CN102034925B - Flat FCB (Flip Chip Bonding) GaN-based LED (Light-Emitting Diode) chip structure - Google Patents
Flat FCB (Flip Chip Bonding) GaN-based LED (Light-Emitting Diode) chip structure Download PDFInfo
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- CN102034925B CN102034925B CN2010105220762A CN201010522076A CN102034925B CN 102034925 B CN102034925 B CN 102034925B CN 2010105220762 A CN2010105220762 A CN 2010105220762A CN 201010522076 A CN201010522076 A CN 201010522076A CN 102034925 B CN102034925 B CN 102034925B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010105220762A CN102034925B (en) | 2010-10-28 | 2010-10-28 | Flat FCB (Flip Chip Bonding) GaN-based LED (Light-Emitting Diode) chip structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105220762A CN102034925B (en) | 2010-10-28 | 2010-10-28 | Flat FCB (Flip Chip Bonding) GaN-based LED (Light-Emitting Diode) chip structure |
Publications (2)
Publication Number | Publication Date |
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CN102034925A CN102034925A (en) | 2011-04-27 |
CN102034925B true CN102034925B (en) | 2013-04-03 |
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Application Number | Title | Priority Date | Filing Date |
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CN2010105220762A Active CN102034925B (en) | 2010-10-28 | 2010-10-28 | Flat FCB (Flip Chip Bonding) GaN-based LED (Light-Emitting Diode) chip structure |
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CN (1) | CN102034925B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102354721A (en) * | 2011-11-04 | 2012-02-15 | 祝进田 | Manufacturing method of LED (light-emitting diode) chip with inverted structure |
CN102927481B (en) * | 2011-11-25 | 2013-11-20 | 俞国宏 | High-power LED lamp |
CN103824923B (en) * | 2012-11-19 | 2016-11-09 | 深圳大道半导体有限公司 | A kind of semiconductor luminous chip, semiconductor lamp and manufacture method thereof |
CN103311261B (en) * | 2013-05-24 | 2016-02-17 | 安徽三安光电有限公司 | Integrated LED luminescent device and preparation method thereof |
CN103247743B (en) * | 2013-05-24 | 2016-04-20 | 安徽三安光电有限公司 | Surface stuck type luminescent device and preparation method thereof |
CN103531689B (en) * | 2013-05-24 | 2017-02-22 | 安徽三安光电有限公司 | Light emitting device |
TWI552386B (en) * | 2013-12-20 | 2016-10-01 | 新世紀光電股份有限公司 | Semiconductor light emitting structure and semiconductor package structure |
CN105276911B (en) * | 2014-05-29 | 2019-08-20 | 潍坊博瑞光电科技有限公司 | A kind of LED freezer lighting device and its manufacturing method |
CN105226177B (en) * | 2015-10-13 | 2018-03-02 | 厦门市三安光电科技有限公司 | The eutectic electrode structure and flip LED chips of flip LED chips |
CN106997918A (en) * | 2017-05-26 | 2017-08-01 | 厦门市东太耀光电子有限公司 | A kind of LED chip front pad structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1967883A (en) * | 2005-11-17 | 2007-05-23 | 上海蓝光科技有限公司 | High power LED flip-chip and its manufacturing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004006468A (en) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device |
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2010
- 2010-10-28 CN CN2010105220762A patent/CN102034925B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1967883A (en) * | 2005-11-17 | 2007-05-23 | 上海蓝光科技有限公司 | High power LED flip-chip and its manufacturing method |
Non-Patent Citations (1)
Title |
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JP特开2004-6468A 2004.01.08 |
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Publication number | Publication date |
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CN102034925A (en) | 2011-04-27 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151211 Address after: 261061 Weifang high tech Zone, Jin Road, No. 9, No. Patentee after: Shandong Inspur Huaguang Optoelectronics Co., Ltd. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20201120 Address after: 215500 No.13, Caotang Road, Changshu, Suzhou, Jiangsu Province Patentee after: Changshu intellectual property operation center Co.,Ltd. Address before: 261061 No. 9, Golden Road, hi tech Zone, Shandong, Weifang Patentee before: SHANDONG INSPUR HUAGUANG OPTOELECTRONICS Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP02 | Change in the address of a patent holder |
Address after: 215500 5th floor, building 4, 68 Lianfeng Road, Changfu street, Changshu City, Suzhou City, Jiangsu Province Patentee after: Changshu intellectual property operation center Co.,Ltd. Address before: No.13 caodang Road, Changshu City, Suzhou City, Jiangsu Province Patentee before: Changshu intellectual property operation center Co.,Ltd. |
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CP02 | Change in the address of a patent holder |