CN102017094B - 在使用多个光谱的化学机械抛光中的终点检测 - Google Patents

在使用多个光谱的化学机械抛光中的终点检测 Download PDF

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Publication number
CN102017094B
CN102017094B CN2009801165583A CN200980116558A CN102017094B CN 102017094 B CN102017094 B CN 102017094B CN 2009801165583 A CN2009801165583 A CN 2009801165583A CN 200980116558 A CN200980116558 A CN 200980116558A CN 102017094 B CN102017094 B CN 102017094B
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spectrum
substrate
spectra
polishing
current
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CN102017094A (zh
Inventor
J·钱
S·瀚达帕尼
H·Q·李
T·H·奥斯特赫尔德
Z·朱
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN2009801165583A 2008-05-02 2009-04-29 在使用多个光谱的化学机械抛光中的终点检测 Active CN102017094B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4996508P 2008-05-02 2008-05-02
US61/049,965 2008-05-02
PCT/US2009/042085 WO2009134865A2 (en) 2008-05-02 2009-04-29 Endpoint detection in chemical mechanical polishing using multiple spectra

Related Child Applications (1)

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CN201310496357.9A Division CN103537975A (zh) 2008-05-02 2009-04-29 在使用多个光谱的化学机械抛光中的终点检测

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CN102017094A CN102017094A (zh) 2011-04-13
CN102017094B true CN102017094B (zh) 2013-11-20

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CN201310496357.9A Pending CN103537975A (zh) 2008-05-02 2009-04-29 在使用多个光谱的化学机械抛光中的终点检测

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US (1) US20090275265A1 (enExample)
JP (1) JP5542802B2 (enExample)
KR (2) KR20160052769A (enExample)
CN (2) CN102017094B (enExample)
WO (1) WO2009134865A2 (enExample)

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US20100103422A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
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US9579767B2 (en) 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
WO2011139571A2 (en) * 2010-05-05 2011-11-10 Applied Materials, Inc. Dynamically or adaptively tracking spectrum features for endpoint detection
US8666665B2 (en) 2010-06-07 2014-03-04 Applied Materials, Inc. Automatic initiation of reference spectra library generation for optical monitoring
US8954186B2 (en) 2010-07-30 2015-02-10 Applied Materials, Inc. Selecting reference libraries for monitoring of multiple zones on a substrate
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
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US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
US8755928B2 (en) 2011-04-27 2014-06-17 Applied Materials, Inc. Automatic selection of reference spectra library
KR101981814B1 (ko) * 2011-04-28 2019-05-23 어플라이드 머티어리얼스, 인코포레이티드 연마를 위한 모델 기반 스펙트럼 라이브러리의 생성
US20140024293A1 (en) * 2012-07-19 2014-01-23 Jimin Zhang Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
US8808059B1 (en) 2013-02-27 2014-08-19 Applied Materials, Inc. Spectraphic monitoring based on pre-screening of theoretical library
CN103887206B (zh) * 2014-04-02 2017-05-31 中国电子科技集团公司第四十五研究所 化学机械平坦化终点检测方法及装置
US20160033958A1 (en) * 2014-08-01 2016-02-04 Globalfoundries Inc. Endpoint determination using individually measured target spectra
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
CN105057712B (zh) * 2015-08-24 2019-04-23 佛山新成洪鼎机械技术有限公司 轴自动定位深孔盲孔加工机床
TWI779986B (zh) * 2016-11-30 2022-10-01 美商應用材料股份有限公司 使用神經網路的光譜監測
WO2020005770A1 (en) 2018-06-28 2020-01-02 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring

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KR20160052769A (ko) 2016-05-12
KR101619374B1 (ko) 2016-05-10
CN103537975A (zh) 2014-01-29
WO2009134865A3 (en) 2010-02-18
KR20110021842A (ko) 2011-03-04
JP5542802B2 (ja) 2014-07-09
CN102017094A (zh) 2011-04-13
US20090275265A1 (en) 2009-11-05
JP2011520264A (ja) 2011-07-14
WO2009134865A2 (en) 2009-11-05

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