CN101971341B - 晶片堆叠、集成电路器件及其制造方法 - Google Patents

晶片堆叠、集成电路器件及其制造方法 Download PDF

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Publication number
CN101971341B
CN101971341B CN2008801270814A CN200880127081A CN101971341B CN 101971341 B CN101971341 B CN 101971341B CN 2008801270814 A CN2008801270814 A CN 2008801270814A CN 200880127081 A CN200880127081 A CN 200880127081A CN 101971341 B CN101971341 B CN 101971341B
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Prior art keywords
wafer
shadow shield
integrated optical
optical device
stacking
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CN2008801270814A
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Chinese (zh)
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CN101971341A (zh
Inventor
M·罗西
H·鲁德曼
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Juguang Singapore Ltd
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Heptagon Oy
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/331—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H10F77/334—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers or cold shields for infrared detectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

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  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN2008801270814A 2007-12-19 2008-12-16 晶片堆叠、集成电路器件及其制造方法 Active CN101971341B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1480807P 2007-12-19 2007-12-19
US61/014808 2007-12-19
PCT/CH2008/000532 WO2009076788A1 (en) 2007-12-19 2008-12-16 Wafer stack, integrated optical device and method for fabricating the same

Publications (2)

Publication Number Publication Date
CN101971341A CN101971341A (zh) 2011-02-09
CN101971341B true CN101971341B (zh) 2012-10-03

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CN2008801270814A Active CN101971341B (zh) 2007-12-19 2008-12-16 晶片堆叠、集成电路器件及其制造方法

Country Status (7)

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US (1) US8289635B2 (enExample)
EP (1) EP2223338A1 (enExample)
JP (1) JP2011507284A (enExample)
KR (1) KR20100106480A (enExample)
CN (1) CN101971341B (enExample)
TW (1) TW200937642A (enExample)
WO (1) WO2009076788A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872033B (zh) * 2009-04-24 2014-04-30 鸿富锦精密工业（深圳）有限公司 遮光片阵列、遮光片阵列制造方法及镜头模组阵列
CN102045494A (zh) * 2009-10-22 2011-05-04 国碁电子(中山)有限公司 相机模组及其制作方法
JP2013531812A (ja) * 2010-06-14 2013-08-08 ヘプタゴン・オサケ・ユキチュア 複数の光学装置の製造方法
WO2011156928A2 (en) 2010-06-14 2011-12-22 Heptagon Oy Camera, and method of manufacturing a plurality of cameras
CN103620468A (zh) * 2011-06-17 2014-03-05 柯尼卡美能达株式会社 晶片透镜的制造方法及晶片透镜、透镜单元的制造方法及透镜单元
KR102123128B1 (ko) * 2011-07-19 2020-06-16 헵타곤 마이크로 옵틱스 피티이. 리미티드 광전 모듈들 및 그 제조 방법들
WO2013049947A1 (en) * 2011-10-05 2013-04-11 Hartmut Rudmann Micro-optical system and method of manufacture thereof
TWI567953B (zh) 2011-12-20 2017-01-21 新加坡恒立私人有限公司 光電模組及包含該模組之裝置
SG11201403240UA (en) 2011-12-22 2014-07-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules, in particular flash modules, and method for manufacturing the same
SG10201701879RA (en) * 2012-05-17 2017-04-27 Heptagon Micro Optics Pte Ltd Assembly of wafer stacks
WO2014007758A1 (en) * 2012-07-03 2014-01-09 Heptagon Micro Optics Pte. Ltd. Use of vacuum chucks to hold a wafer or wafer sub-stack
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
KR102135492B1 (ko) * 2012-12-27 2020-07-20 헵타곤 마이크로 옵틱스 피티이. 리미티드 광학 소자의 제조 및 이를 통합한 모듈
WO2014109711A1 (en) * 2013-01-10 2014-07-17 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including features to help reduce stray light and/or optical cross-talk
JP2014186006A (ja) * 2013-03-25 2014-10-02 Toshiba Corp 赤外線撮像装置および赤外線撮像モジュール
US9923008B2 (en) * 2013-04-12 2018-03-20 Omnivision Technologies, Inc. Wafer-level array cameras and methods for fabricating the same
US9543354B2 (en) * 2013-07-30 2017-01-10 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
US9746349B2 (en) * 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
SG11201601050PA (en) * 2013-09-10 2016-03-30 Heptagon Micro Optics Pte Ltd Compact opto-electronic modules and fabrication methods for such modules
US9880391B2 (en) * 2013-10-01 2018-01-30 Heptagon Micro Optics Pte. Ltd. Lens array modules and wafer-level techniques for fabricating the same
SG10201804924SA (en) * 2013-12-09 2018-07-30 Heptagon Micro Optics Pte Ltd Modules having multiple optical channels including optical elements at different heights above the optoelectronic devices
US9121994B2 (en) * 2013-12-17 2015-09-01 Anteryon Wafer Optics B.V. Method of fabricating a wafer level optical lens assembly
US9176261B2 (en) * 2014-02-17 2015-11-03 Genius Electronic Optical Co., Ltd. Optical lens assembly, array type lens module and method of making the array type lens module
US9711552B2 (en) 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
EP3024029B1 (en) 2014-11-19 2020-04-22 ams AG Method of producing a semiconductor device comprising an aperture array
US10437025B2 (en) * 2015-01-26 2019-10-08 Omnivision Technologies, Inc. Wafer-level lens packaging methods, and associated lens assemblies and camera modules
US10455131B2 (en) 2015-01-26 2019-10-22 Omnivision Technologies, Inc. Wafer-level methods for packing camera modules, and associated camera modules
TWI677991B (zh) * 2015-11-04 2019-11-21 美商豪威科技股份有限公司 用於封裝相機模組的晶圓級方法及相關的相機模組
CN109155258B (zh) * 2016-04-08 2022-04-26 赫普塔冈微光有限公司 具有孔径的薄光电模块及其制造
JP2018109716A (ja) * 2017-01-05 2018-07-12 ソニーセミコンダクタソリューションズ株式会社 レンズモジュールおよびレンズモジュールの製造方法、撮像装置、並びに電子機器
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20100418U1 (de) * 2000-01-15 2001-04-26 Agilent Technologies, Inc., Palo Alto, Calif. Photodetektor
CN1510496A (zh) * 2002-12-18 2004-07-07 ������������ʽ���� 摄影模块及其制造方法
CN1875617A (zh) * 2003-10-27 2006-12-06 皇家飞利浦电子股份有限公司 相机模块以及该相机模块的制造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141562A (ja) * 1982-02-17 1983-08-22 Fujitsu Ltd 冷却型光電変換装置の製造方法
JPH1065132A (ja) * 1996-08-14 1998-03-06 Sony Corp 半導体撮像装置
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
JP3887162B2 (ja) * 2000-10-19 2007-02-28 富士通株式会社 撮像用半導体装置
US6635941B2 (en) 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002368235A (ja) * 2001-03-21 2002-12-20 Canon Inc 半導体装置及びその製造方法
JP4030047B2 (ja) * 2002-03-28 2008-01-09 シチズン電子株式会社 小型撮像モジュール
JP2004029554A (ja) * 2002-06-27 2004-01-29 Olympus Corp 撮像レンズユニットおよび撮像装置
JP3981348B2 (ja) * 2003-05-30 2007-09-26 松下電器産業株式会社 撮像装置およびその製造方法
JP4499385B2 (ja) * 2003-07-29 2010-07-07 浜松ホトニクス株式会社 裏面入射型光検出素子及び裏面入射型光検出素子の製造方法
CN1934872B (zh) * 2004-01-26 2016-08-03 数字光学公司 具有子像素分辨率的薄式照相机
JP2005227500A (ja) * 2004-02-12 2005-08-25 Fujinon Corp 撮像装置
JP2007129164A (ja) * 2005-11-07 2007-05-24 Sharp Corp 光学装置用モジュール、光学装置用モジュールの製造方法、及び、構造体
JP5292291B2 (ja) 2006-07-17 2013-09-18 デジタルオプティクス・コーポレイション・イースト カメラシステムの作製方法
JP2011180293A (ja) * 2010-02-26 2011-09-15 Fujifilm Corp レンズアレイ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20100418U1 (de) * 2000-01-15 2001-04-26 Agilent Technologies, Inc., Palo Alto, Calif. Photodetektor
CN1510496A (zh) * 2002-12-18 2004-07-07 ������������ʽ���� 摄影模块及其制造方法
CN1875617A (zh) * 2003-10-27 2006-12-06 皇家飞利浦电子股份有限公司 相机模块以及该相机模块的制造方法

Also Published As

Publication number Publication date
US8289635B2 (en) 2012-10-16
EP2223338A1 (en) 2010-09-01
WO2009076788A1 (en) 2009-06-25
US20110013292A1 (en) 2011-01-20
CN101971341A (zh) 2011-02-09
KR20100106480A (ko) 2010-10-01
TW200937642A (en) 2009-09-01
JP2011507284A (ja) 2011-03-03

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