CN101924092A - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN101924092A
CN101924092A CN2010101894925A CN201010189492A CN101924092A CN 101924092 A CN101924092 A CN 101924092A CN 2010101894925 A CN2010101894925 A CN 2010101894925A CN 201010189492 A CN201010189492 A CN 201010189492A CN 101924092 A CN101924092 A CN 101924092A
Authority
CN
China
Prior art keywords
silicon substrate
semiconductor device
vss2
high voltage
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010101894925A
Other languages
English (en)
Chinese (zh)
Inventor
小林伸行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN101924092A publication Critical patent/CN101924092A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/28—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels
    • G09G3/288—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels using AC panels
    • G09G3/296—Driving circuits for producing the waveforms applied to the driving electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2010101894925A 2009-06-15 2010-05-26 半导体器件 Pending CN101924092A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009142806A JP2010287866A (ja) 2009-06-15 2009-06-15 半導体装置
JP2009-142806 2009-06-15

Publications (1)

Publication Number Publication Date
CN101924092A true CN101924092A (zh) 2010-12-22

Family

ID=43305739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101894925A Pending CN101924092A (zh) 2009-06-15 2010-05-26 半导体器件

Country Status (3)

Country Link
US (1) US8237261B2 (enExample)
JP (1) JP2010287866A (enExample)
CN (1) CN101924092A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105897165A (zh) * 2015-02-16 2016-08-24 精工爱普生株式会社 振荡电路、振荡器、电子设备以及移动体
CN104022098B (zh) * 2014-05-29 2016-11-16 京东方科技集团股份有限公司 一种覆晶薄膜及显示装置
CN116569327A (zh) * 2020-12-09 2023-08-08 华为技术有限公司 封装结构及其制备方法、电子设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164846A (ja) * 2011-02-08 2012-08-30 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、及び表示装置
JP2012164750A (ja) * 2011-02-04 2012-08-30 Canon Inc 電子機器
JP7025948B2 (ja) * 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
KR20250131658A (ko) * 2024-02-27 2025-09-03 엘지디스플레이 주식회사 표시 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1347146A (zh) * 2000-09-28 2002-05-01 日本电气株式会社 具有绝缘体上硅结构的半导体器件及其制造方法
US6432809B1 (en) * 2000-02-28 2002-08-13 International Business Machines Corporation Method for improved passive thermal flow in silicon on insulator devices
CN1773740A (zh) * 2004-11-12 2006-05-17 国际商业机器公司 集成热电冷却器件及其制作方法
CN101044618A (zh) * 2004-11-16 2007-09-26 国际商业机器公司 制造具有通孔连接的双面soi晶片级封装的装置和方法
CN101252820A (zh) * 2007-02-19 2008-08-27 松下电器产业株式会社 半导体器件和显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282878A (ja) * 2002-03-20 2003-10-03 Citizen Watch Co Ltd 半導体装置およびその製造方法
JP2004095787A (ja) * 2002-08-30 2004-03-25 Mitsubishi Electric Corp 圧接型半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432809B1 (en) * 2000-02-28 2002-08-13 International Business Machines Corporation Method for improved passive thermal flow in silicon on insulator devices
CN1347146A (zh) * 2000-09-28 2002-05-01 日本电气株式会社 具有绝缘体上硅结构的半导体器件及其制造方法
CN1773740A (zh) * 2004-11-12 2006-05-17 国际商业机器公司 集成热电冷却器件及其制作方法
CN101044618A (zh) * 2004-11-16 2007-09-26 国际商业机器公司 制造具有通孔连接的双面soi晶片级封装的装置和方法
CN101252820A (zh) * 2007-02-19 2008-08-27 松下电器产业株式会社 半导体器件和显示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104022098B (zh) * 2014-05-29 2016-11-16 京东方科技集团股份有限公司 一种覆晶薄膜及显示装置
CN105897165A (zh) * 2015-02-16 2016-08-24 精工爱普生株式会社 振荡电路、振荡器、电子设备以及移动体
CN116569327A (zh) * 2020-12-09 2023-08-08 华为技术有限公司 封装结构及其制备方法、电子设备

Also Published As

Publication number Publication date
JP2010287866A (ja) 2010-12-24
US20100314773A1 (en) 2010-12-16
US8237261B2 (en) 2012-08-07

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