CN1934872B - 具有子像素分辨率的薄式照相机 - Google Patents
具有子像素分辨率的薄式照相机 Download PDFInfo
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- CN1934872B CN1934872B CN200580008795.XA CN200580008795A CN1934872B CN 1934872 B CN1934872 B CN 1934872B CN 200580008795 A CN200580008795 A CN 200580008795A CN 1934872 B CN1934872 B CN 1934872B
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- 238000003384 imaging method Methods 0.000 claims abstract description 42
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/48—Increasing resolution by shifting the sensor relative to the scene
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/12—Fluid-filled or evacuated lenses
- G02B3/14—Fluid-filled or evacuated lenses of variable focal length
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Color Television Image Signal Generators (AREA)
- Lenses (AREA)
- Studio Devices (AREA)
- Cameras In General (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510594311.XA CN105141933B (zh) | 2004-01-26 | 2005-01-26 | 具有子像素分辨率的薄式照相机 |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/763,396 US7405761B2 (en) | 2003-10-01 | 2004-01-26 | Thin camera having sub-pixel resolution |
US10/763,396 | 2004-01-26 | ||
US56027304P | 2004-04-08 | 2004-04-08 | |
US60/560,273 | 2004-04-08 | ||
US10/949,807 | 2004-09-27 | ||
US10/949,807 US7773143B2 (en) | 2004-04-08 | 2004-09-27 | Thin color camera having sub-pixel resolution |
PCT/US2005/002520 WO2005072370A2 (en) | 2004-01-26 | 2005-01-26 | Thin camera having sub-pixel resolution |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510594311.XA Division CN105141933B (zh) | 2004-01-26 | 2005-01-26 | 具有子像素分辨率的薄式照相机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1934872A CN1934872A (zh) | 2007-03-21 |
CN1934872B true CN1934872B (zh) | 2016-08-03 |
Family
ID=34831225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200580008795.XA Active CN1934872B (zh) | 2004-01-26 | 2005-01-26 | 具有子像素分辨率的薄式照相机 |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP1712087B1 (zh) |
JP (3) | JP4797151B2 (zh) |
KR (1) | KR101227544B1 (zh) |
CN (1) | CN1934872B (zh) |
WO (1) | WO2005072370A2 (zh) |
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JP4673202B2 (ja) * | 2005-12-06 | 2011-04-20 | 株式会社リコー | 画像入力装置 |
KR100827242B1 (ko) * | 2006-06-26 | 2008-05-07 | 삼성전기주식회사 | 이미지 복원 방법 및 장치 |
EP1874034A3 (en) * | 2006-06-26 | 2011-12-21 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and method of recovering high pixel image |
KR100809277B1 (ko) | 2006-07-05 | 2008-03-03 | 삼성전기주식회사 | 어레이 렌즈를 갖는 카메라 모듈 |
US8072486B2 (en) | 2006-08-01 | 2011-12-06 | Panasonic Corporation | Camera device, liquid lens, and image pickup method |
WO2008060630A2 (en) * | 2006-11-17 | 2008-05-22 | Tessera North America, Inc. | Internal noise reducing structures in camera systems employing an optics stack and associated methods |
TW200937642A (en) * | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
JP4413261B2 (ja) | 2008-01-10 | 2010-02-10 | シャープ株式会社 | 撮像装置及び光軸制御方法 |
JP2010118818A (ja) * | 2008-11-12 | 2010-05-27 | Sharp Corp | 撮像装置 |
TW201109165A (en) * | 2009-09-11 | 2011-03-16 | E Pin Optical Industry Co Ltd | Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof |
US8885067B2 (en) | 2009-12-24 | 2014-11-11 | Sharp Kabushiki Kaisha | Multocular image pickup apparatus and multocular image pickup method |
EP2580781A1 (en) * | 2010-06-14 | 2013-04-17 | Heptagon Micro Optics Pte. Ltd. | Method of manufacturing a plurality of optical devices |
GB2488519A (en) * | 2011-02-16 | 2012-09-05 | St Microelectronics Res & Dev | Multi-channel image sensor incorporating lenslet array and overlapping fields of view. |
EP2536153B1 (en) | 2011-04-22 | 2016-04-13 | Panasonic Intellectual Property Management Co., Ltd. | Image capture device, image capture system, and image capture method |
US8717483B2 (en) | 2011-04-22 | 2014-05-06 | Panasonic Corporation | Imaging device, imaging system, and imaging method |
US8866951B2 (en) * | 2011-08-24 | 2014-10-21 | Aptina Imaging Corporation | Super-resolution imaging systems |
CN102510450A (zh) * | 2011-10-17 | 2012-06-20 | 北京瑞澜联合通信技术有限公司 | 图像传感器、摄像装置及图像数据生成方法 |
US9191635B2 (en) | 2012-03-19 | 2015-11-17 | Semiconductor Components Industries, Llc | Imaging systems with clear filter pixels |
US8791403B2 (en) * | 2012-06-01 | 2014-07-29 | Omnivision Technologies, Inc. | Lens array for partitioned image sensor to focus a single image onto N image sensor regions |
US9595553B2 (en) * | 2012-11-02 | 2017-03-14 | Heptagon Micro Optics Pte. Ltd. | Optical modules including focal length adjustment and fabrication of the optical modules |
WO2014091706A1 (ja) * | 2012-12-14 | 2014-06-19 | コニカミノルタ株式会社 | 撮像装置 |
JP6186573B2 (ja) * | 2013-08-06 | 2017-08-30 | 株式会社モルフォ | 画像処理装置及び画像処理方法 |
US10151859B2 (en) | 2013-09-23 | 2018-12-11 | Lg Innotek Co., Ltd. | Camera module and manufacturing method for same |
CN105916822A (zh) | 2014-01-24 | 2016-08-31 | 柯尼卡美能达株式会社 | 透镜阵列光学系统的制造方法以及透镜阵列光学系统 |
US9983663B2 (en) * | 2014-05-16 | 2018-05-29 | Qualcomm Incorporated | Imaging arrangement for object motion detection and characterization |
JP6495774B2 (ja) * | 2015-07-23 | 2019-04-03 | 株式会社東芝 | 形状認識装置およびその方法 |
KR102105467B1 (ko) * | 2017-12-07 | 2020-05-29 | 엘지전자 주식회사 | 카메라 장치를 구비하는 전자장치 |
US20190179132A1 (en) * | 2017-12-07 | 2019-06-13 | Lg Electronics Inc. | Electronic device having camera device |
US10616536B2 (en) | 2018-01-12 | 2020-04-07 | Semiconductor Components Industries, Llc | Imaging systems having broadband monochromatic and chromatic image sensors |
CN109672816B (zh) * | 2019-01-04 | 2021-03-09 | 多普光电科技有限公司 | 矩阵图像采集系统和矩阵图像投影系统 |
KR102632474B1 (ko) * | 2019-02-11 | 2024-02-01 | 삼성전자주식회사 | 이미지 센서의 픽셀 어레이 및 이를 포함하는 이미지 센서 |
US20230170368A1 (en) * | 2021-11-30 | 2023-06-01 | Visera Technologies Company Limited | Image sensor and method for detecting images |
Citations (2)
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US20020181126A1 (en) * | 1998-06-30 | 2002-12-05 | Kimihiko Nishioka | Variable optical-property element |
US6611289B1 (en) * | 1999-01-15 | 2003-08-26 | Yanbin Yu | Digital cameras using multiple sensors with multiple lenses |
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-
2005
- 2005-01-26 KR KR1020067017082A patent/KR101227544B1/ko active IP Right Grant
- 2005-01-26 WO PCT/US2005/002520 patent/WO2005072370A2/en active Application Filing
- 2005-01-26 CN CN200580008795.XA patent/CN1934872B/zh active Active
- 2005-01-26 JP JP2006551449A patent/JP4797151B2/ja active Active
- 2005-01-26 EP EP05712116.2A patent/EP1712087B1/en active Active
- 2005-01-26 EP EP11153126.5A patent/EP2315448B1/en active Active
-
2011
- 2011-01-06 JP JP2011001385A patent/JP2011072039A/ja active Pending
- 2011-12-07 JP JP2011268244A patent/JP5646445B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020181126A1 (en) * | 1998-06-30 | 2002-12-05 | Kimihiko Nishioka | Variable optical-property element |
US6611289B1 (en) * | 1999-01-15 | 2003-08-26 | Yanbin Yu | Digital cameras using multiple sensors with multiple lenses |
Also Published As
Publication number | Publication date |
---|---|
JP5646445B2 (ja) | 2014-12-24 |
KR101227544B1 (ko) | 2013-01-31 |
EP1712087A4 (en) | 2009-12-16 |
JP4797151B2 (ja) | 2011-10-19 |
KR20070019979A (ko) | 2007-02-16 |
JP2012070431A (ja) | 2012-04-05 |
EP2315448B1 (en) | 2018-03-07 |
EP1712087A2 (en) | 2006-10-18 |
WO2005072370A3 (en) | 2005-12-08 |
JP2011072039A (ja) | 2011-04-07 |
CN1934872A (zh) | 2007-03-21 |
EP1712087B1 (en) | 2021-03-10 |
EP2315448A1 (en) | 2011-04-27 |
JP2007520166A (ja) | 2007-07-19 |
WO2005072370A2 (en) | 2005-08-11 |
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Address after: North Carolina Applicant after: Digitaloptics Corp. East Address before: North Carolina Applicant before: Tessera North America Inc. |
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Free format text: CORRECT: APPLICANT; FROM: TESSERA NORTH AMERICA INC. TO: DIGITAL OPTICAL EAST COMPANY |
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