CN102057313B - 母板的基板加工方法 - Google Patents

母板的基板加工方法 Download PDF

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Publication number
CN102057313B
CN102057313B CN200980121319.7A CN200980121319A CN102057313B CN 102057313 B CN102057313 B CN 102057313B CN 200980121319 A CN200980121319 A CN 200980121319A CN 102057313 B CN102057313 B CN 102057313B
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CN
China
Prior art keywords
substrate
cut surface
terminal
processing
motherboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980121319.7A
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English (en)
Chinese (zh)
Other versions
CN102057313A (zh
Inventor
前川和哉
高松生芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN102057313A publication Critical patent/CN102057313A/zh
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Publication of CN102057313B publication Critical patent/CN102057313B/zh
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B28D1/226—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles with plural scoring tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN200980121319.7A 2008-06-17 2009-02-12 母板的基板加工方法 Expired - Fee Related CN102057313B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-158325 2008-06-17
JP2008158325 2008-06-17
PCT/JP2009/052328 WO2009154012A1 (ja) 2008-06-17 2009-02-12 マザー基板の基板加工方法

Publications (2)

Publication Number Publication Date
CN102057313A CN102057313A (zh) 2011-05-11
CN102057313B true CN102057313B (zh) 2013-06-05

Family

ID=41433930

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980121319.7A Expired - Fee Related CN102057313B (zh) 2008-06-17 2009-02-12 母板的基板加工方法

Country Status (5)

Country Link
JP (1) JP5185379B2 (ja)
KR (1) KR101175105B1 (ja)
CN (1) CN102057313B (ja)
TW (1) TWI424224B (ja)
WO (1) WO2009154012A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101941250B (zh) * 2010-09-11 2012-09-05 周金生 切石机压料结构
JP5156085B2 (ja) * 2010-12-13 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板の分断方法
JP5133436B2 (ja) * 2011-03-08 2013-01-30 シャープ株式会社 液晶パネルの製造方法
JP5553242B2 (ja) * 2011-08-01 2014-07-16 三星ダイヤモンド工業株式会社 基板分断方法
CN102515495B (zh) * 2011-12-13 2015-01-21 意力(广州)电子科技有限公司 面板玻璃多模加工方法及采用该方法加工的半成品
JP6105414B2 (ja) * 2013-07-08 2017-03-29 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
KR20150129156A (ko) 2014-05-08 2015-11-19 삼성디스플레이 주식회사 표시 패널 제조 방법
JP6471491B2 (ja) * 2014-12-24 2019-02-20 三星ダイヤモンド工業株式会社 スクライブ方法
JP6524803B2 (ja) * 2015-06-02 2019-06-05 三星ダイヤモンド工業株式会社 ブレイクシステム
CN105785615A (zh) * 2016-05-23 2016-07-20 武汉华星光电技术有限公司 一种基板的切割方法及装置
CN109188743A (zh) * 2018-11-14 2019-01-11 惠科股份有限公司 显示面板的制作方法及显示装置
CN112573814A (zh) * 2020-12-15 2021-03-30 深圳沃特佳科技有限公司 切割过程中防止ito划伤工艺方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005087458A1 (ja) * 2004-03-15 2005-09-22 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
JP2005266684A (ja) * 2004-03-22 2005-09-29 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置、電子機器
CN1678439A (zh) * 2002-07-02 2005-10-05 三星钻石工业股份有限公司 贴合基板的基板截断系统及基板截断方法
CN101134639A (zh) * 2006-08-29 2008-03-05 精工爱普生株式会社 贴合母基板的划线方法及贴合母基板的分割方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789455B1 (ko) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1678439A (zh) * 2002-07-02 2005-10-05 三星钻石工业股份有限公司 贴合基板的基板截断系统及基板截断方法
WO2005087458A1 (ja) * 2004-03-15 2005-09-22 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
JP2005266684A (ja) * 2004-03-22 2005-09-29 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置、電子機器
CN101134639A (zh) * 2006-08-29 2008-03-05 精工爱普生株式会社 贴合母基板的划线方法及贴合母基板的分割方法

Also Published As

Publication number Publication date
TWI424224B (zh) 2014-01-21
WO2009154012A1 (ja) 2009-12-23
TW201000996A (en) 2010-01-01
JP5185379B2 (ja) 2013-04-17
JPWO2009154012A1 (ja) 2011-11-24
KR101175105B1 (ko) 2012-08-21
KR20100123907A (ko) 2010-11-25
CN102057313A (zh) 2011-05-11

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