CN101994100B - 化学气相沉积设备的安装方法及化学气相沉积设备 - Google Patents
化学气相沉积设备的安装方法及化学气相沉积设备 Download PDFInfo
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- CN101994100B CN101994100B CN2009100567317A CN200910056731A CN101994100B CN 101994100 B CN101994100 B CN 101994100B CN 2009100567317 A CN2009100567317 A CN 2009100567317A CN 200910056731 A CN200910056731 A CN 200910056731A CN 101994100 B CN101994100 B CN 101994100B
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CN2009100567317A CN101994100B (zh) | 2009-08-20 | 2009-08-20 | 化学气相沉积设备的安装方法及化学气相沉积设备 |
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CN101994100A CN101994100A (zh) | 2011-03-30 |
CN101994100B true CN101994100B (zh) | 2012-08-22 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3163693B2 (ja) * | 1991-11-29 | 2001-05-08 | 日本電気株式会社 | 集積回路の製造方法 |
CN1476062A (zh) * | 2002-07-18 | 2004-02-18 | Necһ��������ʽ���� | 形成半导体薄膜的方法和该方法使用的激光设备 |
CN1538505A (zh) * | 2003-04-18 | 2004-10-20 | 矽统科技股份有限公司 | 改善晶圆表面平坦度的方法 |
JP2007119838A (ja) * | 2005-10-27 | 2007-05-17 | Hitachi Kokusai Electric Inc | 基板処理装置 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3163693B2 (ja) * | 1991-11-29 | 2001-05-08 | 日本電気株式会社 | 集積回路の製造方法 |
CN1476062A (zh) * | 2002-07-18 | 2004-02-18 | Necһ��������ʽ���� | 形成半导体薄膜的方法和该方法使用的激光设备 |
CN1538505A (zh) * | 2003-04-18 | 2004-10-20 | 矽统科技股份有限公司 | 改善晶圆表面平坦度的方法 |
JP2007119838A (ja) * | 2005-10-27 | 2007-05-17 | Hitachi Kokusai Electric Inc | 基板処理装置 |
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CN101994100A (zh) | 2011-03-30 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121107 |
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Effective date of registration: 20121107 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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