CN102096312A - 光刻方法 - Google Patents
光刻方法 Download PDFInfo
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- CN102096312A CN102096312A CN2009102012002A CN200910201200A CN102096312A CN 102096312 A CN102096312 A CN 102096312A CN 2009102012002 A CN2009102012002 A CN 2009102012002A CN 200910201200 A CN200910201200 A CN 200910201200A CN 102096312 A CN102096312 A CN 102096312A
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- pattern
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- photoengraving
- mask
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- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009102012002A CN102096312A (zh) | 2009-12-15 | 2009-12-15 | 光刻方法 |
Applications Claiming Priority (1)
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CN2009102012002A CN102096312A (zh) | 2009-12-15 | 2009-12-15 | 光刻方法 |
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CN102096312A true CN102096312A (zh) | 2011-06-15 |
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CN2009102012002A Pending CN102096312A (zh) | 2009-12-15 | 2009-12-15 | 光刻方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103065948A (zh) * | 2012-12-28 | 2013-04-24 | 上海集成电路研发中心有限公司 | 小线宽沟槽图形的制备方法 |
CN103367120A (zh) * | 2013-07-08 | 2013-10-23 | 上海集成电路研发中心有限公司 | 高分辨率沟槽图形的形成方法 |
CN105223783A (zh) * | 2015-09-23 | 2016-01-06 | 武汉华星光电技术有限公司 | 一种曝光方法 |
CN115390362A (zh) * | 2021-05-25 | 2022-11-25 | 赫智科技(苏州)有限公司 | 一种4k光刻的方法 |
-
2009
- 2009-12-15 CN CN2009102012002A patent/CN102096312A/zh active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103065948A (zh) * | 2012-12-28 | 2013-04-24 | 上海集成电路研发中心有限公司 | 小线宽沟槽图形的制备方法 |
CN103065948B (zh) * | 2012-12-28 | 2017-04-19 | 上海集成电路研发中心有限公司 | 小线宽沟槽图形的制备方法 |
CN103367120A (zh) * | 2013-07-08 | 2013-10-23 | 上海集成电路研发中心有限公司 | 高分辨率沟槽图形的形成方法 |
CN105223783A (zh) * | 2015-09-23 | 2016-01-06 | 武汉华星光电技术有限公司 | 一种曝光方法 |
CN115390362A (zh) * | 2021-05-25 | 2022-11-25 | 赫智科技(苏州)有限公司 | 一种4k光刻的方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING (BEIJING) INTERNATIONA Effective date: 20121101 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121101 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110615 |