KR102040183B1 - Printed circuit board and liquid crystal display having the printed circuit board - Google Patents

Printed circuit board and liquid crystal display having the printed circuit board Download PDF

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Publication number
KR102040183B1
KR102040183B1 KR1020130012497A KR20130012497A KR102040183B1 KR 102040183 B1 KR102040183 B1 KR 102040183B1 KR 1020130012497 A KR1020130012497 A KR 1020130012497A KR 20130012497 A KR20130012497 A KR 20130012497A KR 102040183 B1 KR102040183 B1 KR 102040183B1
Authority
KR
South Korea
Prior art keywords
region
string
insulating substrate
circuit board
printed circuit
Prior art date
Application number
KR1020130012497A
Other languages
Korean (ko)
Other versions
KR20140099729A (en
Inventor
최만휴
박현규
홍승권
조인희
이혁수
김민재
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020130012497A priority Critical patent/KR102040183B1/en
Publication of KR20140099729A publication Critical patent/KR20140099729A/en
Application granted granted Critical
Publication of KR102040183B1 publication Critical patent/KR102040183B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Abstract

The present invention provides a support substrate comprising a first region and a second region bent from the first region, one surface of the first region of the support substrate, the other surface facing the one surface, and the one surface and the other surface meet each other. An insulation substrate formed on a side surface, an element mounting portion in which a light emitting element is mounted on one surface of the insulation substrate, and a string portion on which the string wiring for transmitting an electric signal to the light emitting element is formed on the other surface and the side surface of the insulation substrate. It provides a printed circuit board comprising.

Description

Printed circuit board and a liquid crystal display device including the printed circuit board {PRINTED CIRCUIT BOARD AND LIQUID CRYSTAL DISPLAY HAVING THE PRINTED CIRCUIT BOARD}

The present invention relates to a method for efficiently forming wiring in a printed circuit board.

As the electronics industry develops, various display devices are being developed, and video devices, computers, and mobile communication terminals using the same are being developed. Reflecting this trend, the liquid crystal display device has been in the spotlight as a display device such as a monitor and a mobile communication terminal.

Liquid Crystal Display (LCD) is an application of the electrical and optical properties of liquid crystals having intermediate characteristics between liquid and solid to display devices. It is an electric device that changes and transmits various electrical information into visual information. It is a flat panel display that is widely used because of its low power consumption and low power consumption.

LCDs don't self-luminous, so all LCDs always require a backlight. The backlight serves as a light source of the LCD. The backlight unit includes a light source unit including a light source itself to irradiate light from the back of the liquid crystal module, and a power supply circuit for driving the light source and an integral part that forms uniform plane light. : BLU). Recently, a backlight unit using a light emitting diode (LED) has been proposed as a light source for illuminating the LCD. An LED is a light emitting device that generates light by using a light emitting phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller in size, longer in life, and have higher energy efficiency and lower operating voltage than conventional light sources.

The liquid crystal display device configured as described above is becoming slimmer and accordingly, it is required to reduce the width of the liquid crystal display device. Therefore, in order to reduce the width of the liquid crystal display, the size of the backlight unit affecting the width of the liquid crystal display should be reduced. However, the size of the backlight unit can be reduced by reducing the portion of the pad portion or the string portion of the printed circuit board.

1 is a view showing a printed circuit board according to the prior art.

Referring to FIG. 1A, a printed circuit board includes a first area A and a second area B extending from the first area B, and the first area. A string portion having a string line for transmitting an electric signal to the light emitting element 50 connected to the pad portion 20 and the light emitting element 50 mounted with a plurality of light emitting elements 50 such as LEDs on (A) ( 30).

Here, the cross section of the printed circuit board cut from top to bottom is shown in FIG.

Referring to FIG. 1B, a string part in which a pad part 20 in which the light emitting device 50 is mounted and a string line for transmitting an electric signal to the light emitting device 50 are formed on one surface of the first area A. Referring to FIG. Since all 30 are formed, it becomes the cause of length h of 1st area | region A becoming long. That is, when the printed circuit board is mounted on the LCD, the first area A corresponds to the bezel of the LCD, so that the width of the bezel may not be reduced to some extent.

In addition, in the case where the bending process is performed between the first region A and the second region B, a string formed close to the bent portion between the first region A and the second region B during the bending process. The wire or insulation board may be torn or crushed. Such damage may cause electrical or external defects, resulting in damage to the printed circuit board.

According to an embodiment of the present invention, a light emitting device is mounted on one surface of an insulating substrate, and a string wiring for transmitting an electric signal to the light emitting device is formed on the other surface facing the one surface and on the side where the one surface and the other surface meet each other. Provided is a printed circuit board, which can reduce the length of a printed circuit board by the width occupied by the string wiring.

According to an embodiment of the present invention, the string wiring is formed on the side where one surface and the other surface of the first region meet, so that the string wiring is not damaged even when the second region extending from the first region and the first region are bent. A printed circuit board is provided.

According to one embodiment of the present invention, a concave connection groove is formed in a side surface where one surface and the other surface of the first region meet, and a string wiring passes through the connection groove so that the height of the side surface can be reduced. To provide.

A printed circuit board according to an embodiment of the present invention includes a support substrate including a first region and a second region bent from the first region; An insulating substrate formed along one surface of the first region of the support substrate, the other surface opposite to the one surface, a partial region of the one surface and the other surface, and a side surface where the one surface and the other surface meet; A device mounting unit in which a light emitting device is mounted on one surface of the insulating substrate; And a string part on which the string wiring for transmitting an electric signal to the light emitting device is formed on the other surface and the side surface of the insulating substrate.

The device mounting unit may have pad wiring connected to the light emitting device on one surface of the insulating substrate, and the string wiring may be connected to the pad wiring through the side surface of the insulating substrate.

The string part may have string wires connected to one side of the light emitting device formed on one surface of the insulating substrate, and string wires connected to the other side of the light emitting device formed on side surfaces and the other surface of the insulating substrate.

The printed circuit board may further include a connection groove formed on a side surface of the insulating board to which the pad wiring and the string wiring are connected.

The connection groove may be formed concavely in the side surface on the insulating substrate more than the thickness of the string wiring.

According to an embodiment of the present invention, a liquid crystal display device includes a liquid crystal display module, an illumination device including the printed circuit board for supplying light to the liquid crystal display module, and an upper, lower, or the illumination device of the liquid crystal display module. It includes a plurality of optical sheets included.

A printed circuit board according to another embodiment of the present invention includes a support substrate including a first region and a second region bent from the first region, one surface of the first region of the support substrate, and facing the one surface. The other side includes an insulating substrate formed on the side where the one side and the other side meet, and a circuit pattern layer formed on the one side and the other side on the insulating substrate, the string wiring may be formed on the side on the insulating substrate. .

According to an embodiment of the present invention, a light emitting device is mounted on one surface of an insulating substrate, and a string wiring for transmitting an electric signal to the light emitting device is formed on the other surface facing the one surface and the side where the one surface and the other surface meet. By doing so, the length of the printed circuit board can be reduced by the width occupied by the string wiring.

According to an embodiment of the present invention, the string wiring is formed on the side where one surface and the other surface of the first region meet, so that the string wiring is formed even when the second region extending from the first region and the first region are bent. Do not damage it.

According to an embodiment of the present invention, the height of the side surface may be reduced by concave forming a connection groove in a side surface where one surface and the other surface of the first region meet, and forming a string wiring through the connection groove.

1 is a view showing a printed circuit board according to the prior art.
2 illustrates a printed circuit board according to an embodiment of the present invention.
3 is a cross-sectional view of the printed circuit board of FIG. 2.
4 is a diagram illustrating a printed circuit board according to another exemplary embodiment of the present invention.
5 and 6 are cross-sectional views illustrating a printed circuit board according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

2 illustrates a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 2A, the printed circuit board 100 is a front view as viewed from a region in which the light emitting device 50 is mounted. The printed circuit board 100 includes a first substrate A and a second substrate B which is bent and extended from the first region A, and a first region of the support substrate 10. One side of A), the other surface facing the one surface, the insulating substrate 20 formed on the side where the one surface and the other surface meet, the device mounting portion in which the light emitting device 50 is mounted on the one surface on the insulating substrate 20 ( 30, and a string part 40 formed on the other side and the side surface of the insulating substrate 20 to form a string wiring for transmitting an electrical signal to the light emitting device 50.

2B is a rear view of the printed circuit board in a region where the light emitting device 50 is not mounted. As shown in (b), the string part 40 is formed in the other surface (rear surface) facing the said one surface (front surface) of the insulated substrate 20. As shown in FIG. Therefore, the length of the first region A can be reduced as compared with the formation of the string portion 40 in the region where the light emitting device 50 is mounted as in the related art. This is because, in the related art, the device mounting portion 30 and the string portion 40 are all formed on one surface of the first region A. In the present invention, the device mounting portion 30 is disposed on one surface of the first region A. FIG. It mounts and the string part 40 is formed in the other surface of the 1st area | region A, and both front and back surfaces of the 1st area | region A can be utilized.

Therefore, the printed circuit board according to the present invention can prevent the string wiring from being damaged even when bent between the first region A and the second region B. FIG.

In an exemplary embodiment, the string part 40 may include a string wire connected to one side of the light emitting device 50 on one surface of the insulating substrate 20, and a string wire connected to the other side of the light emitting device 50. It may be formed on the side and the other surface of 20). That is, as shown in (a), the string wire 40a connected to one side of the light emitting device 50 is formed on one surface of the insulating substrate 20 and the string wire connected to the other side of the light emitting device 50. 40b may be formed on side surfaces and other surfaces of the insulating substrate 20. For example, the string wire 40a connected to one side of the light emitting device 50 corresponds to a ground, and the string wire 40b connected to the other side of the light emitting device 50 may provide an electrical signal for individual driving. It may be to convey.

The device mounting unit 30 may have a pad wiring connected to the light emitting device 50 on one surface of the insulating substrate 20. Accordingly, the string part 40 may be connected to the pad line through the side surface (upper surface of the first region) on the insulating substrate 20.

3 is a cross-sectional view of the printed circuit board of FIG. 2.

Referring to FIG. 3, the printed circuit board includes a first substrate and a second region that is bent from the first region, and one surface of the first region of the support substrate 10 and the one surface. The device mounting part is formed on the other surface facing the opposite side, the pad substrate is connected to the insulating substrate 20 formed on the side where the one surface and the other surface meet, the light emitting device 50 mounted on the one surface on the insulating substrate 20 ( 30, and a string part 40 formed on the other side and the side surface of the insulating substrate 20 to form a string wiring for transmitting an electrical signal to the light emitting device 50. That is, the string wires may be connected to the pad wires through the side surfaces of the insulating substrate 20.

Accordingly, the height of the printed circuit board corresponding to the length h 'of the first region may be lowered to form a liquid crystal display device and a lighting device that are slimmer than the conventional method (compare h in FIG. 1). In an embodiment, the lighting apparatus according to the present invention may be configured to include the printed circuit board 100 of FIG. The liquid crystal display according to the present invention includes a liquid crystal display module, an illumination device including the printed circuit board 100 of FIG. 2 for supplying light to the liquid crystal display module, and an upper, lower, or the illumination device of the liquid crystal display module. It may include a plurality of optical sheets included in.

In an embodiment, the support substrate 10 may be formed of at least one of aluminum (Al), gold (Au), silver (Ag), chromium (Cr), an organic compound, an inorganic compound, a magnetic material, and a conductive material. The insulating substrate 20 may be formed of at least one of polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polyimide (PI), and polymethyacrylate (PMMA).

4 is a diagram illustrating a printed circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 4A, the printed circuit board 100 includes a first substrate and a second region that is bent and extended from the first region, and the first substrate of the support substrate 10. The light emitting device 50 is mounted on one surface of one region, the other surface facing the one surface, the insulating substrate 20 formed on the side where the one surface and the other surface meet, and the one surface on the insulating substrate 20. A string unit 40 in which a string wire for transmitting an electrical signal to the light emitting device 50 is formed on the other side and the side surface of the device mounting portion 30 having the pad wiring connected to the 50 formed thereon. And a connection groove 60 formed on a side surface of the insulating substrate 20 to which the pad wiring and the string wiring are connected.

Referring to FIG. 4B, the connection groove 60 is formed to prevent the length of the first region from being increased by the thickness of the string wiring by passing the string wiring through the side surface of the insulating substrate 20. will be. Therefore, the connection groove 60 may be formed concave on the side surface on the insulating substrate 20 by the thickness of the string wiring or larger than the thickness of the string wiring. That is, the connection groove 60 may be concave on the side surface on the insulating substrate 20 through which the string wiring passes.

Therefore, the printed circuit board according to the present invention forms a concave groove in a side surface where one surface and the other surface of the first region A meet, and forms a string wire to pass through the connection groove, thereby forming an insulating circuit on the insulating substrate 20. The height of the side surface (length h 'of the first region) can be reduced.

5 and 6 are cross-sectional views illustrating a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 5, the printed circuit board 100 includes a first substrate A and a second substrate B that is bent and extended from the first region A and the supporting substrate 10. Insulating substrate 20 formed on one surface (upper surface of 10) of the first region A, the other surface (lower surface of 10) facing the one surface, and the side surface (left side of 10) where the one surface and the other surface meet. And a circuit pattern layer formed on the one surface and the other surface of the insulating substrate 20, wherein a string wiring is formed on the side surface of the insulating substrate 20. The circuit pattern layer may include a light emitting device disposed on the device mounting portion 30 and the other surface and the side surface of the device mounting portion 30 on which the pad wiring is connected to the light emitting device 50 mounted on the one surface of the insulating substrate 20. It may include a string portion 40 in which a string line for transmitting an electrical signal to the (50) is formed. That is, the string wires may be connected to the pad wires through the side surfaces of the insulating substrate 20.

Referring to FIG. 6, the printed circuit board 100 includes a supporting substrate including a first region A and a second region B that is bent and extended from the first region A. 10), one surface of the first region A of the supporting substrate 10, the other surface facing the one surface, the insulating substrate 20 formed on the side where the one surface and the other surface meet, the one surface on the insulating substrate 20 , A string pattern layer is formed on the circuit pattern layer formed on the other surface, the connection groove 60 formed on the side surface on the insulating substrate 20, and the connection groove 60. The circuit pattern layer may include a light emitting device disposed on the device mounting portion 30 and the other surface and the side surface of the device mounting portion 30 on which the pad wiring is connected to the light emitting device 50 mounted on the one surface of the insulating substrate 20. It may include a string portion 40 in which a string line for transmitting an electrical signal to the (50) is formed.

5 and 6, since the connection grooves 60 are formed on the side surfaces of the insulating substrate 20, the side regions occupied by the insulating substrate 20 and the string wirings are as deep as the connection grooves 60. It can be seen that (C ′) is reduced compared to the side region (C) of FIG. That is, the connection groove 60 is formed to be concave in the side surface on the insulating substrate more than the thickness of the string wiring, it is possible to reduce the height of the side surface on the insulating substrate 20.

In the detailed description of the invention as described above, specific embodiments have been described. However, many modifications are possible without departing from the scope of the invention. The technical spirit of the present invention should not be limited to the described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

100: printed circuit board
10: support substrate 20: insulating substrate
30: device mounting portion 40: string portion
50: light emitting element 60: connection groove

Claims (11)

A support substrate comprising a first region and a second region bent from and extending from the first region;
One surface of the first region of the support substrate, the other surface opposite to the surface of the first region, a portion of one surface of the first region and the other surface of the first region, and one surface of the first region and the first surface of the first substrate. An insulating substrate disposed in a 'c' shape along a side where the other surface of the region meets;
An element mounting unit disposed on one surface of the insulating substrate and configured to mount a light emitting device; And
It includes a string portion disposed on the other surface opposite to one surface of the insulating substrate,
A printed circuit board comprising a string wiring disposed in a 'c' shape along the surface of the insulating substrate and connecting the device mounting portion and the string portion.
The method of claim 1,
The device mounting portion,
Pad wiring connected to the light emitting device is formed on one surface of the insulating substrate,
And the string wiring is connected to the pad wiring through the side surface of the insulating substrate.
The method of claim 1,
The string portion,
A string wiring connected to one side of the light emitting device is formed on one surface of the insulating substrate, a string wiring connected to the other side of the light emitting device is formed on the side and the other surface of the insulating substrate.
The method of claim 2,
A connection groove formed on a side surface of the insulating substrate to which the pad wiring line and the string wiring line are connected;
The connecting groove is,
A printed circuit board is formed concavely in the side surface on the insulating substrate more than the thickness of the string wiring.
The method of claim 1,
And a length of the element mounting portion is longer than a length of the string portion. delete delete delete delete delete delete
KR1020130012497A 2013-02-04 2013-02-04 Printed circuit board and liquid crystal display having the printed circuit board KR102040183B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130012497A KR102040183B1 (en) 2013-02-04 2013-02-04 Printed circuit board and liquid crystal display having the printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130012497A KR102040183B1 (en) 2013-02-04 2013-02-04 Printed circuit board and liquid crystal display having the printed circuit board

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KR20140099729A KR20140099729A (en) 2014-08-13
KR102040183B1 true KR102040183B1 (en) 2019-11-04

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119180A (en) * 2009-12-07 2011-06-16 Panasonic Corp Lighting system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110048301A (en) * 2009-11-02 2011-05-11 엘지이노텍 주식회사 Heat radiating printed circuit board unified bracket for backlight unit and chassis structure having the same
KR101707960B1 (en) * 2010-08-23 2017-02-27 엘지디스플레이 주식회사 Flexible printed circuit board and liquid crystal display device having flexible printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119180A (en) * 2009-12-07 2011-06-16 Panasonic Corp Lighting system

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