JP2009016490A - Wiring forming apparatus, wiring forming method, and jetting controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To more precisely control the beam diameter of conductive particles jetted from a nozzle onto a substrate. <P>SOLUTION: A wiring forming apparatus for forming wiring by applying the conductive particles jetted from the nozzle onto the substrate is disclosed and equipped with a charging means for charging the conductive particles before jetting the conductive particles from the nozzle and a jetting control means for applying an electric field or a magnetic field to the conductive particles jetted from the nozzle and controlling the beam diameter of the conductive particles jetted from the nozzle. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wiring forming device, a wiring forming method, and an ejection control device, and more particularly to a wiring forming device and method for repairing a disconnected wiring on a glass substrate of a liquid crystal display, and a nozzle ejection control device. It is.

  In the liquid crystal display manufacturing process, when a disconnection or the like occurs in the wiring pattern formed on the glass substrate, it is necessary to appropriately repair it.

  Conventionally, as a method of repairing such a disconnected wiring pattern, for example, a solvent in which a conductive material such as metal fine particles is dispersed in a solvent is ejected in a thin beam form from a nozzle and applied to a repaired portion ( There is a way to land).

  At this time, it is necessary to apply a solvent in accordance with the size of the repaired part and the width of the wiring. Conventionally, the solvent is ejected according to the size of the repaired part and the width of the wiring (for example, about 5 to 35 μm). In addition to controlling the gas pressure, the diameter of the conductive particles ejected from the nozzle in the form of a beam is adjusted by blowing gas from the upper side to the lower side around the nozzle tip.

  Further, Patent Document 1 describes a technique for attaching conductive particles converged in a beam shape on a substrate after charging the conductive particles in order to reduce the number of steps of forming a wiring pattern. Has been. Thereby, since the wiring pattern can be directly formed on the substrate, the photolithography process and the etching process can be reduced.

Japanese Patent Laid-Open No. 2005-142491

  However, it is difficult to cope with more precise repair of wiring by the conventional method using only gas pressure control, and it is difficult to converge the conductive particles to a desired beam diameter only by ejecting from the nozzle. Also, the method described in Patent Document 1 simply converges the beam of conductive particles, and it is difficult to control the beam diameter to a desired value, and a mask is required when forming the wiring.

  Accordingly, the present invention proposes a wiring forming apparatus, a wiring forming method, and an ejection control apparatus that can solve these problems of the prior art and can form and repair wiring by converging conductive particles to a desired beam diameter. There is to do.

  In order to solve this problem, a wiring forming apparatus according to a first aspect of the present invention is a wiring forming apparatus for forming wiring by applying conductive particles ejected from a nozzle to a substrate. (1) ejecting conductive particles from a nozzle Charging means for charging the conductive particles, and (2) ejection control for controlling the beam diameter of the conductive particles ejected from the nozzle by applying an electric field or magnetic field to the conductive particles ejected from the nozzle. Means.

  In the wiring forming method of the second invention, the conductive particles ejected from the nozzle are applied to the substrate to form the wiring. (1) Before the conductive particles are ejected from the nozzle, the conductive particles are removed. A charging step for charging; and (2) an ejection control step for controlling the beam diameter of the conductive particles ejected from the nozzle by applying an electric field or a magnetic field to the conductive particles ejected from the nozzle. It is characterized by having.

  According to a third aspect of the present invention, there is provided an ejection control device for controlling ejection of a nozzle that ejects conductive particles to a substrate. (1) Before electrically ejecting conductive particles from a nozzle, the conductive particles are charged. Charging means; and (2) an ejection control means for controlling the beam diameter of the conductive particles ejected from the nozzle by applying an electric field or a magnetic field to the conductive particles ejected from the nozzle. .

  According to the wiring forming device, the wiring forming method, and the ejection control device of the present invention, the conductive particles are charged before ejection from the nozzle, and an electric field or magnetic field is applied to the conductive particles ejected from the nozzle. The beam diameter from the nozzle can be controlled more precisely to obtain a desired beam diameter.

(A) Embodiment Hereinafter, an embodiment of a wiring forming apparatus, a wiring forming method, and an ejection control apparatus of the present invention will be described with reference to the drawings.

  In this embodiment, a case where the present invention is applied to a wiring repair (restoration) apparatus that repairs a disconnected wiring on a glass substrate of a liquid crystal display panel will be described as an example.

(A-1) Configuration of Embodiment FIG. 1 is a configuration diagram illustrating a schematic configuration of a wiring repair device of the embodiment. In FIG. 1, the wiring repair device 100 of this embodiment has at least a charging electrode 101, a first control electrode 102, a second control electrode 103, a nozzle 104, a pipe 105, a storage tank 106, and a pressurized gas supply pipe 107. Configured.

  In addition, the nozzle 104, the charging electrode 101, the first control electrode 102, and the second control electrode 103 constitute an ejection control device 200 that controls the beam diameter of the conductive particles 108 ejected from the nozzle 104. The ejection control device 200 can be attached to the nozzle portion of an existing wiring repair device.

  The wiring repair device 100 is a device for repairing a disconnected wiring in a wiring pattern formed on the glass substrate 200 in the manufacturing process of the liquid crystal display panel. The wiring repair apparatus 100 stores a solvent S in which conductive particles 108 are dispersed in a solvent in a storage tank 106, receives a pressurized gas under the control of a gas pressure control unit (not shown), The active particles 108 are discharged to the nozzle portion through the pipe 105.

  Note that as the conductive particles 108, metal nanoparticles made of metal fine particles such as gold, silver, copper, aluminum, and tungsten can be used. Moreover, as the solvent S, the solvent used for the existing wiring formation can be widely applied.

  The storage tank 106 stores the solvent S and includes a pressurized gas supply pipe 107 and a pipe 105. The pressurized gas supply pipe 107 is a pipe for supplying the pressurized gas G toward the storage tank 106, and the pipe 105 is discharged from the storage tank 106 when the pressurized gas G is supplied. This is a tube for guiding the conductive particles 108 (and solvent S) to the nozzle 104 side. Although not shown in FIG. 1, the storage tank 106 is provided with a temperature control unit (not shown) in order to keep the solvent S at a predetermined temperature.

  The nozzle 104 ejects the conductive particles 108 (and the solvent S) discharged from the storage tank 106 through the pipe 105 toward a repaired location on the substrate 201. Thereby, the conductive particles 108 can be applied (landed) to the repaired portion on the substrate 201, so that the disconnection of the wiring 202 can be repaired.

  Here, the configuration of the nozzle 104 and its peripheral portion will be described with reference to FIG. FIG. 2 is a configuration diagram showing the configuration of the nozzle 104 and its peripheral portion.

  In FIG. 2, the configuration of the nozzle 104 and its peripheral portion includes a charging electrode 101, a first control electrode 102, and a second control electrode 103. The first control electrode 102 and the second control electrode 103 are arranged side by side between the injection port of the nozzle 104 and the substrate 201.

  The charging electrode 101 is an electrode for charging the conductive particles 108 flowing in the pipe 105 with a negative charge. For example, the charging electrode 101 is provided as a grid in the pipe 105.

  The first control electrode 102 is an electrode provided between the tip (ejection port) of the nozzle 104 and the second control electrode 103. The first control electrode 102 applies a positive electric field to the negatively charged conductive particles 108 ejected from the nozzle 104. As a result, when the conductive particles 108 that are negatively charged are emitted from the nozzle 104, they are likely to diverge outward under the influence of the positive electric field from the first control electrode 102.

  The second control electrode 103 is an electrode provided between the first control electrode 102 and the substrate 201. The second control electrode 103 applies a negative electric field to the conductive particles 108 affected by the positive electric field from the first control electrode 102. As a result, the conductive particles 108 affected by the positive electric field from the first control electrode 102 are affected by the negative electric field from the second control electrode 103 and the electric field applied from the second control electrode 103. Rebound to try to converge.

  In this embodiment, since the first control electrode 102 and the second control electrode 103 are provided between the nozzle 104 and the substrate 201, the height between the nozzle 104 and the substrate 201 can be made higher than the conventional one. it can. Therefore, even if the surface on the substrate 201 is uneven, wiring can be formed correspondingly.

(A-2) Operation | movement of embodiment Next, the wiring formation process by the wiring repair apparatus 100 of embodiment is demonstrated.

  First, the solvent S in which the conductive particles 108 are dispersed is put in the storage tank 106 and stored. In addition, the substrate 201 to be repaired is set on a stage (not shown), and the position of the ejection port of the nozzle 104 is adjusted so that the substrate 201 can be ejected toward the repaired portion.

  Next, the pressurized gas G whose pressure is controlled by a gas pressure control unit (not shown) is supplied to the storage tank 106 through the pressurized gas supply pipe 107. When it does so, the pressure in the storage tank 106 will become large and electroconductive particle will be given to the nozzle 104 side through the piping 105. FIG.

  The conductive particles 108 flowing in the pipe 105 are negatively charged by passing through the charging electrode 101 and are ejected from the ejection port of the nozzle 104.

  The conductive particles 108 ejected from the ejection port of the nozzle 104 pass through the first control electrode 102. At this time, since the first control electrode 102 applies a positive electric field to the conductive particles 108, the negatively charged conductive particles 108 are affected by the positive electric field from the first control electrode 102. Emanates into.

  The conductive particles 108 that have passed through the first control electrode 102 then pass through the second control electrode 103. At this time, since the second control electrode 103 applies a negative electric field to the conductive particles 108, the conductive particles 108 radiated outward under the influence of the positive electric field by the first control electrode 102 are now It converges under the influence of a negative electric field from the second control electrode 103.

  As described above, the conductive particles 108 that have passed through the second control electrode 103 are converged to be adjusted to a desired beam diameter, and the conductive particles 108 land on the repaired portion on the substrate 201. Thereby, the disconnected wiring 202 on the substrate 201 can be repaired.

(A-3) Effect of Embodiment As described above, according to this embodiment, the charging electrode that charges the conductive particles flowing in the pipe with the negative charge and the conductive particles ejected from the nozzle Conductive particles ejected from the nozzle by including a first control electrode that applies a positive electric field and a second control electrode that applies a negative electric field to the conductive particles passing through the first control electrode Can converge the beam diameter of the conductive particles on the glass substrate under the influence of the electric fields from the first control electrode and the second control electrode. As a result, the beam diameter of the conductive particles passing through the second control electrode can be controlled to a desired size, so that a fine wiring can be formed.

(B) Other Embodiments (B-1) In the above-described embodiment, the first control electrode 102 and the second control electrode 103 control the beam diameter of the conductive particles ejected from the nozzle 104 by applying an electric field. Although the case has been described as an example, the beam diameter of the conductive particles may be controlled by applying a magnetic field.

(B-2) In the above-described embodiment, the charging electrode 101 charges a negative charge with respect to the conductive particles, the first control electrode 102 applies a positive polarity electric field, while the second control electrode 103 A case where a negative polarity electric field is applied has been described. However, each electrode may be applied with a polarity opposite to that described above. That is, the charging electrode 101 charges the conductive particles with a positive charge, the first control electrode 102 applies a negative polarity electric field, and the second control electrode 103 applies a positive polarity electric field. May be.

(B-3) In the above-described embodiment, the case where the first control electrode 102 and the second control electrode 103 which are two sets of electrodes are used has been described as an example. However, the number of electrodes is one set. Or three or more sets.

(B-4) In the above-described embodiment, the liquid crystal display panel wiring forming apparatus for forming the wiring on the glass substrate has been described as an example. However, the present invention is not limited to the glass substrate, and silicon. The present invention can also be applied when wiring is formed on a substrate such as the above.

It is a block diagram which shows the structure of the wiring repair apparatus which concerns on embodiment of this invention. It is a block diagram which shows the structure of the nozzle of the wiring repair apparatus shown in FIG. 1, and a nozzle peripheral part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... Wiring repair apparatus, 101 ... Charging electrode, 102 ... 1st control electrode, 103 ... 2nd control electric power, 104 ... Nozzle, 105 ... Piping, 106 ... Reservoir, 107 ... Pressurized gas supply pipe, 108 ... Conductivity Particles 201 ... substrate 202 ... wiring S ... solvent G ... pressurized gas.

Claims (8)

In the wiring forming apparatus for forming the wiring by applying the conductive particles ejected from the nozzle to the substrate,
Before ejecting the conductive particles from the nozzle, charging means for charging the conductive particles;
An ejection control means for applying an electric field or a magnetic field to the conductive particles ejected from the nozzle and controlling a beam diameter of the conductive particles ejected from the nozzle;
A wiring forming apparatus comprising: The ejection control means is
A divergence control unit that applies an electric field or a magnetic field having a polarity opposite to the polarity charged by the charging unit to control the divergence of the conductive particles ejected from the nozzle;
A convergence control unit that applies an electric field or magnetic field having a polarity opposite to the polarity of the electric field or magnetic field applied by the divergence control unit to control the convergence of the conductive particles divergenced by the divergence control unit;
The wiring forming apparatus according to claim 1, further comprising:   The charging means negatively charges the conductive particles, the divergence control unit applies a positive electric field to the conductive particles, and the convergence control unit is negative with respect to the conductive particles. The wiring forming apparatus according to claim 2, wherein an electric field is applied.   The charging unit positively charges the conductive particles, the divergence control unit applies a negative electric field to the conductive particles, and the convergence control unit is positive with respect to the conductive particles. The wiring forming apparatus according to claim 2, wherein an electric field is applied. In the wiring forming method of forming the wiring by applying the conductive particles ejected from the nozzle to the substrate,
A charging step of charging the conductive particles before the conductive particles are ejected from the nozzle;
An ejection control step of applying an electric field or a magnetic field to the conductive particles ejected from the nozzle to control a beam diameter of the conductive particles ejected from the nozzle;
A wiring formation method comprising: The charging means negatively charges the conductive particles;
The ejection control step further includes a divergence control step of applying a positive electric field to the conductive particles, and then a convergence control step of applying a negative electric field to the conductive particles.
The wiring formation method according to claim 5, wherein: The charging means positively charges the conductive particles,
The ejection control step further includes a divergence control step of applying a negative electric field to the conductive particles, and then a convergence control step of applying a positive electric field to the conductive particles.
The wiring formation method according to claim 5, wherein: In an ejection control device that performs ejection control of a nozzle that ejects conductive particles to a substrate,
Before ejecting the conductive particles from the nozzle, charging means for charging the conductive particles;
An ejection control means for applying an electric field or a magnetic field to the conductive particles ejected from the nozzle to control a beam diameter of the conductive particles ejected from the nozzle;
An ejection control device comprising:

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