CN101911849B - Method for manufacturing ceramic electronic component and ceramic electronic component - Google Patents

Method for manufacturing ceramic electronic component and ceramic electronic component Download PDF

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Publication number
CN101911849B
CN101911849B CN2008801246321A CN200880124632A CN101911849B CN 101911849 B CN101911849 B CN 101911849B CN 2008801246321 A CN2008801246321 A CN 2008801246321A CN 200880124632 A CN200880124632 A CN 200880124632A CN 101911849 B CN101911849 B CN 101911849B
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Prior art keywords
burning
electronic component
conductor
firing process
layer
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CN101911849A (en
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冈田佳子
近川修
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Disclosed is a method for manufacturing a ceramic electronic component, wherein a ceramic electronic component mounted with a chip electronic component is efficiently manufactured by mounting the chip electronic component without requiring a mounting process in which a bonding material such as a solder or a conductive adhesive is used. Specifically, a chip electronic component (multilayer ceramic capacitor) (11) is mounted on an unburned laminate (32), which comprises a base layer (20) having a surface conductor (21) and a constraining layer (31) having a via-hole conductor (10a), in such a manner that a terminal electrode (13) is in contact with the via-hole conductor (10a). By burning the unburned laminate (32) in such a state, the surface conductor of the base layer and the terminal electrode of the chip electronic component are respectively fixed with the via-hole conductor through sintering. Consequently, the surface conductor and the terminal electrode are electrically connected with each other through the via-hole conductor.

Description

The manufacturing approach of ceramic electronic component and ceramic electronic component
Technical field
The present invention relates at the ceramic electronic component that is mounted with sheet type electronic devices and components on the ceramic formation body manufacturing approach, and on ceramic formation body, be mounted with the ceramic electronic component of sheet type electronic devices and components.
Background technology
Electronic devices and components are being installed under the situation of ceramic substrate; Usually that kind for example shown in Figure 10; At the surface conductor portion that has accomplished the ceramic substrate 51 that burns till 52 coating soldering paste 53; After the erector is loaded into sheet type electronic devices and components 54 in this surface conductor portion 52; The ceramic substrate that is mounted with sheet type electronic devices and components 54 51 is implemented reflow treatment, thereby the terminal electrode 55 of sheet type electronic devices and components 54 is engaged, is fixed to the surface conductor portion 52 (referenced patent document 1) on the ceramic substrate 51 through scolder.
Yet, in the manufacture method of existing ceramic substrate, owing to come mounting electronic, for example therefore need carry out solder reflow operation etc. through scolder, there is the problem of complex procedures.
In addition, in scolder was installed, the inflow of scolder can cause adjacent short circuit between electrodes undesirable, the problem of promptly so-called scolder influent stream.
Based on this viewpoint, actual conditions are when manufacturing is mounted with the ceramic electronic component of sheet type electronic devices and components, require more efficiently, the manufacturing approach of ceramic electronic component more reliably.
Patent documentation 1: Japanese Patent Laid is opened clear 61-263297 communique
Summary of the invention
The present invention accomplishes in order to address the above problem; Its purpose is to provide a kind of manufacturing approach and ceramic electronic component of ceramic electronic component; The manufacturing approach of above-mentioned ceramic electronic component need not used the installation procedure of grafting materials such as scolder, conductive adhesive; Just can efficiently also be installed on the surface conductor reliably sheet type electronic devices and components; Above-mentioned ceramic electronic component need not use grafting materials such as scolder, conductive adhesive, just can be at its mounted on surface sheet type electronic devices and components, and reliability is high.
In order to address the above problem, the manufacturing approach of the ceramic electronic component of the application's claim 1 is characterised in that, comprising:
The duplexer production process; This duplexer production process is made and is not burnt till duplexer; This does not burn till duplexer and comprises substrate layer and restraint layer; Above-mentioned substrate layer has surface conductor, comprises ceramic powders and glass powder, and above-mentioned restraint layer is configured with the mode that contacts with a first type surface of above-mentioned substrate layer at least; And be included under the situation of burning till in the hypoxic atmosphere not by burning-off but make under the situation that its oxygen partial pressure that is higher than above-mentioned hypoxic atmosphere burns till by the burning-off material of burning-off as main component improving oxygen partial pressure, also comprise the via hole conductor that is connected with above-mentioned surface conductor;
Sheet type electronic devices and components load operation, and these sheet type electronic devices and components load operation sheet type electronic devices and components are loaded on the above-mentioned restraint layer with the mode that its terminal electrode contacts with above-mentioned via hole conductor; And,
Firing process; This firing process burns till the above-mentioned duplexer that do not burn till; Make surface conductor and above-mentioned via hole conductor, the terminal electrode that reaches above-mentioned type electronic devices and components and the above-mentioned via hole conductor of above-mentioned substrate layer next affixed through sintering respectively; Make above-mentioned surface conductor and above-mentioned terminal electrode become the state that is electrically connected through above-mentioned via hole conductor
Above-mentioned firing process comprises:
First firing process, this first firing process burns till the above-mentioned duplexer that do not burn till in above-mentioned hypoxic atmosphere, makes the above-mentioned burning-off material that constitutes above-mentioned restraint layer not by burning-off, makes above-mentioned substrate layer sintering; And,
Second firing process, this second firing process are higher than at oxygen partial pressure under the condition of oxygen partial pressure of above-mentioned first firing process and burn till, and make the above-mentioned burning-off material that constitutes above-mentioned restraint layer by burning-off.
In addition; The manufacturing approach of the ceramic electronic component of claim 2 is characterised in that; In above-mentioned duplexer production process, be mounted with the zone of above-mentioned type electronic devices and components on above-mentioned restraint layer surface, promptly include in the zone of above-mentioned via hole conductor and form recess.
In addition, the manufacturing approach of the ceramic electronic component of claim 3 is characterised in that, the surface of above-mentioned substrate layer, with zone that the rear side in the zone that is formed with above-mentioned recess of above-mentioned restraint layer contacts in also form recess.
In addition; The manufacturing approach of the ceramic electronic component of claim 4 is characterised in that; In above-mentioned duplexer production process, through pushing the metal pattern that has with the protuberance of the above-mentioned corresponding size of type electronic devices and components from the upper surface side of above-mentioned restraint layer, thereby form above-mentioned recess.
In addition, the manufacturing approach of the ceramic electronic component of claim 5 is characterised in that, in above-mentioned first firing process, burns till so that the above-mentioned glass material that above-mentioned substrate layer comprised is penetrated into the mode of above-mentioned restraint layer.
In addition, the manufacturing approach of the ceramic electronic component of claim 6 is characterised in that above-mentioned burning-off material is a carbon dust.
In addition, the manufacturing approach of the ceramic electronic component of claim 7 is characterised in that,
Above-mentioned substrate layer comprises adhesive, and,
Comprise unsticking mixture operation, before above-mentioned first firing process of this unsticking mixture operation in above-mentioned firing process, remove the above-mentioned adhesive that above-mentioned substrate layer comprises,
Above-mentioned unsticking mixture operation is implemented in oxygen-containing atmosphere and under above-mentioned burning-off material can not be by the temperature of burning-off.
In addition; The manufacturing approach of the ceramic electronic component of claim 8 is characterised in that; In above-mentioned duplexer production process, above-mentioned restraint layer is to be configured with the mode that contacts with at least one first type surface of above-mentioned substrate layer as the thin slice of main component and to form through comprising above-mentioned burning-off material.
In addition; The manufacturing approach of the ceramic electronic component of claim 9 is characterised in that; In above-mentioned duplexer production process, above-mentioned restraint layer is to form as at least one first type surface that the thickener of main component is coated on above-mentioned substrate layer through comprising above-mentioned burning-off material.
In addition, the present invention's's (claim 10) ceramic electronic component is characterised in that,
Be mounted with sheet type electronic devices and components on the ceramic formation body of surface conductor having with terminal electrode,
The terminal electrode of the surface conductor of above-mentioned ceramic formation body and above-mentioned type electronic devices and components is electrically connected through being connected with conductor, and,
The surface conductor of above-mentioned ceramic formation body with above-mentioned be connected with conductor, and the terminal electrode of above-mentioned type electronic devices and components with above-mentioned be connected with the conductor dbus oversintering affixed.
In addition, the ceramic electronic component of claim 11 is characterised in that, is formed with recess on the surface of above-mentioned ceramic formation body, in above-mentioned recess, is equipped with above-mentioned type electronic devices and components.
In the manufacturing approach of ceramic electronic component of the present invention; Owing to comprising not the burning till on the duplexer of substrate layer with surface conductor and restraint layer with via hole conductor; Mode so that the terminal electrode of sheet type electronic devices and components contacts with the via hole conductor is come carrier sheet type electronic devices and components; Under this state, do not burn till burning till duplexer, therefore, in firing process; Can make surface conductor and via hole conductor, the terminal electrode that reaches sheet type electronic devices and components and the via hole conductor of substrate layer next affixed through sintering respectively, surface conductor and terminal electrode can become the state that is electrically connected through the via hole conductor.
Consequently, do not need as existing, to use the installation of scolder, can simplify manufacturing process.In addition, owing to need not use scolder, therefore can prevent the generation of scolder influent stream.
In addition; Owing under the state that is folded with restraint layer between substrate layer and the sheet type electronic devices and components, burn till; Thereby in first firing process, can suppress the contraction of substrate layer on in-plane; And the contraction of substrate layer can directly not influence sheet type electronic devices and components, therefore, can prevent in sheet type electronic devices and components and ceramic formation body (substrate layer behind the sintering), to crack.
In addition; Owing to directly do not burn till under the state of contact with substrate layer (ceramic formation body) at sheet type electronic devices and components; Therefore the influence of the difference of the thermal coefficient of expansion between sheet type electronic devices and components and ceramic formation body is very little, and this also can be reduced in the possibility that cracks in sheet type electronic devices and components and the ceramic formation body etc.
In addition; The manufacturing approach of ceramic electronic component as claimed in claim 2 is such; In the zone that is mounted with sheet type electronic devices and components on restraint layer surface, promptly be equipped with in the zone of via hole conductor and be formed with under the situation of recess, can reduce the whole height of product, help to realize slimming.
In addition; Owing to only in the zone that is mounted with sheet type electronic devices and components of restraint layer, form recess; Can guarantee the thickness of restraint layer in other parts; Therefore can make restraint layer give full play to restraining force, can suppress the contraction on the in-plane, can the high ceramic electronic component of manufacturing dimension precision.
In addition; The manufacturing approach of ceramic electronic component as claimed in claim 3 is such; The surface of substrate layer, with zone that the rear side in the zone that is formed with above-mentioned recess of restraint layer contacts in also be formed with under the situation of recess; Whole concave depth can be increased, thereby the slimming of product, the reduction of height can be promoted.
In addition; The manufacturing approach of ceramic electronic component as claimed in claim 4 is such; Thereby form under the situation of recess pushing the metal pattern that has with the protuberance of the corresponding size of sheet type electronic devices and components from the upper surface of restraint layer; Can be easily and form recess at restraint layer or restraint layer and substrate layer in the two reliably, can make the present invention more effective.
In addition, the manufacturing approach of ceramic electronic component as claimed in claim 5 is such, in first firing process, the glass material that substrate layer comprised is penetrated into restraint layer, forms permeable formation.So, make restraint layer and substrate layer carry out strong bond through this permeable formation, utilize permeable formation can suppress, prevent the contraction of substrate layer on in-plane in first firing process reliably.
In addition, in order to obtain restraining force more reliably, preferably the glass material of substrate layer can be penetrated into restraint layer reliably, for this reason, preferably sets restraint layer with the mode of being close to substrate layer.
In addition; The manufacturing approach of ceramic electronic component as claimed in claim 6 is such; Using under the situation of carbon dust as the burning-off material; Do not burn under the situation that carbon dust burns till in low oxygen dividing potential drop atmosphere in the first burning-off operation and do not shrink yet, therefore can bring into play the function of burning till contraction that suppresses substrate layer fully.In addition, in second firing process, under the situation of burning till under the oxygen partial pressure conditions of higher, carbon dust burning and by burning-off.Therefore, after second firing process finishes, need not be used to remove the operation of restraint layer, the operation of burning till through constraint, efficiently the manufactured size precision high, be the various ceramic electronic components of representative with the ceramic substrate, can make the present invention more effective.
In addition, as carbon dust, preferably use the powder of particle diameter in the scope of 0.1～100 μ m.Its reason is, under the situation below the 100 μ m, can obtain bigger restraining force at particle diameter, in addition, is more than the 0.1 μ m as if making particle diameter, then easy burning-off in second firing process.
In addition; In the manufacturing approach of the ceramic electronic component of claim 7; Before first firing process; Implement unsticking mixture operation at oxygen-containing atmosphere and under the burning-off material can not be by the temperature of burning-off, the adhesive that therefore can in unsticking mixture operation, remove substrate layer reliably and comprised retrains first firing process that burns till after can successfully implementing and makes second firing process of burning-off material burning-off.
In addition; Carrying out oxygen-containing atmosphere under the situation of unsticking mixture operation for example is meant air atmosphere, atmosphere is imported inert gas atmosphere etc.; Usually, under the such oxygen partial pressure conditions of higher of air atmosphere, implement unsticking mixture operation unsticking mixture efficiently.
In addition; In the present invention; As the method that forms restraint layer, can enumerate out as claim 8, making in advance comprises the thin slice of burning-off material, the method that its mode that contacts with at least one first type surface of substrate layer is configured; Or as claim 9, the thickener that will comprise the burning-off material is applied to the method etc. of at least one first type surface of substrate layer.
In addition; The present invention's's (claim 10) ceramic electronic component has following structure: promptly; Load sheet type electronic devices and components having on the ceramic formation body of surface conductor with terminal electrode; The surface conductor of ceramic formation body be connected with conductor, and the terminal electrode of sheet type electronic devices and components be connected with the conductor dbus oversintering affixed; The surface conductor of ceramic formation body and the terminal electrode of sheet type electronic devices and components are not electrically connected with conductor through connecting through scolder or electrically conducting adhesive, owing to do not use scolder, so can avoid the problem of scolder influent stream.In addition, the manufacturing approach of the invention through implementing claim 1 can be made the ceramic electronic component of aforesaid right requirement 10 more efficiently.
In addition; The sheet type electronic devices and components that the recess arrangement of the ceramic electronic component of claim 11 on the surface that is formed at ceramic formation body has can provide the ceramic electronic component of the high reliability of reduction and the open influent stream of realizing slimming, height as a whole.
In addition, the manufacturing approach of the invention through implementing claim 3 grade can be made the ceramic electronic component of aforesaid right requirement 11 more efficiently.
Description of drawings
Fig. 1 is the figure of the multilayer ceramic substrate of expression embodiments of the invention (embodiment 1).
Fig. 2 is illustrated in the figure that does not burn till duplexer that make, that have restraint layer in the operation of ceramic substrate of shop drawings 1.
Fig. 3 is illustrated in not burning till of Fig. 2 to be mounted with the figure of laminated ceramic capacitor as the state of sheet type electronic devices and components on the duplexer.
Fig. 4 is the figure of the multilayer ceramic substrate of expression another embodiment of the present invention (embodiment 2).
Fig. 5 is illustrated in the figure that does not burn till duplexer that make, that have restraint layer in the operation of ceramic substrate of shop drawings 4.
Fig. 6 is illustrated in the operation of manufacturing approach of multilayer ceramic substrate of embodiments of the invention 2, uses metal pattern to not burning till the figure that duplexer carries out the state of punch process.
Fig. 7 is illustrated in the operation of manufacturing approach of multilayer ceramic substrate of embodiments of the invention 2, uses metal pattern to not burning till the figure that duplexer has carried out the state after the punch process.
Fig. 8 is illustrated in not burning till of Fig. 7 to be mounted with the figure of laminated ceramic capacitor as the state of sheet type electronic devices and components on the duplexer.
Fig. 9 is the figure of variation of the ceramic multi-layer baseplate of expression embodiment 2.
Figure 10 is the existing figure that electronic devices and components is loaded into the method for ceramic substrate of explanation.
Label declaration
1 insulating ceramics layer
The 1a substrate is used ceramic green sheet
2 conductor portion
3a, 3b mounting electronic
10 bonding conductors
The 10a bonding conductor is used the via hole conductor
11 laminated ceramic capacitors (sheet type electronic devices and components)
12 pass through via hole
13 terminal electrodes
15 metal patterns
16 protuberances
21 surface conductors (external conductor)
The unsintered external conductor of 21a
22 interlayer conductors (inner conductor)
The unsintered inner conductor of 22a
23 via hole conductors (the via hole conductor is used in the interlayer connection)
The unsintered via hole conductor of 23a
31 restraint layers
32 do not burn till duplexer
33 restraint layers pass through via hole (restraint layer passes through via hole)
40 recesses
A, B ceramic electronic component (multilayer ceramic substrate)
Embodiment
Below, embodiments of the invention are shown, characteristic of the present invention is explained in more detail.
Embodiment 1
Fig. 1 is the figure of the ceramic electronic component (multilayer ceramic substrate) of expression one embodiment of the present of invention.
Multilayer ceramic substrate A shown in Figure 1 is the multilayer ceramic substrate with following structure: promptly, on the ceramic formation body with surface conductor 21, interlayer conductor 22 (in present embodiment 1, being the multilayer ceramic substrate main body) 20, be mounted with the sheet type electronic devices and components 11 (in present embodiment 1, being laminated ceramic capacitor) with terminal electrode 13.
Multilayer ceramic substrate main body 20 comprises multilayer insulation property ceramic layer 1 and conductor portion 2; Above-mentioned multilayer insulation property ceramic layer 1 is formed by the low-temperature sintered ceramics feedstock composition that contains ceramic powders and glass material, and above-mentioned conductor portion 2 is formed by interlayer conductor 22 and surface conductor 21 grades that are equipped on the surface.
As the low-temperature sintered ceramics constituent that constitutes the insulating ceramics layer, can use the low-temperature sintered ceramics constituent of the glass powder of the ceramic powders that for example mixed alumina type and pyrex class.
In addition, conductor portion 2 comprises: above-mentioned surface conductor 21 (external conductor); Be provided in the multilayer insulation property ceramic layer 1 that is bonded with each other, the interlayer conductor (inner conductor) 22 between 1; And conductor 22 is each other or connect the via hole conductor (interlayer be connected use the via hole conductor) 23 of surface conductor 21 and interlayer conductor 22 between articulamentum.
Surface conductor 21, interlayer conductor 22 form through surface conductor patterns and inner conductor pattern are burnt till, and above-mentioned surface conductor patterns and inner conductor pattern form through conductive paste (for example silver type conductive paste) is printed.In addition, via hole conductor 23 is through for example filled conductive property thickener, conductor powder in passing through via hole, and burns till and form.
And; In this multilayer ceramic substrate A; The surface conductor 21 of multilayer ceramic substrate main body 20 is electrically connected through being connected with conductor 10 with the terminal electrode 13 of laminated ceramic capacitor 11; And the surface conductor 21 of multilayer ceramic substrate main body 20 be connected come through sintering with conductor 10 affixed, in addition, the terminal electrode 13 of laminated ceramic capacitor 11 be connected with conductor 10 also affixed through sintering.
Promptly; In this multilayer ceramic substrate A; Laminated ceramic capacitor 11 as sheet type electronic devices and components does not use scolder and utilizes the affixed power of sintering to be installed on the multilayer ceramic substrate main body 20, and the terminal electrode 13 of surface conductor 21 and laminated ceramic capacitor 11 is electrically connected through being connected with conductor 10.
Next, the manufacturing approach of this multilayer ceramic substrate A is described.
(1) preparation comprises the substrate layer of ceramic powders and glass material
When forming the substrate layer of the major part that constitutes the multilayer ceramic substrate main body; At first add adhesive, dispersant, plasticizer respectively in right amount, reach organic solvent etc. to the mixed-powder that has mixed ceramic powders and glass material; They are mixed, thereby make ceramic size.
Ceramic powders can use many types, still as an example of preferred material, can enumerate out aluminium oxide (AL 2O 3) powder.
Glass material can be from beginning most just to contain the material of glass powder, also can be in firing process, to separate out vitreous material.In addition, such glass material also can be to separate out crystalline, the material of crystallization thus in the final stage of firing process at least.As glass material, can advantageously use the glass powder that for example can make the pyrex class that the such less crystalline of dielectric loss of forsterite, akermanite, diopside separates out.
Next, utilize methods such as scraping the skill in using a kitchen knife in cookery that above-mentioned ceramic size is formed sheet, make the raw cook (substrate is used ceramic green sheet) that substrate layer is used.
In addition, more specifically, with the glass powder (average grain diameter 1.5 μ m) of 50～64 weight % and the AL of 35～50 weight % as ceramic powders 2O 3(average grain diameter 1.0 μ m) mix and obtain mixture, and the composition of above-mentioned glass powder comprises the CaO of 10～55 weight %, the SiO of 45～70 weight % 2, 0～30 weight % Al 2O 3, the impurity of 0～10 weight %, and the B of 5～20 weight % 2O 3, this mixture is distributed to modulates slurry in the organic vehicle that forms by organic solvent, plasticizer etc., use and scrape the skill in using a kitchen knife in cookery, injection molding makes this slurry form sheet, uses ceramic green sheet thereby make substrate.In addition, as the AL of ceramic powders 2O 3Powder also can comprise the impurity of 0～10 weight %.
In addition, substrate (substrate layer) forms through range upon range of multi-disc ceramic green sheet usually, but also can be made up of one piece of ceramic green sheet.In addition, the ceramic green sheet that substrate preferably utilizes above-mentioned forming process to form with ceramic green sheet, but also can be the unsintered thick film screen printing layer that utilizes the thick film screen printing method to form.In addition, ceramic powders also can use the dielectric material of ferrite equimagnetic elastomer material, barium titanate etc. except above-mentioned insulating material.
In addition, preferably use low-temperature sintered ceramics raw cook as substrate with ceramic green sheet at the sintering temperature below 1050 ℃.And, preferably use powder as above-mentioned glass powder with the softening temperature below 750 ℃ for this reason.
In addition, in present embodiment 1, using ceramic green sheet to use glass powder with the ceramic powders of alumina type and the pyrex class thickness as main component, after burning till as substrate is the low-temperature sintered ceramics raw cook of 50 μ m.
(2) prepare restraint layer
The restraint layer that uses in the manufacturing approach as ceramic formation body of the present invention need have following two attributes:
(a) before the low-temperature sintered ceramics material sintering that constitutes substrate layer, in first firing process that promptly in hypoxic atmosphere, burns till, play and suppress the original function of restraint layer that substrate layer shrinks,
(b) afterwards, be higher than in second firing process that burns till under the condition of oxygen partial pressure of first firing process by burning-off at oxygen partial pressure.
Therefore, use and contain under the situation of in hypoxic atmosphere, burning till not by burning-off and improving under the situation that oxygen partial pressure burns till by the restraint layer of the burning-off material of burning-off as main component.
And, as preferred restraint layer, for example can use for example with the restraint layer of carbon dust as the burning-off material.
In addition, preferably burning-off material such as carbon dust is to have to make with its restraint layer as main component can bring into play the material of the characteristic of enough restraining forces, promptly can in first firing process, constitute the material of the restraint layer that is difficult to produce contraction.
In addition, the burning-off material that preferably constitutes restraint layer is the higher material of ignition temperature, makes that the burning-off material can be by burning-off in first firing process.Through using the higher material of ignition temperature as the burning-off material, thereby the heating-up temperature that can improve in the unsticking mixture operation is come unsticking mixture reliably, and can enlarge the range of choice of adhesive.
In addition, the for example ignition temperature of best burning-off material is more than 600 ℃.
In addition, in order to make the enough restraining forces of restraint layer performance, the glass material that is preferably comprised in the substrate layer can be penetrated into restraint layer reliably, forms permeable formation.For this reason, preferably set restraint layer, make the glass material of substrate layer can be penetrated into restraint layer reliably with the mode of being close to substrate layer.For example, form at the thin slice that range upon range of restraint layer is used under the situation of restraint layer, preferably make sheet material be crimped onto substrate layer, in addition, form under the situation of restraint layer, be preferably in and the printing anchor clamps are pressed into substrate layer make its state of being close under and to be coated with thickener at the coating thickener.
In addition, using under the situation of carbon dust as the burning-off material, preferably particle diameter is in the scope of 0.1～100 μ m.At particle diameter is under the situation below the 100 μ m, can obtain bigger restraining force.Under the situation more than the 0.1 μ m, in second firing process, be easy to by burning-off.
In addition; Though need import atmosphere in second firing process behind first firing process; In the higher atmosphere of oxygen partial pressure, burn till and make restraint layer burning, burning-off; But in order in second firing process, to make it easily by burning-off, preferably restraint layer is to be formed by for example carbon dust, adhesive, solvent, and reduces other additives.
In addition, preferably the thickness of restraint layer 31 is 100 μ m～200 μ m.Its reason is, is more than the 100 μ m through making thickness, can just play the function of restraint layer with one deck restraint layer, in addition, is below the 200 μ m through making thickness, can form sheet material easily.
Then; In this embodiment 1; Use is that the carbon dust of about 3 μ m is made restraint layer 31 (Fig. 2) as the thickener of main component with average grain diameter, passes through via hole (restraint layer passes through via hole) 33 (Fig. 2) what its preposition formed that via hole uses, and to pass through to restraint layer that via hole 33 fills with the Ag-Pd powder be the conductive paste of conductive compositions; As shown in Figure 2, make and to have comprised the bonding conductor that after preposition is burnt till, becomes bonding conductor 10 (Fig. 1) restraint layer 31 with via hole conductor 10a.
(3) sheet type electronic devices and components
In present embodiment 1, the sheet type electronic devices and components as the surface that is installed on multilayer ceramic substrate have used laminated ceramic capacitor 11 (with reference to Fig. 1).This laminated ceramic capacitor 11 is to obtain through 950 ℃ firing process, has the internal electrode that the Ag-Pd alloy forms, and has the terminal electrode 13 with predetermined internal electrode conducting at two ends.
(4) make duplexer
(a) make as stated, with ceramic powders and low-temperature sintered ceramics raw cook (substrate the use ceramic green sheet) 1a (Fig. 2) of glass material as main component in; What be provided for forming via hole conductor 23 as required passes through via hole 12 (Fig. 2); Through pass through via hole 12 filled conductive property thickener or conductor powders to this,, formation uses ceramic green sheet 1a thereby having comprised the substrate of unsintered via hole conductor 23a (Fig. 2).In addition, in present embodiment 1, serve as the sufficient conductive paste of conduction with the Ag-Pd alloy to passing through via hole 12 fillings.
(b) then, substrate with ceramic green sheet 1a on, printed silver class conductive paste for example as required, thus form unsintered external conductor 21a, inner conductor 22a (Fig. 2).
Next, as shown in Figure 2, with do not comprise the restraint layer 31 of bonding conductor with the via hole conductor, and multi-piece substrate with ceramic green sheet 1a, comprise that at preposition bonding conductor is range upon range of and carry out punch process according to this order with the restraint layer 31 of via hole conductor 10a.Thus, make have structure that kind shown in Figure 2, be equipped with restraint layer 31 in the both sides up and down of substrate layer (multilayer ceramic substrate that does not burn till) 20a do not burn till duplexer 32.
(5) carrier sheet type electronic devices and components
Then; To the bonding conductor that does not burn till restraint layer 31 duplexer 32, that comprise upper surface side organic type of spraying and adhesive bonding agent of zone coating of exposing face (upper surface), load laminated ceramic capacitor 11 as sheet type electronic devices and components (with reference to Fig. 3) with via hole conductor 10a.
(6) unsticking mixture and burning till
Afterwards, duplexer 32 programming rate with 1 ℃/minute in atmosphere that do not burn till that is mounted with this laminated ceramic capacitor 11 is warmed up to 400 ℃ from room temperature, keeps carrying out in one hour the unsticking mixture.
Afterwards, importing nitrogen, is 10 at oxygen partial pressure -5Under the condition of atm; The low-temperature sintered ceramics material that is promptly comprised in ceramic green sheet 1a at the substrate that constitutes substrate layer (the multilayer ceramic substrate main body of not burning till) 20a carries out sintering but the burning-off material that constitutes restraint layer 31 can not played by burning-off, restraint layer 31 and suppresses substrate layer (multilayer ceramic substrate) 20 under the hypoxic atmosphere of the function that kind of the contraction on the in-plane; Be warmed up to 870 ℃ with 1 ℃/minute programming rate from 400 ℃, keep 10 minutes (first firing process) at 870 ℃.
Then; Import atmosphere, oxygen partial pressure is under the condition of 0.21atm under normal pressure, promptly oxygen partial pressure be higher than first firing process oxygen partial pressure, constitute under can be by the burning-off such atmosphere of the burning-off material of restraint layer 31; Keep 10 minutes (second firing process), make restraint layer 31 by burning-off.
Thus, obtain ceramic electronic component (multilayer ceramic substrate) A with such structure shown in Figure 1.
In addition, the unsticking mixture operation before firing process usually can be through being warmed up to the temperature of adhesive decomposition or burning and keeping certain hour to carry out from room temperature in atmosphere.
For example, can be through in atmosphere, being warmed up to 400 ℃ and keep carrying out in 60 minutes the unsticking mixture from room temperature.
In addition, in the manufacturing approach of ceramic electronic component of the present invention, unsticking mixture operation is carried out in the higher atmosphere of the medium oxygen partial pressure of atmosphere, can obtain high efficiency, is preferred therefore.But, be lower than at oxygen partial pressure under the condition of oxygen partial pressure of atmosphere and also can carry out the unsticking mixture, according to circumstances, also can in than the much lower hypoxic atmosphere of the oxygen partial pressure of atmosphere, carry out the unsticking mixture.
In addition,, in first firing process, preferably for example after unsticking mixture operation, import nitrogen, in hypoxic atmosphere, carry out about the condition of firing process.In addition, in the present invention, the hypoxic atmosphere in first firing process is meant that oxygen partial pressure is lower than the atmosphere of the oxygen partial pressure of atmosphere, especially is being set at 10 with oxygen partial pressure -3～10 -6Under the situation of atm,, be preferred therefore because restraint layer can not retrained substrate layer by burning-off reliably.
In addition, be preferably in second firing process after first firing process finishes, import air and burn till.For example, under the condition of the temperature～room temperature in first firing process, carry out burning till about 10 minutes, thus burning-off restraint layer efficiently.
In addition, first firing process can be implemented under different firing temperatures with second firing process, but also can make the firing temperature in each firing process identical.In addition, can carry out first firing process and second firing process continuously, also can after carry out first firing process, put into stove once more after temporarily from stove, taking out and carry out second firing process.
As stated; Method according to present embodiment 1; The welding sequence that need not reflux etc. just can be made efficiently to have laminated ceramic capacitor (sheet type electronic devices and components) 11 is loaded into the multilayer ceramic substrate A of the structure of multilayer ceramic substrate main body (ceramic formation body) 20.
In addition; In the multilayer ceramic substrate A of present embodiment 1; Surface conductor 21 with multilayer ceramic substrate main body 20 comes affixed structure with bonding conductor 10, the terminal electrode 13 that reaches laminated ceramic capacitor 11 and bonding conductor 10 through sintering; Laminated ceramic capacitor 11 is not loaded on the multilayer ceramic substrate main body 20, therefore, the scolder influent stream can take place through scolder.
In addition; At substrate layer (multilayer ceramic substrate main body) 20a and sheet type electronic devices and components is to be folded with between the laminated ceramic capacitor 11 under the state of restraint layer 31 to burn till; Thereby can suppress the contraction of (multilayer ceramic substrate main body) 20a of substrate layer in first firing process on in-plane; And the contraction of substrate layer 20 can directly not influence laminated ceramic capacitor 11, therefore, can prevent in multilayer ceramic substrate main body 20 and laminated ceramic capacitor 11, to crack.
In addition; With under the multilayer ceramic substrate main body 20 direct state of contact do not burn till at laminated ceramic capacitor 11; Therefore the influence of the difference of thermal coefficient of expansion reduces, and this also can be reduced in the possibility that cracks in multilayer ceramic substrate main body 20 and the laminated ceramic capacitor 11.
And; The burning-off material that constitutes restraint layer 31 burns till under oxygen partial pressure is higher than the condition of oxygen partial pressure of first firing process in second firing process and by burning-off; Therefore need can not constituted restraint layer and retrain the situation of burning till as existing use by the material of burning-off; After finishing firing process, still need carry out removing the operation of restraint layer, thereby can simplify manufacturing process through the processing of physics such as wet shot, machinery.In addition, can prevent as above-mentioned existing use restraint layer retrains the situation of burning till, in removing the engineering of restraint layer, burnt till crack that body produces, collapse broken etc.
In addition, because restraint layer is by burning-off, can be not residual restraint layer between laminated ceramic capacitor 11 and the multilayer ceramic substrate main body 20 therefore at sheet type electronic devices and components, the problem that can prevent to produce etc. owing to residual restraint layer.
Thereby, according to the present invention, do not need complicated manufacturing process just can high production rate the high ceramic electronic component of manufacturing dimension precision.
Embodiment 2
Fig. 4 is the cutaway view of the ceramic electronic component (multilayer ceramic substrate B) of expression another embodiment of the present invention, and Fig. 5～Fig. 8 is the figure of its manufacturing approach of expression.
In Fig. 4～Fig. 8, with adding of Fig. 1～Fig. 3 the part of same numeral represent identical or suitable part.
In this multilayer ceramic substrate B, be that the surface of multilayer ceramic substrate main body 20 is formed with recess 40 at ceramic formation body, being equipped with sheet type electronic devices and components at this recess 40 is laminated ceramic capacitor 11.
If be elaborated; Then in this ceramic electronic component B; In the zone that is mounted with laminated ceramic capacitor 11 of the upper surface of multilayer ceramic substrate main body 20, promptly comprising in the zone of at least a portion in the zone that is equipped with the surface conductor 21 that is connected with the terminal electrode 13 of laminated ceramic capacitor 11; Be formed with recess 40; In the recess 40 of multilayer ceramic substrate main body 20, the terminal electrode 13 that is positioned at its a part of surface conductor 21 and laminated ceramic capacitor 11 is electrically connected through bonding conductor 10.
And the surface conductor 21 of multilayer ceramic substrate main body 20 is next affixed through sintering with bonding conductor 10, and in addition, the terminal electrode 13 of laminated ceramic capacitor 11 also comes affixed through sintering with bonding conductor 10.
In addition, in Fig. 4, omitted the diagram of the internal structure of multilayer ceramic substrate main body 20, but this structure and the foregoing description 1 is identical, and also identical with the foregoing description 1 of the structure of other parts.
As the multilayer ceramic substrate B of present embodiment 2; Surface in multilayer ceramic substrate main body 20 forms recess 40, disposes under the situation of laminated ceramic capacitor 11 at this recess 40; The effect under the situation of the multilayer ceramic substrate A that can obtain the foregoing description 1; Under the identical situation of the height of bonding conductor 10,, can also reduce the amount that is equivalent to recess 40 degree of depth for the whole height of product.
Below, the manufacturing approach of the laminated ceramic capacitor of present embodiment 2 is described.
With do not comprise the restraint layer 31 of bonding conductor with the via hole conductor, and with the used identical multi-piece substrate of embodiment 1 with ceramic green sheet 1a, to have a bonding conductor at preposition range upon range of and carry out punch process according to this order with the restraint layer 31 of via hole conductor 10a.Thus, make have structure that kind shown in Figure 5, be equipped with restraint layer 31 in the both sides up and down of substrate layer (multilayer ceramic substrate that does not burn till) 20a do not burn till duplexer 32.
Afterwards; As shown in Figure 6; The metal pattern 15 that use has roughly with the measure-alike protuberance 16 of the laminated ceramic capacitor that will load 11 carries out punch process, is not burning till that kind surperficial as shown in Figure 7 of duplexer 32, forms roughly the recess 40 of the size shape corresponding with laminated ceramic capacitor 11.In addition, recess 40 relate to substrate layer (multilayer ceramic substrate that does not burn till) 20a that the restraint layer 31 of upside contacts with lower surface with this restraint layer 31 the two and form.
Next, that kind as shown in Figure 8 is loaded laminated ceramic capacitor in the bottom surface of the recess 40 of the restraint layer 31 of upper surface side.At this moment; After comprising bonding conductor organic type of spraying and adhesive bonding agent of zone coating of exposing face with via hole conductor 10a; Laminated ceramic capacitor 11 is fixed to recess 40, makes the terminal electrode 13 of laminated ceramic capacitor 11 be connected with via hole conductor 10a with bonding conductor.
Then, duplexer 32 programming rate with 1 ℃/minute in atmosphere that do not burn till that is equipped with this laminated ceramic capacitor 11 being warmed up to 400 ℃ from room temperature, keeping coming in one hour the unsticking mixture, afterwards, import nitrogen, is 10 at oxygen partial pressure -5Under the condition of atm; The low-temperature sintered ceramics material that is promptly comprised in ceramic green sheet 1a at the substrate that constitutes substrate layer (the multilayer ceramic substrate main body of not burning till) 20 carries out sintering but the burning-off material that constitutes restraint layer 31 can not played by burning-off, restraint layer 31 and suppresses multilayer ceramic substrate 20 under the hypoxic atmosphere of the function that kind of the contraction on the in-plane; Be warmed up to 870 ℃ with 1 ℃/minute programming rate from 400 ℃, keep 10 minutes (first firing process) at 870 ℃.
Then; Import atmosphere, oxygen partial pressure is under the condition of 0.21atm under normal pressure, promptly oxygen partial pressure be higher than first firing process oxygen partial pressure, constitute under can be by the burning-off such atmosphere of the burning-off material of restraint layer 31; Keep 10 minutes (second firing process), make restraint layer 31 by burning-off.
Thus, can obtain to have ceramic electronic component (multilayer ceramic substrate) B of such structure shown in Figure 4.
As stated; The multilayer ceramic substrate B of present embodiment 2 has the structure that in the recess 40 on the surface of multilayer ceramic substrate main body 20, is equipped with laminated ceramic capacitor 11; Therefore the effect under the situation of the multilayer ceramic substrate A that can obtain the foregoing description 1; Under the identical situation of the height of bonding conductor 10,, can reduce the amount that is equivalent to recess 40 degree of depth for the whole height of product.
In addition; In present embodiment 2; The metal pattern 15 that use has roughly with the measure-alike protuberance 16 of the laminated ceramic capacitor that will load 11 carries out punch process, relate to substrate layer (multilayer ceramic substrate that does not burn till) 20a that the restraint layer 31 of upside contacts with lower surface with this restraint layer 31 the two and form recess 40, but height, the pressing force of the protuberance 16 through adjustment metal pattern 15; That kind as shown in Figure 9 also can obtain the only structure of formation recess 40 in restraint layer 30.
Recess 40 only is being formed under the situation of restraint layer 31, can reducing the size of bonding conductor on short transverse, can try hard to reduce the whole height of product according to the degree of depth of recess 40 according to the degree of depth of recess 40.
In addition; In the foregoing description 1 and 2; After comprising bonding conductor organic type of spraying and adhesive bonding agent of the zone coating of exposing face with via hole conductor 10a, load laminated ceramic capacitor 11, therefore can, laminated ceramic capacitor carry out firing process under being securely held on the state in precalculated position.Thereby, can guarantee the " loaded " position precision of laminated ceramic capacitor.In addition, in firing process,, have problems in the sheet type electronic devices and components that therefore can be after not burning till and the electrical connection of multilayer ceramic substrate because organic type of spraying and adhesive bonding agent be by burning-off.
In addition, use organic type of bonding agent of jet printing type, but except jet printing type, also can use for example organic type of bonding agent of cloth of coating-type.
In addition; In the foregoing description 1 and 2, be that multilayer ceramic substrate, sheet type electronic devices and components are that the situation of laminated ceramic capacitor is that example is illustrated to ceramic electronic component, but the invention is not restricted to this; Also can use multiple ceramic electronic components such as LC composite part electronic devices and components, ceramic filter; In addition, sheet type electronic devices and components also are not limited to laminated ceramic capacitor, also can application sheet type multilayer coil component, multiple type electronic devices and components such as chip-resistance.
The present invention also is not limited to the foregoing description in other each side; For the concrete kind and the concrete kind of the burning-off material of mixed ratio, formation restraint layer, the actual conditions of first and second firing process, the treatment conditions of unsticking mixture operation etc. of ceramic powders that constitutes substrate layer and glass material, can in scope of invention, add various application, distortion.
Practicality in the industry
As stated, according to the present invention, need not use the installation procedure of grafting materials such as scolder, conductive adhesive, just ability high efficient and reliable ground installation sheet type electronic devices and components can be made the ceramic electronic component that is mounted with sheet type electronic devices and components efficiently.
Thereby the present invention has the structure that is mounted with sheet type electronic devices and components, through the firing process manufacturing.

Claims (9)

1. the manufacturing approach of a ceramic electronic component is characterized in that,
Comprise: the duplexer production process; This duplexer production process is made and is not burnt till duplexer; This does not burn till duplexer and comprises substrate layer and restraint layer; Said substrate layer has surface conductor, comprises ceramic powders and glass powder, and said restraint layer is configured with the mode that contacts with a first type surface of said substrate layer at least; And be included in that oxygen partial pressure is lower than under the situation of burning till in the hypoxic atmosphere of atmosphere not by burning-off but make under the situation that its oxygen partial pressure that is higher than said hypoxic atmosphere burns till by the burning-off material of burning-off as main component improving oxygen partial pressure, also comprise the via hole conductor that is connected with said surface conductor;
Sheet type electronic devices and components load operation, and these sheet type electronic devices and components load operation sheet type electronic devices and components are loaded on the said restraint layer with the mode that its terminal electrode contacts with said via hole conductor; And,
Firing process; This firing process burns till the said duplexer that do not burn till; Make surface conductor and said via hole conductor, the terminal electrode that reaches said type electronic devices and components and the said via hole conductor of said substrate layer next affixed through sintering respectively; Make said surface conductor and said terminal electrode become the state that is electrically connected through said via hole conductor
Said firing process comprises:
First firing process, this first firing process burns till the said duplexer that do not burn till in said hypoxic atmosphere, makes the said burning-off material that constitutes said restraint layer not by burning-off, makes said substrate layer sintering; And,
Second firing process, this second firing process are higher than at oxygen partial pressure under the condition of oxygen partial pressure of said first firing process and burn till, and make the said burning-off material that constitutes said restraint layer by burning-off.
2. the manufacturing approach of ceramic electronic component as claimed in claim 1 is characterized in that,
In said duplexer production process, in the zone that is mounted with said type electronic devices and components on said restraint layer surface, promptly include in the zone of said via hole conductor and form recess.
3. the manufacturing approach of ceramic electronic component as claimed in claim 2 is characterized in that,
The surface of said substrate layer, with zone that the rear side in the zone that is formed with said recess of said restraint layer contacts in also form recess.
4. the manufacturing approach of ceramic electronic component as claimed in claim 2 is characterized in that,
In said duplexer production process, through pushing the metal pattern that has with the protuberance of the said corresponding size of type electronic devices and components from the upper surface side of said restraint layer, thereby form said recess.
5. like the manufacturing approach of each described ceramic electronic component of claim 1 to 4, it is characterized in that,
In said first firing process,, burns till the said glass material that said substrate layer comprised so that being penetrated into the mode of said restraint layer.
6. like the manufacturing approach of each described ceramic electronic component of claim 1 to 4, it is characterized in that,
Said burning-off material is a carbon dust.
7. like the manufacturing approach of each described ceramic electronic component of claim 1 to 4, it is characterized in that,
Said substrate layer comprises adhesive, and,
Comprise unsticking mixture operation, before said first firing process of this unsticking mixture operation in said firing process, remove the said adhesive that said substrate layer comprises,
Said unsticking mixture operation is implemented in oxygen-containing atmosphere and under said burning-off material can not be by the temperature of burning-off.
8. like the manufacturing approach of each described ceramic electronic component of claim 1 to 4, it is characterized in that,
In said duplexer production process, said restraint layer is to be configured with the mode that contacts with at least one first type surface of said substrate layer as the thin slice of main component and to form through comprising said burning-off material.
9. like the manufacturing approach of each described ceramic electronic component of claim 1 to 4, it is characterized in that,
In said duplexer production process, said restraint layer is to form as at least one first type surface that the thickener of main component is applied to said substrate layer through comprising said burning-off material.
CN2008801246321A 2008-01-11 2008-12-03 Method for manufacturing ceramic electronic component and ceramic electronic component Expired - Fee Related CN101911849B (en)

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