CN102077103B - 半导体测定装置以及方法 - Google Patents
半导体测定装置以及方法 Download PDFInfo
- Publication number
- CN102077103B CN102077103B CN200980125417.8A CN200980125417A CN102077103B CN 102077103 B CN102077103 B CN 102077103B CN 200980125417 A CN200980125417 A CN 200980125417A CN 102077103 B CN102077103 B CN 102077103B
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- China
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- detector
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- electronic
- electronic unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims description 23
- 238000012360 testing method Methods 0.000 claims description 47
- 230000008569 process Effects 0.000 claims description 19
- 230000004069 differentiation Effects 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 abstract description 69
- 230000009471 action Effects 0.000 description 30
- 230000033001 locomotion Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 7
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- 241001422033 Thestylus Species 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
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- 230000008859 change Effects 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
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- 230000015572 biosynthetic process Effects 0.000 description 2
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- 230000005540 biological transmission Effects 0.000 description 1
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- 238000001259 photo etching Methods 0.000 description 1
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- 238000009987 spinning Methods 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2009/057510 WO2010119507A1 (ja) | 2009-04-14 | 2009-04-14 | 半導体測定装置及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102077103A CN102077103A (zh) | 2011-05-25 |
CN102077103B true CN102077103B (zh) | 2013-06-05 |
Family
ID=42982191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980125417.8A Expired - Fee Related CN102077103B (zh) | 2009-04-14 | 2009-04-14 | 半导体测定装置以及方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4646271B1 (zh) |
CN (1) | CN102077103B (zh) |
WO (1) | WO2010119507A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4771346B1 (ja) * | 2010-12-07 | 2011-09-14 | パイオニア株式会社 | 半導体検査装置 |
JP5781864B2 (ja) * | 2011-08-25 | 2015-09-24 | 株式会社日本マイクロニクス | 発光素子の検査装置及び検査方法 |
CN107526014B (zh) * | 2016-06-22 | 2019-10-08 | 致茂电子(苏州)有限公司 | 测试装置及测试方法 |
CN114295948B (zh) * | 2020-10-07 | 2023-11-14 | 台湾爱司帝科技股份有限公司 | 电子元件测量设备、电子元件测量方法及发光二极管的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5605844A (en) * | 1995-03-31 | 1997-02-25 | Matsushita Electric Industrial Co., Ltd. | Inspecting method for semiconductor devices |
CN1782716A (zh) * | 2004-11-29 | 2006-06-07 | 冲电气工业株式会社 | 探针板、使用其的检查方法及由该方法检查的半导体装置 |
CN101271145A (zh) * | 2007-03-23 | 2008-09-24 | 东京毅力科创株式会社 | 检查装置和检查方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2837829B2 (ja) * | 1995-03-31 | 1998-12-16 | 松下電器産業株式会社 | 半導体装置の検査方法 |
JP3065612B1 (ja) * | 1999-06-01 | 2000-07-17 | 日本電産リード株式会社 | 基板検査装置 |
JP2006145402A (ja) * | 2004-11-19 | 2006-06-08 | Oki Electric Ind Co Ltd | 半導体集積回路の同時測定方法 |
US7928591B2 (en) * | 2005-02-11 | 2011-04-19 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
-
2009
- 2009-04-14 CN CN200980125417.8A patent/CN102077103B/zh not_active Expired - Fee Related
- 2009-04-14 WO PCT/JP2009/057510 patent/WO2010119507A1/ja active Application Filing
- 2009-04-14 JP JP2010536669A patent/JP4646271B1/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5605844A (en) * | 1995-03-31 | 1997-02-25 | Matsushita Electric Industrial Co., Ltd. | Inspecting method for semiconductor devices |
CN1782716A (zh) * | 2004-11-29 | 2006-06-07 | 冲电气工业株式会社 | 探针板、使用其的检查方法及由该方法检查的半导体装置 |
CN101271145A (zh) * | 2007-03-23 | 2008-09-24 | 东京毅力科创株式会社 | 检查装置和检查方法 |
Non-Patent Citations (2)
Title |
---|
JP特开2000-346896A 2000.12.15 |
JP特开2006-145402A 2006.06.08 |
Also Published As
Publication number | Publication date |
---|---|
WO2010119507A1 (ja) | 2010-10-21 |
CN102077103A (zh) | 2011-05-25 |
JPWO2010119507A1 (ja) | 2012-10-22 |
JP4646271B1 (ja) | 2011-03-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PIONEER FA Corp. Patentee after: PIONEER Corp. Address before: Kanagawa Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
|
CP02 | Change in the address of a patent holder | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PFA Co. Patentee after: PIONEER Corp. Address before: Tokyo, Japan Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180830 Address after: Saitama Prefecture, Japan Co-patentee after: SHINKAWA Ltd. Patentee after: PFA Co. Address before: Tokyo, Japan Co-patentee before: PFA Co. Patentee before: PIONEER Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20190414 |