separated into by laser beam LB as described above, LB2y utilize collector lens 63 to carry out optically focused and expose to the machined object W kept by chuck table 36.In the embodiment shown in figure 2, the configuration direction setting of separator 621,622 becomes: each focal point (s) of irradiating as described above to 4 laser beams LB2x, LB2y and LB2x of machined object W, LB2y is positioned to linearity in the index feed direction (Y direction) orthogonal with processing direction of feed (X-direction) as illustrated in fig. 4.
Next, be described with reference to other the embodiment of Fig. 5 and Fig. 6 to laser beam separating member 62.
Laser beam separating member 62 shown in Fig. 5 and Fig. 6 possesses 5 separators 621,622,623,624,625.As shown in Figure 6, these 5 separators 621,622,623,624,625 comprise wavelength plate 621a, 622a, 623a, 624a, 625a and birefringence mode beam splitter 621b, 622b, 623b, 624b, 625b respectively, and these 5 separators 621,622,623,624,625 are incorporated in storage shell 627 respectively.Storage shell 627 is formed as rectangle, and is respectively arranged with opening 627a (the opening 627a being arranged at roof is only shown in figure 6) at the roof and diapire receiving shell 627.Form wavelength plate 621a, 622a, 623a, 624a, 625a of being accommodated in each separator 621,622,623,624,625 of this storage shell 627 to be configured to rotate in the horizontal plane, namely can rotate around the optical axis of the laser beam passed through.In addition, by making wavelength plate 621a, 622a, 623a, 624a, 625a rotate, the ratio of the polarized light component parallel with optic axis of laser beam LB and the polarized light component vertical with optic axis of laser beam LB can be changed.In addition, the separation angle forming birefringence mode beam splitter 621b, 622b, 623b, 624b, 625b of each separator 621,622,623,624,625 is set to different values respectively.Be set in the illustrated embodiment: the separation angle of birefringence mode beam splitter 621b is maximum, and the separation angle of birefringence mode beam splitter 622b, 623b, 624b, 625b diminishes successively.Each separator 621,622,623,624,625 formed by this way is incorporated in separator unit shell 628.Separator unit shell 628 is formed as the long rectangular shape of above-below direction.This separator unit shell 628 is respectively arranged with opening 628c at roof 628a and diapire 628b.About the separator unit shell 628 formed by this way, separated by 4 demarcation strips 628d, 628e, 628f, 628g between roof 628a and diapire 628b, thus separator unit shell 628 possesses 5 receiving rooms 628h, 628i, 628j, 628k, 628m for receiving above-mentioned separator 621,622,623,624,625.In addition, be formed with opening 628c respectively at 4 demarcation strips 628d, 628e, 628f, 628g, the diameter of described opening 628c is with to be arranged at roof 628a identical with the diameter of the opening 628c of diapire 628b.Separator 621,622,623,624,625 is in series accommodated in 5 receiving rooms 628h, 628i, 628j, 628k, 628m of the separator unit shell 628 formed by this way in the mode that can load and unload.
Laser beam separating member 62 shown in above-mentioned Fig. 5 and Fig. 6 is formed in the above described manner, is described state laser beam being separated into multiple optical axis with reference to Fig. 7.
The laser beam LB that vibrated by pulse laser light oscillating member 53 is separated into two parts respectively by 5 separators 621,622,623,624,625 in the same manner as the separator 621,622 shown in above-mentioned Fig. 2 and Fig. 3, therefore, the optical axis of the laser beam after utilizing last separator 625 to be separated has 32.Isolated like this 32 optical axises are positioned to linearity in the index feed direction (Y direction) orthogonal with above-mentioned processing direction of feed (X-direction).In addition, in order to many optical axises after separation are positioned to linearity in processing direction of feed (X-direction), as long as each separator 621,622,623,624,625 be accommodated in each receiving room 628h, 628i, 628j, 628k, 628m of separator unit shell 628 is carried out receiving with following state: relative to the state shown in Fig. 5 and Fig. 6, the optical axis around the laser beam passed through have rotated 90 degree.
Next, with reference to Fig. 8, to by the separator 622 and 623 in the laser beam separating member 62 shown in Fig. 5 and Fig. 6 from after separator unit shell 628 removes released state be described.
After separator 622 and 623 is removed, as shown in Figure 8, the laser beam after utilizing separator 621,624,625 to be separated is formed as following form: be positioned with 4 optical axises in both sides respectively, and there is not optical axis at central portion.
As mentioned above, by changing quantity and the configuration status of separator, many optical axises can be utilized to form various form.Therefore, by separator is combined into various form, various processing can be tackled.
Return Fig. 1 to proceed to illustrate, be equipped with imaging member 7 in the leading section of the housing 521 forming above-mentioned laser light irradiation component 52, this imaging member 7 should utilize above-mentioned laser light irradiation component 52 to carry out the machining area of Laser Processing for detecting.This imaging member 7 has such as the following parts: illuminating member, and this illuminating member is used for throwing light on to machined object; Optical system, this optical system is for catching the region of being thrown light on by above-mentioned illuminating member; And imaging apparatus (CCD), the picture that this imaging apparatus is used for being captured by above-mentioned optical system is made a video recording, and the picture signal photographed is sent to not shown control member by above-mentioned imaging member 7.
Laser light irradiation unit 5 in illustrated embodiment possesses mobile member 8, and this mobile member 8 moves in Z-direction along pair of guide rails 423,423 for making unit retainer 51.Mobile member 8 comprises: external thread rod (not shown), and this external thread rod is disposed between pair of guide rails 423,423; And the drive source such as pulse motor 82, this drive source such as pulse motor 82 grade rotates for driving above-mentioned external thread rod, by utilizing pulse motor 82 to drive not shown external thread rod to rotate forward or reversion, unit retainer 51 and laser light irradiation component 52 are moved at focal position adjustment direction (Z-direction) along pair of guide rails 423,423.In addition, in the illustrated embodiment, by driving pulse motor 82 just then laser light irradiation component 52 is moved upward, reversed by driving pulse motor 82 and laser light irradiation component 52 is moved downward.
Laser processing device in illustrated embodiment is formed in the above described manner, is described below to its effect.
Herein, with reference to Fig. 9 and Figure 10, the semiconductor wafer as machined object processed utilizing above-mentioned laser processing device is described.
About the semiconductor wafer 10 shown in Fig. 9 and Figure 10, on the surface of the semiconductor substrates such as silicon 11, utilize the duplexer 12 being laminated with dielectric film and functional membrane to be formed with the devices such as multiple IC, LSI 13 in a matrix form, wherein said functional membrane is for the formation of circuit.Further, each device 13 is divided comes by being formed as cancellate spacing track 14.In addition, in the illustrated embodiment, the dielectric film forming duplexer 12 is formed by low dielectric constant insulator overlay film (Low-k film), and this low dielectric constant insulator overlay film is by SiO
2the film of the inorganic matter classes such as film or SiOF, BSG (SiOB) or formed as the film of the organic matter class of the polymer films such as polyimide, Parylene class.The method splitting the semiconductor wafer 10 so formed along spacing track 14 is described.
When splitting above-mentioned semiconductor wafer 10 along spacing track 14, as shown in figure 11 semiconductor wafer 10 is pasted onto the surface of the boundary belt T being assemblied in ring-shaped frame F.Now, in the mode making the surperficial 10a of semiconductor wafer 10 be positioned at top, the rear side of semiconductor wafer 10 is pasted on boundary belt T.
Then, implement laser light irradiation operation, in this laser light irradiation operation, the spacing track 14 along semiconductor wafer 10 irradiates laser beam, is removed by the duplexer 12 on spacing track.
About this laser light irradiation operation; first the semiconductor wafer 10 being supported on ring-shaped frame F via boundary belt T is positioned on the chuck table 36 of the laser processing device shown in above-mentioned Fig. 1, and semiconductor wafer 10 is remained on this chuck table 36 across boundary belt T absorption.Therefore, semiconductor wafer 10 with make surperficial 10a be positioned at upside mode be kept.In addition, the ring-shaped frame F that carry semiconductor wafer 10 via boundary belt T is fixed by binding clasp 362.
Attracting holding has the chuck table 36 of semiconductor wafer 10 to be positioned at immediately below imaging member 7 by processing feeding component 37 in the above described manner.When chuck table 36 is positioned in immediately below imaging member 7, utilize imaging member 7 and not shown control member to perform calibrating operation, this calibrating operation is the operation should carrying out the machining area of Laser Processing detecting semiconductor wafer 10.Namely, imaging member 7 and not shown control member perform the image procossing such as pattern match, thus completing the calibration of laser light irradiation position, the image procossing such as above-mentioned pattern match are used for the position alignment between the spacing track 14 that carries out being formed on the predetermined direction of semiconductor wafer 10 and the concentrator 6 of the laser light irradiation component 52 that irradiates laser beam along spacing track 14.In addition, for be formed at semiconductor wafer 10, the spacing track 14 that extends in the direction orthogonal with above-mentioned predetermined direction, complete the calibration of laser light irradiation position too.
After in the above described manner the spacing track 14 being formed at the semiconductor wafer 10 be maintained on chuck table 36 being detected and carry out the calibration of laser light irradiation position, as shown in (a) of Figure 12, make chuck table 36 move to laser light irradiation region, be positioned at immediately below concentrator 6 by predetermined spacing track 14, wherein above-mentioned laser light irradiation region is the position at concentrator 6 place irradiating laser beam.Now, as shown in (a) of Figure 12, one end (being left end in (a) of Figure 12) that semiconductor wafer 10 is oriented to spacing track 14 is positioned at immediately below concentrator 6.In this condition, as shown in (b) of Figure 12, from concentrator 6 irradiate above-mentioned 4 laser beams LB2x, LB2y and LB2x, LB2y each focal point (s) be positioned in the width of spacing track 14.Further, mobile member 8 is worked thus adjusts the height and position of laser light irradiation component 52, to make 4 laser beams LB2x, LB2y and LB2x, each focal point (s) of LB2y is positioned at the surface of spacing track 14.
Then, while make laser light irradiation component 52 work irradiate above-mentioned 4 laser beams LB2x, LB2y and LB2x, LB2y from concentrator 6, chuck table 36 is moved (laser light irradiation operation) with predetermined processing feed speed towards the direction shown in arrow X1 in (a) of Figure 12.Then, as shown in (c) of Figure 12, arrive immediately below concentrator 6 after position at the other end (being right-hand member in (c) of Figure 12) of spacing track 14, the irradiation of stop pulse laser beam, and the movement stopping chuck table 36.
In addition, the processing conditions in above-mentioned laser light irradiation operation such as sets in the following manner.
The light source of laser beam: YVO4 laser or YAG laser
Wavelength: 355nm
Export: 10W
Repetition rate: 100kHz
Pulse width: 1ns
Focal point diameter: 8 μm
Processing feed speed: 100mm/ second
Be that the focal point (s) of 8 μm is set to the state contacted with each other as Suo Shi (b) of Figure 12 by focal point diameter under above-mentioned processing conditions, thus, utilize above-mentioned 4 laser beams LB2x, LB2y and LB2x at the spacing track 14 of semiconductor wafer 10 as shown in figure 13, LB2y forms width (E) simultaneously and be 32 μm and the laser processing groove 101 darker than duplexer 12.Like this, above-mentioned laser light irradiation operation is implemented to all spacing tracks 14 being formed at semiconductor wafer 10.
After above-mentioned laser light irradiation operation is implemented to all spacing tracks 14 being formed at semiconductor wafer 10, implement the cutting process cut off by semiconductor wafer 10 along spacing track 14.Namely, as shown in figure 14, the mode that semiconductor wafer 10 after implementing laser light irradiation operation is positioned at upside with surperficial 10a is positioned on the chuck table 161 of topping machanism 16, and utilizes not shown attracting member to be remained on chuck table 161 by semiconductor wafer 10.Then, the chuck table 161 maintaining semiconductor wafer 10 is made to move to the cutting starting position in machining region.Now, as shown in figure 14, one end (in fig. 14 for left end) that semiconductor wafer 10 is oriented to the spacing track 14 that should cut is positioned at the position than scheduled volume on the right side immediately below cutting tool 162.Now, thickness is such as that the cutting tool 162 of 20 μm is positioned in the width (E) of laser processing groove 101 as illustrated in fig. 15.
After the cutting starting position by this way chuck table 161 i.e. semiconductor wafer 10 being positioned at machining region, make the position of readiness of cutting tool 162 from Figure 14 shown in double dot dash line carry out incision feeding downward, as shown in solid line in Figure 16, cutting tool 162 is positioned at predetermined incision supplying position.As shown in figure 16, this incision supplying position is set in such position: in this position, and the lower end of cutting tool 162 arrives the boundary belt T pasted at the back side of semiconductor wafer 10.
Then, make cutting tool 162 rotate with predetermined rotary speed towards the direction shown in arrow 162a as shown in figure 14, and chuck table 161 i.e. semiconductor wafer 10 is moved with predetermined cutting feed speed towards the direction shown in arrow X1 in Figure 14.Then, after the chuck table 161 i.e. other end of semiconductor wafer 10 (being right-hand member in fig. 14) arrives the position than the side scheduled volume that keeps left immediately below cutting tool 162, the mobile of chuck table 161 is stopped.By making chuck table 161 carry out cutting feeding by this way, semiconductor wafer 10 is cut off along spacing track 14.
Then, chuck table 161 i.e. semiconductor wafer 10 is made to carry out index feed in the direction (index feed direction) vertical with paper with the amount suitable with the interval of spacing track 14, the spacing track 14 that should be cut by the next one is positioned at the position corresponding with cutting tool 162, and is back to the state shown in Figure 14.Then, cutting process is implemented in the mode same with aforesaid way.
In addition, above-mentioned cutting process such as carries out under following processing conditions.
Cutting tool: external diameter is 52mm, thickness is 20 μm
The rotary speed of cutting tool: 40000rpm
Cut feed speed: 50mm/ second
Above-mentioned cutting process is implemented to all spacing tracks 14 being formed at semiconductor wafer 10.As a result, semiconductor wafer 10 is cut off along spacing track 14, thus is divided into device 13 one by one.
In the above-described embodiment, show such example: the optical axis being separated into multiple laser beams is positioned to linearity to implement Laser Processing in the index feed direction (Y direction) orthogonal with processing direction of feed (X-direction), form the laser processing groove of preset width thus simultaneously, but, Laser Processing is implemented by the optical axis being separated into multiple laser beams is positioned to linearity in processing direction of feed (X-direction), thus, the Duplication of focal point increases, and can implement effective processing.
Claims (4)
1. a laser processing device, described laser processing device possesses: chuck table, and this chuck table is for keeping machined object; Laser light irradiation component, the machined object that this laser light irradiation component is used for being held in described chuck table irradiates laser beam; And processing feeding component, this processing feeding component is used for making described chuck table and described laser light irradiation component in the relative movement of processing direction of feed,
The feature of described laser processing device is,
Described laser light irradiation component possesses: laser beam oscillating member, and this laser beam oscillating member is for vibrating laser beam; And concentrator, this concentrator coalescence can expose to the machined object being held in described chuck table for making from the vibrate laser beam that of described laser beam oscillating member,
Described concentrator comprises laser beam separating member and collector lens, described laser beam separating member is in series equipped with multiple separator, described separator comprises wavelength plate and birefringence mode beam splitter, described wavelength plate produces phase difference for making to utilize the vibrate polarized light component parallel with optic axis of the laser beam and the polarized light component vertical with optic axis of described laser beam oscillating member, described birefringence mode beam splitter is separated with predetermined separation angle for making the laser beam that have passed described wavelength plate, described collector lens is for making the multi-stripe laser convergence of rays after utilizing described laser beam separating member to be separated,
The separation angle forming each birefringence mode beam splitter of described laser beam separating member is configured to separation angle different from each other,
In the multiple separators in series arranged, be directed into a described collector lens by the multi-stripe laser light after last separator is separated, all incide by the multi-stripe laser light after the separator before last separator is separated the next separator in series arranged.
2. laser processing device according to claim 1, wherein,
Described laser beam separating member, by changing quantity or the interval of described separator, adjusts the isolated quantity of multi-stripe laser light or the interval of focal point.
3. laser processing device according to claim 1 and 2, wherein,
Described laser beam separating member is configured to: the focal point of multi-stripe laser light is positioned at the direction orthogonal with described processing direction of feed.
4. laser processing device according to claim 1 and 2, wherein,
Described laser beam separating member is configured to: the focal point of multi-stripe laser light is positioned at described processing direction of feed.
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| JP2010019009A JP5431989B2 (en) | 2010-01-29 | 2010-01-29 | Laser processing equipment |
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| JP6261844B2 (en) * | 2012-02-20 | 2018-01-17 | 株式会社ディスコ | Laser processing method and laser processing apparatus |
| JP6022223B2 (en) | 2012-06-14 | 2016-11-09 | 株式会社ディスコ | Laser processing equipment |
| JP5940906B2 (en) | 2012-06-19 | 2016-06-29 | 株式会社ディスコ | Laser processing equipment |
| KR20140036593A (en) * | 2012-09-17 | 2014-03-26 | 삼성디스플레이 주식회사 | Laser processing apparatus |
| TWI543833B (en) | 2013-01-28 | 2016-08-01 | 先進科技新加坡有限公司 | Method of radiatively grooving a semiconductor substrate |
| JP6234312B2 (en) * | 2014-04-11 | 2017-11-22 | 株式会社ディスコ | Multilayer substrate processing method |
| JP6802093B2 (en) * | 2017-03-13 | 2020-12-16 | 株式会社ディスコ | Laser processing method and laser processing equipment |
| JP6935126B2 (en) * | 2017-04-05 | 2021-09-15 | 株式会社ディスコ | Wafer laser machining method |
| DE102018205545A1 (en) * | 2018-04-12 | 2019-10-17 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Device, laser processing machine and method for processing a workpiece |
| JP2021009274A (en) * | 2018-07-09 | 2021-01-28 | レーザーテック株式会社 | Light source, inspection device, and production method and inspection method of euv light |
| CN114700628A (en) * | 2022-06-06 | 2022-07-05 | 一道新能源科技(衢州)有限公司 | Device for slotting focused laser birefringence perc battery piece |
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| JP4143391B2 (en) * | 2002-12-02 | 2008-09-03 | Ｎｅｃエンジニアリング株式会社 | Multi-beam and multi-head drawing device |
| JP4736633B2 (en) * | 2005-08-31 | 2011-07-27 | セイコーエプソン株式会社 | Laser irradiation device |
| JP5192213B2 (en) * | 2007-11-02 | 2013-05-08 | 株式会社ディスコ | Laser processing equipment |
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| JP2009248136A (en) * | 2008-04-07 | 2009-10-29 | Miyachi Technos Corp | Laser beam branching device and laser beam machining apparatus |
| CN101614876B (en) * | 2009-07-29 | 2011-09-28 | 中国人民解放军国防科学技术大学 | New method and device for arbitrary beam shaping |
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