CN102063017B - 曝光装置和器件制造方法 - Google Patents

曝光装置和器件制造方法 Download PDF

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Publication number
CN102063017B
CN102063017B CN2010105401255A CN201010540125A CN102063017B CN 102063017 B CN102063017 B CN 102063017B CN 2010105401255 A CN2010105401255 A CN 2010105401255A CN 201010540125 A CN201010540125 A CN 201010540125A CN 102063017 B CN102063017 B CN 102063017B
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China
Prior art keywords
substrate
transfer arm
stage
place
stand
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CN2010105401255A
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English (en)
Chinese (zh)
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CN102063017A (zh
Inventor
平野真一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102063017A publication Critical patent/CN102063017A/zh
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Publication of CN102063017B publication Critical patent/CN102063017B/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2010105401255A 2009-11-16 2010-11-11 曝光装置和器件制造方法 Active CN102063017B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009261318 2009-11-16
JP2009-261318 2009-11-16
JP2010-237915 2010-10-22
JP2010237915A JP5537380B2 (ja) 2009-11-16 2010-10-22 露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
CN102063017A CN102063017A (zh) 2011-05-18
CN102063017B true CN102063017B (zh) 2013-03-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105401255A Active CN102063017B (zh) 2009-11-16 2010-11-11 曝光装置和器件制造方法

Country Status (4)

Country Link
US (1) US9280067B2 (enExample)
JP (1) JP5537380B2 (enExample)
KR (1) KR101431867B1 (enExample)
CN (1) CN102063017B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7212558B2 (ja) * 2019-03-15 2023-01-25 キヤノン株式会社 基板処理装置、決定方法及び物品の製造方法
KR20210086748A (ko) * 2019-12-30 2021-07-09 세메스 주식회사 기판 리프팅 방법 및 기판 처리 장치
JP7625636B2 (ja) 2023-05-24 2025-02-03 キヤノン株式会社 基板処理装置、制御方法、および物品製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1838397A (zh) * 2006-03-10 2006-09-27 友达光电股份有限公司 基板传送装置
CN1922725A (zh) * 2004-03-30 2007-02-28 东京毅力科创株式会社 半导体处理装置和方法
CN101060066A (zh) * 2006-04-17 2007-10-24 大日本网目版制造株式会社 基板处理装置
CN101351878A (zh) * 2006-09-05 2009-01-21 东京毅力科创株式会社 基板交接装置、基板处理装置、基板交接方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100280108B1 (ko) * 1998-11-03 2001-03-02 윤종용 오리엔터 플랫존 유니트의 웨이퍼 파손 방지 시스템
KR100388653B1 (ko) * 2000-12-18 2003-06-25 삼성전자주식회사 반송로봇과 그 제어방법
JP2003163251A (ja) * 2001-11-27 2003-06-06 Sendai Nikon:Kk 搬送装置及び露光装置
JP2005114882A (ja) * 2003-10-06 2005-04-28 Hitachi High-Tech Electronics Engineering Co Ltd 処理ステージの基板載置方法、基板露光ステージおよび基板露光装置
JP2006066636A (ja) * 2004-08-26 2006-03-09 Nikon Corp 搬送装置とその方法、及び露光装置
KR101280166B1 (ko) * 2004-11-25 2013-06-28 가부시키가이샤 니콘 이동체 시스템, 노광 장치 및 디바이스 제조 방법
JPWO2007116752A1 (ja) * 2006-04-05 2009-08-20 株式会社ニコン ステージ装置、露光装置、ステージ制御方法、露光方法、およびデバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1922725A (zh) * 2004-03-30 2007-02-28 东京毅力科创株式会社 半导体处理装置和方法
CN1838397A (zh) * 2006-03-10 2006-09-27 友达光电股份有限公司 基板传送装置
CN101060066A (zh) * 2006-04-17 2007-10-24 大日本网目版制造株式会社 基板处理装置
CN101351878A (zh) * 2006-09-05 2009-01-21 东京毅力科创株式会社 基板交接装置、基板处理装置、基板交接方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-66636A 2006.03.09

Also Published As

Publication number Publication date
JP5537380B2 (ja) 2014-07-02
KR20110053903A (ko) 2011-05-24
KR101431867B1 (ko) 2014-08-25
CN102063017A (zh) 2011-05-18
JP2011124548A (ja) 2011-06-23
US20110116070A1 (en) 2011-05-19
US9280067B2 (en) 2016-03-08

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