CN101909837B - Process for producing ceramic molded product - Google Patents

Process for producing ceramic molded product Download PDF

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Publication number
CN101909837B
CN101909837B CN200880124615.8A CN200880124615A CN101909837B CN 101909837 B CN101909837 B CN 101909837B CN 200880124615 A CN200880124615 A CN 200880124615A CN 101909837 B CN101909837 B CN 101909837B
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China
Prior art keywords
layer
restraint layer
burning
ceramic
firing process
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CN200880124615.8A
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CN101909837A (en
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冈田佳子
近川修
村田崇基
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C04B2235/662—Annealing after sintering
    • C04B2235/663—Oxidative annealing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

Disclosed is a process for producing a ceramic molded product, which does not damage to a ceramic molded product in a constraining layer removing step after the completion of a firing step and can produce a ceramic molded product with a high dimensional accuracy in a reliable and efficient manner. A first constraining layer (31) composed mainly of a burning-out material is provided so as to contact with a base material layer (A'). The burning-out material does not burn out when firing is carried out in a low-oxygen atmosphere while the burning-out material burns out when firing is carried out at an oxygen partial pressure above the oxygen partial pressure in the low-oxygen atmosphere. A second constraining layer (32) composed mainly of a ceramic powder, which is not sintered at the sintering temperature of the base material layer, is provided on the first constraining layer to form an unburned laminate (33). In a first firing step, constraining firing is carried out in a low-oxygen atmosphere, which does not burn out the burning-out material, to sinter the base material layer without shrinking in a planar direction. Thereafter, in a second firing step, firing is carried out at an oxygen partial pressure above the oxygen partial pressure adopted in the first firing step to burn out the first constraining layer.

Description

The manufacturing approach of ceramic formation body
Technical field
The present invention relates to the ceramic substrate is the manufacturing approach of the ceramic formation body of representative; At length say; The manufacturing approach of the ceramic formation bodies such as ceramic substrate that the present invention relates to the so-called constraint firing process of process and process; Said constraint firing process is restraint layer to be set by being burnt till on the body, the operation of in the contraction of the in-plane that suppresses to be burnt till body, burning till.
Background technology
Require the burning till of in-plane in the firing process of ceramic substrate etc. of high planar dimension precision to shrink and the meetings such as deviation of this contraction make a big impact to the quality of product in the ceramic electronic component.
So; As the method for in the contraction in suppressing above-mentioned firing process ceramic formation body being burnt till; Following process for calcining has for example been proposed: as shown in Figure 5; Under the firing temperature that is formed on ceramic formation body 51 on two interareas of ceramic formation body 51 in fact not sintering be layer (restraint layer) 52a, the 52b of main component with hard-to-sinter property materials such as aluminium oxide; Burn till (constraint is burnt till) with this state, can substantially not produce by this under the situation of burning till contraction of in-plane and burn till (with reference to patent documentation 1).
And, in the above-mentioned existing process for calcining,, need reduce the particle diameter of hard-to-sinter property material for improving the restraining force that restraint layer is brought into play.
But if reduce particle diameter, then substrate layer and restraint layer engage securely, therefore exist when burn till the back can be when removing restraint layer to substrate layer through methods such as wet blasts surperficial and electrode cause the problem of damage.For example realized under the situation of multilayer ceramic substrate of thin layerization, multiple stratification of ceramic layer and electrode layer,, existed substrate to crack or the problem of stripping electrode removing in the operation of restraint layer in manufacturing.
Patent documentation 1: japanese patent laid-open 4-243978 communique
The announcement of invention
The present invention is the invention that is used to address the above problem, its objective is removing of restraint layer after being provided at firing process finishes can not cause in the operation ceramic formation body as sintered body damage, can be reliably and the manufacturing approach of the ceramic formation body of the ceramic formation body that the manufacturing dimension precision is high efficiently.
In order to address the above problem, the manufacturing approach of the ceramic formation body of the application's claim 1 is characterised in that, comprising:
Make the duplexer production process that does not burn till duplexer; The said duplexer that do not burn till comprises substrate layer, first restraint layer and second restraint layer; Said substrate layer contains ceramic powders and glass material; After burning till, become ceramic formation body; Said first restraint layer is configured to join with at least one interarea of said substrate layer; And when in hypoxic atmosphere, burning till not burning-off and when in partial pressure of oxygen is higher than the atmosphere of said hypoxic atmosphere, burning till the burning-off material of burning-off be main component, the interarea that does not join with said substrate layer of the opposition side of the face that joins with said substrate layer that said second restraint layer is disposed at said first restraint layer, and with under the sintering temperature of said substrate layer not the ceramic powders of sintering be main component; And
Firing process in this firing process, burns till the said duplexer that do not burn till, and makes said substrate layer sintering;
Said firing process comprises:
First firing process in this first firing process, is comprising in said hypoxic atmosphere under the state of said first restraint layer and second restraint layer and burning till, and makes said substrate layer sintering; And
Second firing process in this second firing process, is higher than in partial pressure of oxygen under the condition of said first firing process and burns till, and makes the said burning-off material burning-off that constitutes said first restraint layer.
In addition, the manufacturing approach of the ceramic formation body of claim 2 is characterised in that, comprises that after said firing process the restraint layer of removing said second restraint layer removes operation.
In addition, the manufacturing approach of the ceramic formation body of claim 3 is characterised in that said ceramic formation body is a ceramic substrate.
In addition, the manufacturing approach of the ceramic formation body of claim 4 is characterised in that, in said first firing process, burns till so that the said glass material that said substrate layer comprised infiltrates into said first restraint layer.
In addition, the manufacturing approach of the ceramic formation body of claim 5 is characterised in that said burning-off material is a carbon dust.
In addition, the manufacturing approach of the ceramic formation body of claim 6 is characterised in that,
Said substrate layer comprises adhesive, and
Comprise the unsticking mixture operation of removing the said adhesive that said substrate layer comprises before said first firing process in said firing process,
Said unsticking mixture operation is not implemented under the temperature of burning-off in oxygen-containing atmosphere and at said burning-off material.
In addition; The manufacturing approach of the ceramic formation body of claim 7 is characterised in that; In said duplexer production process; Said first restraint layer is configured at least one interarea with said substrate layer through the sheet material that will contain its constituent material and joins and form, and said second restraint layer is configured on said first restraint layer through the sheet material that will contain its constituent material and forms.
In addition; The manufacturing approach of the ceramic formation body of claim 8 is characterised in that; In said duplexer production process; At least one interarea that said first restraint layer is coated said substrate layer through the thickener that will contain its constituent material forms, and said second restraint layer is coated on said first restraint layer through the thickener that will contain its constituent material and formed.
In addition, the manufacturing approach of the ceramic formation body of claim 9 is characterised in that said substrate layer has sandwich construction, and this sandwich construction comprises a plurality of layers that contain said ceramic powders and said glass material.
In addition, the manufacturing approach of the ceramic formation body of claim 10 is characterised in that at least one interarea of said substrate layer has wiring pattern.
In addition, the manufacturing approach of the ceramic formation body of claim 11 is characterised in that, also is included in the operation of mounting electronic devices on the outer surface that passes through the substrate layer after burning till in the said firing process.
In the manufacturing approach of the ceramic formation body of the application's claim 1; Will be when in hypoxic atmosphere, burning till not burning-off and when in partial pressure of oxygen is higher than the atmosphere of this hypoxic atmosphere, burning till the burning-off material of burning-off be that first restraint layer of main component is arranged to join with substrate layer; Again on first restraint layer (promptly; That interarea that does not join with substrate layer of first restraint layer) be provided with under the sintering temperature of substrate layer not the ceramic powders of sintering be second restraint layer of main component, do not burn till duplexer thereby form.Then; In first firing process, under the burning-off material can not the hypoxic atmosphere of burning-off, retrain and burn till, can not make substrate layer under the situation of shrinking on the in-plane, make its sintering; Then in second firing process, be higher than in partial pressure of oxygen under the condition of first firing process and burn till.Therefore, in first firing process, utilize first restraint layer between second restraint layer and substrate layer to stop in the firing process second restraint layer and substrate layer bonding securely.
In addition, in second firing process, owing to constitute the burning-off material burning-off of first restraint layer between second restraint layer and substrate layer, second restraint layer that therefore engages with substrate layer through first restraint layer and the joint of substrate layer are disengaged.
Therefore, after firing process finishes,, also can take out the substrate layer (ceramic formation body) that sinters even the operation of initiatively removing restraint layer is not set.Consequently, can not cause in the crackle of the ceramic formation body that restraint layer is produced when substrate layer is removed through physical method such as wet blast or sandblast for example or defective etc., can be with the high ceramic formation body of high utilization rate of raw materials manufacturing dimension precision.
Promptly; According to the present invention; In fact thickness through suitably adjusting firing temperature, firing atmosphere and first restraint layer etc. need not to be provided for initiatively to remove the ceramic formation body of the state that operation just can obtain to separate with restraint layer of restraint layer after firing process.
In addition, in the manufacturing approach of ceramic formation body of the present invention, in first firing process (constraint firing process), first restraint layer and second restraint layer apply the restraining force of the contraction that suppresses in-plane (with the direction of main surface parallel) to substrate layer.And through this restraining force, the sintering on the in-plane of substrate layer shrinks and is inhibited, and is burnt till in fact only sintering contraction on thickness direction of body, therefore can make the high ceramic formation body of dimensional accuracy of in-plane reliably.Especially among the present invention owing under the state of double-deck restraint layer, implement first firing process with first restraint layer and second restraint layer, so can obtain enough restraining forces.
In addition, the hypoxic atmosphere in first firing process of the present invention is meant partial pressure of oxygen than much lower atmosphere such as atmosphere, and the partial pressure of oxygen under the normal pressure of specifically can giving an example is 10 -2The atmosphere of (that is, the oxygen concentration in the atmosphere about 1vol% (volume %) below) below about atm (atmospheric pressure).
As the preferred condition of this hypoxic atmosphere, the partial pressure of oxygen under the normal pressure for example of can giving an example is 10 -3～10 -6Atm (the condition of oxygen concentration 0.1～0.0001vol%).
In addition, the condition that the partial pressure of oxygen in second firing process is higher than first firing process is meant and can makes above-mentioned burning-off material combustion and the atmosphere of the partial pressure of oxygen of burning-off that the partial pressure of oxygen under the normal pressure of specifically can giving an example is 10 -1The atmosphere of atm above (that is, the oxygen concentration in the atmosphere is more than 10vol%).
In addition; As stated, among the present invention, through in second firing process with the first restraint layer burning-off; Second restraint layer that engages with substrate layer through first restraint layer and the joint of substrate layer are disengaged; Second restraint layer separates with substrate layer, therefore the operation of removing second restraint layer can be set especially, but invention as claimed in claim 2 is said; Remove operation through the restraint layer of removing second restraint layer is set after firing process, can obtain to have removed more effectively the high ceramic formation body of reliability of restraint layer.In addition, in the stage behind second firing process,,, can damage substrate layer hardly so can remove second restraint layer easily because second restraint layer is not bonding with substrate layer.
In addition; Of claim 3; The present invention is applicable to the manufacturing approach of the ceramic substrate (comprising multilayer ceramic substrate) that the dimensional accuracy of hoping in-plane in the ceramic formation body and form accuracy are high, through adopting the present invention, the high ceramic substrate of manufacturing dimension precision efficiently.
In addition, during the manufacturing approach of the ceramic formation body of employing claim 4, in first firing process, the glass material that substrate layer comprised infiltrates into first restraint layer or infiltrates into first restraint layer and second restraint layer, thereby forms permeable formation.Then, restraint layer and substrate layer engage through this permeable formation securely, and utilize permeable formation to come to suppress effectively, prevent the contraction of the in-plane of the substrate layer in first firing process.
In addition, in order to obtain restraining force more effectively, better be that the glass material of substrate layer infiltrates into restraint layer effectively.For this reason, restraint layer better is to be arranged to and the substrate layer driving fit.
In addition, because constitute burning-off material burning-off in second firing process of first restraint layer, so as stated, in fact second restraint layer that engages with substrate layer through first restraint layer and the joint of substrate layer are removed in second firing process.
In addition; In the manufacturing approach of the ceramic formation body of claim 5; When in low oxygen partial pressure atmosphere, burning till in first firing process; The carbon dust that uses as the burning-off material of first restraint layer does not burn and does not shrink yet, and therefore can give full play to the function of burning till contraction that suppresses substrate layer, and when in second firing process, under the high keto sectional pressure condition, burning till; Said carbon dust burns and burning-off, therefore can give full play to the joint removing function that the joint of second restraint layer that engages with substrate layer through first restraint layer and substrate layer is removed.
In addition,, the increase of the average specific surface area of first restraint layer can be suppressed, employed organic bond amount can be reduced through suitably selecting the particle diameter of carbon dust.
In addition, as carbon dust, preferably use the carbon dust of particle diameter in the scope of 0.1～100 μ m.Particle diameter surpasses 100 μ m if this is, then restraining force is not enough, promptly; Particle diameter is when 100 μ m are following; Can obtain bigger restraining force, in addition, through making particle diameter more than 0.1 μ m; Can prevent carbon dust burning-off in first firing process, also can guarantee the easy burning-off property of carbon dust in second firing process on the other hand.
In addition; In the manufacturing approach of the ceramic formation body of claim 6; Before first firing process; In oxygen-containing atmosphere and at the burning-off material, do not implement unsticking mixture operation under the temperature of burning-off, the adhesive that therefore can remove substrate layer effectively and comprised is successfully implemented follow-up retraining first firing process that burns till and second firing process that makes the burning-off material burning-off that constitutes restraint layer.
Can give an example air atmosphere or atmosphere imported atmosphere that inert gas forms etc. of oxygen-containing atmosphere when in addition, carrying out unsticking mixture operation.Usually, under the such high keto sectional pressure condition of air atmosphere, implement said unsticking mixture operation and can accomplish the unsticking mixture more efficiently.
In addition; Among the present invention; As the method that forms first restraint layer and second restraint layer; It is of claim 7 to give an example, and at least one interarea that the sheet material of the constituent material through will containing first restraint layer is disposed at substrate layer forms first restraint layer, and the sheet material of the constituent material through will containing second restraint layer is configured in the method that forms second restraint layer on first restraint layer; Or it is of claim 8; At least one interarea that the thickener of the constituent material through will containing first restraint layer is coated substrate layer forms first restraint layer, and the thickener of the constituent material through will containing second restraint layer is coated on method that forms second restraint layer on first restraint layer etc.Through adopting these methods, restraint layer can be set efficiently.
In addition, the manufacturing approach of ceramic formation body as claimed in claim 9 is said, through substrate layer is processed sandwich construction, can make efficiently the flat shape precision good be the various ceramic formation bodies of representative with the ceramic substrate.
In addition; In the manufacturing approach of the ceramic formation body of claim 10; Because at least one interarea of substrate layer is formed with wiring pattern, therefore through using the ceramic formation body of processing by this method, can be of claim 11; Through mounting electronic devices on the substrate layer after burning till, making what have the structure that is mounted with electronic device on the outer surface efficiently is the ceramic formation body of representative with the ceramic substrate in firing process.
The simple declaration of accompanying drawing
Fig. 1 is the figure of the multilayer ceramic substrate processed of the manufacturing approach of the ceramic formation body of expression through embodiments of the invention (embodiment 1).
Fig. 2 is the figure that is mounted with the state of installing device on the ceramic substrate of presentation graphs 1.
Fig. 3 is the figure that does not burn till duplexer that comprises first restraint layer and second restraint layer that processes in the manufacturing process of ceramic substrate of presentation graphs 1 and Fig. 2.
Fig. 4 be the expression embodiments of the invention an operation in from the duplexer that comprises first restraint layer and second restraint layer burning-off figure of the state behind first restraint layer.
Fig. 5 representes that employing in the past is that the restraint layer of main component comes ceramic formation body is retrained the figure of the method for burning till with hard-to-sinter property material.
The explanation of symbol
1 insulation gonosome ceramic layer
The 1a substrate is used ceramic green
2 conductor portion
3a, 3b mounting electronic devices
12 through holes
21 surface conductors (external conductor)
The unsintered external conductor of 21a
22 interlayer conductors (inner conductor)
The unsintered inner conductor of 22a
23 via hole conductors
The unsintered via hole conductor of 23a
31 first restraint layers
32 second restraint layers
33 do not burn till duplexer
The A multilayer ceramic substrate
A ' substrate layer (multilayer ceramic substrate that does not burn till)
B is mounted with the multilayer ceramic substrate of installing device
The best mode that carries out an invention
Embodiment of the present invention is shown below, and the present invention will be described in more detail.
(1) contains the making of the substrate layer of oxygen ceramic powders and glass material
When forming the substrate layer of the major part that constitutes ceramic substrate; At first in the mixed-powder that mixes by ceramic powders and glass material, add an amount of adhesive, dispersant, plasticizer and organic solvent etc. respectively; They are mixed, thereby process ceramic size.
As ceramic powders, can use various ceramic powders, as an example of preferred material, the aluminium oxide of can giving an example (Al 2O 3) powder.
About glass material, can be from the beginning contain with the form of glass powder, also can in firing process, separate out the nature of glass.In addition, above-mentioned glass material also can separate out crystalline in the terminal stage at least of firing process, carries out crystallization by this.As glass material, can preferably use the glass powder of the borosilicate glass class that for example can separate out the little crystalline of the such dielectric loss of forsterite, akermanite or diopside.
Then, this ceramic size is configured as sheet, processes green compact (substrate when for example making multilayer ceramic substrate the is used ceramic green) 1a (Fig. 3) that substrate layer is used through methods such as scraper rubbing methods.
More specifically, with 50～64 weight % as the CaO that contains 10～55 weight % of glass powder, the SiO of 45～70 weight % 2, 0～30 weight % Al 2O 3, the impurity of 0～10 weight %, the B of 5～20 weight % 2O 3Glass powder (average grain diameter 1.5 μ m) and 35～50 weight % of composition as the Al of ceramic powders 2O 3Powder (average grain diameter 1.0 μ m) mixes, and this mixture is scattered in the organic carrier that is made up of organic solvent, plasticizer etc., is modulated into slurry.Through scraper rubbing method or casting method this slurry is configured as sheet then, processes substrate by this and use ceramic green.In addition, as the Al of ceramic powders 2O 3Powder also can contain the impurity of 0～10 weight %.
In addition, substrate (substrate layer) is usually through forming the polylith ceramic green is range upon range of, but also can be made up of a ceramic green.In addition, substrate also can be the unsintered thick film screen printing layer that forms through the thick film screen printing method with the ceramic green that ceramic green preferably forms through above-mentioned sheet material forming process.In addition, as ceramic powders, except that above-mentioned insulating material, also can use dielectric substances such as ferrite equimagnetic elastomer material or barium titanate.
In addition, use ceramic green, the preferred low-temperature sintered ceramics green compact that use at the sintering temperature below 1050 ℃ as substrate.For this reason, as above-mentioned glass powder, the preferred glass powder that uses with the softening point below 750 ℃.
(2) restraint layer
In the manufacturing approach of ceramic formation body of the present invention; Use first restraint layer and second restraint layer; Said first restraint layer when in hypoxic atmosphere, burning till not burning-off and when in partial pressure of oxygen is higher than the atmosphere of this hypoxic atmosphere, burning till the burning-off material of burning-off be main component; Said second restraint layer is arranged on first restraint layer, with under the sintering temperature of substrate layer not the ceramic powders of sintering be main component.
(a) first restraint layer
First restraint layer as being arranged to join with substrate layer must possess 2 following attributes:
(I) arrive till the low-temperature sintered ceramics material sintering that constitutes substrate layer, that is, in first firing process that in hypoxic atmosphere, burns till, play the restraint layer function originally of the contraction that suppresses substrate layer;
(II) be higher than burning-off in second firing process that burns till under the condition of first firing process in follow-up partial pressure of oxygen.
Therefore, among the present invention, as first restraint layer, use contain when in hypoxic atmosphere, burning till burning-off not and when in hyperoxia atmosphere, burning till the burning-off material of burning-off as the restraint layer of main component.
As first restraint layer, can use for example with the restraint layer of carbon dust as the burning-off material.
As burning-off materials such as carbon dusts, preferably use with it and can bring into play the carbon dust of the proterties of enough restraining forces as the restraint layer of main component, that is, can be formed in the carbon dust of the restraint layer that is difficult for shrinking in first firing process.
In addition, for make the burning-off material can be in first firing process burning-off, the burning-off material that constitutes first restraint layer preferably uses the high material of ignition temperature.In addition,, can improve the heating-up temperature in the unsticking mixture operation, carry out the unsticking mixture effectively, and can enlarge the range of choice of adhesive through using the high material of ignition temperature as the burning-off material.In addition, as burning-off materials such as carbon dusts, for example preferably use ignition temperature at the material more than 600 ℃.
In addition, for making the enough restraining forces of first restraint layer performance, better be that the glass material that substrate layer comprised infiltrates into first restraint layer effectively, form permeable formation.Therefore, for the glass material that makes substrate layer infiltrates into first restraint layer effectively, better be first restraint layer is arranged to and the substrate layer driving fit.For example; Restraint layer is range upon range of and when forming first restraint layer, better be that sheet material is crimped on substrate layer, in addition with sheet material; Coating thickener and when forming first restraint layer, better be will print anchor clamps press on substrate layer and with the state of substrate layer driving fit under be coated with thickener.
In addition, as the carbon dust of carbon dust preferable particle size in the scope of 0.1～100 μ m of burning-off material.This is because particle diameter when 100 μ m are following, can obtain bigger restraining force, in addition, particle diameter when 0.1 μ m is above, easy burning-off in second firing process.
In addition, better be to import atmosphere in second firing process behind first firing process, in high keto sectional pressure atmosphere, burn till, make the burning of first restraint layer by this and burning-off.For easy burning-off in second firing process, restraint layer better is to be formed by carbon dust, adhesive and solvent, and reduces other additive.
In addition, preferred 100～200 μ m of the thickness of first restraint layer.This is because the thickness through making first restraint layer more than 100 μ m, can be given its enough restraining force, and the thickness through making first restraint layer can easily carry out sheet material and be shaped below 200 μ m.
(b) second restraint layer
Second restraint layer engages with substrate layer through first restraint layer, is the restraint layer that is provided with in order to guarantee restraining force more effectively, use be with in the firing process of substrate layer in fact not the ceramic powders of sintering be the material of main component.As preferred ceramic powders, the for example alumina powder of can giving an example.
The powder of easy acquired character of alumina powder and stability of characteristics, and under the sintering temperature of substrate layer sintering not, possess desirable condition.
As the ceramic powders that constitutes second restraint layer, preferably using average grain diameter is the ceramic powders of 0.1～5.0 μ m.
If the average grain diameter deficiency of ceramic powders 0.1 μ m then because particle diameter is little, disperses so the organic principles such as adhesive in the sheet material are difficult to decompose in firing process, it is folded, undesirable that delamination takes place in substrate layer sometimes.In addition, if average grain diameter surpasses 5.0 μ m, the restraint of then burning till contraction descends, and is therefore undesirable.
In addition, the ceramic powders that constitutes second restraint layer be in the firing process of substrate layer in fact not the ceramic powders of sintering get final product, outside the alumina, also can use various ceramic powders such as zirconia or magnesia.
In addition, preferred 100～200 μ m of the thickness of second restraint layer.This is because the thickness through making second restraint layer more than 100 μ m, can be given its enough restraining force, and the thickness through making second restraint layer can easily carry out sheet material and be shaped below 200 μ m.
(3) conductor and the used conductive material of this conductor about being formed at substrate layer
Substrate layer is formed with in the stage of not burning till as conductive pattern of via hole conductor, via conductors, external conductor and inner conductor etc.; As wherein used conductive material, preferably use metal material (for example Ag) to be the conductive material of main component with low resistance and difficult oxidisability.
But, as conductive material, also can use other material, can use for example Ag-Pd, Au, Pt etc.
In addition, when requiring, also can in conductive material, add the Al more than a kind with ceramic bond strength 2O 3Deng additive.
In addition; Can add organic carrier with the ratio of regulation with respect to above-mentioned main component (conductive material); Stir, mixing, thereby process conductive paste, form as the conductive pattern of via hole conductor, via conductors, external conductor and inner conductor with this conductive paste etc.
But the proportioning of the kind of the main component of formation conductive paste, adding ingredient, organic carrier etc. does not have special qualification.
In addition, organic carrier is the carrier that adhesive resin and solvent form, and as adhesive resin, can use for example ethyl cellulose, acrylic resin, polyvinyl butyral resin, methacrylic resin etc.In addition, as solvent, can use for example terpineol, dihydroxy terpineol, dihydroxy terpineol acetic acid esters, BC, acetate of butyl carbitol, alcohols etc.Also can add various dispersants, plasticizer, activating agent etc. as required.
The conductive pattern on substrate layer surface also comprises the part that is used for perforation conductors such as the interconnective via hole conductor of the conductive pattern between levels, via conductors are exposed to the surface.These connect conductors can be through formation such as following methods: on the glass ceramics green compact, form through hole through punch process etc., insert above-mentioned thickener in this through hole through being printed on.
(4) unsticking mixture operation
The unsticking mixture operation of before firing process, implementing is usually through being warming up to the temperature of adhesive decomposition or burning and keeping certain hour to implement from room temperature in atmosphere.
For example can be through in atmosphere, being warming up to 400 ℃ and keep carrying out in 60 minutes the unsticking mixture from room temperature.
In addition, in the manufacturing approach of ceramic formation body of the present invention, for obtaining high efficiency, unsticking mixture operation better is in the medium high keto sectional pressure atmosphere of atmosphere, to carry out.But, be lower than in partial pressure of oxygen under the condition of atmosphere and also can carry out the unsticking mixture, according to circumstances also can in the partial pressure of oxygen hypoxic atmosphere more much lower, carry out than atmosphere.
(5) firing condition
(a) first firing process carries out through after unsticking mixture operation, importing nitrogen and the sintering temperature of substrate layer for example being warming up to 950 ℃ from 400 ℃.
Among the present invention, the hypoxic atmosphere in first firing process is meant that partial pressure of oxygen is lower than the atmosphere of atmosphere, and especially partial pressure of oxygen is 10 -3～10 -6During atm, the burning-off materials such as carbon dust in first restraint layer are burning-off not, can retrain substrate layer reliably, and are therefore preferable.
(b) second firing process is higher than in partial pressure of oxygen under the condition of first firing process and implements, and makes the burning-off material burning-offs such as for example carbon dust that constitute first restraint layer, thereby removes first restraint layer.
For example, finish the back at first firing process and import atmosphere, under normal pressure, under the partial pressure of oxygen 0.21atm, 950 ℃ condition, kept 10 minutes, make the carbon burning-off that constitutes first restraint layer by this.
In addition, first firing process can be implemented under identical firing temperature with second firing process as stated, but also can under different temperature, implement first firing process and second firing process.In addition, first firing process and second firing process can carry out continuously, also can after finishing first firing process, temporarily from stove, take out, and then drop in the stove and carry out second firing process.
As stated, through in second firing process with the first restraint layer burning-off, utilize second restraint layer that first restraint layer engages with substrate layer and the joint of substrate layer to be disengaged, second restraint layer separates with substrate layer.
Consequently, thickness through suitably adjusting firing temperature, firing atmosphere, restraint layer etc. even the operation of initiatively removing restraint layer is not set, also can take out the substrate layer (ceramic formation body) after burning till.
Therefore, with not causing crackle or defective equivalent damage the operation of restraint layer when substrate layer is removed to substrate layer (ceramic formation body), can be with the high ceramic formation body of high utilization rate of raw materials manufacturing dimension precision.
In addition; Through in second firing process with the first restraint layer burning-off; Utilize second restraint layer that first restraint layer engages with substrate layer and the joint of substrate layer to be disengaged, second restraint layer separates with substrate layer, therefore the operation of initiatively removing second restraint layer can be set; But when the residual residue that first restraint layer arranged or second restraint layer; The restraint layer of removing this residue and second restraint layer also can be set remove operation, at this moment, can obtain the high ceramic formation body of reliability that does not have residue etc. to adhere to more effectively.
In addition, as the method for removing restraint layer, the method for whisking off with hand etc. of can giving an example or with method of ultrasonic waves for cleaning etc.Through these methods, can easily remove restraint layer, can not cause damage to substrate layer and electrode.
In addition, among the present invention, that first restraint layer and second restraint layer is range upon range of and form restraint layer.If adopt this method, then compare with the situation of only using first restraint layer that constitutes by the burning-off material to form restraint layer, produce following effect.
In the method for the present invention, the thickness of first restraint layer is made as the thickness of first restraint layer when only forming restraint layer by first restraint layer when identical, can increases the thickness of whole restraint layer, therefore can strengthen restraining force.
In addition; The thickness of the restraint layer that first restraint layer and second restraint layer are cascaded is made as thickness with the restraint layer that is only formed by first restraint layer when identical; The former (the present invention) can reduce the thickness of first restraint layer with respect to whole restraint layer; Therefore compare with the latter, can reduce the variation of furnace atmosphere, can reduce pottery is burnt till the influence of body.
Below, embodiments of the invention are shown, characteristic point of the present invention is explained in more detail.
Embodiment 1
Fig. 1 is the figure of the multilayer ceramic substrate (ceramic formation body) processed of the manufacturing approach of the ceramic formation body of expression through embodiments of the invention (embodiment 1); Fig. 2 is the figure that is mounted with the state of installing device on the multilayer ceramic substrate of presentation graphs 1; Fig. 3 is the figure that does not burn till duplexer that comprises first restraint layer and second restraint layer that processes in the manufacturing process of multilayer ceramic substrate of presentation graphs 1 and Fig. 2, Fig. 4 be expression from the duplexer that comprises first restraint layer and second restraint layer burning-off figure of the state behind first restraint layer.
Multilayer ceramic substrate A shown in Figure 1 comprise to the low-temperature sintered ceramics feedstock composition that contains ceramic powders and glass material burn till and insulating ceramics layer 1, and the conductor portion 2 that is arranged at insulating ceramics layer 1.In addition, the multilayer ceramic substrate A of present embodiment 1 is the multilager base plate with the sandwich construction that is cascaded by polylith insulating ceramics layer 1.
As the low-temperature sintered ceramics composition that constitutes insulating ceramics layer 1, the low-temperature sintered ceramics composition that can use the glass powder with the ceramic powders of alumina type and borosilicate glass class to mix.
In addition; Conductor portion 2 is made up of surface conductor (external conductor) 21, interlayer conductor (inner conductor) 22, via hole conductor 23; Said surface conductor 21 is positioned at the surface of multilayer ceramic substrate A; Said interlayer conductor 22 is arranged at a plurality of insulating ceramics layers 1 of being bonded with each other, between 1, said via hole conductor 23 is connected to each other interlayer conductor 22, perhaps surface conductor 21 is connected with interlayer conductor 22.
Surface conductor 21 and interlayer conductor 22 burn till through external conductor film that printing conductive property thickener (for example silver class conductive paste) is formed and internal conductor membrane and form.In addition, via hole conductor 23 is for example through filled conductive property thickener or conductor powder in through hole and burn till and form.
In addition, the multilayer ceramic substrate B that is mounted with electronic device of Fig. 2 forms through on the multilayer ceramic substrate A of Fig. 1, mounting electronic devices 3a, 3b such as semiconductor element or chip capacitor being set.
Then, the manufacturing approach to this multilayer ceramic substrate A and B describes.
Describe with reference to Fig. 1～Fig. 4 below.
(1) at first, in the mixed-powder that mixes by ceramic powders and glass material, add an amount of adhesive, dispersant, plasticizer and organic solvent etc. respectively, they are mixed, thereby process ceramic size.
(2) then, this ceramic size is configured as sheet, processes substrate with ceramic green 1a (Fig. 3) through methods such as scraper rubbing methods.
In addition, at this, will
(a) 45 weight % are as the CaO that contains 43 weight % of glass powder, the SiO of 41 weight % 2, 7 weight % Al 2O 3, 6 weight % B 2O 3Composition glass powder with
(b) 55 weight % are as the Al of ceramic powders 2O 3Powder
Mix, this mixture is scattered in the organic carrier that is made up of organic solvent, plasticizer etc., be modulated into slurry.
Then, this slurry is configured as sheet, processes the substrate that thickness after burning till reaches 50 μ m and use ceramic green through scraper rubbing method or casting method etc.In addition, this substrate with the sintering temperature of ceramic green below 1050 ℃.
(3) then; Be formed for forming the through hole 12 (Fig. 3) of via hole conductor as required on ceramic green 1a at the substrate of gained; Form unsintered via hole conductor 23a (Fig. 3) (in the present embodiment 1, in through hole 12, filling with Ag is the conductive paste of conductive compositions) through filled conductive property thickener or conductor powder in this through hole 12.
(4) in addition, as required through printed silver class conductive paste for example and substrate with ceramic green 1a on the unsintered external conductor 21a of formation, inner conductor 22a (with reference to Fig. 3).
(5) in addition, make first restraint layer according to following steps.
At first, the carbon dust with respect to the average grain diameter 2 μ m of 100 weight portions mixes the adhesive of 12 weight portions, the dispersant of 1 weight portion, the plasticizer of 4 weight portions and the organic solvent of 100 weight portions, mixes, and uses slurry thereby process restraint layer.Then, this restraint layer is configured as sheet with slurry, processes first restraint layer of thick 100 μ m through the scraper rubbing method.
(6) in addition, make second restraint layer according to following steps.
At first, will aforesaid substrate with the firing temperature of ceramic green under in fact not the ceramic powders of sintering (in the present embodiment for alumina powder) be scattered in the organic carrier that constitutes by organic bond, organic solvent, plasticizer etc., be modulated into slurry.
Then, the gained slurry is configured as sheet, processes restraint layer and use ceramic green.In addition, in the present embodiment, use the alumina powder of average grain diameter 1 μ m as ceramic powders.
In addition, in the present embodiment, the thickness of second restraint layer is made as 300 μ m to guarantee enough restraining forces.
(7) then; As shown in Figure 3; With the polylith substrate with ceramic green 1a, first restraint layer 31, second restraint layer 32 by the regulation sequential cascade; Through methods such as hydrostatic pressing pressurizations; For example through the crimping with the exert pressure of 5～200MPa, do not burn till duplexer 33 thereby process, this does not burn till duplexer 33 and possesses the structure (with reference to Fig. 3) that on two interareas of the substrate layer with sandwich construction (multilayer ceramic substrate that the does not burn till) A ' of substrate is range upon range of with ceramic green 1a and formation, disposes first restraint layer 31, on first restraint layer 31, also disposes second restraint layer 32.
In the present embodiment 1, the thickness of substrate layer A ' is 250 μ m, and the thickness of first restraint layer 31 is 100 μ m, and the thickness of second restraint layer 32 is 300 μ m.
In addition, can as required this not burnt till duplexer 33 yet and cut into suitable size.
In addition, in the present embodiment that the polylith substrate is range upon range of and process the substrate layer A ' of sandwich construction with ceramic green 1a, but also can substrate be made as one with the piece number of ceramic green 1a, make the substrate layer of single layer structure, thereby process the ceramic substrate of single panel type.
In addition, in the present embodiment, first restraint layer 31 and second restraint layer 32 are set in the both sides up and down of substrate layer A ', but also can constitute an interarea that only is arranged at substrate layer A '.
In addition, first restraint layer 31 and second restraint layer 32 can also can be formed with ceramic green by a restraint layer through the polylith restraint layer is formed with ceramic green is range upon range of.
(8) then, in atmosphere, under lower skimming temp (the for example temperature about 400 ℃), this is not burnt till duplexer 33 and heat-treat, remove organic matters such as adhesive.
Then; The burning-off material that constitutes first restraint layer 31 at substrate layer A ' sintering is burning-off and the ceramic powders that constitutes second restraint layer 32 also not under the condition of sintering not; That is, in the present embodiment, the hypoxic atmosphere below oxygen concentration 1vol% (is partial pressure of oxygen 10 in the present embodiment -5Atm) be warming up to 850～950 ℃ and burn till in, make substrate layer A ' sintering (first firing process).
At this moment; The carbon dust that constitutes restraint layer 31 is burning-off and residual not; The ceramic powders that constitutes second restraint layer 32 is sintering not also, and therefore first restraint layer 31 and both restraining forces of second restraint layer 32 all are able to give full play to, and can suppress the contraction of the in-plane of substrate layer A ' effectively.
In addition, have first restraint layer 31 between second restraint layer 32 and the substrate layer A ', can prevent that therefore second restraint layer 32 is bonding securely with substrate layer A '.
(9) then,, partial pressure of oxygen burns till (second firing process) under being higher than the condition (in the present embodiment, partial pressure of oxygen is 0.21atm) of first firing process, and will be as the carbon dust burning-off of the burning-off material that constitutes first restraint layer 31.By this, represent schematically that first restraint layer 31 is removed, be disengaged through first restraint layer 31 second restraint layer 32 that engages with substrate layer A ' and the joint that substrate layer A ' burns till the multilayer ceramic substrate A (Fig. 1) that gets like Fig. 4.
Consequently,, firing process need not to be provided with the operation of removing second restraint layer 32 on one's own initiative, the desirable multilayer ceramic substrate A that goes out to have structure shown in Figure 1 after finishing as the ceramic formation body behind the sintering.
Promptly; Utilize the method for present embodiment; Can not cause crackle or defective of the ceramic formation body (multilayer ceramic substrate A) behind the sintering that produces when for example physical method such as wet blast or sandblast is removed restraint layer etc., can be with the high multilayer ceramic substrate A of high utilization rate of raw materials manufacturing dimension precision.
In addition, through on the multilayer ceramic substrate A of Fig. 1, loading mounting electronic devices 3a, 3b such as semiconductor element or chip capacitor, the ceramic formation body B that can obtain to have structure shown in Figure 2.
In addition; In the foregoing description; Situation to make as the ceramic substrate (multilayer ceramic substrate) of ceramic formation body is that example is illustrated; But the invention is not restricted to ceramic substrate, can be used for ceramic electronic components such as ceramic coil component, ceramic LC multiple devices is the manufacturing approach of the various ceramic formation bodies of representative.
Others of the present invention also are not limited to the foregoing description; For the burning-off material of the concrete kind of ceramic powders that constitutes substrate layer and glass material and proportioning, formation first restraint layer with constitute the actual conditions in concrete kind, first firing process and second firing process of the ceramic powders of second restraint layer, the treatment conditions in the unsticking mixture operation etc., can be in scope of invention in addition various application and change.
Utilizability in the industry
As stated, utilize the present invention, the removing of the restraint layer after firing process finishes can not cause in the operation ceramic formation body as sintered body damage, can be reliably and the high ceramic formation body of manufacturing dimension precision efficiently.
Therefore, the present invention can be widely used in the process firing process and the manufacturing field of ceramic formation bodies such as the ceramic substrate of processing, ceramic coil component, ceramic LC multiple device.

Claims (10)

1. the manufacturing approach of a ceramic formation body is characterized in that, comprising:
Make the duplexer production process that does not burn till duplexer; The said duplexer that do not burn till comprises substrate layer, first restraint layer and second restraint layer; Said substrate layer contains ceramic powders and glass material; After burning till, become ceramic formation body; Said first restraint layer is configured to join with at least one interarea of said substrate layer; And when in hypoxic atmosphere, burning till not burning-off and when in partial pressure of oxygen is higher than the atmosphere of said hypoxic atmosphere, burning till the burning-off material of burning-off be main component, the interarea that does not join with said substrate layer of the opposition side of the face that joins with said substrate layer that said second restraint layer is disposed at said first restraint layer, and with under the sintering temperature of said substrate layer not the ceramic powders of sintering be main component; And
Firing process in this firing process, burns till the said duplexer that do not burn till, and makes said substrate layer sintering;
Said firing process comprises:
First firing process in this first firing process, is comprising in said hypoxic atmosphere under the state of said first restraint layer and second restraint layer and burning till, and makes said substrate layer sintering; And
Second firing process in this second firing process, is higher than in partial pressure of oxygen under the condition of said first firing process and burns till, and makes the said burning-off material burning-off that constitutes said first restraint layer;
Said substrate layer comprises adhesive, and
Comprise the unsticking mixture operation of removing the said adhesive that said substrate layer comprises before said first firing process in said firing process,
Said unsticking mixture operation is not implemented under the temperature of burning-off in oxygen-containing atmosphere and at said burning-off material.
2. the manufacturing approach of ceramic formation body as claimed in claim 1 is characterized in that, comprises that after said firing process the restraint layer of removing said second restraint layer removes operation.
3. the manufacturing approach of ceramic formation body as claimed in claim 1 is characterized in that, said ceramic formation body is a ceramic substrate.
4. the manufacturing approach of ceramic formation body as claimed in claim 1 is characterized in that, in said first firing process, burns till so that the said glass material that said substrate layer comprised infiltrates into said first restraint layer.
5. the manufacturing approach of ceramic formation body as claimed in claim 1 is characterized in that, said burning-off material is a carbon dust.
6. the manufacturing approach of ceramic formation body as claimed in claim 1; It is characterized in that; In said duplexer production process; Said first restraint layer is configured at least one interarea with said substrate layer through the sheet material that will contain its constituent material and joins and form, and said second restraint layer is configured on said first restraint layer through the sheet material that will contain its constituent material and forms.
7. the manufacturing approach of ceramic formation body as claimed in claim 1; It is characterized in that; In said duplexer production process; At least one interarea that said first restraint layer is coated said substrate layer through the thickener that will contain its constituent material forms, and said second restraint layer is coated on said first restraint layer through the thickener that will contain its constituent material and formed.
8. the manufacturing approach of ceramic formation body as claimed in claim 1 is characterized in that, said substrate layer has sandwich construction, and this sandwich construction comprises a plurality of layers that contain said ceramic powders and said glass material.
9. the manufacturing approach of ceramic formation body as claimed in claim 1 is characterized in that, at least one interarea of said substrate layer has wiring pattern.
10. like the manufacturing approach of each the described ceramic formation body in the claim 1～9, it is characterized in that, also be included in the operation of mounting electronic devices on the outer surface that passes through the substrate layer after burning till in the said firing process.
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