CN101971341A - 晶片堆叠、集成电路器件及其制造方法 - Google Patents
晶片堆叠、集成电路器件及其制造方法 Download PDFInfo
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- CN101971341A CN101971341A CN2008801270814A CN200880127081A CN101971341A CN 101971341 A CN101971341 A CN 101971341A CN 2008801270814 A CN2008801270814 A CN 2008801270814A CN 200880127081 A CN200880127081 A CN 200880127081A CN 101971341 A CN101971341 A CN 101971341A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1480807P | 2007-12-19 | 2007-12-19 | |
US61/014808 | 2007-12-19 | ||
PCT/CH2008/000532 WO2009076788A1 (en) | 2007-12-19 | 2008-12-16 | Wafer stack, integrated optical device and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101971341A true CN101971341A (zh) | 2011-02-09 |
CN101971341B CN101971341B (zh) | 2012-10-03 |
Family
ID=40430188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801270814A Active CN101971341B (zh) | 2007-12-19 | 2008-12-16 | 晶片堆叠、集成电路器件及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8289635B2 (zh) |
EP (1) | EP2223338A1 (zh) |
JP (1) | JP2011507284A (zh) |
KR (1) | KR20100106480A (zh) |
CN (1) | CN101971341B (zh) |
TW (1) | TW200937642A (zh) |
WO (1) | WO2009076788A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103620468A (zh) * | 2011-06-17 | 2014-03-05 | 柯尼卡美能达株式会社 | 晶片透镜的制造方法及晶片透镜、透镜单元的制造方法及透镜单元 |
CN103959125A (zh) * | 2011-10-05 | 2014-07-30 | 新加坡恒立私人有限公司 | 微光学系统及其制造方法 |
CN106796916A (zh) * | 2014-08-19 | 2017-05-31 | 赫普塔冈微光有限公司 | 具有硅衬底的光电子模块以及此类模块的制造方法 |
CN104471695B (zh) * | 2012-07-03 | 2017-09-19 | 赫普塔冈微光有限公司 | 使用真空吸盘固持晶片或晶片子堆叠 |
CN107845650A (zh) * | 2012-05-17 | 2018-03-27 | 赫普塔冈微光有限公司 | 晶片堆叠的组装 |
CN109983368A (zh) * | 2017-01-05 | 2019-07-05 | 索尼半导体解决方案公司 | 透镜模块、制造透镜模块的方法、成像装置和电子设备 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101872033B (zh) * | 2009-04-24 | 2014-04-30 | 鸿富锦精密工业(深圳)有限公司 | 遮光片阵列、遮光片阵列制造方法及镜头模组阵列 |
CN102045494A (zh) * | 2009-10-22 | 2011-05-04 | 国碁电子(中山)有限公司 | 相机模组及其制作方法 |
SG186210A1 (en) | 2010-06-14 | 2013-01-30 | Heptagon Micro Optics Pte Ltd | Camera, and method of manufacturing a plurality of cameras |
EP2580781A1 (en) * | 2010-06-14 | 2013-04-17 | Heptagon Micro Optics Pte. Ltd. | Method of manufacturing a plurality of optical devices |
CN103620779B (zh) * | 2011-07-19 | 2016-12-28 | 赫普塔冈微光有限公司 | 光电模块及其制造方法 |
TWI567953B (zh) * | 2011-12-20 | 2017-01-21 | 新加坡恒立私人有限公司 | 光電模組及包含該模組之裝置 |
EP2795674B1 (en) | 2011-12-22 | 2021-12-15 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
US8606057B1 (en) | 2012-11-02 | 2013-12-10 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules including electrically conductive connections for integration with an electronic device |
WO2014104972A1 (en) * | 2012-12-27 | 2014-07-03 | Heptagon Micro Optics Pte. Ltd. | Fabrication of optical elements and modules incorporating the same |
US9613939B2 (en) | 2013-01-10 | 2017-04-04 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules including features to help reduce stray light and/or optical cross-talk |
JP2014186006A (ja) * | 2013-03-25 | 2014-10-02 | Toshiba Corp | 赤外線撮像装置および赤外線撮像モジュール |
US9923008B2 (en) * | 2013-04-12 | 2018-03-20 | Omnivision Technologies, Inc. | Wafer-level array cameras and methods for fabricating the same |
US9543354B2 (en) | 2013-07-30 | 2017-01-10 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
WO2015030673A1 (en) * | 2013-09-02 | 2015-03-05 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element |
SG10201705797UA (en) * | 2013-09-10 | 2017-08-30 | Heptagon Micro Optics Pte Ltd | Compact opto-electronic modules and fabrication methods for such modules |
WO2015050499A1 (en) * | 2013-10-01 | 2015-04-09 | Heptagon Micro Optics Pte. Ltd. | Lens array modules and wafer-level techniques for fabricating the same |
CN105849892B (zh) * | 2013-12-09 | 2019-05-31 | 赫普塔冈微光有限公司 | 具有包括在光电子器件上方的不同高度处的光学元件的多个光学通道的模块 |
US9121994B2 (en) * | 2013-12-17 | 2015-09-01 | Anteryon Wafer Optics B.V. | Method of fabricating a wafer level optical lens assembly |
US9176261B2 (en) * | 2014-02-17 | 2015-11-03 | Genius Electronic Optical Co., Ltd. | Optical lens assembly, array type lens module and method of making the array type lens module |
EP3024029B1 (en) | 2014-11-19 | 2020-04-22 | ams AG | Method of producing a semiconductor device comprising an aperture array |
US10437025B2 (en) * | 2015-01-26 | 2019-10-08 | Omnivision Technologies, Inc. | Wafer-level lens packaging methods, and associated lens assemblies and camera modules |
US10455131B2 (en) | 2015-01-26 | 2019-10-22 | Omnivision Technologies, Inc. | Wafer-level methods for packing camera modules, and associated camera modules |
TWI677991B (zh) * | 2015-11-04 | 2019-11-21 | 美商豪威科技股份有限公司 | 用於封裝相機模組的晶圓級方法及相關的相機模組 |
US10886420B2 (en) * | 2016-04-08 | 2021-01-05 | Ams Sensors Singapore Pte. Ltd. | Thin optoelectronic modules with apertures and their manufacture |
US10734184B1 (en) | 2019-06-21 | 2020-08-04 | Elbit Systems Of America, Llc | Wafer scale image intensifier |
Family Cites Families (18)
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JPS58141562A (ja) | 1982-02-17 | 1983-08-22 | Fujitsu Ltd | 冷却型光電変換装置の製造方法 |
JPH1065132A (ja) * | 1996-08-14 | 1998-03-06 | Sony Corp | 半導体撮像装置 |
US6324010B1 (en) * | 1999-07-19 | 2001-11-27 | Eastman Kodak Company | Optical assembly and a method for manufacturing lens systems |
DE20100418U1 (de) | 2000-01-15 | 2001-04-26 | Agilent Technologies, Inc., Palo Alto, Calif. | Photodetektor |
JP3887162B2 (ja) * | 2000-10-19 | 2007-02-28 | 富士通株式会社 | 撮像用半導体装置 |
US6635941B2 (en) | 2001-03-21 | 2003-10-21 | Canon Kabushiki Kaisha | Structure of semiconductor device with improved reliability |
JP2002368235A (ja) * | 2001-03-21 | 2002-12-20 | Canon Inc | 半導体装置及びその製造方法 |
JP4030047B2 (ja) * | 2002-03-28 | 2008-01-09 | シチズン電子株式会社 | 小型撮像モジュール |
JP2004029554A (ja) * | 2002-06-27 | 2004-01-29 | Olympus Corp | 撮像レンズユニットおよび撮像装置 |
JP2004200965A (ja) * | 2002-12-18 | 2004-07-15 | Sanyo Electric Co Ltd | カメラモジュール及びその製造方法 |
JP3981348B2 (ja) * | 2003-05-30 | 2007-09-26 | 松下電器産業株式会社 | 撮像装置およびその製造方法 |
JP4499385B2 (ja) | 2003-07-29 | 2010-07-07 | 浜松ホトニクス株式会社 | 裏面入射型光検出素子及び裏面入射型光検出素子の製造方法 |
JP2007510291A (ja) * | 2003-10-27 | 2007-04-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | カメラモジュール及びこのようなカメラモジュールの製造方法 |
CN1934872B (zh) * | 2004-01-26 | 2016-08-03 | 数字光学公司 | 具有子像素分辨率的薄式照相机 |
JP2005227500A (ja) * | 2004-02-12 | 2005-08-25 | Fujinon Corp | 撮像装置 |
JP2007129164A (ja) * | 2005-11-07 | 2007-05-24 | Sharp Corp | 光学装置用モジュール、光学装置用モジュールの製造方法、及び、構造体 |
EP2044629A4 (en) | 2006-07-17 | 2012-08-01 | Digitaloptics Corp East | CAMERA SYSTEM AND RELATED METHODS |
JP2011180293A (ja) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | レンズアレイ |
-
2008
- 2008-12-15 TW TW097148778A patent/TW200937642A/zh unknown
- 2008-12-16 JP JP2010538308A patent/JP2011507284A/ja active Pending
- 2008-12-16 CN CN2008801270814A patent/CN101971341B/zh active Active
- 2008-12-16 EP EP08863376A patent/EP2223338A1/en not_active Withdrawn
- 2008-12-16 WO PCT/CH2008/000532 patent/WO2009076788A1/en active Application Filing
- 2008-12-16 KR KR1020107015605A patent/KR20100106480A/ko not_active Application Discontinuation
- 2008-12-16 US US12/809,362 patent/US8289635B2/en active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103620468A (zh) * | 2011-06-17 | 2014-03-05 | 柯尼卡美能达株式会社 | 晶片透镜的制造方法及晶片透镜、透镜单元的制造方法及透镜单元 |
CN103959125A (zh) * | 2011-10-05 | 2014-07-30 | 新加坡恒立私人有限公司 | 微光学系统及其制造方法 |
CN107845650A (zh) * | 2012-05-17 | 2018-03-27 | 赫普塔冈微光有限公司 | 晶片堆叠的组装 |
CN107845650B (zh) * | 2012-05-17 | 2021-10-26 | 赫普塔冈微光有限公司 | 晶片堆叠的组装 |
CN104471695B (zh) * | 2012-07-03 | 2017-09-19 | 赫普塔冈微光有限公司 | 使用真空吸盘固持晶片或晶片子堆叠 |
US9793152B2 (en) | 2012-07-03 | 2017-10-17 | Heptagon Micro Optics Pte. Ltd. | Use of vacuum chucks to hold a wafer or wafer sub-stack |
US9899251B2 (en) | 2012-07-03 | 2018-02-20 | Heptagon Micro Optics Pte. Ltd. | Use of vacuum chucks to hold a wafer or wafer sub-stack |
CN106796916A (zh) * | 2014-08-19 | 2017-05-31 | 赫普塔冈微光有限公司 | 具有硅衬底的光电子模块以及此类模块的制造方法 |
CN106796916B (zh) * | 2014-08-19 | 2019-11-08 | 赫普塔冈微光有限公司 | 具有硅衬底的光电子模块以及此类模块的制造方法 |
CN109983368A (zh) * | 2017-01-05 | 2019-07-05 | 索尼半导体解决方案公司 | 透镜模块、制造透镜模块的方法、成像装置和电子设备 |
Also Published As
Publication number | Publication date |
---|---|
EP2223338A1 (en) | 2010-09-01 |
KR20100106480A (ko) | 2010-10-01 |
US20110013292A1 (en) | 2011-01-20 |
JP2011507284A (ja) | 2011-03-03 |
WO2009076788A1 (en) | 2009-06-25 |
US8289635B2 (en) | 2012-10-16 |
CN101971341B (zh) | 2012-10-03 |
TW200937642A (en) | 2009-09-01 |
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