KR20130058835A - Apparatus and method for treating substrate - Google Patents

Abstract

PURPOSE: An apparatus for processing and treating a substrate and a method thereof are provided to perform coating and patterning on a substrate using an electrohydrodynamic method instead of a rubbing method, thereby coating the substrate with a patterned thin film without damaging the substrate. CONSTITUTION: A discharging unit is disposed on the state(110) and discharges a coating solution. A pattern inducing unit(130) includes needle bars(132) that are formed on a surface facing the stage and induces a pattern in the discharged coating solution. A conveyance unit horizontally moves the stage or horizontally moves the discharging unit and the pattern inducing unit. A power source(40) supplies high voltage to the pattern inducing unit. [Reference numerals] (140) Power supply

Description

Substrate processing apparatus and substrate processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for performing patterning.

Liquid crystal display (LCD) is the most widely used flat panel display (FPD), and is composed of a liquid crystal layer in which a liquid crystal layer is described between two substrates on which electrodes are formed. It is applied to rearrange the liquid crystal materials to adjust the amount of light transmitted to display an image. In general, it is difficult to align the liquid crystal material simply by describing it between the substrates, so that an alignment film for aligning the liquid crystal molecules is essentially processed on the inner wall of the substrate.

In general, such an alignment layer is formed of a thin film on the substrate by inorganic or polyimide (PI) -based organic material having an alignment mechanism such as silicon oxide (SiOx) on the substrate, and cured the liquid crystal molecules by rubbing method It is manufactured by forming a pattern so that the major axis of is aligned.

However, such an alignment film manufacturing method causes dust to occur during the rubbing process, and causes display defects, as well as static electricity, which can destroy a thin film transistor (TFT) circuit, thereby causing a decrease in yield. Accordingly, recently, research on an alignment film manufacturing process that can replace the conventional rubbing process has been actively conducted.

One object of the present invention is to provide a substrate treating apparatus and a substrate treating method for applying a coating liquid to a thin film and forming a pattern in the coating liquid without damaging the substrate.

Another object of the present invention is to provide a substrate treating apparatus and a substrate treating method for simultaneously coating and patterning a substrate.

Still another object of the present invention is to provide a substrate treating apparatus and a substrate treating method for uniformly applying and patterning a substrate electrodynamically.

Tasks to be solved by the present invention are not limited to the above-described problems, and problems that are not mentioned may be clearly understood by those skilled in the art from the present specification and the accompanying drawings. There will be.

The present invention provides a substrate processing apparatus.

Substrate processing apparatus according to an aspect of the present invention, the substrate is mounted on the stage; A discharging unit disposed above the stage and discharging a coating liquid; A pattern induction unit formed on a body installed on the top of the stage and on a surface of the body opposite to the stage, and including a needle rod for inducing a pattern to the discharged coating liquid; A transfer device for moving the stage in a horizontal direction or for moving the discharge unit and the pattern guide unit in a horizontal direction; And a power source for applying a high voltage to the pattern induction unit.

A plurality of needle rods may be spoken to the body in a direction perpendicular to the moving direction.

The discharge unit may include a plurality of nozzles for discharging the coating liquid, and the plurality of nozzles and the plurality of needle rods may be arranged side by side along the moving direction.

The substrate processing apparatus may further include a lifting device for moving the body or the needle bar in a vertical direction.

The needles to which the high voltage is applied may be raised by applying an electric field to the coating liquid located below the needles.

The needles to which the high voltage is applied may form a downward airflow under the needle bar to lower the coating liquid located at the bottom of the needle bar.

The coating solution may be polyimide (PI).

The present invention provides a substrate processing method.

According to an aspect of the present invention, there is provided a substrate processing method comprising: discharging a coating unit disposed on an upper stage of a stage on which a substrate is seated to discharge the coating liquid; Applying a high voltage to the pattern induction unit; And moving the pattern guide unit disposed above the stage relative to the substrate, and the needle bar of the pattern guide unit applied with the high voltage lifts the coating liquid.

In the step of elevating, when the high voltage is the first voltage, the coating liquid may be raised, and when the high voltage is the second voltage higher than the first voltage, the coating liquid may be lowered.

In the step of elevating, the needles to which the high voltage is applied may generate electrohydraulic energy to the coating liquid located below the needle bar, thereby increasing the coating liquid located below the needle bar.

The substrate treating method may further include adjusting a distance between the substrate and the needle bar, and the coating liquid may rise higher as the separation distance decreases.

In the step of elevating, the needles to which the high voltage is applied ionize the gas around them, and the ionized gas is lowered by the electric field formed by the high voltage applied to the pattern induction unit, and thus the coating liquid is located below the needles. Can be lowered.

The substrate treating method may further include solidifying the coating solution.

In the solidifying step, the pattern induction unit to which a high voltage is applied may charge the coating solution to induce evaporation of the solvent of the coating solution.

The needle bar is spaced apart by a predetermined interval in the direction perpendicular to the moving direction on the lower surface of the body of the pattern induction unit is a plurality of speech, the coating liquid, the pattern can be formed by repeating the lifting in accordance with the predetermined interval have.

According to the present invention, it is possible to coat a thin film having a pattern on the substrate without damaging the substrate by applying and patterning the substrate using an electro-hydraulic method instead of a rubbing method.

According to the present invention, coating, patterning, and solidification can be performed in a single process to improve the throughput of the substrate.

According to the present invention, since the coating liquid is elevated and lifted to form a pattern, the fine pattern can be precisely and uniformly formed.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a configuration diagram of an embodiment of a substrate processing apparatus.
2 is a cross-sectional view of the substrate processing apparatus of FIG. 1.
3 is a cross-sectional view of the pattern guide unit of FIG. 2.
4 is a view showing that the coating liquid is electro-hydrodynamically increased by the pattern guide unit of FIG. 3.
5 is a view showing that the coating liquid rises along the length of the needle bar in FIG.
6 is a view showing that the coating liquid is lowered by the downdraft of the gas ionized by the pattern guide unit of FIG. 3.
7 is a flowchart of an embodiment of a substrate processing method.

The terms and accompanying drawings used herein are for the purpose of illustrating the present invention easily, and the present invention is not limited by the terms and drawings.

The detailed description of known techniques which are not closely related to the idea of the present invention among the techniques used in the present invention will be omitted.

Hereinafter, the substrate processing apparatus 100 according to the present invention will be described.

The substrate processing apparatus 100 forms a film having a pattern on the substrate S. FIG. The substrate treating apparatus 100 may coat a film by applying the coating liquid C on the substrate S, and may form a pattern on the coated coating liquid C. A typical example of such a process may be a polyimide coating process of coating an polyimide on a transparent substrate S used in the manufacture of a flat panel display, and forming an alignment layer by forming an alignment pattern on the coated polyimide. Hereinafter, the substrate treating apparatus 100 and the substrate treating method will be described based on the manufacturing process of the alignment layer.

However, this is only for convenience of understanding and explanation of the present invention, and thus the present invention is not limited to the alignment film manufacturing process. Therefore, the substrate processing apparatus 100 and the substrate processing method according to the present invention can be used in various processes used for manufacturing a semiconductor device or forming a thin film having a pattern as well as a flat panel display.

Hereinafter, an embodiment of the substrate processing apparatus 100 according to the present invention will be described.

1 is a configuration diagram of an embodiment of a substrate processing apparatus 100.

Referring to FIG. 1, the substrate processing apparatus 100 may include a stage 110, a discharge unit 120, a pattern guide unit 130, a power source, a transfer device 140, a lifting device 150, and a controller 160. It may include.

The stage 110 supports the substrate S. The substrate S may be transported from the outside and seated on the stage 110. Here, the substrate S may be a transparent substrate S, including a glass substrate (S). If the present invention uses a semiconductor device manufacturing process, a wafer including a silicon wafer may be used as the substrate (S). The upper surface of the stage 110 may be provided in the same or similar shape as the substrate S, and an area of the upper surface of the stage 110 may be larger than that of the substrate S. FIG.

The discharge unit 120 sprays the coating liquid (C). The discharge unit 120 may be disposed above the stage 110 to spray the coating liquid C onto the substrate S mounted on the stage 110. Here, as the coating liquid (C), an inorganic material such as a polyimide-based organic material for forming an organic alignment film or a silicon oxide for forming an inorganic alignment film may be used. However, the kind of coating liquid (C) is not limited to the above-mentioned example. For example, another fluid having an alignment mechanism may be used as the coating liquid C. If the present invention is used for manufacturing a semiconductor device, a conductive ink may be used.

2 is a cross-sectional view of the substrate processing apparatus 100 of FIG. 1.

Referring to FIG. 2, the discharge unit 120 may include a body 131, an inflow port 123, and a nozzle 122.

The body 121 is disposed above the stage 110. The body 121 may be provided with the same or similar to the width of the stage 110 opposite the width perpendicular to the moving direction by the transfer device 140 to be described later.

The inflow port 123 introduces the coating liquid C into the discharge unit 120. The inlet port 123 may be connected to a supply line for supplying the coating liquid C to the discharge unit 120 from an external coating liquid C supply source to receive the coating liquid C. On the supply line may be connected to a pump for adjusting the inflow flow rate of the coating liquid (C) to be supplied. The inflow port 123 may be installed on the top or side of the body 121. Body 121 may be provided in the form of a tank (tank) having a space therein to temporarily store the coating liquid (C) flowing through the inlet port (123).

The nozzle 122 discharges the coating liquid C. The nozzle 122 may be disposed under the body 121 to discharge the coating liquid C to the substrate S seated on the stage 110. The body 121 may be provided with a plurality of nozzles 122. The plurality of nozzles 122 may be spaced apart at regular intervals in the width direction of the body 121. With this structure, when the body 121 travels on the substrate S by the transfer unit, the coating liquid C may be applied to the entire area of the substrate S. FIG.

Various shapes may be used as the nozzle 122. For example, the nozzle 122 may be a continuous jetting (CJ) nozzle or a drop on demand (DOD) inkjet such as a Piezo inkjet or a thermal inkjet. Nozzles or nozzles of the electrohydrodynamic type can be used. Of course, the type of the nozzle 122 is not limited to the above-described example, and various types of nozzles may be used.

The electro-hydraulic nozzle 122 may be provided in the form of a hollow needle having a fine tube structure having a fine inner diameter. The hollow needle-type nozzle 122 may electrospray the coating liquid C when the coating liquid C is charged by a high voltage of a power source to be described later.

When the coating liquid C charged by the high voltage is injected through the nozzle 122 having the microscopic structure, the coating liquid C is divided or thinned into particles having a size of nano units to micrometers in the air by the repulsive force between charges. It can be sprayed in the form of ultra-fine particles. Accordingly, the nozzle 122 may perform electrospray. The coating liquid C may be charged in various ways. For example, a high voltage may be applied to the body 131 of the discharge unit 120 to charge the coating liquid C therein. At this time, the discharge unit 120 may be provided with a metal material having good electrical conductivity. As another example, the coating liquid C may be charged in advance on the supply line to supply the charged coating liquid C to the discharge unit 120. For another example, instead of the coating liquid C being directly applied to the electric field, if the power source forms an electric field on top of the substrate S, the coating liquid C may be charged by the electric field.

The pattern guide unit 130 induces a pattern in the coating liquid C applied to the substrate S.

3 is a cross-sectional view of the pattern guide unit 130 of FIG.

Referring to FIG. 3, the pattern guide unit 130 includes a body 131 and a needle bar 132.

The body 131 is formed on the top of the stage 110. The body 131 may be provided the same as or similar to the width of the stage 110 opposite the width perpendicular to the moving direction by the transfer device 140 to be described later.

 The needle bar 132 is formed on a surface of the lower surface of the body 131 opposite to the substrate S. The needle bar 132 may be installed in plurality in the body 131. The plurality of needle bars 132 may be spaced apart at regular intervals in the width direction of the body 131. Here, the plurality of needle rods 132 may be disposed to correspond to the plurality of nozzles 122. For example, the plurality of nozzles 122 and the plurality of needles 132 may be arranged side by side along the moving direction. Accordingly, the movement paths of the plurality of nozzles 122 and the plurality of needle rods 132 may overlap each other. Alternatively, the plurality of needles 132 may be alternately arranged with the plurality of nozzles 122. For example, the plurality of nozzles 122 may be disposed between spaces in which the plurality of needle bars 132 are spaced along the moving direction. Accordingly, the movement paths of the plurality of nozzles 122 may be between the movement paths of the needle bar 132, and conversely, the movement paths of the plurality of needles 132 may be between the movement paths of the plurality of nozzles 122. . More specifically, the plurality of needle rods 132 and the plurality of nozzles 122 may be disposed such that the movement paths of the plurality of nozzles 122 are located at the center of the movement paths of the plurality of needle rods 132.

The needle bar 132 may be provided in the form of a thin needle. The needle bar 132 may be provided to be fixed to the body 131 so that its tip is spaced apart from the substrate S by a predetermined interval, or may be provided in a structure in which the tip is moved up and down to move vertically.

The body 131 and the needle bar 132 of the pattern guide unit 130 may be provided of a conductive material. For example, the body 131 and the needle bar 132 may be provided with a metal material. Meanwhile, the body 131 and the needle bar 132 may be integrally provided or provided in such a manner that the needle bar 132 is inserted into the body 131. In addition, the body 131 and the needle bar 132 may be made of a single material or different materials.

The power supply generates a high voltage. The power source may be connected to the pattern induction unit 130 to apply a high voltage to the pattern induction unit 130. Specifically, the power source may apply a high voltage to the body 131 of the pattern induction unit 130, and a high voltage may be applied to the needle bar 132 through the body 131. In addition, the power source may be connected to the pattern induction unit 130 and the stage 110 to apply a high voltage to form an electric field between the pattern induction unit 130 and the stage 110. When power is connected to the stage 110, the stage 110 may be provided of a material having good electrical conductivity. For example, the stage 110 may be provided in a metal material.

When a high voltage is applied to the pattern induction unit 130 by a power source, the needle bar 132 to which the high voltage is applied may form a pattern in the coating liquid C applied to the substrate S. Each of the needle rods 132 may raise or lower the coating liquid C positioned at the lower portion of the needle rod 132 when a high voltage is applied. Accordingly, a pattern is applied to the coating liquid C by the plurality of needle rods 132. Can be formed.

4 is a view illustrating that the coating liquid C is electrohydrodynamically increased by the pattern guide unit 130 of FIG. 3.

The needle bar 132 may induce a pattern electrohydrodynamically. When a high voltage is applied to the needle bar 132, and an electric field is formed between the pattern induction unit 130 and the stage 110, the coating liquid C is charged. An electrohydraulic airflow is formed in the charged coating liquid (C) to rise in the direction of the needle bar 132 along the electric field. Accordingly, the coating liquid (C) located in the lower portion of the needle bar 132 is raised, the coating liquid (C) located in the lower portion of the space between the needle bar 132 is lowered to induce a pattern in the coating liquid (C). .

Here, the degree to which the coating liquid C rises may be proportional to the magnitude of the high voltage applied to the needle bar 132, and the separation distance between the needle bar 132 and the substrate S or the coating solution C.

For example, when a larger voltage is applied to the needle bar 132, the strength of the electric field formed between the pattern induction unit 130 and the stage 110 becomes stronger, and thus, the greater the electrohydraulic force in the coating liquid C. Force can act to raise the coating liquid (C) higher.

In another example, the longer the length of the needle bar 132, the shorter the separation distance between the needle bar 132 and the substrate (S) to form a stronger electric field at the same voltage. Accordingly, a stronger electrohydraulic force acts on the coating liquid C positioned below the needle bar 132 to raise the coating liquid C higher.

5 is a view showing that the coating liquid (C) rises along the length of the needle bar 132 in FIG.

Referring to FIG. 5, when the long needle bar 132b and the short needle bar 132a are compared, it can be seen that the coating liquid C located under the long needle bar 132b increases more. .

Here, the elevating member may adjust the separation distance between the needle bar 132 and the substrate (S). The elevating member may be installed on the body 131 to adjust the separation distance between the needle bar 132 and the substrate S by elevating the needle bar 132 integrally with the body 131. Alternatively, the elevating member may adjust the separation distance between the needle bar 132 and the substrate S by elevating the needle bar 132 in the vertical direction. Alternatively, the elevating member may adjust the distance between the substrate S and the needle bar 132 by elevating the substrate 110 or the stage 110 on which the substrate S is seated.

On the other hand, unlike the above, when a high voltage is applied to the needle bar 132, the needle bar 132 may lower the coating liquid (C).

FIG. 6 is a view showing that the coating liquid C is lowered by the descending airflow of the gas ionized by the pattern guide unit 130 of FIG. 3.

Referring to FIG. 6, when a high voltage is applied to the needle bar 132, gas present around the needle bar 132 may be ionized by the high voltage. Since an electric field is formed between the pattern guide unit 130 and the stage 110, the ionized gas may form a downdraft in the direction of the substrate S along the electric field. This downdraft may apply a pressure to the coating liquid (C) located in the lower portion of the needle bar 132 to lower the coating liquid (C). Accordingly, the coating liquid (C) located in the lower portion of the needle bar 132 is lowered, the coating liquid (C) located in the lower portion of the space between the needle bar 132 is raised, the pattern may be induced in the coating liquid (C).

In this case, the stronger the voltage is applied to the needle bar 132, the more gas around the needle bar 132 is ionized, and thus, a strong downward airflow is formed so that the coating liquid C located under the needle bar 132 is formed. You will be able to descend more.

As such, when a high voltage is applied from the power source, the needle bar 132 may elevate the coating liquid C to induce a pattern in the coating liquid C. Here, a higher voltage is required when ionizing the gas and lowering the coating liquid C into the air stream than when the needle bar 132 is lifted electrohydrodynamically. Therefore, by adjusting the magnitude of the voltage applied to the needle bar 132 from the power source, it is possible to adjust the irregularities and the step of the pattern formed by the needle bar 132.

In addition, unlike the conventional rubbing method, the method of forming a pattern by using an electrohydraulic pattern or ionized gas stream does not induce mechanical static electricity and does not cause static electricity, and thus does not damage the substrate S. Can be. In addition, the needle bar 132 may be provided in the form of a fine needle, it may be possible to form a more precise pattern in the coating liquid (C).

On the other hand, the pattern guide unit 130 may solidify the coating liquid (C) applied to the substrate (S). The pattern induction unit 130 induced by a high voltage by the power source may charge the coating liquid C applied to the substrate S. The evaporation of the solvent can be performed quickly compared to the uncharged state of the charged coating solution (C). As a result, the coating solution C positioned under the pattern induction unit 130 to which the high voltage is applied may rapidly evaporate the solvent, thereby solidifying the coating solution C.

Therefore, the pattern induction unit 130 may simplify the process and improve productivity by simultaneously performing a process of forming a pattern in the coating liquid C thereunder and a process of curing the pattern by solidifying the pattern. In addition, according to this method, since the coating liquid (C) is uniformly cured, a result of uniformly forming a pattern may be obtained.

The transfer device 140 moves the discharge unit 120 and the pattern guide unit 130 in the horizontal direction with respect to the substrate (S). The transfer device 140 may move the stage 110 on which the substrate S is mounted in the horizontal direction or transfer the substrate S itself in the horizontal direction.

Alternatively, the transfer device 140 may move the discharge unit 120 and the pattern guide unit 130 in the horizontal direction. The transfer device 140 may include a rail and a transfer member. The rail is installed in the horizontal direction, and the conveying member moves along the rail by a driving force of an external motor or a motor installed therein.

The discharge unit 120 and the pattern guide unit 130 is coupled to the transfer member. At this time, the discharge unit 120 and the pattern guide unit 130 may be coupled to the transfer member in sequence according to the moving direction. Accordingly, as the transfer member moves, the discharge unit 120 precedes the coating liquid C on the substrate S, and the pattern induction unit 130 moves on the substrate S on which the coating liquid C is applied. The pattern can be induced in the coating liquid (C) while following.

The controller 160 may control the components of the substrate processing apparatus 100. For example, the lifting device 150 may be controlled to control the spacing between the substrate S and the tip of the needle bar 132.

Such controller 160 may be implemented in a computer or similar device using hardware, software, or a combination thereof.

In hardware, the controller 160 includes application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), and processors (processors). It can be implemented as micro-controllers, microprocessors, or electrical devices that perform similar control functions.

In addition, in software, the controller 160 may be implemented by software code or software application written in one or more programming languages. The software is executed by a hardware-implemented control unit. The software may be installed by being transmitted from an external device such as a server in the hardware configuration described above.

Hereinafter, the substrate processing method according to the present invention will be described using the substrate processing apparatus 100 described above. However, since this is only for ease of description, the substrate processing method may be performed using the same or similar other device in addition to the substrate processing apparatus 100 described above. In addition, the substrate processing method according to the present invention may be stored in a computer-readable recording medium in the form of a code or a program for performing the same.

Hereinafter, one embodiment of the substrate processing method will be described.

7 is a flowchart of an embodiment of a substrate processing method.

In one embodiment of the substrate processing method, the step of mounting the substrate (S) on the stage 110 (S110), the step of discharging the coating liquid (S120), the step of applying a high voltage to the pattern guide unit 130 (S130), the step of inducing a pattern in the coating liquid (C) to which the needle bar 132 is applied (S140) and the pattern guide unit 130 includes the step of solidifying the coating liquid (S) (S150). On the other hand, the above-described steps are not necessarily executed in the order described, the steps described later may be performed before the steps described first. Each step will be described below.

The substrate S is transferred from the outside and seated on the stage 110 (S110). The substrate S may be transferred by a robot, a roller, and various other substrate transfer means.

When the substrate S is seated on the stage 110, the discharge unit 120 discharges the coating liquid C onto the substrate S (S120). The discharge unit 120 may move in the horizontal direction according to the transfer device 140 and discharge the coating liquid C on the substrate S. FIG. A plurality of nozzles 122 are arranged in the body 121 of the discharge unit 120 in a direction perpendicular to the transfer direction to apply the coating liquid C to the entire area of the substrate S. Here, the coating liquid (C) may be discharged by the above-described electrospray method.

The discharge unit 120 and the pattern guide unit 130 are spaced apart at regular intervals according to the moving direction, so that the discharge unit 120 has the discharge unit 120 on the substrate S to which the coating liquid C is applied. The pattern guide unit 130 may be followed along.

The power source applies a high voltage to the pattern induction unit 130 traveling along the discharge unit 120 (S130). In detail, the power source may apply power to the body 131. In addition, the power source may be connected to the stage 110 and the pattern guide unit 130 to apply a high voltage therebetween. When a high voltage is applied, an electric field may be formed between the stage 110 and the pattern guide unit 130.

When a high voltage is applied to the pattern induction unit 130, the pattern is induced to the coating liquid (C) to which the needle bar 132 is applied (S140). The needle bar 132 may form a pattern in the coating liquid C by raising or lowering the coating liquid C disposed below the coating liquid C with respect to the coating liquid C positioned between the plurality of needle bars 132. Since the pattern guide unit 130 is moved by the transfer device 140, the coating liquid C may have a pattern having irregularities corresponding to the arrangement of the needle bar 132 in a direction perpendicular to the transfer direction.

Here, the step difference of the pattern may be adjusted by adjusting the size of the power applied from the power source. For example, as described above, when the first voltage is applied to the needle bar 132, an electro-hydraulic airflow is generated in the coating liquid C by the electric field formed by the needle bar 132, and thus the needle bar 132 The coating liquid (C) located at the bottom of the rises may form a pattern. As such, in the case of generating the air flow electrodynamically, the lifting device 150 may control the step difference of the pattern by adjusting the separation distance between the tip of the needle bar 132 and the substrate S.

Here, the nozzle 122 and the needle bar 132 may be arranged to overlap the movement path. Even if the nozzle 122 uniformly applies the coating liquid C to the entire area of the substrate S, a large amount of the coating liquid C may be applied to the area of the substrate S relatively directly below the nozzle 122. When the nozzle 122 and the needle bar 132 are arranged so that the movement paths overlap, the needle bar 132 relatively elevates the area passing through the thickly coated area of the coating liquid C, thereby making the pattern more efficient. have.

On the contrary, when a second voltage higher than the first voltage is applied to the needle bar 132, gas existing around the needle bar 132 is ionized, and an electric field is formed between the stage 110 and the pattern guide unit 130. The downdraft formed in the ionized gas may apply a pressure to the coating liquid C positioned below the needle bar 132 to lower the coating liquid C to form a pattern.

Here, the nozzle 122 and the needle bar 132 may be disposed so that the movement path does not cross each other. For example, the needle bar 132 may be disposed such that its movement path is between the movement paths of the nozzle 122. As described above, the coating liquid C is thickly applied directly below the nozzle 122, and the coating liquid C is relatively thinly applied directly below the space between the nozzle 122 and the nozzle 122. As the needle bar 132 moves between the movement paths of the nozzle 122, the coating liquid C which is relatively thinly applied may be lowered to effectively form a larger step in the pattern.

Of course, the nozzle 122 and the needle bar 132 may be disposed as opposed to the above-described example in order to reduce the step in the pattern or to prevent the low portion of the pattern of the coating liquid C from being applied too thin.

The pattern guide unit 130 may solidify the coating solution (C) together with forming a pattern in the coating solution (C) (S150). When a high voltage is applied to the pattern guide unit 130, an electric field is formed between the stage 110 and the pattern guide unit 130, and the coating liquid C discharged or applied may be charged accordingly. Since the solvent is rapidly evaporated in the charged coating solution (C), the pattern guide unit 130 may thereby solidify the coating solution (C). As such, when the pattern induction unit 130 runs on the coated coating liquid C, irregularities corresponding to the needle bar 132 of the pattern induction unit 130 are formed in the coating liquid C, and the coating liquid C is formed. Since it is cured in that state, coating and patterning may be simultaneously performed on the substrate S, thereby increasing process efficiency.

The coating liquid C may not be completely cured due to various causes such as the coating liquid C used, the applied voltage, and the moving speed of the transfer device 140. In this case, the substrate treating apparatus 100 may Separate solidification equipment may be additionally included. Such solidification equipment may be used, such as laser curing equipment or ultraviolet curing equipment.

The above-described embodiments of the present invention are described in order to facilitate understanding of the present invention to those skilled in the art, so the present invention is not limited to the above embodiments.

Therefore, it is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof. For example, the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. All of the modifications are included.

In addition, the scope of protection of the present invention should be construed according to the following claims, and all inventions within the scope of the claims should be construed as being included in the scope of the present invention.

100: substrate processing apparatus
110: stage
120: discharge unit
130: pattern induction unit
131: Body
132: needle
140: feeder
150: lifting device
160:
S: substrate
C: coating liquid

Claims (2)

A stage on which the substrate is seated;
A discharging unit disposed above the stage and discharging a coating liquid;
A pattern induction unit formed on a body installed on the top of the stage and on a surface of the body opposite to the stage, and including a needle rod for inducing a pattern to the discharged coating liquid;
A transfer device for moving the stage in a horizontal direction or for moving the discharge unit and the pattern guide unit in a horizontal direction; And
It includes; a power supply for applying a high voltage to the pattern induction unit
Substrate processing apparatus. The method of claim 1,
The needle bar is a plurality of speech to the body in a direction perpendicular to the moving direction
Substrate processing apparatus.

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