CN101998970B - 用于粉末涂料应用的环氧-咪唑催化剂 - Google Patents

用于粉末涂料应用的环氧-咪唑催化剂 Download PDF

Info

Publication number
CN101998970B
CN101998970B CN200980112915.9A CN200980112915A CN101998970B CN 101998970 B CN101998970 B CN 101998970B CN 200980112915 A CN200980112915 A CN 200980112915A CN 101998970 B CN101998970 B CN 101998970B
Authority
CN
China
Prior art keywords
epoxy
imidazole
epoxy resins
catalyst
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980112915.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN101998970A (zh
Inventor
约瑟夫·甘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Blue Cube IP LLC
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Publication of CN101998970A publication Critical patent/CN101998970A/zh
Application granted granted Critical
Publication of CN101998970B publication Critical patent/CN101998970B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200980112915.9A 2008-04-14 2009-04-07 用于粉末涂料应用的环氧-咪唑催化剂 Expired - Fee Related CN101998970B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4483008P 2008-04-14 2008-04-14
US61/044,830 2008-04-14
PCT/US2009/039771 WO2009129088A1 (en) 2008-04-14 2009-04-07 Epoxy-imidazole catalysts useful for powder coating applications

Publications (2)

Publication Number Publication Date
CN101998970A CN101998970A (zh) 2011-03-30
CN101998970B true CN101998970B (zh) 2013-12-18

Family

ID=40823427

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980112915.9A Expired - Fee Related CN101998970B (zh) 2008-04-14 2009-04-07 用于粉末涂料应用的环氧-咪唑催化剂

Country Status (8)

Country Link
US (1) US20110028602A1 (enExample)
EP (1) EP2268697B1 (enExample)
JP (2) JP2011516714A (enExample)
KR (2) KR101582881B1 (enExample)
CN (1) CN101998970B (enExample)
BR (1) BRPI0907275A2 (enExample)
TW (1) TWI481636B (enExample)
WO (1) WO2009129088A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5420212B2 (ja) 2007-10-31 2014-02-19 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ スチール用耐薄チップパウダートップコート
JP5209739B2 (ja) 2008-01-25 2013-06-12 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 亜鉛を実質的に含有しないプライマーを有するパウダーコーティング用組成物
JP5503349B2 (ja) 2009-04-03 2014-05-28 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 耐腐蝕および耐チップ性粉体コーティング
JP5757944B2 (ja) 2009-07-29 2015-08-05 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 実質的に亜鉛非含有のプライマーを有することが可能な粉末コーティング組成物
RU2479601C1 (ru) * 2012-03-02 2013-04-20 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Эпоксидная композиция холодного отверждения
CN103214796B (zh) * 2013-04-28 2014-04-09 纽宝力精化(广州)有限公司 环氧树脂组合物、其制备方法以及其所制备的覆铜板
CN103965435B (zh) * 2014-04-09 2016-07-06 天津翔盛粉末涂料有限公司 一种粉末涂料用咪唑改性环氧胺加合物及其制备方法和应用
JP6413444B2 (ja) * 2014-07-31 2018-10-31 味の素株式会社 樹脂シート、積層シート、積層板及び半導体装置
US9617373B2 (en) 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
KR101741652B1 (ko) * 2015-05-08 2017-06-01 주식회사 케이씨씨 분체 도료용 잠재성 경화제 및 이를 포함하는 에폭시 분체 도료 조성물
JP6637253B2 (ja) * 2015-05-12 2020-01-29 株式会社Adeka エポキシ樹脂組成物、及び、それを用いた繊維強化プラスチック
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
KR101958520B1 (ko) * 2016-10-10 2019-03-14 주식회사 케이씨씨 분체 도료 조성물
EP3560979B1 (en) * 2018-04-26 2021-06-23 SHPP Global Technologies B.V. Curing agent compositions for thermosetting epoxy resin compositions
US20190330411A1 (en) * 2018-04-26 2019-10-31 Sabic Global Technologies B.V. Curable epoxy compositions
EP3560978A1 (en) * 2018-04-26 2019-10-30 SABIC Global Technologies B.V. High heat thermoset epoxy compositions
EP3560977B1 (en) * 2018-04-26 2022-06-01 SHPP Global Technologies B.V. Curable epoxy compositions
US11820915B2 (en) 2018-12-14 2023-11-21 Swimc Llc Fusion bonded epoxy rebar powder coatings

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3756984A (en) * 1968-03-04 1973-09-04 Shell Oil Co Epoxy imidazole adducts as curing agents for epoxy resins
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US6509413B1 (en) * 1997-11-04 2003-01-21 Rohm And Haas Company One-component powder coating of epoxy resin, epoxy-polyamine adduct and acid matting agent

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2750395A (en) 1954-01-05 1956-06-12 Union Carbide & Carbon Corp Diepoxides
US2890194A (en) 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US3018262A (en) * 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US5066735A (en) 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
CN1040810A (zh) 1988-04-30 1990-03-28 三井东圧化学株式会社 多硫化合物基树脂透镜及其制备方法
JPH03115331A (ja) * 1989-09-28 1991-05-16 Nippon Oil Co Ltd プリプレグ用エポキシ樹脂組成物
JPH03275714A (ja) * 1990-03-23 1991-12-06 Nippon Steel Chem Co Ltd エポキシ樹脂用硬化剤組成物およびこれを含有するエポキシ樹脂組成物
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
KR930010077A (ko) 1991-11-22 1993-06-22 알베르투스 빌헬무스 요 아네스 째스트 라텐 에폭시 이미다졸 첨가물 및 에폭시 수지 조성물
DE4142575A1 (de) * 1991-12-21 1993-06-24 Basf Ag Poly(meth)acrylimide
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
TW448197B (en) * 1996-07-22 2001-08-01 Dow Chemical Co A process to make a curable composition, a curable composition, a process to cure the composition, and a catalyst and/or curing agent product for epoxy resins
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
DE59810370D1 (de) * 1997-02-07 2004-01-22 Vantico Ag Pulverlack
ATE198212T1 (de) 1997-10-02 2001-01-15 Hexcel Corp Epoxidharzhärter
JPH11140277A (ja) 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
CA2269378C (en) * 1998-04-17 2008-04-01 Ajinomoto Co., Inc. Curable resin composition
GB9827367D0 (en) 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
US6632893B2 (en) * 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
MXPA03002222A (es) * 2002-03-28 2004-10-29 Rohm & Haas Polvos de recubrimiento, metodos para su elaboracion y articulos formados a partir de los mismos.
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
AU2003297706A1 (en) * 2002-12-17 2004-07-29 Dow Global Technologies Inc. Amine-epoxy autocatalytic polymers and polyurethane products made therefrom
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
JP3837134B2 (ja) * 2004-01-26 2006-10-25 富士化成工業株式会社 一成分系加熱硬化性エポキシド組成物
US7923073B2 (en) 2004-11-10 2011-04-12 Dow Global Technologies Llc Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US3756984A (en) * 1968-03-04 1973-09-04 Shell Oil Co Epoxy imidazole adducts as curing agents for epoxy resins
US6509413B1 (en) * 1997-11-04 2003-01-21 Rohm And Haas Company One-component powder coating of epoxy resin, epoxy-polyamine adduct and acid matting agent

Also Published As

Publication number Publication date
WO2009129088A1 (en) 2009-10-22
JP5934176B2 (ja) 2016-06-15
JP2011516714A (ja) 2011-05-26
BRPI0907275A2 (pt) 2015-07-21
KR101582881B1 (ko) 2016-01-15
TWI481636B (zh) 2015-04-21
CN101998970A (zh) 2011-03-30
JP2014111773A (ja) 2014-06-19
EP2268697A1 (en) 2011-01-05
TW201000510A (en) 2010-01-01
EP2268697B1 (en) 2014-01-29
KR20110007172A (ko) 2011-01-21
US20110028602A1 (en) 2011-02-03
KR20160007668A (ko) 2016-01-20

Similar Documents

Publication Publication Date Title
CN101998970B (zh) 用于粉末涂料应用的环氧-咪唑催化剂
CN101910238B (zh) 用于复合材料应用的高Tg环氧体系
TWI452057B (zh) 使用二氰二醯胺作為用於熱固性環氧樹脂之固化劑的無二甲基甲醯胺調配物
EP2147034B1 (en) Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
CN101910230A (zh) 用于电层合体中的含有异氰脲酸酯的环氧树脂组合物
JP5840948B2 (ja) エポキシ系組成物の反応発熱を低下させるための吸熱相転移を受ける充填剤の使用
US8404310B2 (en) Thermoset dampener material
CN102471561A (zh) 用于电工用层压板组合物的核/壳橡胶
CN102272252B (zh) 环氧树脂的金属稳定剂和分散方法
CN102272190A (zh) 环氧树脂的金属稳定剂和增长方法
HK1151809A (en) Epoxy resin composition containing isocyanurates for use in electrical laminates
HK1151810B (en) Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
CN118834371A (zh) 一种高Tg值可降解的热固性复合材料及其制备的可降解井下封堵工具

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: American Michigan

Patentee after: Dow Global Technologies Llc

Address before: American Michigan

Patentee before: Dow Global Technologies Inc.

TR01 Transfer of patent right

Effective date of registration: 20151221

Address after: American Michigan

Patentee after: BLUE CUBE IP LLC

Address before: American Michigan

Patentee before: Dow Global Technologies Llc

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131218

Termination date: 20170407

CF01 Termination of patent right due to non-payment of annual fee