CN102147080A - Backlight unit and display device using the same - Google Patents

Backlight unit and display device using the same Download PDF

Info

Publication number
CN102147080A
CN102147080A CN2011100218031A CN201110021803A CN102147080A CN 102147080 A CN102147080 A CN 102147080A CN 2011100218031 A CN2011100218031 A CN 2011100218031A CN 201110021803 A CN201110021803 A CN 201110021803A CN 102147080 A CN102147080 A CN 102147080A
Authority
CN
China
Prior art keywords
lgp
back light
light unit
emitting module
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011100218031A
Other languages
Chinese (zh)
Other versions
CN102147080B (en
Inventor
朴东昱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN102147080A publication Critical patent/CN102147080A/en
Application granted granted Critical
Publication of CN102147080B publication Critical patent/CN102147080B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Abstract

Disclosed are a backlight unit and a display device using the same. The backlight unit includes a light guide plate, a light emitting module provided on at least one lateral surface of the light guide plate to supply light to the light guide plate, and a bottom cover to contain the light guide plate and the light emitting module. The light emitting module includes a substrate including a plurality of through holes and a plurality of light emitting devices which are inserted into the through holes and spaced apart from the light guide plate at a first distance.

Description

The display unit of back light unit and this back light unit of use
The cross reference of related application
The application requires the priority of (on January 15th, 2010 submitted to) korean patent application No.10-2010-0004103, and the full content of this Korean application is incorporated in this mode by reference.
Technical field
Embodiment relates to a kind of back light unit and uses the display unit of this back light unit.
Background technology
Light emitting diode (LED) is a kind of semiconductor devices that converts electrical energy into light.With compare such as the conventional light source of fluorescent lamp or glow lamp etc., LED is having superiority aspect power consumption, life cycle, response speed, security and the environmental requirement.In this regard, carried out various researchs and substituted conventional light source to utilize LED.LED is used as the light source such as the lighting device of various lamps, LCD, electronic mark board and street lamp etc. day by day.
Summary of the invention
Embodiment provides a kind of display unit that has the back light unit of novel structure and use this back light unit.
Embodiment provides a kind of display unit that can improve the back light unit of reliability and use this back light unit.
According to embodiment, this back light unit comprises: LGP; Light emitting module, this light emitting module are arranged at least one lateral surface of LGP, so that light is fed to LGP; And bottom, this bottom holds described LGP and light emitting module.This light emitting module comprises substrate and a plurality of luminescent device, and this substrate comprises a plurality of through holes, described a plurality of luminescent devices be inserted in described a plurality of through hole and with spaced apart first distance of LGP.
According to embodiment, this display unit comprises LGP; Light emitting module, this light emitting module are arranged at least one lateral surface of LGP, so that light is fed to LGP; Bottom, this bottom holds described LGP and light emitting module, wherein, this light emitting module comprises substrate and a plurality of luminescent device, this substrate comprises a plurality of through holes, described a plurality of luminescent devices be inserted in described a plurality of through hole and with spaced apart first distance of LGP; And liquid crystal panel, this liquid crystal panel is positioned at described back light unit top.
Embodiment can provide a kind of display unit that has the back light unit of novel structure and use this back light unit.
Embodiment can provide a kind of display unit that can improve the back light unit of reliability and use this back light unit.
Description of drawings
Fig. 1 is the perspective view that illustrates according to the back light unit of first embodiment;
Fig. 2 is the decomposition diagram that the back light unit of Fig. 1 is shown;
Fig. 3 illustrates the LGP of back light unit of Fig. 1 and the view of light emitting module;
Fig. 4 is the enlarged drawing that the regional A of Fig. 3 is shown;
Fig. 5 illustrates according to the view back light unit of second embodiment, LGP and light emitting module;
Fig. 6 is the enlarged drawing that the area B of Fig. 5 is shown;
Fig. 7 illustrates according to the LGP of the back light unit of the 3rd embodiment and the enlarged drawing of light emitting module; And
Fig. 8 illustrates the perspective view that comprises according to the display unit of back light unit of the present disclosure.
The specific embodiment
In the description of embodiment, be to be understood that, when a layer (or film), zone, pattern or structure be called as another substrate, another layer (or film), another zone, another pad or another pattern " on " or during D score, it can be positioned at " directly " or " indirectly " on another substrate, layer (or film), zone, pad or the pattern, perhaps also can have one or more intermediate layers.This position of layer has been described with reference to the drawings.
For convenience or for the purpose of clear, the thickness of each shown in the figure layer and size can by exaggerative, omit or schematically draw.In addition, these size of component and not exclusively reflection full-size(d).
Hereinafter, with the display unit of describing in detail with reference to the accompanying drawings according to back light unit and this back light unit of use of embodiment.
＜embodiment 1 〉
Fig. 1 is the perspective view that illustrates according to the back light unit of first embodiment, and Fig. 2 is the decomposition diagram that the back light unit of Fig. 1 is shown.
With reference to figure 1 and Fig. 2, comprise according to the back light unit of this embodiment: LGP 200; Light emitting module 100, at least one lateral surface of these light emitting module 100 contact LGPs 200 is to be fed to light this LGP 200; Reflecting member 300, this reflecting member 300 is positioned at LGP 200 belows; And bottom 400, this bottom 400 holds LGP 200, light emitting module 100 and reflecting member 300.
LGP 200 makes light diffusion supply surface light.LGP 200 comprises transparent material.For example, LGP 200 can comprise select a kind of from the group of being made up of following item: such as acrylic based resin, PET (PET), PC (Merlon), COC (cyclic olefine copolymer) and PEN (PEN) resin of PMAA (polymethyl methacrylate).
Light emitting module 100 is fed at least one cross side of LGP 200 with light, and light emitting module 100 is as the light source of the display unit that comprises this back light unit.
Light emitting module 100 can be positioned to LGP 200 contiguous.At length, light emitting module 100 comprises substrate 120 and a plurality of luminescent devices 110 that are installed on this substrate 120, and substrate 120 can be contiguous with LGP 200.
These luminescent devices 110 are inserted in a plurality of through holes that substrate 120 forms in the mode that is used for radiative light output surface and LGP 200 spaced apart first distances, will describe its details in detail below.
Reflecting member 300 can be formed on LGP 200 belows.Reflecting member 300 is the upwards reflection of the light of the basal surface incident of passing through LGP 200, thus the brightness that can improve this back light unit.Reflecting member 300 can comprise resin PET, PC or PVC, but present embodiment is not limited thereto.
Bottom 400 can hold LGP 200, light emitting module 00 and reflecting member 300 within it.For this reason, bottom 400 has box form, have uncovered top surface, but present embodiment is not limited thereto.
Can be by using metal material or resin material, utilizing extrusion process or expressing technique to make this bottom 400.
Hereinafter, light emitting module 100 will be described in more detail.
Fig. 3 is the view that light emitting module 100 and LGP 200 are shown, and Fig. 4 is the enlarged drawing that the regional A of Fig. 3 is shown.
With reference to figure 3 and Fig. 4, light emitting module 100 comprises substrate 120 and a plurality of luminescent device 110, and these luminescent devices 110 are inserted in a plurality of through holes 115 that form in substrate 120.
A surface of substrate 120 can contact with LGP 200.Because substrate 120 has relative homogeneous thickness on its whole zone, so the whole zone on a surface of substrate 120 can contact with LGP 200.
Substrate 120 can comprise insulating barrier 121 and PCB (printed circuit board), and this PCB comprises at least one the lip-deep circuit pattern 122 that is formed on insulating barrier 121.Except common PCB, substrate 120 can also comprise MCPCB (metal-cored PCB) or FPCB (flexible PCB), but present embodiment is not limited thereto.
In addition, can be provided with a plurality of through holes 115 in the substrate 120.These through holes 115 can penetrate into basal surface from the top surface of the insulating barrier 121 of substrate 120.These through holes 115 can form corresponding with the size and dimension of luminescent device 110, thereby luminescent device 110 can be inserted in these through holes 115.In addition, can determine to form the position of these through holes 115 according to the arrangement of luminescent device 110.
Luminescent device 110 can be inserted in the through hole 115 of substrate 120.The electrode 31 of luminescent device 110 and 32 can be electrically connected to circuit pattern 122, this circuit pattern 122 be formed on substrate 120 not on the surface of described LGP 200.Luminescent device 110 can utilize the electric power that transmits by circuit pattern 122 to produce light.
Can keep the mode of first distance h with LGP 200 with luminescent device 110, luminescent device 110 can be inserted in the through hole 115.In other words, the light output surface of luminescent device 110 can with LGP 200 spaced apart first distance h.
For this reason, the thickness of luminescent device 110 can be less than the degree of depth of through hole 115, and perhaps the part of luminescent device 110 is outstanding from the back of the body surface of substrate 120, but present embodiment is not limited thereto.
First distance h can be at about 0.05mm to the scope of about 0.5mm.Preferably, first distance h can be at about 0.05mm to the scope of about 0.15mm.
Luminescent device 110 and LGP 200 spaced apart first distance h, thereby, can be from the light of luminescent device 110 emissions in diffusion effectively in LGP 200 under the distortionless situation.
In addition,, can prevent luminescent device 110 contact LGPs 200, thereby can prevent because the deterioration of the luminescent device 110 that causes from the heat or the pressure of LGP 200 transmission according to another embodiment.
Hereinafter, will describe luminescent device 110 in detail.
With reference to figure 4, luminescent device 110 comprises: main body 10; A plurality of electrodes 31 and 32, described a plurality of electrodes 31 and 32 are installed in the main body 10; Luminescence chip 20, this luminescence chip 20 are installed in the main body 10 and are electrically connected to electrode 31 and 32; And encapsulation object 40, this encapsulation object 40 is used to seal described luminescence chip 20.
Main body 10 can comprise select at least a from the group of being made up of following item: such as resin material, Si, metal material, PSG (photosensitive glass), the Al of PPA (polyphthalamide) 2O 3, and PCB.
According to the purposes and the design of luminescent device 110, the top surface of main body 10 can have different shape, for example rectangle, polygon and circle.
Can be provided with cavity 15 in the main body 10, thereby make the opened upper end of main body 10.Cavity 15 can have the shape of cup-shaped or concave-shaped receptacle.Cavity 15 can have basal surface with cavity 15 inside lateral surface vertical or that tilt with respect to the basal surface of cavity 15.In addition, when observing in plane, cavity 15 can have circle, rectangle, polygon or elliptical shape.
In main body 10, electrode 31 and 32 is spaced apart from each other as follows: promptly, electrode 31 and 32 is electric insulation each other.Electrode 31 and 32 is electrically connected to luminescence chip 20, to supply power to luminescence chip 20.
Electrode 31 and 32 can comprise metal material, and that for example selects from the group of being made up of following item is at least a: Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag and P.
Electrode 31 and 32 exposes by the back of the body surface of main body 10, and the circuit pattern 122 that is electrically connected to substrate 120 is to receive electric power.
Luminescence chip 20 can be installed in electrode 31 and 32 one, perhaps can be installed on the main body 10.Luminescence chip 20 can be electrically connected to electrode 31 and 32 with reception electric power, thereby produces light.
For example, luminescence chip 20 can comprise at least one light emitting diode (LED).This LED can comprise the color LED of emission red light, green light, blue light or white light and UV (ultraviolet ray) LED of emission UV light, but present embodiment is not limited thereto.
As shown in Figure 4, luminescence chip 20 can be electrically connected to electrode 31 and 32 by the wire bond scheme, perhaps can be electrically connected to electrode 31 and 32 by flip-chip scheme or chips incorporate scheme.
Encapsulation object 40 can be formed in the cavity 15 of main body 10, to protect luminescence chip 20 by sealing this luminescence chip 20.Encapsulation object 40 can comprise phosphor.In this case, the top surface of encapsulation object 40 can be used as light output surface, with the light of emission by luminescence chip 20 generations.
Encapsulation object 40 can comprise silicon materials or resin material.Contain phosphor in the encapsulation object 40, and this phosphor is by first optical excitation that produces from luminescence chip 20, to produce second light.
＜embodiment 2 〉
Hereinafter, the back light unit of second embodiment will be described, but for fear of repetition, with omit or simplify before the parts described and the details of structure.
Fig. 5 illustrates according to the view back light unit of second embodiment, LGP and light emitting module, and Fig. 6 is the enlarged drawing that the area B of Fig. 5 is shown.
The arrangement relation between light emitting module and LGP and the shape of light emitting module, identical with structure according to the back light unit of first embodiment according to the structure of the back light unit of second embodiment.
With reference to figure 5 and Fig. 6, in back light unit according to second embodiment, at least one lateral surface of light emitting module 100B contact LGP 200.
Light emitting module 100B comprises substrate 120 and a plurality of luminescent device 110B, and these luminescent devices 110B is inserted in the through hole 115 of substrate 120.
A plurality of electrode 31B and the 32B of luminescent device 110B can be electrically connected to the circuit pattern 122 that forms on the top surface of substrate 120, to receive electric power.
Electrode 31B and 32B can be provided with binder course 35 by its top surface, thereby electrode 31B contacts LGP 200 so that light emitting module 100B is fixed to LGP 200 with 32B.
For example, binder course 35 can comprise metal or the resin material that presents strong bond strength, for example scolder or epoxy resin, but present embodiment is not limited thereto.
Binder course 35 and electrode 31B and 32B be light output surface and LGP 200 spaced apart first distance h of luminescent device 110B, thereby, can be from the light of luminescent device 110B emission in diffusion effectively in LGP 200 under the distortionless situation.Simultaneously, binder course 35 and electrode 31B and 32B can prevent luminescent device 110B because heat that transmits from LGP 200 or pressure and deterioration.
＜embodiment 3 〉
Hereinafter, with the back light unit of describing according to the 3rd embodiment, but for fear of repetition, with omit or simplify before the parts described and the details of structure.
Fig. 7 illustrates according to the enlarged drawing back light unit of the 3rd embodiment, LGP and light emitting module.
Except the shape of substrate, identical with structure according to the back light unit of second embodiment according to the structure of the back light unit of the 3rd embodiment.
With reference to figure 7, at least one lateral surface of light emitting module 100B contact LGP 200.
Light emitting module 100B comprises substrate 120 and a plurality of luminescent device 110B, and these luminescent devices 110B is inserted in the groove 116 of substrate 120.
Substrate 120 comprises that a plurality of grooves 116 are to hold these luminescent devices 110B.
In other words, in the back light unit of Fig. 6, be provided with a plurality of through holes 115 in the substrate 120 to hold these luminescent devices 110B.By contrast, in the back light unit of Fig. 7, light emitting module 100B is contained in the groove 116, thereby substrate 10 supports these luminescent devices 110B.
The electrode 31B of luminescent device 110B and 32B can be electrically connected to the circuit pattern 122 that forms on the top surface of substrate 120, to receive electric power.
Simultaneously, electrode 31B and 32B can be provided with binder course 35 by its top surface, thereby electrode 31B contacts this LGP 200 with 32B, so that light emitting module 100B is fixed to LGP 200.
For example, binder course 35 can comprise metal or the resin material that presents strong bond strength, for example scolder or epoxy resin, but present embodiment is not limited thereto.
Binder course 35 and electrode 31B and 32B are spaced apart with first distance h with light output surface and the LGP 200 of luminescent device 110B, thereby, can be from the light of luminescent device 110B emission in diffusion effectively in LGP 200 under the distortionless situation.Simultaneously, binder course 35 and electrode 31B and 32B can prevent luminescent device 110B because heat that transmits from LGP 200 or pressure and deterioration.
Hereinafter, description has been adopted display unit according to back light unit of the present disclosure.Fig. 8 illustrates the perspective view that comprises according to the display unit of back light unit of the present disclosure.
Above back light unit, be provided with optical sheet 500 and liquid crystal panel 600, and top cover 700 is configured to hold and support of optical sheet 500, this back light unit and liquid crystal panel 600, makes this display unit thus according to present embodiment.
Optical sheet 500 is arranged on this back light unit.For example, optical sheet 500 can comprise and makes light diffusing diffusion disk, makes concentration piece that diffused light assembles and the screening glass that the pattern that is formed on the concentration piece is protected.
Liquid crystal panel 600 is arranged on optical sheet 500 tops.For example, liquid crystal panel 600 comprises: thin film transistor base plate, this thin film transistor base plate comprise a plurality of TFT (thin film transistor (TFT)); Colored filter substrate, this colored filter substrate are arranged on the thin film transistor base plate top; And liquid crystal, this liquid crystal is between this thin film transistor base plate and colored filter substrate.In addition, this thin film transistor base plate can be provided with IC chip (IC chip) at an one terminal place.A plurality of clock signals that this IC chip produces picture signal, sweep signal and is used to use described picture signal or sweep signal, wherein, this picture signal, sweep signal and clock signal are used to drive LCD, and picture signal and sweep signal are applied to the gate line and the data wire of liquid crystal panel 600.
Top cover 700 connects with bottom 400 by coupling member 650, to hold and to support this back light unit.
With being not described further other structure of this display unit, because for a person skilled in the art, these structures are normally known.
Any quoting for " embodiment ", " embodiment ", " exemplary embodiment " etc. means that all special characteristic, structure or the characteristic described in conjunction with this embodiment are included among at least one embodiment of the present invention in this manual.Same embodiment needn't all be represented in this class phrase that occurs everywhere in specification.In addition, when describing special characteristic, structure or characteristic in conjunction with any embodiment, think in conjunction with other embodiment among these embodiment realize such feature, structure or characteristic also be those skilled in the art can expect.
Though described embodiment, should be appreciated that those skilled in the art can expect many interior other modification and embodiment of spirit and scope that will fall into disclosure principle with reference to a plurality of exemplary embodiments of the present invention.More particularly, in the scope of the disclosure, accompanying drawing and appended claims, the variations and modifications of the building block of subject combination arrangement and/or arrangement aspect all are possible.For a person skilled in the art, except the variation and modification of building block and/or arrangement aspect, alternative purposes also will be conspicuous.

Claims (15)

1. back light unit comprises:
LGP;
Light emitting module, described light emitting module are arranged at least one lateral surface of described LGP; And
Bottom, described bottom hold described LGP and described light emitting module,
Wherein, described light emitting module comprises substrate and a plurality of luminescent device, and described substrate comprises a plurality of through holes, described a plurality of luminescent devices be inserted in described a plurality of through hole and with spaced apart first distance of described LGP.
2. back light unit according to claim 1, wherein, described first distance is in the scope of the extremely about 0.5mm of about 0.05mm.
3. back light unit according to claim 1, wherein, described substrate comprises: insulating barrier, described a plurality of through holes are formed in the described insulating barrier; And circuit pattern, described circuit pattern is formed at least one surface of described insulating barrier.
4. back light unit according to claim 3, wherein, a plurality of electrodes of described luminescent device are electrically connected to described circuit pattern, described circuit pattern be formed on described insulating barrier not on the surface of described LGP.
5. back light unit according to claim 3, wherein, the insulating barrier of described substrate contacts described LGP.
6. back light unit according to claim 1, wherein, spaced apart described first distance of the light output surface of described luminescent device and described LGP.
7. back light unit according to claim 1, wherein, the electrode of described luminescent device is electrically connected to the circuit pattern that forms on the surface of described LGP at insulating barrier.
8. back light unit according to claim 7 also comprises the binder course of the top surface top that is positioned at described electrode, and wherein, described binder course contacts described LGP.
9. back light unit according to claim 8, wherein, described binder course comprises scolder or epoxy resin.
10. back light unit according to claim 1, wherein, each luminescent device comprises: main body; First electrode and second electrode, described first electrode and described second electrode are installed in the described main body; Luminescence chip, described luminescence chip are formed on in described first electrode and described second electrode at least one and are electrically connected to described first electrode and described second electrode; And encapsulation object, described encapsulation object is used to seal described luminescence chip, and wherein, the top surface of described encapsulation object constitutes the light output surface of described luminescent device.
11. back light unit according to claim 1, wherein, described substrate comprises a kind of in the following circuit board: common printed circuit board, flexible circuit board and metal-cored printed circuit board.
12. back light unit according to claim 1, wherein, the thickness of each luminescent device is less than the degree of depth of described through hole.
13. back light unit according to claim 1, wherein, the part of each luminescent device is outstanding from the back of the body surface of described substrate.
14. a back light unit comprises:
LGP;
Light emitting module, described light emitting module are arranged at least one lateral surface of described LGP, light is fed to described LGP; And
Bottom, described bottom hold described LGP and described light emitting module,
Wherein, described light emitting module comprises substrate and a plurality of luminescent device, and described substrate comprises a plurality of insertion grooves, described a plurality of luminescent devices be inserted in described a plurality of insertion groove and with spaced apart first distance of described LGP.
15. a display unit comprises:
According to each the described back light unit in the claim 1 to 14; And
Be positioned at the liquid crystal panel of described back light unit top.
CN201110021803.1A 2010-01-15 2011-01-14 The display device of back light unit and this back light unit of use Expired - Fee Related CN102147080B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0004103 2010-01-15
KR1020100004103A KR101055023B1 (en) 2010-01-15 2010-01-15 Backlight unit and display device using same

Publications (2)

Publication Number Publication Date
CN102147080A true CN102147080A (en) 2011-08-10
CN102147080B CN102147080B (en) 2016-02-03

Family

ID=43897085

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110021803.1A Expired - Fee Related CN102147080B (en) 2010-01-15 2011-01-14 The display device of back light unit and this back light unit of use

Country Status (5)

Country Link
US (1) US8477262B2 (en)
EP (1) EP2354819B1 (en)
JP (1) JP2011146382A (en)
KR (1) KR101055023B1 (en)
CN (1) CN102147080B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817659A (en) * 2019-02-15 2019-05-28 京东方科技集团股份有限公司 Display base plate and preparation method thereof, display device
TWI736447B (en) * 2020-10-15 2021-08-11 香港商冠捷投資有限公司 Light bar module and backlight equipment

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101824038B1 (en) * 2011-07-22 2018-01-31 엘지이노텍 주식회사 display apparatus
FR2978379B1 (en) * 2011-07-29 2014-03-14 Saint Gobain LIGHTING OF VEHICLE, MANUFACTURING
KR101946832B1 (en) * 2011-10-07 2019-02-13 엘지이노텍 주식회사 The backlight unit and the display device having the same
KR102009293B1 (en) * 2012-10-31 2019-08-09 엘지이노텍 주식회사 Printed circuit board and housing for lighting device having the printed circuit board
TWI504993B (en) * 2013-06-14 2015-10-21 Innolux Corp Backlight unit and display apparatus including the same
WO2016117591A1 (en) * 2015-01-21 2016-07-28 古河電気工業株式会社 Illumination device and flexible substrate
KR101919599B1 (en) 2016-11-15 2018-11-19 희성전자 주식회사 Backlight unit for display device
CN106842695A (en) * 2016-12-19 2017-06-13 武汉华星光电技术有限公司 A kind of glue frame, backlight module and liquid crystal display
RU2660376C1 (en) * 2017-06-23 2018-07-10 Юрий Борисович Соколов Flat lighting device with side lighting
KR20190075195A (en) * 2017-12-20 2019-07-01 삼성디스플레이 주식회사 Backlight unit and display device having the same
KR102225444B1 (en) * 2020-12-22 2021-03-09 주식회사 베이스원 코퍼레이션 All In One Kiosk

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020180923A1 (en) * 2001-05-30 2002-12-05 Hitachi, Ltd. And Hitachi Electronic Devices Co., Ltd. Liquid crystal display device
CN1534355A (en) * 2003-04-01 2004-10-06 ������������ʽ���� Assembly for lighting device, lighting device, back side lighting device and display
US20080074902A1 (en) * 2006-09-25 2008-03-27 Samsung Electronics Co., Ltd. Lcd backlight assembly with leds
US20080088763A1 (en) * 2006-10-02 2008-04-17 Yoshio Toriyama Liquid Crystal Display Device
US20080180972A1 (en) * 2007-01-31 2008-07-31 Mitsubishi Electric Corporation Light source device and surface light source device equipped with same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6886704B2 (en) * 2002-10-22 2005-05-03 Pactiv Corporation Containers and container assemblies with releasable locking feature
JP2004311791A (en) * 2003-04-08 2004-11-04 Sharp Corp Lighting device, backlight and display
US7455441B2 (en) * 2003-09-29 2008-11-25 Panasonic Corporation Linear light source, method for manufacturing the same and surface emitting device
JP2006210183A (en) * 2005-01-28 2006-08-10 Minebea Co Ltd Planar lighting equipment
KR20060098936A (en) * 2005-03-09 2006-09-19 삼성에스디아이 주식회사 Plasma display panel
KR20080032834A (en) * 2006-10-11 2008-04-16 삼성전자주식회사 Backlight unit and liquid crystal display device having the same
CN101174058A (en) * 2006-10-30 2008-05-07 鸿富锦精密工业（深圳）有限公司 Back light module unit and method for producing the same
JP2008140849A (en) 2006-11-30 2008-06-19 Toshiba Matsushita Display Technology Co Ltd Backlight unit, and liquid crystal display device
KR20080061763A (en) * 2006-12-28 2008-07-03 주식회사 우영 Led back light unit
TW200832004A (en) * 2007-01-16 2008-08-01 Chi Mei Optoelectronics Corp Backlight module and liquid crystal display using the same
TWI368082B (en) * 2007-03-15 2012-07-11 Au Optronics Corp Display panel
TWI368336B (en) * 2007-07-12 2012-07-11 Chi Mei Lighting Tech Corp Light emitting diode device and applications thereof
JP4959506B2 (en) * 2007-10-31 2012-06-27 株式会社ジャパンディスプレイイースト Liquid crystal display
KR20090104521A (en) * 2008-03-31 2009-10-06 서울반도체 주식회사 Backlight unit
US8164710B2 (en) * 2008-09-04 2012-04-24 Seoul Semiconductor Co., Ltd. Backlight assembly and liquid crystal display apparatus having the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020180923A1 (en) * 2001-05-30 2002-12-05 Hitachi, Ltd. And Hitachi Electronic Devices Co., Ltd. Liquid crystal display device
CN1534355A (en) * 2003-04-01 2004-10-06 ������������ʽ���� Assembly for lighting device, lighting device, back side lighting device and display
US20080074902A1 (en) * 2006-09-25 2008-03-27 Samsung Electronics Co., Ltd. Lcd backlight assembly with leds
US20080088763A1 (en) * 2006-10-02 2008-04-17 Yoshio Toriyama Liquid Crystal Display Device
US20080180972A1 (en) * 2007-01-31 2008-07-31 Mitsubishi Electric Corporation Light source device and surface light source device equipped with same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817659A (en) * 2019-02-15 2019-05-28 京东方科技集团股份有限公司 Display base plate and preparation method thereof, display device
TWI736447B (en) * 2020-10-15 2021-08-11 香港商冠捷投資有限公司 Light bar module and backlight equipment

Also Published As

Publication number Publication date
EP2354819A1 (en) 2011-08-10
EP2354819B1 (en) 2016-11-30
JP2011146382A (en) 2011-07-28
US8477262B2 (en) 2013-07-02
KR101055023B1 (en) 2011-08-05
KR20110084054A (en) 2011-07-21
US20110176087A1 (en) 2011-07-21
CN102147080B (en) 2016-02-03

Similar Documents

Publication Publication Date Title
CN102147080B (en) The display device of back light unit and this back light unit of use
CN102201525B (en) Light emitting device package and lighting system having the same
US8324654B2 (en) Light emitting device and light unit having the same
JP6058351B2 (en) LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME
US9112125B2 (en) Light emitting device, method of fabricating the same and lighting system having the same
KR101805118B1 (en) Light-emitting device
US8476662B2 (en) Light emitting device, method for manufacturing the same, and backlight unit
JP2007258620A (en) Light emitting device
US9470370B2 (en) Light emitting module and light emitting device having the same
CN102479911B (en) Light emitting device package
KR102261945B1 (en) Light emitting device and lighting apparatus having thereof
KR20110128693A (en) Light emitting device package and light unit having the same
CN102194962A (en) Packaging structure emitting light broadwise of semiconductor component
KR101896684B1 (en) Light emitting module and lighting system having the same
KR101724699B1 (en) Light emitting apparatus and lighting system
KR101664487B1 (en) Light unit device
KR20140076879A (en) Light Emitting Device Package
KR20120071151A (en) Light emitting package
CN102213373A (en) Lighting device, display device and lighting system having the same
KR20120072743A (en) Light emitting device package
KR102019830B1 (en) Light Emitting Device
KR20120073929A (en) Light emitting device package
KR20110108541A (en) Light emitting module and light unit using the same
KR20120034484A (en) Light emitting device package
KR20120037263A (en) Light emitting device package

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160203

Termination date: 20200114