CN102057763A - 电子纺织品 - Google Patents

电子纺织品 Download PDF

Info

Publication number
CN102057763A
CN102057763A CN2009801217662A CN200980121766A CN102057763A CN 102057763 A CN102057763 A CN 102057763A CN 2009801217662 A CN2009801217662 A CN 2009801217662A CN 200980121766 A CN200980121766 A CN 200980121766A CN 102057763 A CN102057763 A CN 102057763A
Authority
CN
China
Prior art keywords
electrode
textile
coupling layer
electronic
yarn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2009801217662A
Other languages
English (en)
Other versions
CN102057763B (zh
Inventor
R·巴塔查亚
L·范皮特森
K·范奥斯
T·舒勒
G·拉梅里希斯
E·阿尔特维舍尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN102057763A publication Critical patent/CN102057763A/zh
Application granted granted Critical
Publication of CN102057763B publication Critical patent/CN102057763B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/038Textiles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0233Deformable particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0281Conductive fibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/029Woven fibrous reinforcement or textile
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10393Clamping a component by an element or a set of elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2008Fabric composed of a fiber or strand which is of specific structural definition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2041Two or more non-extruded coatings or impregnations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2041Two or more non-extruded coatings or impregnations
    • Y10T442/2098At least two coatings or impregnations of different chemical composition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2041Two or more non-extruded coatings or impregnations
    • Y10T442/2098At least two coatings or impregnations of different chemical composition
    • Y10T442/2107At least one coating or impregnation contains particulate material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2041Two or more non-extruded coatings or impregnations
    • Y10T442/2123At least one coating or impregnation contains particulate material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2738Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith

Abstract

本发明涉及一种电子纺织品,该电子纺织品包括具有衬底电极的纺织品衬底,以及具有部件电极的电子部件。部件电极经由具有方向依赖性的电导的耦合层与衬底电极导电接触,从而择优地允许电流在衬底电极和部件电极之间流动。由于耦合层不必被图案化以防止出现寄生电流,所以衬底电极和部件电极之间的导电接触具有改进的可靠性。

Description

电子纺织品
技术领域
本发明涉及一种电子纺织品(electronic textile),该电子纺织品包括具有衬底电极的纺织品衬底以及具有部件电极的电子部件,部件电极经由耦合层与衬底电极导电接触。
本发明还涉及一种制造根据先前段落的电子纺织品的方法。
背景技术
纺织品是一种包括交织纤维的材料,其可以例如通过对纤维进行编织、针织、钩编、打结或挤压在一起来制造。许多类型的纺织品被用于我们的日常生活中。当电子部件(即,通过控制电子的流动来工作的器件)集成到纺织品内时,新的应用领域出现。当纺织品为包括电子部件的电路的组成部分时,就获得了电子纺织品。
电子部件的一个实例是形式为表面安装器件(SMD-LED)的LED封装,其可以通过胶粘、焊接、纽扣连接或者缝纫而附连到纺织品衬底。所得到的发光纺织品可以开创宽广范围的新颖的室内布景和服装应用,涵盖了从照明到创造气氛到传递消息。
从UK专利申请GB2396252A已知一种电子纺织品。该已知发光纺织品包括利用导电环氧树脂固定到具有导电纺织品轨迹的织物构件的SMD-LED。
该已知电子纺织品的缺点为SMD-LED与包括在织物构件中的导电纺织品轨迹之间的导电接触的不良可靠性。
发明内容
本发明的一个目的是提供一种电子纺织品,该电子纺织品包括具有衬底电极的纺织品衬底以及具有部件电极的电子部件,部件电极经由耦合层与衬底电极导电接触,其中耦合层包括能够实现导电接触的改进可靠性的材料。
本发明的另一目的是提供一种用于制造根据先前段落的电子纺织品的方法。
根据本发明第一方面,该目的是通过一种电子纺织品来实现的,该电子纺织品包括具有衬底电极的纺织品衬底以及具有部件电极的电子部件,部件电极经由耦合层与衬底电极导电接触,其特征在于,耦合层包括各向异性传导材料。
各向异性传导材料为具有方向依赖性的电导的材料。换言之,当沿着不同的轴测量时,材料的电导是不同的。在本发明的上下文中,提供各向异性传导材料,使得最高电导的方向是在衬底电极和部件电极之间。
在已知电子纺织品中使用的导电环氧树脂用于改进部件电极和衬底电极之间的电接触。然而,由于导电环氧树脂为各向同性传导材料(即,当沿着不同的轴测量时,材料的电导是类似的),所以导电环氧树脂必须以图案化方式应用从而防止出现寄生电流(即,由于非故意原因引起的不期望的电流)。
发明人已经意识到,在纺织品衬底上适当地以图案化方式应用耦合层受到纺织品衬底的尺寸不稳定性的严重限制,尺寸不稳定性是指纺织品衬底的尺寸可以例如由于纺织品衬底的拉伸或加热的原因而改变。结果,通过使用包括各向同性传导材料的耦合层,无法最优地改进衬底电极和部件电极之间的导电接触的可靠性。
与包括各向同性传导材料的耦合层对比,应用包括各向异性传导材料的耦合层的容差大得多,因为它可以被应用以覆盖延伸超出其中电子部件必须与纺织品衬底导电接触的区域的区域。因此,包括各向异性传导材料的耦合层的使用对于纺织品衬底的尺寸不稳定性的敏感性低得多,且它可以用作底填层以改进纺织品衬底和电子部件之间的连接的机械可靠性。
附加的优点为,该耦合层在位于纺织品衬底上不连接电子部件的位置时可以用作粘合剂以将例如覆盖纺织品层的第二层附连到纺织品衬底,从而改进电子纺织品的外观和/或鲁棒性。
在根据本发明的电子纺织品的第一实施例中,各向异性传导材料包括电绝缘粘结剂和导电颗粒。当在这种耦合层中导电颗粒以太低的浓度分散在电绝缘粘结剂中而不允许预先存在导电路径时,仅仅在电子部件已经提供在纺织品衬底上的位置处将由于压缩各向异性传导材料而形成导电路径。部件电极和衬底电极之间的导电接触可以或者通过衬底电极和部件电极之间的直接物理接触来实现,或者通过经由已被捕获在部件电极和衬底电极之间的导电颗粒的间接接触来实现。
在根据本发明的电子纺织品的第二实施例中,各向异性传导材料包括电绝缘粘结剂和导电颗粒,其中导电颗粒是弹性的。导电颗粒的弹性导致在受应力时、例如当它们被捕获在部件电极和衬底电极之间时,它们可以可逆变形。按此方式,由于可逆变形的导电颗粒在两个电极上均施加压力,所以部件电极和衬底电极之间的导电接触进一步改进。
在根据本发明的电子纺织品的第三实施例中,各向异性传导材料包括电绝缘粘结剂和导电颗粒,其中电绝缘粘结剂为选自由热固性合成树脂和热塑性合成树脂构成的组的化合物。由于热固性或热塑性合成树脂中的压应变导致电子部件朝纺织品衬底被拉动,所以该实施例进一步改进衬底电极和部件电极之间的导电接触的可靠性。
在根据本发明的电子纺织品的第四实施例中,衬底电极包括导电纱线,且各向异性传导材料为导电纱线的外层。该实施例允许使用导电纱线作为可以被绝缘的衬底电极,同时允许形成与部件电极的改进的机械和导电接触。
在根据本发明的电子纺织品的第五实施例中,电子部件包括夹紧构件。通过夹紧构件将电子部件朝纺织品衬底拉动,该实施例进一步改进衬底电极和部件电极之间的导电接触的可靠性。
根据本发明的第二方面,该目的是通过一种制造电子纺织品的方法来实现的,该电子纺织品包括具有衬底电极的纺织品衬底和具有部件电极的电子部件,该方法包括下述步骤:为衬底电极和部件电极其中之一提供耦合层,该耦合层在沿着该层的方向上是电绝缘的并且布置成允许在与耦合层垂直的方向上的导电性;以及经由耦合层建立衬底电极和部件电极之间的导电接触。
在根据本发明的方法的第一实施例中,耦合层包括电绝缘粘结剂和导电颗粒,以及其中经由耦合层建立衬底电极和部件电极之间的导电接触的步骤包括在与耦合层垂直的方向上施加压力。
附图说明
现在将参考附图对本发明的实例予以详细描述,在附图中:
图1示出根据本发明的电子纺织品的第一实施例的示意性截面图;
图2示出根据本发明的电子纺织品的第二实施例的示意性截面图;
图3示出可以在根据本发明的电子纺织品中使用的导电颗粒的示意性截面图;
图4示出根据本发明的电子纺织品的第三实施例的示意性截面图;
图5示出用于在根据本发明的电子纺织品的实施例中使用的纺织品衬底;
图6示出可以在图5的纺织品衬底中使用的第一纱线的透视图和截面图;
图7示出可以在图5的纺织品衬底中使用的第二纱线的透视图和截面图;
图8示出制造根据本发明的电子纺织品的方法。
应指出,这些图是概略性的且未按比例绘制。为了清楚和方便起见,这些图的一些部分的相对尺寸和比例在尺寸上夸大或缩小地示出。
具体实施方式
在下文的描述中,参考根据本发明的示例性电子纺织品对本发明予以描述。
图1示出根据本发明的电子纺织品1的示意性截面图。电子纺织品1包括具有衬底电极111的纺织品衬底11以及具有部件电极121的电子部件12。衬底电极111经由各向异性传导材料13连接到部件电极121。
优选地,各向异性传导材料13作为带(tape)被施加,但是它也可以作为箔、糊剂、格栅或者以诸如条(strip)的区域的形式被施加。
在图1中,各向异性传导材料13包括电绝缘粘结剂131和导电颗粒132。电绝缘粘结剂131包括热固性合成树脂,且导电颗粒132为直径约为3微米至5微米的球形颗粒。可替换地,热塑性合成树脂也可以用作电绝缘粘结剂。
在其中各向异性传导材料13被施加的状态下(即,在电子部件12已经连接到纺织品衬底11之前),各向异性传导材料是电绝缘的,因为导电颗粒132分隔开太远而不形成导电路径。为此目的,各向异性传导材料13中导电颗粒132的浓度优选地是在约5至10体积百分比的范围内。
在电子部件12的连接期间,压力施加在各向异性传导材料13上,且材料被局部地压缩使得导电颗粒132一同移动得更加靠近。当电绝缘粘结剂131包括热固性合成树脂时,力施加在各向异性传导材料13被压缩的位置处,所述力使得电子部件12朝纺织品衬底11被拉动。
在位置14处,部件电极121连接到衬底电极111,且各向异性传导材料13已被压缩至这样的程度:使得若干导电颗粒132已经被捕获在部件电极121和衬底电极111之间,由此建立两个电极之间的导电路径。在图1中,部件电极121和衬底电极111经由单层的导电颗粒132被连接。当然,该连接也可以至少部分地由多层的导电颗粒132而形成,或者通过部件电极121和衬底电极111之间的直接物理接触而形成。
在部件电极121不连接到衬底电极111的位置15处,各向异性传导材料13用作非传导底填层,并改进电子部件12和纺织品衬底11之间的粘合强度。
在位置16处,各向异性传导材料13不被压缩。各向异性传导材料在这里露出且可用于附连辅助层,例如保护层和/或装饰层。
图2示出根据本发明的电子纺织品2的示意性截面图。电子纺织品2包括具有衬底电极211的纺织品衬底21以及具有部件电极221的电子部件22。衬底电极211经由各向异性传导材料23连接到部件电极221。各向异性传导材料23包括电绝缘粘结剂231和导电颗粒232。
导电颗粒232是弹性的,这意味着它们在受应力时能够可逆变形。为此目的,导电颗粒232包括合成树脂核心233,该合成树脂核心用例如金属的导电材料234涂敷。优选地,合成树脂核心233用Ni-Au层涂敷,因为Ni为导电颗粒232提供高的硬度,且Au为导电颗粒232提供高的抗腐蚀性和高的电导。在位置24处,部件电极221连接到衬底电极211,且各向异性传导材料23已经压缩至这样的程度:若干导电颗粒232已经被捕获在部件电极221和衬底电极211之间,由此形成两个电极之间的导电路径。再者,当捕获的导电颗粒232变形时,它们的弹性导致它们不断地向外压在衬底电极211和部件电极221二者上,由此改进两个电极之间的导电接触的可靠性。
图3示出也可以在各向异性传导材料中用作导电颗粒的导电颗粒332的示意性截面图。导电颗粒332包括合成树脂核心333,该合成树脂核心用导电材料334、例如Ni-Au层涂敷。导电颗粒332进一步包括电绝缘外层335,当导电颗粒332在衬底电极311和部件电极321之间被捕获且变形时,该电绝缘外层335可以被推开,允许导电层234在衬底电极311和部件电极321之间建立导电连接。电绝缘外层335防止导电颗粒332在与其变形的方向垂直的方向上、例如在与纺织品衬底的平面平行的方向上形成导电接触。
图4示出根据本发明的电子纺织品4的示意性截面图。电子纺织品4包括具有衬底电极411的纺织品衬底41以及具有部件电极421的电子部件42。衬底电极411经由各向异性传导材料43连接到部件电极421。各向异性传导材料43包括电绝缘粘结剂431和导电颗粒432。
为了增加用于在位置44和45处压缩各向异性传导材料43的压力,从而获得电子部件42和纺织品衬底41之间改进的机械和导电连接,电子部件42包括夹紧构件422。在图4中,夹紧构件422已经穿过纺织品衬底41。可替换地,也可以使用绕纺织品衬底边缘缠绕的夹紧构件。夹紧构件和部件电极可以集成在单个元件中。
替代(next to)分别如图1、2和4所示的各向异性传导材料13、23和43,在根据本发明的电子纺织品中可以使用其它类型的各向异性传导材料。
替换性的各向异性传导材料的第一实例包括量子隧穿复合物。量子隧穿复合物包括分散在电绝缘粘结剂中的导电颗粒。与图1的各向异性传导材料13类似,没有压力时,导电颗粒分隔太远而无法传导电流,但是当施加压力时,导电颗粒移动得更加靠近至这样的程度:使得电子可以隧穿通过电绝缘粘结剂。
替换性的各向异性传导材料的第二实例包括电绝缘粘结剂和导电颗粒,该导电颗粒对准,使得在垂直于各向异性传导材料的表面的方向上存在导电路径。与上文给出的实例对比,在电子部件连接到纺织品衬底之前,这里的各向异性传导材料已经是各向异性传导的。通过施加例如磁场的外部刺激或者经由自对准过程,导电颗粒可以已经被对准。
图5示出用于在根据本发明的电子纺织品的另外的实施例中使用的纺织品衬底51。纺织品衬底51分别包括导电经纱线511和导电纬纱线512,以及电绝缘纱线513。导电经纱线511和导电纬纱线512在纺织品衬底51的表面514处部分地露出,使得它们可用于例如经由连接器区域515和516连接到电子部件。
图6示出纱线611的透视图和截面图。纱线611可以用作图5的纺织品衬底51中的导电经纱线或导电纬纱线。导电纱线611包括一束导电纤维612,该束用外层613涂敷。外层613为根据前文所述任何一种各向异性传导材料的各向异性传导材料。相应地,外层613在沿着纱线611的方向614上是电绝缘的,且其布置成允许在垂直于纱线611的方向615上的导电性。
图7示出纱线711的截面图。纱线711可以用作图5的纺织品衬底51中的导电经纱线或导电纬纱线。导电纱线711包括导电纤维712,每个导电纤维分别用外层713涂敷。外层713为根据前文所述任何一种各向异性传导材料的各向异性传导材料。相应地,外层713在沿着纱线711的方向714上是电绝缘的,且其布置成允许在垂直于纱线711的方向715上的导电性。
纱线611和711的附加优点为,可以分别选择外层613和713的属性从而改进纱线的可编织性。
图8示意性地示出制造电子纺织品8的方法,该电子纺织品包括具有衬底电极811的纺织品衬底81以及具有部件电极821的电子部件82。
在第一阶段(a),包括热固性电绝缘粘结剂831和导电颗粒832的耦合层83被施加到衬底电极811。在步骤(a)期间,耦合层83通过提高其温度而被软化(取决于耦合层83的成分,但是典型地高达大约100摄氏度的温度),并且压力(典型地约为1MPa)被施加以将耦合层83层叠到纺织品衬底81上。
在第二阶段(b),电子部件82相对于纺织品衬底81被定位,使得部件电极821在纺织品衬底81上的投影与衬底电极811交叠。通过在垂直于纺织品衬底81的方向84上施加压力(典型地约为4MPa至5MPa),电子部件82随后朝纺织品衬底81移动。与步骤(a)期间类似,在步骤(b)期间耦合层83也通过提高其温度而被软化。同样,用于软化耦合层83的条件取决于耦合层83的成分。优选地,典型地通过将耦合层83的温度提高至高达约200摄氏度,在步骤(b)期间耦合层83被软化到与在步骤(a)期间相比更高的程度。部件电极821朝衬底电极811被压到软化的耦合层83内,直到在部件电极821和衬底电极811之间获得导电连接的程度。典型地,电子部件82被压住大约10秒。
在第三阶段(c),电子部件82上的压力被释放,并且耦合层83的温度降低到室温,从而获得电子纺织品8。
尽管在图8中耦合层83以层叠到衬底上的层的形式被施加,但是通过包括例如喷射、印刷、喷涂、或者从注射器分配的涂敷技术,耦合层也可以从液相被施加。再者,尽管在图8中,在建立衬底电极811和部件电极821之间的导电接触之前,为衬底电极811提供耦合层83,不过也可能首先为部件电极提供耦合层。
尽管在附图和前述描述中已经详细说明和描述了本发明,但这种说明和描述应被认为是说明性或示例性而非限制性的;本发明不限于所公开的实施例。通过研究附图、公开内容和所附权利要求,本领域技术人员在实践所要求保护的发明时可以理解和达成对所公开实施例的变更。在权利要求中,用词“包括”不排除其它元件,且不定冠词“一”或“一个”不排除多个。在多个互不相同的从属权利要求中陈述某些措施的纯粹事实并不表示不能有利地使用这些措施的组合。权利要求中的任何附图标记不应解读为限制范围。

Claims (10)

1. 一种电子纺织品,该电子纺织品包括具有衬底电极的纺织品衬底以及具有部件电极的电子部件,所述部件电极经由耦合层与所述衬底电极导电接触,其特征在于,所述耦合层包括各向异性传导材料。
2. 根据权利要求1的电子纺织品,其中所述各向异性传导材料包括电绝缘粘结剂和导电颗粒。
3. 根据权利要求2的电子纺织品,其中所述导电颗粒是弹性的。
4. 根据权利要求2的电子纺织品,其中所述电绝缘粘结剂包括选自由热固性合成树脂和热塑性合成树脂构成的组的化合物。
5. 根据前述权利要求中任意一项的电子纺织品,其中所述衬底电极包括导电纱线,并且其中所述各向异性传导材料为导电纱线的外层。
6. 根据前述权利要求中任意一项的电子纺织品,其中所述电子部件包括夹紧构件。
7. 一种制造电子纺织品的方法,该电子纺织品包括具有衬底电极的纺织品衬底和具有部件电极的电子部件,该方法包括下述步骤:为所述衬底电极和所述部件电极其中之一提供耦合层,该耦合层在沿着该层的方向上是电绝缘的并且布置成允许在与所述耦合层垂直的方向上的导电性;以及经由所述耦合层建立所述衬底电极和所述部件电极之间的导电接触。
8. 根据权利要求7的方法,其中所述耦合层包括电绝缘粘结剂和导电颗粒,并且其中经由所述耦合层建立所述衬底电极和所述部件电极之间的导电接触的步骤包括在与所述耦合层垂直的方向上施加压力。
9. 一种纱线,包括导电纤维和在沿着所述纱线的方向上电绝缘的外层,其中该外层布置成允许在与所述纱线垂直的方向上的导电性。
10. 一种纺织品,包括根据权利要求9的纱线。
CN200980121766.2A 2008-06-10 2009-06-03 电子纺织品、制造其的方法以及用于其的纱线 Expired - Fee Related CN102057763B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08157906 2008-06-10
EP08157906.2 2008-06-10
PCT/IB2009/052333 WO2009150570A1 (en) 2008-06-10 2009-06-03 Electronic textile

Publications (2)

Publication Number Publication Date
CN102057763A true CN102057763A (zh) 2011-05-11
CN102057763B CN102057763B (zh) 2016-01-20

Family

ID=41137852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980121766.2A Expired - Fee Related CN102057763B (zh) 2008-06-10 2009-06-03 电子纺织品、制造其的方法以及用于其的纱线

Country Status (6)

Country Link
US (1) US8569189B2 (zh)
EP (1) EP2289291A1 (zh)
JP (1) JP5503644B2 (zh)
KR (1) KR101582527B1 (zh)
CN (1) CN102057763B (zh)
WO (1) WO2009150570A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109429426A (zh) * 2017-08-25 2019-03-05 台北科技大学 整合电子元件的多层线路织物材料及制造方法
CN109690899A (zh) * 2016-09-30 2019-04-26 英特尔公司 用于充电的织物设备
CN111534899A (zh) * 2014-12-22 2020-08-14 苹果公司 织造织物中的导电信号路径

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201208217A (en) * 2010-08-09 2012-02-16 Kings Metal Fiber Technologies Electrical connection structure and light emitting device, fabric circuits, and singal fabric having the same
DE102011075034A1 (de) * 2011-04-29 2012-10-31 Technische Universität Berlin Kontaktstabiler Schnappverbinder
FR2978607A1 (fr) * 2011-07-28 2013-02-01 Commissariat Energie Atomique Procede d'assemblage d'un dispositif a puce micro-electronique dans un tissu, dispositif a puce, et tissu incorporant un dispositif a puce serti
EP2640168A1 (en) 2012-03-15 2013-09-18 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Submount, assembly including submount, method of assembling and assembling device
US8948839B1 (en) 2013-08-06 2015-02-03 L.I.F.E. Corporation S.A. Compression garments having stretchable and conductive ink
US8945328B2 (en) 2012-09-11 2015-02-03 L.I.F.E. Corporation S.A. Methods of making garments having stretchable and conductive ink
US9817440B2 (en) 2012-09-11 2017-11-14 L.I.F.E. Corporation S.A. Garments having stretchable and conductive ink
CN104768455B (zh) 2012-09-11 2018-01-02 L.I.F.E.公司 可穿戴式通信平台
US11246213B2 (en) 2012-09-11 2022-02-08 L.I.F.E. Corporation S.A. Physiological monitoring garments
US10462898B2 (en) 2012-09-11 2019-10-29 L.I.F.E. Corporation S.A. Physiological monitoring garments
US10201310B2 (en) 2012-09-11 2019-02-12 L.I.F.E. Corporation S.A. Calibration packaging apparatuses for physiological monitoring garments
US10159440B2 (en) 2014-03-10 2018-12-25 L.I.F.E. Corporation S.A. Physiological monitoring garments
EP2957154B1 (en) 2013-02-15 2018-11-07 IMEC vzw Textile integration of electronic circuits
WO2014207102A1 (en) 2013-06-26 2014-12-31 Imec Methods for electrically connecting textile integrated conductive yarns
WO2015103620A1 (en) 2014-01-06 2015-07-09 Andrea Aliverti Systems and methods to automatically determine garment fit
US9575560B2 (en) 2014-06-03 2017-02-21 Google Inc. Radar-based gesture-recognition through a wearable device
US9811164B2 (en) 2014-08-07 2017-11-07 Google Inc. Radar-based gesture sensing and data transmission
US9921660B2 (en) 2014-08-07 2018-03-20 Google Llc Radar-based gesture recognition
US10268321B2 (en) 2014-08-15 2019-04-23 Google Llc Interactive textiles within hard objects
US9588625B2 (en) 2014-08-15 2017-03-07 Google Inc. Interactive textiles
US9778749B2 (en) 2014-08-22 2017-10-03 Google Inc. Occluded gesture recognition
US11169988B2 (en) 2014-08-22 2021-11-09 Google Llc Radar recognition-aided search
US9600080B2 (en) 2014-10-02 2017-03-21 Google Inc. Non-line-of-sight radar-based gesture recognition
US10016162B1 (en) 2015-03-23 2018-07-10 Google Llc In-ear health monitoring
US9983747B2 (en) 2015-03-26 2018-05-29 Google Llc Two-layer interactive textiles
WO2016176574A1 (en) 2015-04-30 2016-11-03 Google Inc. Wide-field radar-based gesture recognition
US10310620B2 (en) 2015-04-30 2019-06-04 Google Llc Type-agnostic RF signal representations
US10241581B2 (en) 2015-04-30 2019-03-26 Google Llc RF-based micro-motion tracking for gesture tracking and recognition
US10088908B1 (en) 2015-05-27 2018-10-02 Google Llc Gesture detection and interactions
US9693592B2 (en) 2015-05-27 2017-07-04 Google Inc. Attaching electronic components to interactive textiles
KR102593337B1 (ko) 2015-07-20 2023-10-23 엘.아이.에프.이. 코포레이션 에스.에이. 센서들 및 전자장치를 가진 의류용 유연한 패브릭 리본 연결기들
CN112822840A (zh) 2015-08-20 2021-05-18 苹果公司 具有电子部件阵列的基于织物的物品
US10817065B1 (en) 2015-10-06 2020-10-27 Google Llc Gesture recognition using multiple antenna
CN107851932A (zh) * 2015-11-04 2018-03-27 谷歌有限责任公司 用于将嵌入在服装中的电子器件连接至外部装置的连接器
EP3177118B1 (en) 2015-12-03 2021-06-23 Nokia Technologies Oy An apparatus and method for coupling the apparatus to a reciprocal apparatus
WO2017192167A1 (en) 2016-05-03 2017-11-09 Google Llc Connecting an electronic component to an interactive textile
WO2017200570A1 (en) 2016-05-16 2017-11-23 Google Llc Interactive object with multiple electronics modules
EP3478174A1 (en) 2016-07-01 2019-05-08 L.I.F.E. Corporation S.A. Biometric identification by garments having a plurality of sensors
GB2554646A (en) * 2016-09-30 2018-04-11 Bae Systems Plc An improved method and apparatus
US10579150B2 (en) 2016-12-05 2020-03-03 Google Llc Concurrent detection of absolute distance and relative movement for sensing action gestures
JP7218049B2 (ja) * 2018-07-06 2023-02-06 グンゼ株式会社 導電性編地の電極接続構造及び導電性編地の電極接続方法
GB2593925B (en) * 2020-04-09 2023-05-17 Kymira Ltd Electronic unit for a garment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
WO2008007237A2 (en) * 2006-06-08 2008-01-17 Koninklijke Philips Electronics N.V. Submount for electronic components
CN101184876A (zh) * 2005-05-31 2008-05-21 皇家飞利浦电子股份有限公司 允许无源和有源矩阵寻址的全织物电极布局

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63318010A (ja) * 1987-06-22 1988-12-26 Mitsui Mining & Smelting Co Ltd フレキシブル配線板
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
JPH05182516A (ja) * 1991-12-30 1993-07-23 Casio Comput Co Ltd 異方導電性接着剤および導電接続構造
JPH07152045A (ja) * 1993-11-26 1995-06-16 Casio Comput Co Ltd 液晶表示装置
US6011307A (en) * 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6447886B1 (en) * 2000-03-20 2002-09-10 3Tex, Inc. Base material for a printed circuit board formed from a three-dimensional woven fiber structure
US7268479B2 (en) * 2001-02-15 2007-09-11 Integral Technologies, Inc. Low cost lighting circuits manufactured from conductive loaded resin-based materials
GB2396252A (en) * 2002-10-01 2004-06-16 Steven Leftly Textile light system
WO2004056162A1 (ja) * 2002-12-18 2004-07-01 K-Tech Devices Corp. フリップチップ実装用電子部品及びその製造法、回路板及びその製造法、実装体の製造法
EP1585197B1 (en) 2003-01-17 2011-06-29 JSR Corporation Anisotropic conductive connector and production method therefor and inspection unit for circuit device
KR101051217B1 (ko) * 2003-06-12 2011-07-21 제이에스알 가부시끼가이샤 이방 도전성 커넥터 장치 및 그 제조 방법 및 회로 장치의검사 장치
DE102004001661A1 (de) * 2004-01-12 2005-08-11 Infineon Technologies Ag Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und Vorrichtung
EP1727408A1 (de) * 2005-05-13 2006-11-29 Eidgenössische Technische Hochschule Zürich Textil mit einem Leiterbahnsystem und Verfahren zu dessen Herstellung
US7462035B2 (en) * 2005-07-27 2008-12-09 Physical Optics Corporation Electrical connector configured as a fastening element
US20100065320A1 (en) * 2006-12-07 2010-03-18 Nec Corporation Wiring board and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
CN101184876A (zh) * 2005-05-31 2008-05-21 皇家飞利浦电子股份有限公司 允许无源和有源矩阵寻址的全织物电极布局
WO2008007237A2 (en) * 2006-06-08 2008-01-17 Koninklijke Philips Electronics N.V. Submount for electronic components

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111534899A (zh) * 2014-12-22 2020-08-14 苹果公司 织造织物中的导电信号路径
US11124904B2 (en) 2014-12-22 2021-09-21 Apple Inc. Conductive signal paths in woven fabrics
CN109690899A (zh) * 2016-09-30 2019-04-26 英特尔公司 用于充电的织物设备
CN109690899B (zh) * 2016-09-30 2023-11-10 英特尔公司 用于充电的织物设备
CN109429426A (zh) * 2017-08-25 2019-03-05 台北科技大学 整合电子元件的多层线路织物材料及制造方法
US10893608B2 (en) 2017-08-25 2021-01-12 National Taipei University Of Technology Fabric having multiple layered circuit thereon integrating with electronic devices

Also Published As

Publication number Publication date
JP5503644B2 (ja) 2014-05-28
US20110100683A1 (en) 2011-05-05
KR20110039252A (ko) 2011-04-15
US8569189B2 (en) 2013-10-29
CN102057763B (zh) 2016-01-20
JP2011525043A (ja) 2011-09-08
WO2009150570A1 (en) 2009-12-17
EP2289291A1 (en) 2011-03-02
KR101582527B1 (ko) 2016-01-06

Similar Documents

Publication Publication Date Title
CN102057763A (zh) 电子纺织品
CN101467503B (zh) 用于电子部件的次基台
US10041195B2 (en) Woven signal-routing substrate for wearable electronic devices
US10863780B2 (en) Component for garment or textile product
CN201898147U (zh) 微型发光导线与非导电纱线的结构
US10458050B2 (en) Methods for electrically connecting textile integrated conductive yarns
CN106644194A (zh) 电阻型压力传感器与可穿戴设备
JP2009042108A (ja) 感圧センサ
KR100888324B1 (ko) 도전성 접착제의 제조방법
CN104576965B (zh) 一种可首尾电连接的柔性显示装置及其制备方法
CN109628002A (zh) 异方性导电胶带及其制作方法
US6414380B1 (en) Semiconductor device and method of making same
CN209785612U (zh) 一种新型发光线缆
CN209685995U (zh) 一种弹性导电丝
KR102163491B1 (ko) 탄소섬유 발열 패치 및 이의 제조방법
CN111807352B (zh) 一种基于柔性多孔纤维材料制备石墨烯电热膜的方法
KR102247006B1 (ko) 자가조립 전도성 페이스트를 포함하는 섬유 복합 적층체 및 그의 제조방법
JP6360962B2 (ja) 薄膜ボタンサーキットの上、下シートの新型導電構造及び導電方法
WO2017102615A1 (en) Method for manufacturing a panel of fabric and kit for creating a wearable electronic item
CN203240371U (zh) Led灯串结构
DE102022104390A1 (de) Verfahren zum elektrischen Kontaktieren, Kontaktierungsgarn und Verwendung des Kontaktierungsgarns
CN116828697A (zh) 线路结构及其连接方法
JPS62101042A (ja) Icチツプの基板への搭載構造

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Holland Ian Deho Finn

Patentee after: KONINKLIJKE PHILIPS N.V.

Address before: Holland Ian Deho Finn

Patentee before: Koninklijke Philips Electronics N.V.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20170314

Address after: Eindhoven

Patentee after: KONINKLIJKE PHILIPS N.V.

Address before: Holland Ian Deho Finn

Patentee before: KONINKLIJKE PHILIPS N.V.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160120

Termination date: 20180603

CF01 Termination of patent right due to non-payment of annual fee