CN101905855A - 晶片级微器件的封装方法 - Google Patents
晶片级微器件的封装方法 Download PDFInfo
- Publication number
- CN101905855A CN101905855A CN2010101989357A CN201010198935A CN101905855A CN 101905855 A CN101905855 A CN 101905855A CN 2010101989357 A CN2010101989357 A CN 2010101989357A CN 201010198935 A CN201010198935 A CN 201010198935A CN 101905855 A CN101905855 A CN 101905855A
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- China
- Prior art keywords
- silicon wafer
- wafer
- film layer
- carbon film
- face
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18459809P | 2009-06-05 | 2009-06-05 | |
US61/184,598 | 2009-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101905855A true CN101905855A (zh) | 2010-12-08 |
CN101905855B CN101905855B (zh) | 2012-08-22 |
Family
ID=43261478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101989357A Active CN101905855B (zh) | 2009-06-05 | 2010-06-04 | 晶片级微器件的封装方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8043891B2 (zh) |
CN (1) | CN101905855B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102963864A (zh) * | 2012-12-11 | 2013-03-13 | 北京大学 | 一种基于bcb胶的晶片级微空腔的密封方法 |
CN104766798A (zh) * | 2015-03-27 | 2015-07-08 | 西安电子科技大学 | 改善SiC/SiO2界面粗糙度的方法 |
WO2020082624A1 (zh) * | 2018-10-26 | 2020-04-30 | 深圳市华星光电半导体显示技术有限公司 | 一种薄膜晶体管阵列基板的制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2969592B1 (fr) * | 2010-12-23 | 2013-02-08 | Commissariat Energie Atomique | Dispositif pour connecter des nano-objets a des systèmes électriques externes, et procédé de fabrication du dispositif |
US8575037B2 (en) * | 2010-12-27 | 2013-11-05 | Infineon Technologies Ag | Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same |
JP6073624B2 (ja) * | 2012-09-28 | 2017-02-01 | Hoya株式会社 | モールドプレス成形型の製造方法およびそのモールドプレス成形型、並びにそれを用いたガラス光学素子の製造方法 |
JP2014187354A (ja) * | 2013-02-21 | 2014-10-02 | Ricoh Co Ltd | デバイス、及びデバイスの作製方法 |
US9969613B2 (en) | 2013-04-12 | 2018-05-15 | International Business Machines Corporation | Method for forming micro-electro-mechanical system (MEMS) beam structure |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6844623B1 (en) * | 2000-05-16 | 2005-01-18 | Sandia Corporation | Temporary coatings for protection of microelectronic devices during packaging |
CN101244613A (zh) * | 2007-02-16 | 2008-08-20 | 探微科技股份有限公司 | 保护晶片正面结构及进行晶片切割的方法 |
CN101312904A (zh) * | 2005-11-23 | 2008-11-26 | Vti技术有限公司 | 制造微机电元件的方法以及该微机电元件 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914507A (en) * | 1994-05-11 | 1999-06-22 | Regents Of The University Of Minnesota | PZT microdevice |
US5963289A (en) * | 1997-10-27 | 1999-10-05 | S Vision | Asymmetrical scribe and separation method of manufacturing liquid crystal devices on silicon wafers |
IL133453A0 (en) * | 1999-12-10 | 2001-04-30 | Shellcase Ltd | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
US6660564B2 (en) * | 2002-01-25 | 2003-12-09 | Sony Corporation | Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby |
US6635509B1 (en) * | 2002-04-12 | 2003-10-21 | Dalsa Semiconductor Inc. | Wafer-level MEMS packaging |
US6953985B2 (en) * | 2002-06-12 | 2005-10-11 | Freescale Semiconductor, Inc. | Wafer level MEMS packaging |
JP4528124B2 (ja) * | 2002-09-06 | 2010-08-18 | フラウンホファー ゲセルシャフト ツール フェールデルンク ダー アンゲヴァンテン フォルシュンク エー.ファオ. | 平面基板構造化方法、平面基板製造方法、部品を電気的に接触させる方法 |
US6806557B2 (en) * | 2002-09-30 | 2004-10-19 | Motorola, Inc. | Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum |
US6972480B2 (en) * | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
US7159047B2 (en) * | 2004-04-21 | 2007-01-02 | Tezzaron Semiconductor | Network with programmable interconnect nodes adapted to large integrated circuits |
US7102467B2 (en) * | 2004-04-28 | 2006-09-05 | Robert Bosch Gmbh | Method for adjusting the frequency of a MEMS resonator |
US7245009B2 (en) * | 2005-06-29 | 2007-07-17 | Motorola, Inc. | Hermetic cavity package |
US7323401B2 (en) * | 2005-08-08 | 2008-01-29 | Applied Materials, Inc. | Semiconductor substrate process using a low temperature deposited carbon-containing hard mask |
US7393758B2 (en) * | 2005-11-03 | 2008-07-01 | Maxim Integrated Products, Inc. | Wafer level packaging process |
US20070243662A1 (en) * | 2006-03-17 | 2007-10-18 | Johnson Donald W | Packaging of MEMS devices |
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2010
- 2010-06-03 US US12/793,295 patent/US8043891B2/en active Active
- 2010-06-04 CN CN2010101989357A patent/CN101905855B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6844623B1 (en) * | 2000-05-16 | 2005-01-18 | Sandia Corporation | Temporary coatings for protection of microelectronic devices during packaging |
CN101312904A (zh) * | 2005-11-23 | 2008-11-26 | Vti技术有限公司 | 制造微机电元件的方法以及该微机电元件 |
CN101244613A (zh) * | 2007-02-16 | 2008-08-20 | 探微科技股份有限公司 | 保护晶片正面结构及进行晶片切割的方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102963864A (zh) * | 2012-12-11 | 2013-03-13 | 北京大学 | 一种基于bcb胶的晶片级微空腔的密封方法 |
CN102963864B (zh) * | 2012-12-11 | 2015-05-20 | 北京大学 | 一种基于bcb胶的晶片级微空腔的密封方法 |
CN104766798A (zh) * | 2015-03-27 | 2015-07-08 | 西安电子科技大学 | 改善SiC/SiO2界面粗糙度的方法 |
WO2020082624A1 (zh) * | 2018-10-26 | 2020-04-30 | 深圳市华星光电半导体显示技术有限公司 | 一种薄膜晶体管阵列基板的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100311209A1 (en) | 2010-12-09 |
US8043891B2 (en) | 2011-10-25 |
CN101905855B (zh) | 2012-08-22 |
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ASS | Succession or assignment of patent right |
Owner name: SHANGHAI LIHENG LIGHT MICROELECTRONICS TECHNOLOGY Free format text: FORMER OWNER: JIANGSU LIHENG ELECTRONICS CO., LTD. Effective date: 20120611 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 212009 ZHENJIANG, JIANGSU PROVINCE TO: PUDONG NEW AREA, SHANGHAI |
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TA01 | Transfer of patent application right |
Effective date of registration: 20120611 Address after: Room 5, building 3000, long East Road, Zhangjiang hi tech park, Shanghai, Applicant after: Shanghai Lexvu Opto Mircoelectrics Technology Co., Ltd. Address before: 212009 Zhenjiang hi tech Industrial Development Zone, Jiangsu Province, No. twelve, No. 211, room 668 Applicant before: Jiangsu Liheng Electronic Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160407 Address after: 710075, arc building, No. 60, West Avenue, new industrial park, hi tech Zone, Shaanxi, Xi'an, 204 Patentee after: Xi'an Yisheng Photoelectric Technology Co., Ltd. Address before: 201203, Shanghai Zhangjiang hi tech park, 3000 East Road, No. 5 building, room 501B Patentee before: Shanghai Lexvu Opto Mircoelectrics Technology Co., Ltd. |