JP4420137B2 - Manufacturing method of ceramic molded body - Google Patents

Description

  The present invention relates to a method for producing a ceramic molded body including a ceramic substrate. More specifically, the present invention relates to a so-called restraint in which a restraint layer is disposed on a fired body and firing is performed while suppressing shrinkage in the planar direction of the fired body. The present invention relates to a method for manufacturing a ceramic molded body such as a ceramic substrate manufactured through a firing step.

  Among ceramic electronic components, in a ceramic substrate or the like that requires high planar dimensional accuracy, firing shrinkage in the planar direction in the firing process, variations in the shrinkage, and the like greatly affect product quality.

  Therefore, as a method of firing the ceramic molded body while suppressing shrinkage in such a firing step, for example, as shown in FIG. 5, the firing temperature of the ceramic molded body 51 is set on both main surfaces of the ceramic molded body 51. By firing (constrained firing) in a state in which layers (constrained layers) 52a and 52b, which are mainly sintered and hardly sinterable material such as alumina, are formed, they are substantially in the plane direction. A firing method has been proposed in which firing can be performed so that firing shrinkage does not occur (see Patent Document 1).

And in the said conventional baking method, in order to raise the restraint force which a restraint layer exhibits, it is necessary to make the particle size of a hardly sinterable material small.
However, if the particle size is reduced, the base material layer and the constraining layer are strongly bonded, and therefore, when the constraining layer is removed by a method such as wet blasting after firing, the surface of the base material layer and the electrode are damaged. There is a point. For example, when manufacturing a multilayer ceramic substrate in which the ceramic layer or electrode layer is thinned or multilayered, the substrate may be cracked or the electrode may be peeled off in the constraining layer removal process. There are some problems.
JP-A-4-243978

  The present invention solves the above-mentioned problems, and does not damage the ceramic molded body, which is a sintered body, in the removal process of the constraining layer after the firing process, and reliably ensures a ceramic molded body with high dimensional accuracy. And it aims at providing the manufacturing method of the ceramic molded object which can be manufactured efficiently.

In order to solve the above-mentioned problem,
Containing a ceramic powder and a glass material, and a base material layer that becomes a ceramic molded body after firing;
It is disposed so as to be in contact with at least one main surface of the base material layer and is not burned down when fired in a low oxygen atmosphere, which is an atmosphere having a lower oxygen partial pressure than the atmosphere, but the oxygen content is lower than that in the low oxygen atmosphere. A first constraining layer whose main component is carbon powder , which is a burnt material that burns down when fired at a high pressure;
Ceramic powder that is disposed on the main surface of the first constraining layer that is opposite to the surface that contacts the base material layer and that does not contact the base material layer, and that does not sinter at the sintering temperature of the base material layer A second constrained layer comprising as a main component;
A laminate production step of producing an unfired laminate comprising:
A firing step of firing the green laminate and sintering the base material layer,
The firing step includes
In the low oxygen atmosphere, a first firing step of sintering the base material layer by firing in a state provided with the first and second constraining layers;
And a second firing step of firing the carbon powder constituting the first constraining layer by firing under a condition having a higher oxygen partial pressure than the first firing step.

  The method for producing a ceramic molded body according to claim 2 is characterized by comprising a constraining layer removing step of removing the second constraining layer after the firing step.

  The method for producing a ceramic molded body according to claim 3 is characterized in that the ceramic molded body is a ceramic substrate.

  The method for producing a ceramic molded body according to claim 4 is characterized in that, in the first firing step, firing is performed so that the glass material contained in the base material layer penetrates into the first constraining layer. Yes.

The method for producing a ceramic molded body according to claim 5 is:
The base material layer includes a binder, and
A binder removal step of removing the binder contained in the base material layer before the first firing step in the firing step;
The binder removal step is performed in an oxygen-containing atmosphere and at a temperature at which the carbon powder does not burn off.

In the method for manufacturing a ceramic molded body according to claim 6, in the laminate manufacturing step, the first constraining layer is configured such that a sheet containing the constituent material is in contact with at least one main surface of the base material layer. The second constraining layer is formed by disposing a sheet containing the constituent material on the first constraining layer.

In the method for manufacturing a ceramic molded body according to claim 7, in the laminate manufacturing step, the first constraining layer applies a paste containing the constituent material to at least one main surface of the base material layer. The second constraining layer is formed by applying a paste containing the constituent material on the first constraining layer.

The method for producing a ceramic molded body according to claim 8 is characterized in that the base material layer has a multi-layer structure including a plurality of layers containing the ceramic powder and the glass material.

The method for producing a ceramic molded body according to claim 9 is characterized in that the base material layer includes a wiring pattern on at least one main surface.

The method for producing a ceramic molded body according to claim 10 further includes a step of mounting an electronic component on the outer surface of the base material layer after being fired in the firing step.

In the method for producing a ceramic molded body according to claim 1 of the present invention , the low-oxygen atmosphere is not burned down when fired in a low-oxygen atmosphere in which the oxygen partial pressure is lower than the air so as to be in contact with the base material layer. A first constraining layer mainly composed of carbon powder , which is a burned-out material that burns down when fired at a higher oxygen partial pressure, and further on the first constraining layer (ie, the first constraining layer). The second constraining layer mainly comprising ceramic powder that does not sinter at the sintering temperature of the base material layer is disposed on the main surface of the constraining layer that does not contact the base material layer to form an unfired laminate. Like to do. Then, in the first firing step, restraint firing is performed in a low oxygen atmosphere in which the carbon powder is not burned out, and the base material layer is sintered without shrinking in the plane direction, and then in the second firing step, Firing is performed under conditions where the oxygen partial pressure is higher than that in one firing step. Therefore, the first constraining layer interposed between the second constraining layer and the base material layer in the first firing step prevents the second constraining layer and the base material layer from being firmly fixed in the firing step. Is done.
In addition, since the carbon powder constituting the first constraining layer interposed between the second constraining layer and the base material layer is burned out in the second firing step, it is bonded to the base material layer through the first constraining layer. The bonding between the second constraining layer and the base material layer that has been performed is released.

Therefore, it is possible to take out the sintered base material layer (ceramic molded body) without providing a step of positively removing the constraining layer after completion of the firing step. As a result, a ceramic molded body with high dimensional accuracy can be obtained without causing cracking or chipping of the ceramic molded body that occurs when the constraining layer is removed from the base material layer by a physical method such as wet blasting or sand blasting. , Can be manufactured with good yield.
That is, according to the present invention, by appropriately adjusting the firing temperature, the firing atmosphere, the thickness of the first constraining layer, etc., the removal step for positively removing the constraining layer after the firing step is virtually performed. Without providing, it becomes possible to obtain a ceramic molded body separated from the constraining layer.

  In the method for producing a ceramic molded body of the present invention, in the first firing step (constrained firing step), the first and second constraining layers are in a plane direction (a direction parallel to the main surface) with respect to the base material layer. Demonstrate the restraint force that suppresses the shrinkage. And this restraining force suppresses the sintering shrinkage in the plane direction of the base material layer, and the object to be fired substantially sinters and shrinks only in the thickness direction. The body can be manufactured reliably. In particular, in the present invention, since the first firing step is performed in a state in which a constraining layer having a two-layer structure of the first and second constraining layers is provided, a sufficient restraining force can be obtained.

Note that the low oxygen atmosphere in the first firing step of the present invention refers to an atmosphere whose oxygen partial pressure is considerably lower than air or the like. Specifically, the oxygen partial pressure is 10 under normal pressure. ^An atmosphere in which the oxygen concentration is about ⁻² atm or less (that is, the oxygen concentration in the atmosphere is about 1 vol% or less) is exemplified.

As a more preferable condition of this low oxygen atmosphere, for example, a condition in which the oxygen partial pressure is 10 ⁻³ to 10 ⁻⁶ atm (oxygen concentration 0.1 to 0.0001 vol%) under normal pressure is exemplified.
In the second firing step, the condition where the oxygen partial pressure is higher than that in the first firing step refers to an oxygen partial pressure atmosphere in which the carbon powder can be burned and burned. Is an atmosphere in which the oxygen partial pressure is 10 ⁻¹ atm or more under normal pressure (that is, the oxygen concentration in the atmosphere is 10 vol% or more).

  Note that the carbon powder used as the burnout material for the first constraining layer does not burn and does not shrink when fired in a low-oxygen atmosphere in the first firing step. In the second firing step, when the firing is performed under a condition having a high oxygen partial pressure, it burns and burns down, and thus the base material layer is interposed via the first constraining layer. It is possible to sufficiently exert the bonding release function for releasing the bonding between the second constraining layer and the base material layer that have been bonded.
  In addition, by appropriately selecting the particle size of the carbon powder, it is possible to suppress an increase in the average specific surface area of the first constraining layer, and the amount of the organic binder to be used can be reduced.

  Further, as described above, in the present invention, the second constraining layer joined to the base material layer via the first constraining layer by the first constraining layer being burned out in the second firing step; Since the bonding with the base material layer is released and the second constraining layer is separated from the base material layer, it is particularly possible not to provide a step of removing the second constraining layer. However, as in the invention of claim 2, by providing a constraining layer removing step for removing the second constraining layer after the firing step, a highly reliable ceramic molded body from which the constraining layer has been removed more reliably is obtained. It becomes possible to obtain. In the stage after the second firing step, the second constraining layer is not fixed to the base material layer, so the second constraining layer can be easily removed, and the base material layer may be damaged. rare.

  In addition, as described in claim 3, the present invention is suitable for application to a method of manufacturing a ceramic substrate (including a multilayer ceramic substrate) that preferably has high dimensional accuracy and shape accuracy in a planar direction among ceramic molded bodies. By using the present invention, a ceramic substrate having high dimensional accuracy can be efficiently manufactured.

  In the method for producing a ceramic molded body according to claim 4, in the first firing step, the glass material contained in the base material layer penetrates into the first constraining layer or the first and second constraining layers, and the permeation layer. Is formed. And while a constrained layer and a base material layer are strongly joined via this osmosis | permeation layer, the shrinkage | contraction of the planar direction of the base material layer in a 1st baking process is reliably suppressed and prevented by an osmosis | permeation layer.

In order to obtain a restraining force more reliably, it is desirable that the glass material of the base material layer surely penetrates into the restraining layer. For this purpose, it is desirable that the constraining layer is disposed so as to be in close contact with the base material layer.
Moreover, since the carbon powder which comprises a 1st constrained layer burns down by a 2nd baking process, joining of the 2nd constrained layer and base material layer which were joined to the base material layer via the 1st constrained layer As described above, this is effectively canceled in the second firing step.

  In addition, as a carbon powder, it is desirable to use a thing with the particle size of the range of 0.1-100 micrometers. This is because the binding force becomes insufficient when the particle size exceeds 100 μm, that is, when the particle size is 100 μm or less, a large binding force is obtained, and the particle size is set to 0.1 μm or more. This is because it can be prevented from being burned out in the first baking step, while being easy to be burned out in the second baking step.

In the method for manufacturing a ceramic molded body according to claim 5 , since the binder removal step is performed in an oxygen-containing atmosphere and at a temperature at which the carbon powder is not burned out before the first firing step, It is possible to smoothly carry out the first firing step in which the contained binder is reliably removed and the subsequent restraint firing is performed, and the second firing step in which the carbon powder constituting the restraint layer is burned off.
Note that examples of the oxygen-containing atmosphere in the binder removal step include an air atmosphere and an atmosphere in which air is introduced into an inert gas. Usually, the binder removal can be carried out more efficiently when carried out under a condition with a high oxygen partial pressure, such as an air atmosphere.

In the present invention, as a method of forming the first and second constraining layers, as in claim 6 , the first constraining layer, the sheet containing the constituent material thereof, and at least one of the base material layers are used. is formed by placing the main surface, the second constraining layers, a sheet containing the constituent materials, and a method of forming by arranging the first constraining layer, as claimed in claim 7, the The first constraining layer is formed by applying a paste containing the constituent material to at least one main surface of the base material layer, and the second constraining layer is formed by applying the paste containing the constituent material to the first The method of forming by apply | coating on a constrained layer, etc. are mentioned. By using these methods, the constraining layer can be efficiently disposed.

In addition, as in the method of manufacturing a ceramic molded body according to claim 8 , by making the base material layer into a multi-layer structure, various ceramic molded bodies including a ceramic substrate having excellent planar shape accuracy are efficiently manufactured. can do.

In the method of manufacturing the ceramic formed body according to claim 9, since at least one major surface to the wiring pattern of the base layer is formed by using the ceramic moldings produced in this way, it claims 10 As described above, electronic parts are mounted on the base material layer after being fired in the firing process, and ceramic molded bodies such as ceramic substrates having a structure in which the electronic parts are mounted on the outer surface are efficiently manufactured. can do.

It is a figure which shows the multilayer ceramic substrate manufactured by the manufacturing method of the ceramic molded body concerning the Example (Example 1) of this invention. It is a figure which shows the state which mounted mounting components on the ceramic substrate of FIG. It is a figure which shows the unbaking laminated body provided with the 1st and 2nd constrained layer produced at the process of manufacturing the ceramic substrate of FIG. 1 and FIG. It is a figure which shows the state which burned down the 1st constrained layer from the laminated body provided with the 1st and 2nd constrained layer by 1 process of the Example of this invention. It is a figure which shows the method of restraint baking of the ceramic molded object using the conventional constrained layer which makes a hardly sinterable material the main component.

DESCRIPTION OF SYMBOLS 1 Insulating ceramic layer 1a Ceramic green sheet for board | substrates 2 Conductor part 3a, 3b Mounting electronic component 12 Through-hole 21 Surface conductor (external conductor)
21a Unsintered outer conductor 22 Interlayer conductor (inner conductor)
22a unsintered inner conductor 23 via hole conductor 23a unsintered via hole conductor 31 first constraining layer 32 second constraining layer 33 unfired laminate A multilayer ceramic substrate A 'substrate layer (unsintered multilayer ceramic substrate )
B Multilayer ceramic substrate with mounted components

  Hereinafter, the present invention will be described in more detail with reference to embodiments of the present invention.

(1) Production of base material layer containing ceramic powder and glass material In forming the base material layer constituting the main part of the ceramic substrate, first, the binder mixed with the mixed powder obtained by mixing the ceramic powder and the glass material. Then, an appropriate amount of each of a dispersant, a plasticizer, an organic solvent, and the like are added and mixed to prepare a ceramic slurry.

Various ceramic powders can be used, and an example of a preferable material is alumina (Al ₂ O ₃ ) powder.

  The glass material may be contained as glass powder from the beginning, or may precipitate glassy material in the firing step. Further, such a glass material may be crystallized by depositing a crystalline substance at least in the final stage of the firing process. As the glass material, for example, a borosilicate glass-based glass powder capable of precipitating a crystalline material with low dielectric loss such as forsterite, akermanite or diopsite can be advantageously used.

Next, the ceramic slurry is formed into a sheet shape by a method such as a doctor blade method to produce a green sheet for a base layer (for example, a ceramic green sheet for a substrate in the case of producing a multilayer ceramic substrate) 1a (FIG. 3). .
Incidentally, more specifically, as a glass powder, CaO: L0～55 wt%, SiO _2: 45 to 70 wt%, Al ₂ O _3: 0 to 30 wt%, impurities: 0-10 wt%, B ₂ O ₃ : 50 to 64% by weight of glass powder (average particle size 1.5 μm) having a composition of 5 to 20% by weight, and 35% of Al ₂ O ₃ powder (average particle size 1.0 μm) as ceramic powder -50 wt% is mixed, and this mixture is dispersed in an organic vehicle composed of an organic solvent, a plasticizer, and the like to prepare a slurry. Then, this slurry is formed into a sheet by a doctor grade method or a casting method, thereby producing a ceramic green sheet for a substrate. The Al ₂ O ₃ powder as the ceramic powder may contain 0 to 10% by weight of impurities.

  The substrate (base material layer) is usually formed by laminating a plurality of ceramic green sheets, but may be composed of a single ceramic green sheet. The ceramic green sheet for a substrate is preferably a ceramic green sheet formed by the above-described sheet forming method, but may be an unsintered thick film printed layer formed by a thick film printing method. In addition to the insulator material described above, a magnetic material such as ferrite and a dielectric material such as barium titanate can also be used for the ceramic powder.

  Moreover, as the ceramic green sheet for substrates, it is preferable to use a low-temperature sintered ceramic green sheet that is sintered at a temperature of 1050 ° C. or lower. And for that purpose, it is desirable to use what has a softening point of 750 degrees C or less as the glass powder mentioned above.

(2) Constraining layer In the method for producing a ceramic molded body of the present invention, it is not burned down when fired in a low oxygen atmosphere, but is burned down when fired at a higher oxygen partial pressure than the low oxygen atmosphere. A first constraining layer mainly composed of carbon powder , and a second constraining layer mainly composed of ceramic powder disposed on the first constraining layer and not sintered at the sintering temperature of the base material layer; Is used.

(a) 1st constraining layer As the 1st constraining layer arrange | positioned so that a base material layer may be touched,
(A) Until the low-temperature sintered ceramic material constituting the base material layer is sintered, that is, in the first firing step of firing in a low oxygen atmosphere, the original function of the constraining layer that suppresses the shrinkage of the base material layer is achieved. Indeed,
(B) It is necessary to have the following two properties of burning out in the second baking step in which baking is performed under a condition where the oxygen partial pressure is higher than that in the first baking step.
Accordingly, in the present invention, as the first constraining layer, a constraining layer containing carbon powder as a main component that does not burn out when fired in a low oxygen atmosphere but is burned out when fired in a high oxygen atmosphere is used. It is done.

The carbon powder should be of such a property that the constraining layer containing it as a main component can exert a sufficient constraining force, that is, a material that can constitute a constraining layer that is unlikely to shrink in the first firing step. desirable.

In addition, it is desirable to use a carbon powder constituting the first constraining layer having a high combustion temperature so that the burned material does not burn in the first firing step. In addition, by using a material with a high combustion temperature as the burned-out material, it is possible to increase the heating temperature in the binder removal process, to reliably perform the binder removal, and to expand the range of binder selection. Become. For example, it is desirable to use carbon powder having a combustion temperature of 600 ° C. or higher.

  Further, in order to exert sufficient restraining force on the first constraining layer, the glass material contained in the base material layer surely permeates the first constraining layer so that the permeation layer is formed. preferable. For this purpose, it is desirable to arrange the first constraining layer in close contact with the base material layer so that the glass material of the base material layer surely penetrates into the first constraining layer. For example, when forming a first constraining layer by laminating sheets for constraining layers, it is desirable to pressure-bond the sheet to the base material layer, and when applying the paste to form the first constraining layer In this case, it is desirable to apply the paste in a state where the printing jig is pressed against the base material layer.

  Moreover, it is desirable that the carbon powder as the burned-out material has a particle size in the range of 0.1 to 100 μm. This is because when the particle size is 100 μm or less, a large restraining force can be obtained, and when the particle size is 0.1 μm or more, it is easy to burn out in the second firing step.

The first constraining layer is desirably burned and burned by introducing air in the second firing step after the first firing step and firing in an atmosphere having a high oxygen partial pressure. In order to make it easy to burn out in the second firing step, it is preferable to form the constraining layer from carbon powder, a binder and a solvent and to reduce other additives.
The thickness of the first constraining layer is preferably 100 to 200 μm. This is because a sufficient restraining force can be applied by setting the thickness of the first constraining layer to 100 μm or more, and sheet molding can be facilitated by setting the thickness to 200 μm or less. by.

(b) Second constraining layer The second constraining layer is bonded to the base material layer via the first constraining layer, and is disposed to ensure a restraining force more reliably. In this case, the main component is ceramic powder that is not substantially sintered in the firing step of the base material layer. A preferable ceramic powder is exemplified by alumina powder.
The alumina powder is easy to obtain a powder having stable properties and characteristics, and does not sinter at the sintering temperature of the base material layer, and has desirable conditions.

The ceramic powder constituting the second constraining layer is preferably one having an average particle size of 0.1 to 5.0 μm.
When the average particle size of the ceramic powder is less than 0.1 μm, due to the small particle size, organic components such as binders in the sheet are not easily decomposed and scattered in the firing process, and delamination occurs in the base material layer. Is not preferable. Further, if the average particle diameter exceeds 5.0 μm, the firing shrinkage suppressing power is reduced, which is not preferable.

  The ceramic powder constituting the second constraining layer may be any ceramic powder that does not substantially sinter in the firing step of the base material layer. In addition to alumina, various ceramic powders such as zirconia and magnesia are used. It is possible to use.

  The thickness of the second constraining layer is preferably 100 to 200 μm. This is because a sufficient constraining force can be applied by setting the thickness of the second constraining layer to 100 μm or more, and a sheet molding can be prepared by setting the thickness to 200 μm or less. by.

(3) Conductor to be formed on base material layer and conductive material used therefor In the base material layer, via hole conductors, through-hole conductors, external conductors, and conductor patterns to become internal conductors are formed in an unfired stage. As the conductive material used therefor, it is preferable to use a material having a metal material (for example, Ag) which is a low resistance and hardly oxidizing material as a main component.
However, other materials can be used as the conductive material, and for example, Ag—Pd, Au, Pt, or the like can be used.

In addition, when the bonding strength with ceramic is required, it is possible to add one or more additives such as Al ₂ O ₃ to the conductive material.
In addition, an organic vehicle is added to the main component (conductive material) at a predetermined ratio, and stirred and kneaded to produce a conductive paste. Using this, a via-hole conductor, a through-hole conductor, an external conductor and A conductor pattern to be an internal conductor can be formed.
However, there are no particular restrictions on the types and blending ratios of the main component, additive component, organic vehicle, and the like constituting the conductive paste.

  The organic vehicle is a mixture of a binder resin and a solvent. As the binder resin, for example, ethyl cellulose, acrylic resin, polyvinyl butyral, methacrylic resin, or the like can be used. As the solvent, for example, terpineol, dihydroterpineol, dihydroterpineol acetate, butyl carbitol, butyl carbitol acetate, alcohols and the like can be used. Furthermore, you may add various dispersing agents, a plasticizer, an activator, etc. as needed.

  Further, the conductor pattern on the surface of the base material layer includes a portion where a through conductor such as a via hole conductor or a through hole conductor for connecting conductor patterns between upper and lower layers is exposed on the surface. These through conductors can be formed by a method such as embedding the paste in a through hole formed in the glass ceramic green sheet by punching or the like.

(4) Binder removal step The binder removal step carried out before the firing step is usually carried out by raising the temperature from room temperature to the decomposition or combustion temperature of the binder in the atmosphere and holding it for a certain period of time.
For example, the binder can be removed by raising the temperature from room temperature to 400 ° C. in the air and holding it for 60 minutes.

  In the method for producing a ceramic molded body of the present invention, it is desirable to perform the binder removal step in an atmosphere having a high oxygen partial pressure, such as the air, in order to obtain high efficiency. However, it is possible to remove the binder even under a condition where the oxygen partial pressure is lower than that in the atmosphere, and in some cases, it is also possible to carry out in a low oxygen atmosphere where the oxygen partial pressure is considerably lower than that in the atmosphere.

(5) Firing conditions
(a) A 1st baking process is performed by introduce | transducing nitrogen after a binder removal process, and heating up from the sintering temperature of a base material layer, for example, 400 degreeC to 950 degreeC.
In the present invention, the low oxygen atmosphere in the first firing step refers to an atmosphere having an oxygen partial pressure lower than that of the atmosphere, but particularly when the oxygen partial pressure is 10 ⁻³ to 10 ⁻⁶ atm, The carbon powder is preferable because the base material layer can be reliably restrained without burning out.
(b) The second firing step is performed under a condition in which the oxygen partial pressure is higher than that of the first firing step, and the first constraining layer is removed by, for example , burning out carbon powder constituting the first constraining layer.
For example, after the completion of the first firing step, the atmosphere constituting the first constraining layer is introduced by introducing air and holding it under normal pressure, oxygen partial pressure 0.21 atm, and 950 ° C. for 10 minutes. Burn out.

  The first firing step and the second firing step may be performed at the same firing temperature as described above, but the first firing step and the second firing step may be performed at different temperatures. In addition, the first firing step and the second firing step may be performed continuously, or after the first firing step is performed, the first firing step is once taken out of the furnace and again put into the furnace to perform the second firing step. Also good.

As described above, when the first constraining layer is burned out in the second firing step, the bonding between the second constraining layer and the base material layer joined to the base material layer via the first constraining layer is performed. The second constraining layer is released from the base material layer.
As a result, by appropriately adjusting the firing temperature, firing atmosphere, constraining layer thickness, etc., it is possible to take out the fired base material layer (ceramic compact) without providing an active constraining layer removal step. Can do.
Accordingly, it is possible to produce a ceramic molded body with high dimensional accuracy with a high yield without damaging the substrate layer (ceramic molded body) such as cracking or chipping in the process of removing the constraining layer from the base material layer. it can.

In addition, joining of the 2nd constrained layer and base material layer which were joined to the base material layer via the 1st constraining layer is canceled by burning out the 1st constraining layer in the 2nd baking process, Since the second constraining layer is separated from the base material layer, there is no need to actively remove the second constraining layer, but the first constraining layer residue and the second constraining layer remain. In such a case, a constraining layer removing step for removing the residue and the second constraining layer may be provided. In that case, a highly reliable ceramic molded body that does not adhere to the residue or the like is further reliably provided. It becomes possible to obtain.
Examples of the method for removing the constraining layer include a method of wiping with a hand or the like, a method of ultrasonic cleaning, and the like. According to these methods, the constraining layer can be easily removed, and there is no possibility of damaging the base material layer or the electrode.
In the present invention, the constraining layer is formed by laminating the first constraining layer and the second constraining layer. According to this method, the following effects can be obtained as compared with the case where the constraining layer is formed only from the first constraining layer made of carbon powder .
In the method of the present invention, when the thickness of the first constraining layer is the same as the thickness of the first constraining layer when the constraining layer is formed only from the first constraining layer, the thickness of the entire constraining layer is increased. Therefore, the binding force can be increased.
Further, when the thickness of the constraining layer formed by laminating the first constraining layer and the second constraining layer is the same as the thickness of the constraining layer composed only of the first constraining layer, the former (the present invention) Since the thickness of the first constraining layer relative to the entire constraining layer can be reduced, changes in the furnace atmosphere can be suppressed compared to the latter, and the influence on the ceramic fired body can be suppressed. .

  Examples of the present invention will be described below to describe the features of the present invention in more detail.

FIG. 1 is a diagram showing a multilayer ceramic substrate (ceramic molded body) manufactured by a method for manufacturing a ceramic molded body according to an embodiment (Example 1) of the present invention, and FIG. 2 is mounted on the multilayer ceramic substrate of FIG. The figure which shows the state which mounted components, FIG. 3 is a figure which shows the unbaking laminated body provided with the 1st and 2nd constraining layer produced in the process of manufacturing the multilayer ceramic substrate of FIG. 1 and FIG. 4 is a view showing a state in which the first constraining layer is burned out from the laminate including the first and second constraining layers.
It is.

  A multilayer ceramic substrate A shown in FIG. 1 includes an insulating ceramic layer 1 obtained by firing a low-temperature sintered ceramic raw material composition containing ceramic powder and a glass material, and a conductor portion disposed on the insulating ceramic layer 1. 2 are provided. The multilayer ceramic substrate A of Example 1 is a multilayer substrate having a multilayer structure in which a plurality of insulating ceramic layers 1 are laminated.

  As the low-temperature sintered ceramic composition constituting the insulating ceramic layer 1, a low-temperature sintered ceramic composition in which an alumina-based ceramic powder and a borosilicate glass-based glass powder are blended is used.

  The conductor portion 2 includes a surface conductor (external conductor) 21 located on the surface of the multilayer ceramic substrate A, and an interlayer conductor (internal conductor) disposed between the plurality of insulating ceramic layers 1 and 1 joined to each other. 22 and the interlayer conductors 22 or via-hole conductors 23 connecting the surface conductors 21 and the interlayer conductors 22.

  The surface conductor 21 and the interlayer conductor 22 are formed by firing an external conductor film and an internal conductor film formed by printing a conductive paste (for example, a silver-based conductive paste). The via-hole conductor 23 is formed, for example, by filling a through hole with a conductive paste or conductor powder and firing it.

  2 is formed by disposing mounting electronic components 3a and 3b such as semiconductor elements and chip capacitors on the multilayer ceramic substrate A of FIG.

  Next, a method for manufacturing the multilayer ceramic substrates A and B will be described.

Hereinafter, description will be given with reference to FIGS.
(1) First, an appropriate amount of each of a binder, a dispersant, a plasticizer, an organic solvent, and the like was added to a mixed powder obtained by mixing a ceramic powder and a glass material, and these were mixed to prepare a ceramic slurry.

(2) Next, this ceramic slurry was formed into a sheet shape by a method such as a doctor blade method to produce a ceramic green sheet 1a (FIG. 3) for a substrate.
Here,
As (a) a glass powder, CaO 43% by weight, a SiO ₂ 44 wt%, the Al ₂ O ₃ 7% by weight, glass powder 45 wt% of the composition containing B ₂ O ₃ at a ratio of 6 wt% ,
(b) 55% by weight of Al ₂ O ₃ powder as ceramic powder,
And the mixture was dispersed in an organic vehicle composed of an organic solvent, a plasticizer and the like to prepare a slurry.
Then, the slurry was formed into a sheet shape by a doctor grade method or a casting method, thereby producing a ceramic green sheet for a substrate having a thickness such that the thickness after firing was 50 μm. In addition, the sintering temperature of this ceramic green sheet for substrates is 1050 ° C. or less.

  (3) Next, a through-hole 12 (FIG. 3) for forming a via-hole conductor is formed in the obtained ceramic green sheet for substrate 1a as necessary, and a conductive paste or conductor is formed in the through-hole 12 An unsintered via-hole conductor 23a (FIG. 3) was formed by filling the powder (in Example 1, the through-hole 12 was filled with a conductive paste containing Ag as a conductive component).

  (4) Moreover, the unsintered outer conductor 21a and the inner conductor 22a were formed on the ceramic green sheet 1a for a board | substrate as needed, for example by printing a silver-type electrically conductive paste (refer FIG. 3). ).

(5) Moreover, the 1st constrained layer was produced in the following procedures.
First, 12 parts by weight of a binder, 1 part by weight of a dispersant, 4 parts by weight of a plasticizer and 100 parts by weight of an organic solvent are blended and mixed with 100 parts by weight of carbon powder having an average particle size of 2 μm. A slurry is prepared. And this slurry for constrained layers was shape | molded by the doctor blade method in the sheet form, and produced the 1st constrained layer with a thickness of 100 micrometers.

(6) Moreover, the 2nd constrained layer was produced in the following procedures.
First, a ceramic powder (alumina powder in this example) that does not substantially sinter at the firing temperature of the ceramic green sheet for substrate is dispersed in an organic vehicle composed of an organic binder, an organic solvent, a plasticizer, and the like to prepare a slurry. did.
And the obtained slurry was shape | molded in the sheet form, and the ceramic green sheet for constrained layers was produced. In this example, alumina powder having an average particle size of 1 μm was used as the ceramic powder.
In this example, the thickness of the second constraining layer was set to 300 μm so as to ensure a sufficient restraining force.

(7) Next, as shown in FIG. 3, a plurality of substrate ceramic green sheets 1a, a first constraining layer 31, and a second constraining layer 32 are laminated in a predetermined order, and a method such as isostatic pressing is performed. For example, the substrate layer (unfired multilayer ceramic substrate) A ′ having a multi-layer structure formed by laminating the ceramic green sheets 1a for a substrate by pressing and pressure bonding at a pressure of 5 to 200 MPa. An unfired laminated body 33 having a structure in which the first constraining layer 31 is disposed on both main surfaces and the second constraining layer 32 is disposed on the first constraining layer 31 is manufactured (see FIG. 3). .
In Example 1, the thickness of the base material layer A ′ was 250 μm, the thickness of the first constraining layer 31 was 100 μm, and the thickness of the second constraining layer was 300 μm.
In addition, you may cut | disconnect this unbaking laminated body 33 to a suitable magnitude | size as needed.
Further, in this embodiment, a plurality of substrate ceramic green sheets 1a are laminated to produce a base material layer A ′ having a multilayer structure, but the number of substrate ceramic green sheets 1a is one, It is also possible to manufacture a single layer ceramic substrate by producing a single layer base material layer.
In this embodiment, the first constraining layer 31 and the second constraining layer 32 are disposed on both upper and lower sides of the base material layer A ′. However, the first constraining layer 31 is disposed only on one main surface of the base material layer A ′. It can also be configured to be provided.
The first constraining layer 31 and the second constraining layer 32 may be formed by laminating a plurality of constraining layer ceramic green sheets, or may be formed from a single constraining layer ceramic green sheet. Also good.

(8) Next, this unfired laminated body 33 was heat-treated in the atmosphere at a low degreasing temperature (for example, a temperature of about 400 ° C.) to remove organic substances such as a binder.
Thereafter, the base material layer A ′ is sintered, but the carbon powder constituting the first constraining layer 31 is not burned out, and the ceramic powder constituting the second constraining layer 32 is not sintered, that is, In this embodiment, the substrate layer A ′ is sintered by raising the temperature to 850 to 950 ° C. in a low oxygen atmosphere (oxygen partial pressure 10 ⁻⁵ atm in this embodiment) with an oxygen concentration of 1 vol% or less and firing. (First firing step).
At this time, the carbon powder constituting the constraining layer 31 remains without being burned out, and the ceramic powder constituting the second constraining layer 32 is not sintered, so that both the first constraining layer 31 and the second constraining layer 32 are used. Is sufficiently exerted, and the shrinkage of the base material layer A ′ in the planar direction is reliably suppressed.
In addition, since the first constraining layer 31 is interposed between the second constraining layer 32 and the base material layer A ′, the second constraining layer 32 and the base material layer A ′ are prevented from being firmly fixed. Is done.

(9) Thereafter, the carbon powder constituting the first constraining layer 31 is fired under the condition of higher oxygen partial pressure than in the first firing step (in this embodiment, oxygen partial pressure 0.21 atm) (second firing step). Burnt down. Thereby, as schematically shown in FIG. 4, the first constraining layer 31 is removed, and the second constraining layer 32 and the base bonded to the base material layer A ′ via the first constraining layer 31 are removed. Bonding with the multilayer ceramic substrate A (FIG. 1) on which the material layer A ′ is fired is released.
As a result, it is a sintered ceramic molded body having a structure as shown in FIG. 1 without having to provide a step of positively removing the second constraining layer 32 after the firing step. The multilayer ceramic substrate A could be taken out.
That is, according to the method of this embodiment, for example, cracking of the sintered ceramic molded body (multilayer ceramic substrate A) that occurs when the constraining layer is removed by a physical method such as wet blasting or sand blasting. The multi-layer ceramic substrate A with high dimensional accuracy could be manufactured with high yield without causing cracks or chipping.

  Further, by mounting the mounted electronic components 3a and 3b such as semiconductor elements and chip capacitors on the multilayer ceramic substrate A of FIG. 1, a ceramic molded body B having a structure as shown in FIG. 2 can be obtained.

  In the above embodiment, a case where a ceramic substrate (multilayer ceramic substrate) is manufactured as a ceramic molded body has been described as an example. However, the present invention is not limited to a ceramic substrate, but a ceramic coil component, a ceramic LC composite component, or the like. The present invention can be applied to various ceramic molded body manufacturing methods including electronic parts.

In addition, the present invention is not limited to the above-mentioned examples in other respects, and the specific types and blending ratios of the ceramic powder and glass material constituting the base material layer, and the carbon constituting the first constraining layer. Various applications within the scope of the invention regarding the specific types of the powder and the ceramic powder constituting the second constraining layer, the specific conditions in the first and second firing steps, the processing conditions in the binder removal step, etc. , Deformation can be added.

As described above, according to the present invention, the ceramic molded body, which is a sintered body, is not damaged in the removal process of the constraining layer after the firing process, and the ceramic molded body with high dimensional accuracy is surely obtained. It becomes possible to manufacture efficiently.
Therefore, the present invention can be widely used in the field of manufacturing ceramic molded bodies such as ceramic substrates, ceramic coil components, and ceramic LC composite components manufactured through a firing process.

Claims (10)

Containing a ceramic powder and a glass material, and a base material layer that becomes a ceramic molded body after firing;
It is disposed so as to be in contact with at least one main surface of the base material layer and is not burned down when fired in a low oxygen atmosphere, which is an atmosphere having a lower oxygen partial pressure than the atmosphere, but the oxygen content is lower than that in the low oxygen atmosphere. A first constraining layer whose main component is carbon powder , which is a burnt material that burns down when fired at a high pressure;
Ceramic powder that is disposed on the main surface of the first constraining layer that is opposite to the surface that contacts the base material layer and that does not contact the base material layer, and that does not sinter at the sintering temperature of the base material layer A second constrained layer comprising as a main component;
A laminate production step of producing an unfired laminate comprising:
A firing step of firing the green laminate and sintering the base material layer,
The firing step includes
In the low oxygen atmosphere, a first firing step of sintering the base material layer by firing in a state provided with the first and second constraining layers;
A second firing step of firing the carbon powder constituting the first constraining layer by firing under a condition having a higher oxygen partial pressure than the first firing step. Method.   The method for producing a ceramic molded body according to claim 1, further comprising a constraining layer removing step of removing the second constraining layer after the firing step.   3. The method of manufacturing a ceramic molded body according to claim 1, wherein the ceramic molded body is a ceramic substrate.   The ceramic according to claim 1, wherein in the first firing step, firing is performed so that the glass material contained in the base material layer penetrates into the first constraining layer. Manufacturing method of a molded object. The base material layer includes a binder, and
A binder removal step of removing the binder contained in the base material layer before the first firing step in the firing step;
The method for producing a ceramic molded body according to any one of claims 1 to 4 , wherein the binder removal step is performed in an oxygen-containing atmosphere and at a temperature at which the carbon powder does not burn off. In the laminate manufacturing step, the first constraining layer is formed by disposing a sheet containing the constituent material so as to contact at least one main surface of the base material layer, and the second constraining layer. Is formed by disposing a sheet containing the constituent material on the first constraining layer. The method for producing a ceramic molded body according to any one of claims 1 to 5 . In the laminate manufacturing step, the first constraining layer is formed by applying a paste containing the constituent material to at least one main surface of the base material layer, and the second constraining layer includes: The method for producing a ceramic molded body according to any one of claims 1 to 5 , wherein the ceramic molded body is formed by applying a paste containing a constituent material on the first constraining layer. The ceramic base body according to any one of claims 1 to 7 , wherein the base material layer has a multi-layer structure including a plurality of layers containing the ceramic powder and the glass material. Manufacturing method. The method for producing a ceramic molded body according to any one of claims 1 to 8 , wherein the base material layer includes a wiring pattern on at least one main surface. The method for producing a ceramic molded body according to any one of claims 1 to 9 , further comprising a step of mounting an electronic component on the outer surface of the base material layer after being fired in the firing step.

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