CN102037550B - 使工具与工艺效果分离的衬底矩阵 - Google Patents

使工具与工艺效果分离的衬底矩阵 Download PDF

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Publication number
CN102037550B
CN102037550B CN2009801185750A CN200980118575A CN102037550B CN 102037550 B CN102037550 B CN 102037550B CN 2009801185750 A CN2009801185750 A CN 2009801185750A CN 200980118575 A CN200980118575 A CN 200980118575A CN 102037550 B CN102037550 B CN 102037550B
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China
Prior art keywords
parameter
test
test matrix
exposure
parameters
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CN2009801185750A
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Chinese (zh)
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CN102037550A (zh
Inventor
P·伊兹克森
M·E·阿德尔
D·坎德尔
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32187—Correlation between controlling parameters for influence on quality parameters
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36307—Table with workpiece features and corresponding machining parameters, methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN2009801185750A 2008-05-21 2009-05-20 使工具与工艺效果分离的衬底矩阵 Active CN102037550B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5489708P 2008-05-21 2008-05-21
US61/054,897 2008-05-21
PCT/US2009/044594 WO2009143200A2 (en) 2008-05-21 2009-05-20 Substrate matrix to decouple tool and process effects

Publications (2)

Publication Number Publication Date
CN102037550A CN102037550A (zh) 2011-04-27
CN102037550B true CN102037550B (zh) 2012-08-15

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CN2009801185750A Active CN102037550B (zh) 2008-05-21 2009-05-20 使工具与工艺效果分离的衬底矩阵

Country Status (7)

Country Link
US (1) US8142966B2 (https=)
EP (1) EP2286447A2 (https=)
JP (3) JP2011521475A (https=)
KR (1) KR101504504B1 (https=)
CN (1) CN102037550B (https=)
IL (1) IL208576A (https=)
WO (1) WO2009143200A2 (https=)

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US9588439B1 (en) * 2010-12-21 2017-03-07 Asml Netherlands B.V. Information matrix creation and calibration test pattern selection based on computational lithography model parameters
NL2009305A (en) 2011-08-31 2013-03-04 Asml Netherlands Bv A method of determining focus corrections, lithographic processing cell and device manufacturing method.
JP6122290B2 (ja) 2011-12-22 2017-04-26 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 再配線層を有する半導体パッケージ
US9875946B2 (en) 2013-04-19 2018-01-23 Kla-Tencor Corporation On-device metrology
NL2013417A (en) 2013-10-02 2015-04-07 Asml Netherlands Bv Methods & apparatus for obtaining diagnostic information relating to an industrial process.
US9490182B2 (en) 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
KR102377411B1 (ko) 2015-04-10 2022-03-21 에이에스엠엘 네델란즈 비.브이. 검사와 계측을 위한 방법 및 장치
US10504759B2 (en) 2016-04-04 2019-12-10 Kla-Tencor Corporation Semiconductor metrology with information from multiple processing steps
US9940705B2 (en) * 2016-05-04 2018-04-10 Kla-Tencor Corporation System, method and computer program product for detecting defects in a fabricated target component using consistent modulation for the target and reference components
CN110100174B (zh) 2016-10-20 2022-01-18 科磊股份有限公司 用于图案化晶片特性化的混合度量
JP6779173B2 (ja) * 2017-05-18 2020-11-04 株式会社荏原製作所 基板処理装置、プログラムを記録した記録媒体
KR102596144B1 (ko) * 2018-12-31 2023-11-01 에이에스엠엘 네델란즈 비.브이. 프로세스 제어를 위한 인-다이 계측 방법 및 시스템

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JP3109631B2 (ja) 1992-12-14 2000-11-20 沖電気工業株式会社 ホトリソグラフィーのパターン検証方法
EP1205806A1 (en) * 2000-11-09 2002-05-15 Semiconductor300 GmbH &amp; Co KG Method for exposing a semiconductor wafer
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Also Published As

Publication number Publication date
CN102037550A (zh) 2011-04-27
IL208576A (en) 2014-12-31
KR101504504B1 (ko) 2015-03-20
IL208576A0 (en) 2010-12-30
KR20110010804A (ko) 2011-02-07
JP2017201402A (ja) 2017-11-09
WO2009143200A2 (en) 2009-11-26
JP2011521475A (ja) 2011-07-21
US20110051116A1 (en) 2011-03-03
WO2009143200A3 (en) 2010-03-04
US8142966B2 (en) 2012-03-27
JP2015180953A (ja) 2015-10-15
EP2286447A2 (en) 2011-02-23

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