CN101924052B - 快速检测外延图形漂移缺陷的方法 - Google Patents
快速检测外延图形漂移缺陷的方法 Download PDFInfo
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- CN101924052B CN101924052B CN2009100574132A CN200910057413A CN101924052B CN 101924052 B CN101924052 B CN 101924052B CN 2009100574132 A CN2009100574132 A CN 2009100574132A CN 200910057413 A CN200910057413 A CN 200910057413A CN 101924052 B CN101924052 B CN 101924052B
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- epitaxial patterns
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CN101924052A CN101924052A (zh) | 2010-12-22 |
CN101924052B true CN101924052B (zh) | 2011-08-24 |
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CN104596829A (zh) * | 2015-01-20 | 2015-05-06 | 苏州同冠微电子有限公司 | 硅片二次缺陷检测液及检测方法 |
CN108376655B (zh) * | 2018-01-30 | 2021-05-11 | 北京世纪金光半导体有限公司 | 一种晶圆制造过程中检测缺陷的定位和跟踪方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1610826A (zh) * | 2001-11-28 | 2005-04-27 | 应用材料有限公司 | 探测缺陷的方法 |
CN1763511A (zh) * | 2004-10-13 | 2006-04-26 | 优志旺电机株式会社 | 图案检查装置 |
CN1896727A (zh) * | 2006-05-31 | 2007-01-17 | 西安电子科技大学 | GaN单晶缺陷种类和密度的检测方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1610826A (zh) * | 2001-11-28 | 2005-04-27 | 应用材料有限公司 | 探测缺陷的方法 |
CN1763511A (zh) * | 2004-10-13 | 2006-04-26 | 优志旺电机株式会社 | 图案检查装置 |
CN1896727A (zh) * | 2006-05-31 | 2007-01-17 | 西安电子科技大学 | GaN单晶缺陷种类和密度的检测方法 |
Non-Patent Citations (2)
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JP特开2000-55818A 2000.02.25 |
JP特开2001-281178A 2001.10.10 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |