CN102109286B - 散热器总成 - Google Patents
散热器总成 Download PDFInfo
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- CN102109286B CN102109286B CN201110052090A CN201110052090A CN102109286B CN 102109286 B CN102109286 B CN 102109286B CN 201110052090 A CN201110052090 A CN 201110052090A CN 201110052090 A CN201110052090 A CN 201110052090A CN 102109286 B CN102109286 B CN 102109286B
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- heat
- heat pipe
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
- F28F9/002—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core with fastening means for other structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明涉及一种散热器总成,包括一热管、复数金属支撑件以及一固定簧片;该热管设有一第一热源接触面;该复数金属支撑件分别设有一第二热源接触面;该固定簧片包括一热管结合部,以无锡紧配的方式与该热管结合;复数支撑部,该每一支撑部分别与一该金属支撑件结合;以及复数固定部,用以固定于一设有热源之基座上;其中,该热管与该固定簧片结合后,该热管之第一热源接触面会突出于该固定簧片,且该金属支撑件之第二热源接触面系与该热管之第一热源接触面在同一水平面上;藉此本发明不仅可使热源的热直接传至热管提升热的传导效果外,亦可同时减少散热装置的重量;此外,在加工上因采无锡紧配的方式,不仅可降低成本,加工上亦较为简单。
Description
技术领域
本发明系为一种散热器总成,尤只一种利用热管直触热源提升热传导效率之散热器总成。
背景技术
请参阅图1至图3,一种习知散热装置,其包括一热管a、一固定座b、二锁固簧片d以及一均热板e,该固定座b设有一凹槽c,将该热管a以锡膏焊接的方式固定于该固定座b之凹槽c内;二锁固簧片d系结合于该固定座b的两侧;均热板e将该均热板e以锡膏焊接的方式设置于该热管a与该固定座b的底部。该散热装置系利用螺丝f穿过该锁固簧片d将该散热装置锁固于设有热源之板体上,并藉由该均热板e与热源做接触,使热藉由该均热板e导热至该热管a,以达成散热之功效。如前述习知的散热装置主要有下述两缺点:1、热源的热须透过均热板导热至该热管,热的传导较差且增加散热装置整体的重量;2、固定座与热管间的结合系以锡膏焊接的方式结合,不仅会影响热的传导外,加工上亦较为复杂。
发明内容
本发明主要目的在于提供一种重量轻、成本低、加工简便且可提高热传导性的散热器总成。
为实现上述之目的,本发明采取如下技术方案:
一种散热器总成,包括:一热管、复数金属支撑件以及一固定簧片;该热管,设有一第一热源接触面;该复数金属支撑件,分别设有一第二热源接触面;该固定簧片包括:一热管结合部,以无锡紧配的方式与该热管结合;复数支撑部,该每一支撑部分别与一该金属支撑件结合;以及复数固定部,用以固定于一设有热源之基座上;其中,该热管与该固定簧片结合后,该热管之第一热源接触面会突出于该固定簧片,且该金属支撑件之第二热源接触面系与该热管之第一热源接触面在同一水平面上。
本发明之散热器总成,不仅可使热源的热直接传至热管提升热的传导效果外,且因少了均热板的设置使散热装置的重量亦随之降低;此外,在加工上因采无锡紧配的方式,不仅可降低成本,加工上亦较为简单。
附图说明
图1是习式散热装置之仰视图。
图2是习式散热装置之侧视图。
图3是习式散热装置之侧视分解图。
图4是本发明散热器总成之侧视图。
图5是本发明散热器总成之侧视分解图。
图6是本发明散热器总成之俯视图。
图7是本发明散热器总成之仰视图。
图8是本发明散热器总成之具使用状态说明图(一)。
图9是本发明散热器总成之具使用状态说明图(二)。
附图标号说明:
a热管 b固定座
c凹槽 d锁固簧片
e均热板 f螺丝
1热管 11第一热源接触面
2金属支撑件 21第二热源接触面
3固定簧片 31热管结合部
32支撑部 33固定部
34肋部 8螺丝
9热源 91基座。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步描述。
请参阅图4至图9所示,一种散热器总成,包括热管1、二金属支撑件2、一固定簧片3,其中:
热管1,设有一第一热源接触面11;
二金属支撑件2,分别设有一第二热源接触面21;以及
固定簧片3,该固定簧片3包括热管结合部31,较佳的系呈一倒锥形缺口,并以无锡紧配的方式与该热管结合;二支撑部32,该每一支撑部32分别与一该金属支撑件结合2;以及四固定部33,用以固定于一设有热源9之基座91上;
所述固定簧片3并非完全包覆该热管1,使该热管1与该固定簧片3结合后,该热管1之第一热源接触面11会突出于该固定簧片3,且该金属支撑件2之第二热源接触面21系与该热管1之第一热源接触面在11同一水平面上。
本发明之散热器总成系将该金属支撑件2之第二热源接触面21与该热管1之第一热源接触面11直触所欲散热之热源9表面,再利用复数螺丝8将该固定簧片3之四个固定部33锁固于设有热源9之基座91上;藉此,可使热管1直触热源9,提升热的传导效果,且因采无锡紧配的方式,加工上亦较为便利。
另,为增加该固定簧片3之支撑力,较佳的可于该固定簧片3之热管结合部31与支撑部32间设置复数个肋部34。
另,该金属支撑件2不仅可用来做为支撑使用,更有均温导热之功效,较佳的系将该金属支撑件2与该热管1相接触,如此还可辅助固定该热管1。
另,为达到最佳的导热效果,较佳的,该金属支撑件2之第二热源接触面21之面积与该热管1之第一热源接触面11之面积总合应大于所欲散热之热源9表面。
另,该固定簧片3与该金属支撑件2的结合方式,系可选用一体成型的方式或铆接的方式做结合。
另,该固定簧片3较佳的系为不锈钢之固定簧片;该金属支撑件2较佳的系为铝材、铜材或其它金属导热材之支撑件;该固定簧片3之顶部厚度较佳的系控制在0.5mm以内
以上所述,仅是本发明较佳实施例而已,并非对本发明的技术范围作任何限制,故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (9)
1.一种散热器总成,其特征在于:包括
一热管,设有一第一热源接触面;
复数金属支撑件,分别设有一第二热源接触面;以及
一固定簧片,该固定簧片包括一热管结合部、复数支撑部以及复数固定部,该热管结合部以无锡紧配的方式与该热管结合;所述每一支撑部分别与一该金属支撑件结合;所述固定部用以固定于一设有热源之基座上;
其中,该热管与该固定簧片结合后,该热管之第一热源接触面会突出于该固定簧片,且该金属支撑件之第二热源接触面系与该热管之第一热源接触面在同一水平面上。
2.如权利要求1所述之散热器总成,其特征在于:该固定簧片与该金属支撑件系一体成型。
3.如权利要求1所述之散热器总成,其特征在于:该固定簧片与该金属支撑件系以铆接的方式结合。
4.如权利要求1所述之散热器总成,其特征在于:该固定簧片系为不锈钢之固定簧片。
5.如权利要求1所述之散热器总成,其特征在于:该固定簧片之热管结合部与支撑部间设有至少一肋部。
6.如权利要求1所述之散热器总成,其特征在于:该金属支撑件系为铝材、铜材或其它金属导热材之支撑件。
7.如权利要求1所述之散热器总成,其特征在于:该金属支撑件与该热管系相接触。
8.如权利要求1所述之散热器总成,其特征在于:该金属支撑件之第二热源接触面之面积与该热管之第一热源接触面之面积总合大于所欲散热之热源表面。
9.如权利要求1所述之散热器总成,其特征在于:该固定簧片之热管结合部系呈一倒锥形缺口。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110052090A CN102109286B (zh) | 2011-03-04 | 2011-03-04 | 散热器总成 |
US13/176,748 US9175911B2 (en) | 2011-03-04 | 2011-07-06 | Heat sink assembly |
DE202011050778U DE202011050778U1 (de) | 2011-03-04 | 2011-07-20 | Kühlkörper-Baugruppe |
JP2011004298U JP3170897U (ja) | 2011-03-04 | 2011-07-25 | 放熱器アセンブリ |
KR2020110007128U KR200465922Y1 (ko) | 2011-03-04 | 2011-08-05 | 히트싱크 구조체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110052090A CN102109286B (zh) | 2011-03-04 | 2011-03-04 | 散热器总成 |
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CN102109286A CN102109286A (zh) | 2011-06-29 |
CN102109286B true CN102109286B (zh) | 2012-09-19 |
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US (1) | US9175911B2 (zh) |
JP (1) | JP3170897U (zh) |
KR (1) | KR200465922Y1 (zh) |
CN (1) | CN102109286B (zh) |
DE (1) | DE202011050778U1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190383566A1 (en) * | 2013-09-06 | 2019-12-19 | Delta Electronics, Inc. | Heat sink |
CN104635889B (zh) * | 2013-11-15 | 2018-01-19 | 升业科技股份有限公司 | 散热底板的制造方法 |
US9618274B2 (en) * | 2014-03-11 | 2017-04-11 | Asia Vital Components Co., Ltd. | Thermal module with enhanced assembling structure |
US20150330715A1 (en) * | 2014-05-14 | 2015-11-19 | Asia Vital Components Co., Ltd. | Manufacturing method of thermal module |
US20150330716A1 (en) * | 2014-05-18 | 2015-11-19 | Asia Vital Components Co., Ltd. | Base plate fixing structure for a heat dissipating module |
USD772822S1 (en) * | 2015-06-11 | 2016-11-29 | Ebullient, Inc. | Redundant heat sink module |
USD772179S1 (en) * | 2015-08-26 | 2016-11-22 | Ebullient, Inc. | Heat sink module |
USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
USD786806S1 (en) * | 2015-09-26 | 2017-05-16 | Ebullient, Inc. | Heat sink module |
US10522443B2 (en) * | 2017-06-05 | 2019-12-31 | Microsemi Corporation | Lid cover spring design |
KR102620058B1 (ko) | 2018-11-01 | 2024-01-03 | 삼성전자주식회사 | 방열 구조체 및 이를 포함하는 전자 장치 |
US20230262933A1 (en) * | 2020-07-23 | 2023-08-17 | Hewlett-Packard Development Company, L.P. | Thermal management devices |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4080703A (en) * | 1975-08-01 | 1978-03-28 | The Stolle Corporation | Radiating or absorbing heat exchange panel |
CA2310358A1 (en) * | 1999-06-01 | 2000-12-01 | Showa Aluminum Corporation | Heat sinks for cpus for use in personal computers |
JP2001110970A (ja) | 1999-10-07 | 2001-04-20 | Fujikura Ltd | 電子素子の放熱構造 |
JP2002286380A (ja) | 2001-03-28 | 2002-10-03 | Showa Denko Kk | ヒートパイプ式冷却装置 |
TW591363B (en) * | 2001-10-10 | 2004-06-11 | Aavid Thermalloy Llc | Heat collector with mounting plate |
US6853555B2 (en) * | 2002-04-11 | 2005-02-08 | Lytron, Inc. | Tube-in-plate cooling or heating plate |
JP3634825B2 (ja) * | 2002-06-28 | 2005-03-30 | 株式会社東芝 | 電子機器 |
US20050180110A1 (en) * | 2004-02-18 | 2005-08-18 | Lin I-Yung | Heat dissipation structure |
US7714423B2 (en) * | 2005-09-30 | 2010-05-11 | Apple Inc. | Mid-plane arrangement for components in a computer system |
US20070121291A1 (en) * | 2005-11-30 | 2007-05-31 | Inventec Corporation | Heat sink module of a notebook computer |
TW200739327A (en) * | 2006-04-14 | 2007-10-16 | Compal Electronics Inc | Heat dissipating module |
US7511958B2 (en) * | 2006-05-31 | 2009-03-31 | Cheng-Hsing Lin | Heat dissipating assembly of heat dissipating device |
US7405937B1 (en) * | 2007-02-16 | 2008-07-29 | Inventec Corporation | Heat sink module for dual heat sources |
US7650929B2 (en) * | 2007-09-30 | 2010-01-26 | Tsung-Hsien Huang | Cooler module |
CN101448381B (zh) * | 2007-11-27 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
TW200821811A (en) * | 2008-01-11 | 2008-05-16 | Chung-Shian Huang | Heat dissipation device without a base |
TWM349179U (en) * | 2008-08-05 | 2009-01-11 | yi-ren Xie | Heat conduction module |
CN201252094Y (zh) * | 2008-09-09 | 2009-06-03 | 昆山迪生电子有限公司 | 笔记本电脑cpu与热管压接高效导热结构 |
CN101674717B (zh) * | 2008-09-11 | 2012-05-16 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101782342B (zh) * | 2009-01-16 | 2013-03-20 | 富瑞精密组件(昆山)有限公司 | 热管及其毛细结构的制作方法 |
CN101840257A (zh) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件(昆山)有限公司 | 散热模组及其固定装置 |
CN101841987A (zh) * | 2009-03-21 | 2010-09-22 | 富准精密工业(深圳)有限公司 | 散热装置及其扣具 |
US20110240258A1 (en) * | 2010-03-31 | 2011-10-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus |
US8488322B2 (en) * | 2010-10-28 | 2013-07-16 | Chaun-Choung Technology Corp. | Thin fastener of heat sink |
CN201945224U (zh) * | 2011-03-04 | 2011-08-24 | 东莞汉旭五金塑胶科技有限公司 | 散热器总成 |
US20130000870A1 (en) * | 2011-06-28 | 2013-01-03 | Chun-Ming Wu | Thermal module and method of manufacturing same |
US20130020055A1 (en) * | 2011-07-19 | 2013-01-24 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
US20130032313A1 (en) * | 2011-08-05 | 2013-02-07 | Chun-Ming Wu | Heat-dissipation unit and method of manufacturing same |
US9429369B2 (en) * | 2011-09-06 | 2016-08-30 | Asia Vital Components Co., Ltd. | Thermal module structure |
US9188394B2 (en) * | 2011-11-23 | 2015-11-17 | Chaun-Choung Technology Corp. | Thin heat pipe having recesses for fastener |
-
2011
- 2011-03-04 CN CN201110052090A patent/CN102109286B/zh active Active
- 2011-07-06 US US13/176,748 patent/US9175911B2/en active Active
- 2011-07-20 DE DE202011050778U patent/DE202011050778U1/de not_active Expired - Lifetime
- 2011-07-25 JP JP2011004298U patent/JP3170897U/ja not_active Expired - Fee Related
- 2011-08-05 KR KR2020110007128U patent/KR200465922Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE202011050778U1 (de) | 2012-01-13 |
KR20120006357U (ko) | 2012-09-12 |
CN102109286A (zh) | 2011-06-29 |
US9175911B2 (en) | 2015-11-03 |
KR200465922Y1 (ko) | 2013-03-18 |
JP3170897U (ja) | 2011-10-06 |
US20120222836A1 (en) | 2012-09-06 |
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