The photoresist apparatus for coating
Technical field
The present invention relates to a kind of photoresist apparatus for coating, belong to LCD manufacturing technology field.
Background technology
In the photoetching process of semiconductor devices and panel display board manufacturing, circuitous pattern need obtain by exposure and development after substrate surface is coated with photoresist.Prior art in the method for substrate surface coating photoresist can be: substrate is lain on the coating table top, on accurate basis, gap between assurance gap nozzle and the substrate, the uniform pressure that gap nozzle utilizes the average rate pump to produce, photoresist is coated on the substrate, by rotary unit photoresist is coated with evenly on substrate then.With the liquid crystal panel manufacturing process is example, in photoetching process, during the photoresist coating, at first glass substrate is lain on the smooth table top, gap nozzle is in support bracket fastened moving horizontally then, and gap nozzle utilizes the average rate pump that photoresist is coated on the substrate uniformly.In coating process, must guarantee to keep suitable gap between gap nozzle and the glass substrate, thereby guarantee the even coating of photoresist.In general, this gap is set to 0.1~0.3mm, can adjust to some extent for the glass substrate gap of different-thickness.
But; because the gap only is 0.1~0.3mm between gap nozzle and the glass; therefore existing photoresist apparatus for coating is in the process of coating; because of existing foreign matter, glass surface damages gap nozzle through regular meeting; and, cause production cost to significantly improve because the maintenance of gap nozzle and purchase cost are very expensive.
Summary of the invention
The objective of the invention is defective at prior art; a kind of photoresist apparatus for coating is provided, and nozzle is damaged easily in the prior art to solve, the technical matters that causes production cost to improve; realize that the protection nozzle is not damaged the technique effect that reduces production costs by the impurity on the substrate.
For achieving the above object, the invention provides a kind of photoresist apparatus for coating, comprise photoresist apparatus for coating body, the outer cup of stating the nozzle of photoresist apparatus for coating body is provided with and is used for protection module that the impurities on described nozzle and the substrate is opened.
Described nozzle comprises the first surface that is oppositely arranged along described nozzle direction of motion, and described protection module comprises two first protected locations, and described two first protected locations are fixed on the described first surface by stationary installation, and forms slit.
Described stationary installation is a screw, and described first protected location is provided with rectangular through-hole, and described screw passes described rectangular through-hole described first protected location is fixed on the described first surface adjustablely, to form the slit of scalable size.
Described nozzle also comprises the end face that the perpendicular direction of edge and described nozzle direction of motion is oppositely arranged; described protection module also comprises two second protected locations; described two second protected locations are provided with rectangular through-hole; the rectangular through-hole that screw passes on described second protected location is fixed on described second protected location on the described end face adjustablely; and involutory with described two first protected locations, the slit of formation scalable size.
Described protection module is structure as a whole, and described protection module is mirror symmetrical structure along the rectilinear direction of vertically passing nozzle, described protection module and described substrate over against the end be planar structure, and described end is provided with at least one round crack or slit.
Described nozzle comprises the first surface that is oppositely arranged along described nozzle direction of motion, and described protection module comprises first parts of the first surface outside that is located at described nozzle.
Described nozzle also comprises the second surface that is connected with described first surface, and described protection module also comprises second parts that are located at described second surface outside, and described second parts are connected with described first parts.
Described nozzle also comprises the 3rd surface that is connected with described second surface, and described protection module also comprises the 3rd parts that are located at outside, described the 3rd surface, and described the 3rd parts are connected with described second parts.
Described protection module is structure as a whole, and described protection module is arranged on the forward side of described nozzle upper edge moving direction, and the distance between described protection module and the described substrate is smaller or equal to the distance between described nozzle and the described substrate.
Described protection module is structure as a whole, and described protection module is arranged on the both sides of described nozzle upper edge moving direction, and the distance between described protection module and the described substrate is smaller or equal to the distance between described nozzle and the described substrate.
Described protection module adopts carbon steel material.
Photoresist apparatus for coating of the present invention is based on existing photoresist apparatus for coating body; the external stability protection module of the nozzle on photoresist apparatus for coating body; by this protection module the impurities on nozzle and the substrate is opened; thereby prevent that nozzle from passing through this protection module and being damaged by the impurity on the substrate in substrate surface motion coating photoresist, reduced production cost.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Fig. 1 is the structural representation of photoresist apparatus for coating first embodiment of the present invention;
Fig. 2 is the structural representation of first protected location among photoresist apparatus for coating first embodiment of the present invention;
Fig. 3 is the partial structurtes synoptic diagram of photoresist apparatus for coating first embodiment of the present invention;
Fig. 4 is the structural representation of second protected location among photoresist apparatus for coating second embodiment of the present invention;
Fig. 5 is the structural representation of photoresist apparatus for coating the 3rd embodiment of the present invention;
Fig. 6 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 3rd embodiment of the present invention;
Fig. 7 is the partial structurtes synoptic diagram of protection module end among photoresist apparatus for coating the 3rd embodiment of the present invention;
Fig. 8 is another partial structurtes synoptic diagram of protection module end among photoresist apparatus for coating the 3rd embodiment of the present invention;
Fig. 9 is a partial structurtes synoptic diagram again of protection module end among photoresist apparatus for coating the 3rd embodiment of the present invention;
Figure 10 is the structural representation of photoresist apparatus for coating the 4th embodiment of the present invention;
Figure 11 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 4th embodiment of the present invention;
Figure 12 is the structural representation of photoresist apparatus for coating the 5th embodiment of the present invention;
Figure 13 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 5th embodiment of the present invention;
Figure 14 is the structural representation of photoresist apparatus for coating the 6th embodiment of the present invention;
Figure 15 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 6th embodiment of the present invention;
Figure 16 is the structural representation of photoresist apparatus for coating the 7th embodiment of the present invention;
Figure 17 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 7th embodiment of the present invention.
Embodiment
Photoresist apparatus for coating of the present invention comprises photoresist apparatus for coating body, and the outer cup of the nozzle of described photoresist apparatus for coating body is provided with and is used for protection module that the impurities on described nozzle and the substrate is opened.
Photoresist apparatus for coating of the present invention is based on existing photoresist apparatus for coating body; the external stability protection module of the nozzle on photoresist apparatus for coating body; by this protection module the impurities on nozzle and the substrate is opened; thereby prevent that nozzle from passing through this protection module and being damaged by the impurity on the substrate in substrate surface motion coating photoresist, reduced production cost.
In actual production process, protection module can adopt multiple structure to realize that the specific embodiment with several protection modules is elaborated to photoresist apparatus for coating of the present invention below.
Fig. 1 is the structural representation of photoresist apparatus for coating first embodiment of the present invention; Fig. 2 is the structural representation of first protected location among photoresist apparatus for coating first embodiment of the present invention; Fig. 3 is the partial structurtes synoptic diagram of photoresist apparatus for coating first embodiment of the present invention; shown in Fig. 1~3; the photoresist apparatus for coating of present embodiment comprises photoresist apparatus for coating body; this photoresist apparatus for coating body can comprise: nozzle 1; nozzle holder 2; differential head 3; knob 4 and main shaft 5 or the like; it will be appreciated by those skilled in the art that; this photoresist apparatus for coating body can also comprise any parts that other is required; and; said nozzle 1; nozzle holder 2; differential head 3; the function of knob 4 and main shaft 5 is also similar with prior art, repeats no more.The device of present embodiment is covered with a protection module 6 in the outside of nozzle 1.The nozzle 1 of present embodiment comprises the first surface 11 that is oppositely arranged along nozzle 1 direction of motion, and protection module 6 can comprise that 61, two first protected locations 61 of two first protected locations are fixed on the first surface 11 by stationary installation, and forms slit.For first protected location 61 with this protection module 6 is fixed on the first surface 11 of nozzle 1; can be screw 612 in the present embodiment stationary installation; first protected location 61 is provided with rectangular through-hole 611; screw 612 passes rectangular through-hole 611 first protected location 61 is fixed on the first surface 11 adjustablely, to form the slit of scalable size.Present embodiment can pass this rectangular through-hole 611 by screw 612 or other similar stationary installation and this protection module 6 closely is fixed on the first surface 11 of nozzle 1; and; because this through hole is a rectangle; therefore; by adjusting the fixed position of screw 612 on rectangular through-hole 611; can adjust the position on the first surface 11 that protection module 6 is located at nozzle 1, thereby form the slit of scalable size, thereby can control the flow of photoresist.Present embodiment can protect nozzle 1 to avoid being damaged by the foreign matter of substrate surface when being coated with the photoresist material by protection module 6, has reduced production cost.
Explain in order to know more; see also Fig. 3; first protected location 61 passes rectangular through-hole 611 by screw 612 and is fixed on the nozzle; and there is certain distance in first protected location 61 with the upper surface of nozzle; thereby convenient this first protected location 61 fixed position on nozzle of adjusting; and then adjust the slit that two first protected locations 61 form, so that photoresist is discharged from this slit.
Present embodiment forms protection module by first protected location, avoids being damaged by the foreign matter of substrate surface in the process of coating photoresist with the protection nozzle.And; by being arranged on the rectangular through-hole on first protected location; protection module and nozzle secure fixation both can have been made; again can be by adjusting the fixed position of screw on rectangular through-hole; adjust the slit size that first protected location forms; thereby determine suitable gap size, make things convenient for the discharge of photoresist material.
Fig. 4 is the structural representation of second protected location among photoresist apparatus for coating second embodiment of the present invention; as shown in Figure 4; on the basis of photoresist apparatus for coating first embodiment of the present invention; the nozzle 1 of present embodiment can also comprise the end face that the perpendicular direction of edge and nozzle 1 direction of motion is oppositely arranged; protection module 6 can also comprise two second protected locations 62; this second protected location 62 is provided with rectangular through-hole 611; the rectangular through-hole 611 that screw 612 passes on second protected location 62 is fixed on second protected location 62 on the end face adjustablely; and involutory with two first protected locations 61, the slit of formation scalable size.
Specifically; also be provided with a plurality of rectangular through-hole 611 on this second protected location 62; screw 612 can pass rectangular through-hole 611; first protected location 61 and second protected location 62 are fixed on the nozzle 1; its concrete fixed form can be fixed on the left and right sides of nozzle 1 among Fig. 1 for two first protected locations 61; be on the first surface 11, two second protected locations 62 are fixed on the both sides, front and back of nozzle 1, promptly on the end face.And; because the fixed orifice of rectangular through-hole 611 is shaped as rectangle; therefore; two first protected locations 61 can carry out relative the adjustment by adjusting the fixed position of screw 612 on this rectangular through-hole 611 with two second protected location 62 positions each other; thereby win protected location 61 and second protected location 62 are being combined to form when protection module 6 protects nozzle 1; can also form the slit of size reasonable, thereby make the photoresist material from this slit, discharge.
Present embodiment forms protection module by first protected location and second protected location, avoids being damaged by the foreign matter of substrate surface in the process of coating photoresist with the protection nozzle.And; by being arranged on the rectangular through-hole on first protected location and second protected location; protection module and nozzle secure fixation both can have been made; again can be by adjusting the fixed position of screw on rectangular through-hole; adjust the slit size that the involutory back of first protected location and second protected location forms; thereby determine suitable slit sizes, make things convenient for the discharge of photoresist material.
Fig. 5 is the structural representation of photoresist apparatus for coating the 3rd embodiment of the present invention; Fig. 6 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 3rd embodiment of the present invention; as illustrated in Figures 5 and 6; in the photoresist apparatus for coating of present embodiment; this protection module 6 is structure as a whole; and protection module 6 is mirror symmetrical structure along the rectilinear direction of vertically passing nozzle 1, protection module 6 and substrate over against end 63 be planar structure, and can be provided with at least one round crack or slit on this end 63.In the present embodiment, nozzle 1 comprises the first surface 11 that is oppositely arranged along nozzle 1 direction of motion, and this protection module 6 comprises first parts 64 of first surface 11 outsides that are located at nozzle 1.Fig. 7 as shown in Figure 7, in the present embodiment, can be provided with a round crack on this end 63 for the partial structurtes synoptic diagram of protection module end among photoresist apparatus for coating the 3rd embodiment of the present invention.Fig. 8 is another partial structurtes synoptic diagram of protection module end among photoresist apparatus for coating the 3rd embodiment of the present invention, and as shown in Figure 8, this end 63 is provided with two round cracks.Fig. 9 is a partial structurtes synoptic diagram again of protection module end among photoresist apparatus for coating the 3rd embodiment of the present invention, and as shown in Figure 9, this end 63 is provided with three row slits.Shown in Fig. 7~9, the photoresist material of discharging from nozzle can be discharged and be coated on the substrate by this hole on the end 63 of protection module or slit.
Present embodiment is avoided being damaged by the foreign matter of substrate surface with the protection nozzle in the process of coating photoresist by be covered with the protection module of integrative-structure in the nozzle outside.And, because this protection module is structure as a whole, make the operation that this protection module is fixed on the nozzle become more simple to operation.
Figure 10 is the structural representation of photoresist apparatus for coating the 4th embodiment of the present invention; Figure 11 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 4th embodiment of the present invention; shown in Figure 10 and 11; the photoresist apparatus for coating of present embodiment is based on photoresist apparatus for coating the 3rd embodiment of the present invention; nozzle 1 also comprises the second surface 12 that is connected with first surface 11; protection module 6 also comprises second parts 65 that are located at second surface 12 outsides, and second parts 65 are connected with first parts 64.Protection module 6 shown in Figure 10 and 11 can increase the protection zone to nozzle 1, makes more reliable to the protection of nozzle 1.And, owing to increased contact area between protection module 6 and the nozzle 1, also make between protection module 6 and the nozzle 1 fix more firm.
Figure 12 is the structural representation of photoresist apparatus for coating the 5th embodiment of the present invention; Figure 13 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 5th embodiment of the present invention; shown in Figure 12 and 13; the photoresist apparatus for coating of present embodiment is based on photoresist apparatus for coating the 4th embodiment of the present invention; nozzle 1 also comprises the 3rd surface 13 that is connected with second surface 12; protection module 6 also comprises the 3rd parts 66 that are located at the 3rd surperficial 13 outsides, and the 3rd parts 66 are connected with second parts 65.Compare Figure 10 and protection module 6 shown in Figure 11 with the protection module 6 shown in 13 as Figure 12, can further increase protection zone, make more reliable the protection of nozzle 1 to nozzle 1.And, owing to further increased contact area between protection module 6 and the nozzle 1, also make between protection module 6 and the nozzle 1 fix more firm.
Figure 14 is the structural representation of photoresist apparatus for coating the 6th embodiment of the present invention; Figure 15 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 6th embodiment of the present invention; shown in Figure 14 and 15; nozzle 1 in the present embodiment comprises the first surface 11 that is oppositely arranged along nozzle 1 direction of motion; protection module 6 is structure as a whole; protection module 6 is arranged in the first surface 11 along on the surface of the forward side of moving direction, and the distance between protection module 6 and the substrate is smaller or equal to the distance between nozzle 1 and the substrate.Preferably, the protection module 6 of present embodiment and the distance between the substrate equal the distance between nozzle 1 and the substrate, thereby make protection module 6 both can protect nozzle 1, can not hinder nozzle 1 discharging photoresist.In the present embodiment, this protection module 6 when direction of motion moves, can be touched the foreign matter of substrate surface at nozzle 1 earlier, and this foreign matter is moved away, thereby avoids foreign matter defective nozzle 1, has reduced production cost.This protection module 6 can adopt any fixed form of the prior art to be fixed on the nozzle 1.
The photoresist apparatus for coating of present embodiment, simple in structure, be easy to realize, and can move in the process of coating photoresist at nozzle, touch the foreign matter of substrate surface in advance, and this foreign matter is moved away, thereby avoid the foreign matter defective nozzle, reduced production cost.
Figure 16 is the structural representation of photoresist apparatus for coating the 7th embodiment of the present invention; Figure 17 is the partial structurtes synoptic diagram of photoresist apparatus for coating the 7th embodiment of the present invention; shown in Figure 16 and 17; nozzle 1 in the present embodiment comprises the first surface 11 that is oppositely arranged along nozzle 1 direction of motion; protection module 6 also is structure as a whole; protection module 6 is arranged on the first surface 11, and the distance between protection module 6 and the substrate is smaller or equal to the distance between nozzle 1 and the substrate.Preferably, the protection module 6 of present embodiment and the distance between the substrate equal the distance between nozzle 1 and the substrate, thereby make protection module 6 both can protect nozzle 1, can not hinder nozzle 1 discharging photoresist.Present embodiment is with respect to photoresist apparatus for coating the 6th embodiment of the present invention; this protection module 6 when direction of motion moves back and forth, all can be touched the foreign matter of substrate surface at nozzle earlier, and this foreign matter is moved away; thereby avoid the foreign matter defective nozzle, reduced production cost.This protection module 6 can adopt any fixed form of the prior art to be fixed on the nozzle 1.The photoresist apparatus for coating of present embodiment is with respect to photoresist apparatus for coating the 6th embodiment of the present invention, and the protection domain of its protection module 6 is bigger, and security is better.
The photoresist apparatus for coating of present embodiment, simple in structure, be easy to realize, and can move back and forth in the process of coating photoresist at nozzle, touch the foreign matter of substrate surface in advance, and this foreign matter is moved away, thereby avoid the foreign matter defective nozzle, reduced production cost.
In photoresist apparatus for coating the foregoing description of the present invention, the distance between protection module and the substrate can be 0.1 millimeter~0.3 millimeter, can not contact between protection module and the substrate guaranteeing.And protection module can adopt carbon steel material, to guarantee the hardness of protection module, so that can not be damaged when the foreign matter of touching substrate surface.
Photoresist apparatus for coating the foregoing description of the present invention; based on existing photoresist apparatus for coating body; the external stability protection module of the nozzle on photoresist apparatus for coating body; by this protection module the impurities on nozzle and the substrate is opened; thereby prevent that nozzle from passing through this protection module and being damaged by the impurity on the substrate in substrate surface motion coating photoresist, reduced production cost.
It should be noted that at last: above embodiment is only in order to technical scheme of the present invention to be described but not limit it, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that: it still can make amendment or be equal to replacement technical scheme of the present invention, and these modifications or be equal to replacement and also can not make amended technical scheme break away from the spirit and scope of technical solution of the present invention.