KR102009293B1 - Printed circuit board and housing for lighting device having the printed circuit board - Google Patents

Printed circuit board and housing for lighting device having the printed circuit board Download PDF

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Publication number
KR102009293B1
KR102009293B1 KR1020120122158A KR20120122158A KR102009293B1 KR 102009293 B1 KR102009293 B1 KR 102009293B1 KR 1020120122158 A KR1020120122158 A KR 1020120122158A KR 20120122158 A KR20120122158 A KR 20120122158A KR 102009293 B1 KR102009293 B1 KR 102009293B1
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KR
South Korea
Prior art keywords
region
circuit board
printed circuit
substrate
light emitting
Prior art date
Application number
KR1020120122158A
Other languages
Korean (ko)
Other versions
KR20140055402A (en
Inventor
박현규
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120122158A priority Critical patent/KR102009293B1/en
Priority to PCT/KR2013/009315 priority patent/WO2014069824A1/en
Publication of KR20140055402A publication Critical patent/KR20140055402A/en
Application granted granted Critical
Publication of KR102009293B1 publication Critical patent/KR102009293B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

The present invention has a structure in which the first region and the second region are bent, a substrate having a through hole in which the light emitting device is mounted in the first region, and a pad wiring connected to the light emitting device on the other surface of the first region. Provided is a printed circuit board including a pad portion to be formed, and a string portion connected to the pad wiring on the other surface of the second region and having a string wiring for transmitting an electrical signal to the light emitting device.

Description

Printed circuit board and housing for lighting device having same {PRINTED CIRCUIT BOARD AND HOUSING FOR LIGHTING DEVICE HAVING THE PRINTED CIRCUIT BOARD}

The present invention relates to a method for efficiently utilizing a printed circuit board.

As the electronics industry develops, various display devices are being developed, and video devices, computers, and mobile communication terminals using the same are being developed. Reflecting this trend, the liquid crystal display device has been in the spotlight as a display device such as a monitor and a mobile communication terminal.

Liquid crystal display (LCD) is an application of the electrical and optical properties of liquid crystals having an intermediate characteristic between liquid and solid to a display device. It is an electric device that changes and transmits various electrical information into visual information. It is a flat panel display that is widely used because of its low power consumption and low power consumption.

LCDs don't self-luminous, so all LCDs always require a backlight. The backlight serves as a light source of the LCD. The backlight unit includes a light source unit including a light source itself to irradiate light from the back of the liquid crystal module, and a power supply circuit for driving the light source, and an integral part that forms uniform plane light. : BLU). Recently, a backlight unit using a light emitting diode (LED) has been proposed as a light source for illuminating the LCD. An LED is a light emitting device that generates light by using a light emission phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller than conventional light sources, have a long lifetime, and have high energy efficiency and low operating voltages because electrical energy are directly converted into light energy.

The liquid crystal display device configured as described above is becoming slimmer and accordingly, it is required to reduce the width of the liquid crystal display device. Therefore, in order to reduce the width of the liquid crystal display, the size of the backlight unit affecting the width of the liquid crystal display should be reduced. However, the size of the backlight unit can be reduced by reducing the portion of the pad portion or the string portion of the printed circuit board.

1 is a view showing a printed circuit board according to the prior art.

Referring to FIG. 1, a printed circuit board (PCB) is connected to the pad unit 110 on which a plurality of light emitting devices such as LEDs are mounted on one surface of the substrate 10 and the light emitting module on one surface thereof. The string unit 120 includes a string line for transmitting an electrical signal to the light emitting module. For reference, a cross-sectional view of the printed circuit board shown in the upper portion A is shown in the lower portion.

However, since both the pad part 110 and the string part 120 are formed on one surface of the substrate 10, there is a limitation in slimming the printed circuit board. This is because the insulating layer 20 and the circuit pattern layer 30 are formed on one surface of the substrate 10 to form the pad part 110 and the string part 120. Therefore, the thickness a including the substrate 10, the insulating layer 20, and the circuit pattern layer 30 is increased. In addition, since the light emitting device 40 is mounted on one surface of the substrate 10, the light emitting device 40 is thicker than the thickness b of the light emitting device 40.

However, one surface of the substrate 10 corresponds to the bezel portion of the liquid crystal display device, and a bent portion extending from one surface of the substrate 10 corresponds to the screen portion of the liquid crystal display device. Therefore, the thickness a + b of the bezel part including both the printed circuit board and the light emitting device 40 is inevitably thicker.

According to an embodiment of the present invention, a through hole in which a light emitting device is mounted is formed in the first area of a substrate formed in a structure bent into a first area and a second area, and the light emitting device is mounted in the through hole, thereby providing the light emitting device. It provides a printed circuit board that can reduce the thickness of the area to be mounted.

According to an embodiment of the present invention, the substrate protects the light emitting device according to a region in which the light emitting device is mounted in the through hole by adjusting the position of forming the through hole in the first region of the substrate, or the width of the substrate. To provide a printed circuit board that can reduce the width of the bezel.

An embodiment of the present invention provides a printed circuit board capable of integrally forming a printed circuit board and a housing for supporting the light guide plate by forming a second region of the substrate to be bent to support the light guide plate. do.

An embodiment of the present invention provides a housing for a lighting apparatus in which the light guide plate support part can compensate for thermal characteristics of the light guide plate by forming the light guide plate support part in close contact with the printed circuit board and the second region.

The printed circuit board according to the exemplary embodiment of the present invention has a structure in which a printed circuit board is bent into a first region and a second region, and a through hole in which a light emitting device is mounted is formed in the first region, and the other surface of the first region. And a pad portion having a pad wiring connected to the light emitting device, and a string portion connected to the pad wiring on the other surface of the second region and having a string wiring for transmitting an electrical signal to the light emitting device.

The string line may be connected to the pad line through the lower region of the through hole.

The substrate may have a bending hole formed at a boundary between the first region and the second region.

The string portion may be connected to the pad line through the bending hole.

The substrate may be formed such that the second region is bent to support the light guide plate.

The substrate may have a protruding pattern for fixing and supporting the light guide plate on one surface of the second region.

The pad part and the string part may include an insulating layer formed on the other surface of the first area and the second area, and a circuit pattern layer formed on the insulating layer.

The pad part may further include a solder resist applied to the circuit pattern layer.

The pad part and the string part may further include a metal substrate formed between the other surface of the first area and the second area and the insulating layer.

The housing for a lighting apparatus according to an embodiment of the present invention includes a light guide plate support unit which is in close contact with the printed circuit board and the second area of the printed circuit board to support the light guide plate.

The light guide plate support may have a protruding pattern for fixing and supporting the light guide plate on one surface of the second region.

According to an embodiment of the present invention, a through hole in which a light emitting device is mounted is formed in the first area of the substrate formed in a structure bent into a first area and a second area, and the light emitting device is mounted in the through hole. The thickness of the region in which the light emitting device is mounted can be reduced.

According to an embodiment of the present invention, by adjusting the position of forming the through hole in the first region of the substrate, the substrate to protect the light emitting device according to the region in which the light emitting device is mounted in the through hole, or the substrate By reducing the width of the bezel can be reduced.

According to an embodiment of the present invention, the second region of the substrate is bent to form one surface of the second region to support the light guide plate, thereby forming a housing integrally supporting the printed circuit board and the light guide plate.

According to the exemplary embodiment of the present invention, the light guide plate support may be made to closely adhere to the printed circuit board and the second region so that the light guide plate support may compensate for the thermal characteristics of the light guide plate.

1 is a view showing a printed circuit board according to the prior art.
2 illustrates a printed circuit board according to an embodiment of the present invention.
3 is a view showing the other side and one side of the printed circuit board according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a printed circuit board according to an exemplary embodiment of the present invention.
5 is a diagram illustrating a printed circuit board according to another exemplary embodiment of the present invention.
6 is a view showing a housing for a lighting apparatus according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

2 illustrates a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 2, the printed circuit board has a structure in which the printed circuit board is bent into a first region and a second region, and a through hole in which the light emitting device 40 is mounted is formed in the first region. A pad unit 110 having a pad wiring connected to the light emitting device 40 on the other surface of one region, and a pad wiring connected to the pad wiring on the other surface of the second region, and transmitting an electrical signal to the light emitting device 40. The string part 120 includes a string line.

Referring to the upper drawing of FIG. 2, the first region corresponds to the upper region based on the bending hole formed at the boundary between the pad portion 110 and the string portion 120. That is, in FIG. 2, the upper area is an area where the pad part 110 is formed. The second region corresponds to the lower region based on the bending hole.

Therefore, the through hole may be formed to penetrate the substrate 10 on the first region where the pad part 110 is formed. The through hole may be formed as large as the light emitting device 40 can be mounted. In addition, the position at which the through hole is formed can be easily adjusted up and down in the first region. For example, referring to the bottom view of FIG. 2, when the upper part of the through hole is left around the through hole, the light emitting device 40 may be protected from an external force, and when the upper part of the through hole is less, the printing may be performed. When the circuit board is mounted on the liquid crystal display device, the width of the bezel portion of the liquid crystal display device can be reduced.

An insulating layer 20 for forming the pad part 110 and the string part 120 and a circuit pattern layer 30 formed on the insulating layer 20 may be formed on the other surface of the substrate 10. Here, the other surface of the substrate 10 may be a left side with respect to the substrate 10 with reference to the bottom view of FIG. 2, and one surface of the substrate 10 may be a right side of the substrate 10.

Conventionally, a pad portion and a string portion are formed on one surface of a substrate, and an insulating layer and a circuit pattern layer are formed on one surface of the substrate. In addition, since the pad portion and the string portion are formed on one surface of the substrate, the light emitting element is also mounted on one surface of the substrate (see FIG. 1).

However, in the present invention, by forming the pad part 110 and the string part 120 on the other surface of the substrate 10, the insulating layer 20 and the circuit pattern layer 30 are formed on the other surface of the substrate 10. In this case, the light emitting device 40 and the pad wiring of the pad unit 110 are connected to the other surface of the substrate 10. In addition, in order to form pad wiring on the other surface of the substrate 10, a through hole is formed in the substrate 10, and the light emitting element 40 is mounted in the through hole, so that the area in which the light emitting element 40 is mounted is provided. Can be reduced.

That is, when comparing FIG. 1 and FIG. 2, conventionally, a thickness a including the substrate 10, the insulating layer 20, and the circuit pattern layer 30, and a light emitting device on one surface of the substrate 10 are described. Since 40 is mounted, the thickness is as thick as the thickness b of the light emitting yarn 40 (a + b). However, in the present invention, the thickness c including the substrate 10, the insulating layer 20, and the circuit pattern layer 30 is the same as the conventional thickness a, but the thickness b occupies by the light emitting element 40. You can see that it is reduced by). Therefore, the present invention can reduce the thickness of the region in which the light emitting device 40 is mounted.

In an embodiment, the string unit 120 may be connected to the pad line through the lower region of the through hole. To this end, referring to the lower right view (cross section taken in B) of FIG. 2, the substrate 10 may have a bending hole formed at a boundary between the first region and the second region. Accordingly, the string part 120 may be connected to the pad line through the bending hole. For reference, the lower left side view of FIG. 2 (the cross-sectional view cut in A) is a view showing a region where no bending hole is formed.

3 is a view showing the other side and one side of the printed circuit board according to an embodiment of the present invention.

Referring to FIG. 3, reference numeral 310 is a front view of the other surface of the first region of the substrate 10, and a through hole in which the light emitting device 40 is mounted is formed in the first region of the substrate 10. A bending hole formed at a boundary between the first area and the second area may be formed below the through hole. 320 is a view showing the other surface of the second region of the substrate 10 in front, and a string line for transmitting an electrical signal to the light emitting device 40 is formed on the other surface of the second region of the substrate 10.

4 is a cross-sectional view illustrating a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the printed circuit board includes an insulating layer 20 formed on the other surface of the first region and the second region, and a circuit pattern layer 30 formed on the insulating layer 20. In an embodiment, the metal substrate 21 may be formed on the insulating layer 20. The metal substrate 21, the insulating layer 20, and the circuit pattern layer 30 are areas in which the pad part and the string part are formed in the printed circuit board. When the printed circuit board has the metal substrate 21, an insulating layer 20 may be formed on the side surface of the through hole in order to prevent a short circuit. Therefore, the metal substrate 21 may be formed entirely or partially of the insulating layer 20. The pad part may further include a solder resist 21 applied to the circuit pattern layer 30.

Therefore, the insulating layer 20 and the circuit pattern layer 30 are formed on the other surface of the substrate 10 and the soldering 70 is formed on the other surface, thereby reducing the height of the printed circuit board.

In an embodiment, the printed circuit board may be formed such that the second region is bent to support the light guide plate.

5 is a diagram illustrating a printed circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 5, as shown in 510, a printed circuit board may have a bent shape that is bent into a first region and a second region. As shown in 520, the printed circuit board may be formed such that the second region is bent to support the light guide plate 90. As shown in 530, the printed circuit board may include a protruding pattern for fixing and supporting the light guide plate 90 on one surface of the second region. As shown in 540, the printed circuit board may be formed in a U shape to support the light guide plate 90 on a U shape and a bottom surface thereof. In 540, the upper surface of the printed circuit board may block light leaking to the upper surface of the light guide plate 90, the lower surface of the printed circuit board performs a heat dissipation function, and the center surface of the printed circuit board mounts the light emitting device. can do.

Therefore, the printed circuit board of the present invention may include a housing structure for mounting the light emitting device and supporting the light guide plate.

6 is a view showing a housing for a lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 6, the lighting device housing has a structure in which the housing is bent into a first region and a second region, and a printed circuit having a substrate in which a through hole in which the light emitting device 40 is mounted is formed in the first region. And a light guide plate support part 100 in close contact with a substrate and a second region of the printed circuit board to support the light guide plate.

In this case, the light guide plate support part 100 may have a protruding pattern for fixing and supporting the light guide plate on one surface of the second region. That is, the light guide plate support part 100

In the detailed description of the invention as described above, specific embodiments have been described. However, many modifications are possible without departing from the scope of the invention. The technical spirit of the present invention should not be limited to the described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

10: Substrate
20: circuit pattern layer
30: insulation layer
40: light emitting element

Claims (11)

A substrate formed in a structure bent into a first region and a second region, the substrate having a through hole in which a light emitting device is mounted;
A pad unit having a pad wiring connected to the light emitting device on the other surface of the first region; And
A string part connected to the pad wiring on the other surface of the second region and having a string wiring for transmitting an electrical signal to the light emitting device;
Printed circuit board comprising a.
The method of claim 1,
The string portion,
And the string wiring is connected to the pad wiring through a lower region of the through hole.
The method of claim 1,
The substrate,
And a bending hole formed at a boundary between the first region and the second region.
The method of claim 3,
The string portion,
And the string wiring is connected to the pad wiring through the bending hole.
The method of claim 1,
The substrate,
And the second region is bent to support the light guide plate.
The method of claim 1,
The substrate,
The printed circuit board is provided with a protrusion pattern for fixing and supporting the light guide plate on one surface of the second region.
The method of claim 1,
The pad part and the string part,
An insulating layer formed on the other surface of the first region and the second region; And
A circuit pattern layer formed on the insulating layer
Printed circuit board comprising a.
The method of claim 7, wherein
The pad unit,
Solder resist applied to the circuit pattern layer
Printed circuit board further comprising.
The method of claim 7, wherein
The pad part and the string part,
A metal substrate formed between the other surface of the first region and the second region and the insulating layer
Printed circuit board further comprising.
The printed circuit board of claim 1; And
A light guide plate support part in close contact with the second area of the printed circuit board to support the light guide plate
Housing for lighting apparatus comprising a.
The method of claim 10,
The light guide plate support portion,
The protruding pattern for fixing and supporting the light guide plate is formed on one surface of the second region, the housing for a lighting device.
KR1020120122158A 2012-10-31 2012-10-31 Printed circuit board and housing for lighting device having the printed circuit board KR102009293B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020120122158A KR102009293B1 (en) 2012-10-31 2012-10-31 Printed circuit board and housing for lighting device having the printed circuit board
PCT/KR2013/009315 WO2014069824A1 (en) 2012-10-31 2013-10-18 Printed circuit board and lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120122158A KR102009293B1 (en) 2012-10-31 2012-10-31 Printed circuit board and housing for lighting device having the printed circuit board

Publications (2)

Publication Number Publication Date
KR20140055402A KR20140055402A (en) 2014-05-09
KR102009293B1 true KR102009293B1 (en) 2019-08-09

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ID=50627671

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120122158A KR102009293B1 (en) 2012-10-31 2012-10-31 Printed circuit board and housing for lighting device having the printed circuit board

Country Status (2)

Country Link
KR (1) KR102009293B1 (en)
WO (1) WO2014069824A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080051628A (en) * 2006-12-06 2008-06-11 삼성전자주식회사 Light source unit and back light assembly including the same
KR20090003932A (en) * 2007-07-05 2009-01-12 삼성전자주식회사 Flexible printed circuit board and liquid crystal display using thereof
JP5154387B2 (en) * 2008-12-01 2013-02-27 日本発條株式会社 Printed wiring board and manufacturing method thereof, printed wiring board semi-finished product chain
KR101546741B1 (en) * 2009-05-13 2015-08-25 삼성디스플레이 주식회사 Light emitting module and display apparatus having the same
KR101055023B1 (en) * 2010-01-15 2011-08-05 엘지이노텍 주식회사 Backlight unit and display device using same

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Publication number Publication date
WO2014069824A1 (en) 2014-05-08
KR20140055402A (en) 2014-05-09

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