CN101898390A - Break-up device and method for dividing - Google Patents
Break-up device and method for dividing Download PDFInfo
- Publication number
- CN101898390A CN101898390A CN2010101890962A CN201010189096A CN101898390A CN 101898390 A CN101898390 A CN 101898390A CN 2010101890962 A CN2010101890962 A CN 2010101890962A CN 201010189096 A CN201010189096 A CN 201010189096A CN 101898390 A CN101898390 A CN 101898390A
- Authority
- CN
- China
- Prior art keywords
- substrate
- platform
- disjunction
- broken string
- break
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
Abstract
The present invention relates to a kind of break-up device and method for dividing.The present invention can apply even power and carry out disjunction exactly forming the substrate of cutting line.Substrate is remained on the platform 22, make substrate outstanding and utilize location division 30 to be located to the side of platform 22.Utilize grip unit 40 to fix the part of substrate 23 on platform then.Then use disjunction unit 50 from pushing the ledge of substrate 23, and carry out disjunction along cutting line.Even if the little substrate of diameter whereby also can apply even power and easily carries out disjunction.
Description
Technical field
The invention particularly relates to a kind of break-up device and method for dividing that is used to cut off brittle substrates such as low-temperature co-fired ceramic substrate, HTCC substrate.
Background technology
LTCC (hereinafter referred to as LTCC (Low Temperature Co-Fired Ceramic)) is as infrabasal plate: on the thin slice that aluminium oxide aggregate and glass material mix conductor is carried out distribution and forms multilayer film, with about 800 ℃ low temperature co-fired described multilayer film.Ltcc substrate is to form a plurality of cancellate functional areas on 1 motherboard simultaneously, and corresponding each functional area is cut apart described a plurality of functional area and used.Shown in patent documentation 1, be to use pottery to rule with scriber in the past, and manual disjunction ltcc substrate.The situation of utilizing cutting tool and mechanically cutting off ltcc substrate is also arranged in addition.
[conventional art document]
[patent documentation]
No. 3116743 communique of [patent documentation 1] Japan Patent
Summary of the invention
[inventing problem to be solved]
Utilized in the dividing method of machine cuts, not only cutting is quite time-consuming, and is difficult to cut exactly in the past.And, have the shortcoming of fixed space of producing dust when cutting off or must between each the little substrate on the motherboard, being provided for cutting off in advance and so on.
Also cut line and when portraying motherboard exactly, can cut apart at ltcc substrate along cutting line along required.
But when forming after the line manual disjunction on ltcc substrate etc., its shape is limited.For example if substrate greater than the square just ltcc substrate after manually disjunction is portrayed of 5mm etc.Yet,, be difficult to apply even power and carry out disjunction if size is square less than 5mm.Has bad and so on the shortcoming of the cutting that easily produces goods when forcing disjunction.
The object of the present invention is to provide a kind of break-up device and the method for dividing cut disjunction easily after the line that on substrate, form.
[technological means of dealing with problems]
In order to solve described problem, break-up device of the present invention comprises: platform, mounting are being pre-formed cuts the line and the substrate that should cut off, and with its end as a minute broken string; Grip unit makes the line of cutting of the substrate on the described platform be kept from the outstanding laterally T1 (〉=0) of the branch broken string of platform end; And the disjunction unit, be arranged on the side of described platform with respect to the face of platform with moving freely, push from the end of the outstanding substrate of described platform, and carry out disjunction.
Can also more comprise mechanism for monitoring herein, be used for discerning position from the outstanding substrate in the end of described platform.
Herein, described disjunction unit also can make segmenting part move up and down from its end from the position that the branch broken string of described platform leaves T2 (〉=0) laterally.
Herein, described disjunction unit also can make segmenting part leave the position rotation of T2 (〉=0) laterally from the branch broken string of described platform end from its end.
In order to solve described problem, method for dividing of the present invention with the end as minute platform of broken string on mounting be pre-formed and cutting the line and the substrate that should cut off, the line of cutting of the substrate on the described platform is kept from the outstanding laterally T1 (〉=0) of the branch broken string of platform end, push from the end of the outstanding substrate of described platform from the side of described platform, and carry out disjunction.
Herein, described disjunction step also can move up and down described segmenting part in (left side) position of leaving T2 (〉=0) from the branch broken string of described platform from the right-hand end of segmenting part laterally.
Herein, described disjunction step also can make the segmenting part rotation in (left side) position of leaving T2 (〉=0) from the branch broken string of described platform end laterally from the right-hand end of segmenting part.
As the substrate of object of the present invention, ceramic substrate, other various brittle substrates except that glass such as low-temperature co-fired ceramic substrate, HTCC substrate have been comprised.
[effect of invention]
According to the present invention with this kind feature, can be corresponding each cut that line positions and along cutting that line applies even power and in addition disjunction.Therefore, though brittle substrate can its shape and is cut apart along cutting line.So, less or in the size of substrate, effective especially by cutting apart under the situation that obtains little goods below the 5mm for example.
Description of drawings
Fig. 1 is the plane of the break-up device of the 1st example of the present invention.
Fig. 2 is the front view of the break-up device of this example.
Fig. 3 (a)～(c) is the part side view of different shape of the platform end of this example of expression.
Fig. 4 A is the figure of the position relation of expression platform end and substrate and disjunction unit.
Fig. 4 B is the figure of the position relation of expression platform end and substrate and disjunction unit.
Fig. 5 A is the figure of the position relation of expression platform end and substrate and disjunction unit.
Fig. 5 B is the figure of the position relation of expression platform end and substrate and disjunction unit.
Fig. 5 C is the figure of the position relation of expression platform end and substrate and disjunction unit.
Fig. 6 A is the figure of other examples of expression disjunction unit.
Fig. 6 B is the figure of other examples that move of expression disjunction unit.
Fig. 7 is the plane of the break-up device of the present invention's the 2nd example.
Fig. 8 is the front view of the break-up device of this example.
Fig. 9 is the right side view of the break-up device of this example.
Figure 10 is the location slide plate of this example and the perspective view of disjunction plate.
Figure 11 is the briquetting of this example and the perspective view of substrate pressing plate.
Figure 12 is the figure of the position relation of expression platform end and substrate, substrate orientation device and disjunction unit.
[explanation of symbol]
10,100 break-up devices
20 base portion
21,22 pedestals
22,113 platforms
23 substrates
30,130 location divisions
31 slide blocks
32 fixed parts
117 substrate guide plates
40,140 grip unit
41 press press strip
42 pressing levers
50,120 disjunction unit
51 segmenting parts
55,135 gauges
60,160 monitoring portions
61,161 CCD cameras
112 objective table base plates
123 location slide plates
124 disjunction plates
125 cutting push rods
131 positioning sliding blocks
132 substrate orientation devices
133 adjust jam plate
134 adjust screw
141 briquettings
142 substrate pressing plates
150 pallets
The specific embodiment
Next, the 1st example of the present invention is illustrated.Fig. 1 is the plane of formation of the break-up device of expression the 1st example, and Fig. 2 is its front view.Shown in a plurality of as described figure, break-up device 10 comprises base portion 20, location division 30, grip unit 40, disjunction unit 50, reaches monitoring portion 60.
The end that grip unit 40 is used for making the substrate 23 that will cut to be being kept from the outstanding state in the left part of platform 22, and comprises by press strip 41 and pressing lever 42.Grip unit 40 are strip members by press strip 41 greater than the width of platform 22 on Y direction, remain with the XY plane parallel and freely move up and down slightly.Pressing lever 42 is to be used for making the push rod that moves up and down by press strip 41.The user descends pressing lever 42 by after substrate 23 location, thereby can utilize the left end of pushing substrate 23 from top by press strip 41 that it is fixed.
And, as shown in Figure 2,, be provided with the monitoring portion 60 of state of the substrate end on the Identification platform 22 of being used on the top of described platform 22.Monitoring portion 60 comprises CCD (Charge Coupled Device, charge-coupled image sensor) camera 61, and CCD camera 61 utilizes slide mechanism 62 and moves freely on Y direction.The position of the substrate of 61 pairs of platform 22 ends of CCD camera is taken, and captured image shows to the user by not shown monitor.
Next, illustrate and use described break-up device parallel action when forming a plurality of substrates of cutting line SL and cutting off in advance.At first, placement substrate 23 on platform 22, make the end (left end) of slide block 31 be contacted with the right-hand member of substrate 23, and the line of cutting that forms on the substrate 23 is aimed at the left end of platform 22.Will be about described position in hereinafter being elaborated.The position that utilize the CCD camera 61 of monitoring portion 60 to confirm the substrate left surface and/or cut line SL this moment.
Then, under described state, utilize the fixed part 32 of location division 30 to fix the right side of substrate 23.Then make the left end face of disjunction unit 50, and be fixed on the pre-position near platform 22.Utilize the pushing the left end of substrate 23 from top and it is fixed of grip unit 40 then by press strip 41.Replace described fixing, also can utilize vacuum suction to fix substrate from the bottom of platform 22.Next, depress segmenting part 51 by the cut-out push rod 53 that rotates disjunction unit 50.Can rule and disjunction substrate 23 along cutting whereby.Then, remove the fixing of substrate 23.Then remove the fixing of slide block 31, slide block 31 is moved along the groove 24 of platform 22, move to down all line same processing of complex phase of laying equal stress on.
Next, the structure of the end of platform 22 and the relation of platform and disjunction unit and substrate are described.Fig. 3 is the side view of different shape of the left end of the expression platform 22 that keeps substrate 23.At first, the end of platform 22 can be rectangular-shaped shown in Fig. 3 (a).In this case with the crestal line of described platform 22 as a minute broken string BL1.In addition, shown in Fig. 3 (b), platform 22 also can form the otch that the cross section is the inclined-plane in the end.In this case with the crestal line on the top and inclined-plane of platform 22 as a minute broken string BL2.In addition, shown in Fig. 3 (c), can also constitute the end bending that makes platform 22.To begin crooked part in this case as a minute broken string BL3.As shown in Fig. 3 (a)～(c) difference, described a plurality of branches broken string BL1～BL3 are lines vertical with drawing.
Next, the substrate 23 when using the rectangular-shaped platform 22 shown in Fig. 3 (a) describes with the related of disjunction unit 50.At first as shown in Figure 4, can make substrate 23 forms above cut line SL and divide broken string BL1 in consistent on the Z-direction (existence abreast on same YZ plane).This moment, the right-hand end of the segmenting part of depressing from top 51 can be in consistent with minute broken string BL1 (existence abreast on same YZ plane) on the Z axle shown in Fig. 4 A.In addition, shown in Fig. 4 B, also can be in the score broken string BL1 position in (left side) more in the outer part.Described position need utilize the CCD camera 61 of monitoring portion 60 to confirm.No matter under which kind of situation, by with segmenting part 51 to the negative direction of Z axle, promptly depress the below, just can carry out disjunction along cutting line SL.
And as shown in Figure 5, the line SL that cuts of substrate 23 also can be from the branch of platform 22 broken string BL1 to the left, promptly the outside be given prominence to and is fixed.In this case, the end of segmenting part 51 is aimed at dividing broken string BL1.In addition, shown in Fig. 5 B, the right-hand end that also can make segmenting part 51 with cut line SL and aim at.In addition, shown in Fig. 5 C, also can be made as than cutting line SL (left side) more in the outer part.Described position need utilize the CCD camera 61 of monitoring portion 60 to confirm.In either case, by disjunction unit 50 is depressed, just can come disjunction substrate 23 downwards along cutting line SL.
More generally,, minute broken string BL is made as T1 with cutting the interval of line SL on X-direction, minute broken string BL and the interval of disjunction unit 50 on X-direction are made as T2, then will consider following situation if shown in Fig. 5 C.
(1)T1＝T2＝0
(2)T1＞T2≥0
(3)T2＞T1≥0
(4)T2＝T1＞0
Fig. 4 A is the situation of (1), and Fig. 4 B is the situation of (3), and Fig. 5 A, Fig. 5 B, Fig. 5 C are respectively the situations of (2), (4) and (3).
Work as platform 22 herein and be under Fig. 3 (b) or the situation (c), if will divide the interval between broken string BL2, BL3 and platform 22 left ends to be made as Δ T, then T2 must be more than Δ T.
In addition, in this example, shown in Fig. 4 A～Fig. 5 C, the segmenting part 51 of disjunction unit 50 have parallel with substrate 23 below, and below will depress downwards above the substrate 23 by segmenting part, but also can use disjunction unit as shown in Figure 6A, utilize the inclined plane to depress towards Z-direction on the substrate 23 with inclined plane not parallel but that tilt to the right with the face of substrate 23.And shown in Fig. 6 B, the segmenting part 51 parallel with substrate 23 rotates as shown in arrow among the figure below also can making, thereby the left end of substrate 23 is depressed, and carries out disjunction along cutting the SL that rules whereby.
Next, the break-up device to the 2nd example of the present invention describes.Fig. 7 is the plane of formation of the break-up device 100 of this example of expression, and Fig. 8 is its front view, and Fig. 9 is a right side view.The break-up device 100 of this example also comprises base portion 110, disjunction unit 120, location division 130, grip unit 140 and monitoring portion 160.In this example, base portion 110 is keeping objective table base plate 112 on base plate 111.Objective table base plate 112 utilizes 4 pillars 114 to support the platform 113 on top.Objective table base plate 112 constitutes and can move with slight gap to X-direction on base plate 111, and utilizes the objective table be installed on the carriage 115 to move to adjust screw 116 and be set in after the desired location, utilizes bolt and is fixed on the base plate 111.As shown in Figure 7, on platform 113 along a side wherein and be provided with substrate guide plate 117.Substrate guide plate 117 is by compressing the side of the substrate that will cut off, and keeps the position of described substrate on Y direction.
Disjunction unit 120 will be from outstanding substrate 23 disjunctions of platform 113.In this example, the back shaft 122a, the 122b that comprise helical spring 121a, 121b vertically are embedded on the base plate 111.Disjunction unit 120 comprises location slide plate 123 and disjunction plate 124, and location slide plate 123 and disjunction plate 124 remain with the XY plane parallel by back shaft 122a, 122b and freely move up and down in fixed range.Shown in the perspective view of Figure 10, location slide plate 123 is plate-like members, about be provided with OBL maintaining part 123a, 123b, guide following positioning sliding block and it remained on X-direction by the sidewall of maintaining part and freely slide.In addition, be provided with flat disjunction plate 124 at an upper portion thereof, and utilize bolt and be fixed on integratedly the location slide plate 123 on.Location slide plate 123 is only gone up with slight gap in Z-direction (above-below direction) with disjunction plate 124 and is freely moved.Disjunction plate 124 is used for disjunction substrate 23, and will be made as the inclined-plane towards the top with the left end face right flank in opposite directions of platform 113.In addition, the top of back shaft 122a utilizes contact pin (pin) and rotates freely and link with an end that cuts off push rod 125.As Fig. 8, shown in Figure 9, cut-out push rod 125 is configured to parallel with Y direction, and located therein roller 126 is connected on the disjunction plate 124.And, in Fig. 7, omitted the diagram of cutting off push rod.
Next, location division 130 is described.Location division 130 comprises positioning sliding block shown in Figure 10 131 and substrate orientation device 132.Positioning sliding block 131 and substrate orientation device 132 are fixing integratedly by bolt, and whole one-tenth T word shape.The right flank of the length direction of substrate orientation device 132 is the faces that allow substrate 23 contact.Positioning sliding block 131 is directed on the sidewall of a pair of maintaining part 123a, the 123b of location on the slide plate 123, and only remains and be free to slide on X-direction.In the side of location slide plate 123, as Fig. 7, shown in Figure 8, be provided with the location and adjust jam plate 133 and adjust screw 134, screw 134 is adjusted in utilization can make positioning sliding block 131 move on X-direction.In addition, the position that constitutes on the X-direction can utilize gauge 135 to confirm.
Next, grip unit 140 makes the end of the substrate 23 that will cut off to be kept from platform 113 outstanding states.Grip unit 140 is to be made of with substrate pressing plate 142 briquetting 141 that is installed on the disjunction unit 120.Shown in the perspective view of Figure 11, briquetting 141 comprises 141a of square portion and the fixed part 141b that flat board is bent into the shape of L word shape, and fixed part 141b utilizes 2 bolts and is fixed on above the right side of disjunction plate 124.Substrate pressing plate 142 is elongated plate-like members, and is configured in the end of platform along Y direction.Briquetting 141 moves up and down by remaining freely by last item 143 and spring 144 and with substrate pressing plate 142.Therefore, depress towards the below, disjunction plate 124 and location division 130, grip unit 140 are moved up and down integratedly by cutting off push rod 125.In addition, on base plate 111, be provided with the substrate tray 150 of the substrate after being used for keeping cutting off.
And, on the top of described platform 113, be provided with the monitoring portion 160 of left end state of the substrate on the Identification platform 113 of being used for as shown in Figure 8.Monitoring portion 160 comprises CCD camera 161, and CCD camera 161 utilizes slide mechanism 162 and freely moves on Y direction.CCD camera 161 is used for the position of substrate of shooting platform 113 left end, and captured image shows to the user by not shown monitor.In addition, in Fig. 7, Fig. 9, omitted the diagram of monitoring portion 160.
Next, use Figure 12, illustrate and use described break-up device parallel action when forming a plurality of substrates of cutting line SL and cutting off in advance.In the break-up device 100 of the 2nd example, disjunction plate 124 is moved on X-direction, and platform 113 and substrate orientation device 132 are moved on X-direction.At first, set the position of platform 113 on X-direction, and set the interval T 2 of described adjustment screw 116 and disjunction plate 124 ends by adjusting screw 116.Then carry out the location on the X-direction of substrate orientation device 132.Just, adjust screw 134 rotations by making, positioning sliding block 131 and substrate orientation device 132 move slight distance, set interval T 3 to-X-direction on the slide plate 123 of location.Can utilize gauge 135 confirm and the end of platform 113 of this moment between the interval.If platform end and the overhang of cutting line are made as the T1 identical with the 1st example, then following formula is set up.
T1＝T3+T2-P
And, P be form on the Y direction cut the spacing of line on X-direction.
Then, mounting substrate 23 on platform 113, and the end on its Y direction withstood on the substrate guide plate 117.And, make the left end of substrate 23 be connected to the right-hand end of substrate orientation device 132.Manual fixing base 23 under described state, and depress and cut off push rod 125 and carry out disjunction.At this moment, in depressing the way substrate pressing plate 142 along substrate 23 ends one side (left end) butt on Y direction, and then depress and cut off push rod 125, spring 121a, the 121b end of shrinking and tightly pushing substrate 23 whereby, thereby substrate 23 is kept.On the other hand, disjunction plate 124 and then be depressed, therefore can be along cutting line disjunction substrate 23.The cut off machine of substrate 23 drops in the substrate tray 150.Afterwards, substrate pressing plate 142 will cut off on the push rod 125 and be pushed into till the position of not pushing down substrate 23, make substrate 23 move, and carry out disjunction in the same way to-X-direction.
So in the present invention, making at least should be outstanding from platform along the part of cutting the cut substrate of line, will carry out disjunction behind the partial fixing on the platform.Therefore, regardless of the gap size of cutting line,, therefore can carry out disjunction exactly along cutting line even if the tiny substrate of for example described interval below 5mm also can apply even power.
In addition, 1st, be to describe as substrate in the 2nd example, but comprise ceramic substrate, silicon, sapphire, InP (indium), GaN (gallium nitride) substrate, other various brittle substrates except that glass such as HTCC substrate as the substrate of object of the present invention with low-temperature co-fired ceramic substrate.
In the 1st example, the location division is to be made of with fixed part 32 slide block 31 that slides on platform, and the location division is to be made of substrate orientation device 132 in the 2nd example, but also can be the slide mechanism that substrate 23 is slided automatically.In addition, the disjunction unit is by rotate cutting off push rod the disjunction unit to be moved up and down, but also can use cylinder or motor and make the disjunction unit automatically move up and down or rotate.
And, in the 1st, the 2nd example, monitoring portion is set on break-up device, but also monitoring portion can be set but confirms the position by estimating from the top for the extrusion position of confirming substrate.
[industrial utilization possibility]
The present invention relates to a kind of break-up device and method for dividing that brittle substrate is carried out disjunction, can locate exactly in advance the brittle substrate of line, apply even power and carry out disjunction, so can be preferred for the disjunction of the little substrate of size.
Claims (7)
1. break-up device is characterized in that comprising:
Platform, mounting are being pre-formed cuts the line and the substrate that should cut off, and with its end as a minute broken string;
Grip unit makes the line of cutting of the substrate on the described platform be kept from the outstanding laterally T1 (〉=0) of the branch broken string of platform end; And
The disjunction unit is arranged on the side of described platform with respect to the face of platform with moving freely, pushes from the end of the outstanding substrate of described platform and carries out disjunction.
2. break-up device according to claim 1 is characterized in that: the mechanism for monitoring that more comprises the position that is used for discerning the substrate outstanding from described platform end.
3. break-up device according to claim 1 is characterized in that: described disjunction unit makes segmenting part move up and down from its end from the position that the branch of described platform broken string leaves T2 (〉=0) laterally.
4. break-up device according to claim 1 is characterized in that: described disjunction unit makes segmenting part leave the position rotation of T2 (〉=0) laterally from the branch broken string of described platform end from its end.
5. method for dividing is characterized in that: with the end as minute platform of broken string on mounting be pre-formed the substrate of cutting line and should cutting off;
The line of cutting of the substrate on the described platform is kept from the outstanding laterally T1 (〉=0) of the branch broken string of platform end;
Push the end of the substrate of giving prominence to from described platform from the side of described platform and carry out disjunction.
6. method for dividing according to claim 5 is characterized in that: described disjunction step moves up and down described segmenting part from the end of segmenting part from the position that the branch broken string of described platform leaves T2 (〉=0) laterally.
7. method for dividing according to claim 5 is characterized in that: described disjunction step makes the segmenting part rotation from the end of segmenting part from the position that the branch broken string of described platform end leaves T2 (〉=0) laterally.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-130454 | 2009-05-29 | ||
| JP2009130454A JP5777849B2 (en) | 2009-05-29 | 2009-05-29 | Break device and break method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101898390A true CN101898390A (en) | 2010-12-01 |
| CN101898390B CN101898390B (en) | 2015-02-04 |
Family
ID=42668087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010189096.2A Expired - Fee Related CN101898390B (en) | 2009-05-29 | 2010-05-26 | Breaking apparatus and breaking method |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2255939A3 (en) |
| JP (1) | JP5777849B2 (en) |
| KR (1) | KR101123618B1 (en) |
| CN (1) | CN101898390B (en) |
| TW (1) | TWI385064B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737979A (en) * | 2011-04-11 | 2012-10-17 | 夏普株式会社 | Slicing device and slicing method |
| CN105580245A (en) * | 2013-08-29 | 2016-05-11 | 日产自动车株式会社 | Cutting method and cutting device for manufacturing magnet piece constituting magnet body for field pole to be arranged in rotary electric machine |
| CN110978298A (en) * | 2019-12-21 | 2020-04-10 | 许翠玲 | Processing machine and processing technology for building curtain wall dry-hanging decorative face stone |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5919888B2 (en) * | 2012-03-01 | 2016-05-18 | 日産自動車株式会社 | A cleaving method and a cleaving apparatus for cleaving a permanent magnet body into a magnet piece constituting a field pole magnet body disposed in a rotating electrical machine |
| JP2019196281A (en) * | 2018-05-09 | 2019-11-14 | 三星ダイヤモンド工業株式会社 | Substrate dividing device |
| JP2021104648A (en) | 2019-12-27 | 2021-07-26 | 三星ダイヤモンド工業株式会社 | Break head and break device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19930639A1 (en) * | 1999-07-02 | 2001-01-11 | Bosch Gmbh Robert | Method to separate glass ceramic substrates for electronic circuits; involves holding substrate on support, guiding cutting wheel through slit in support to form score line and bending substrate |
| JP2001250798A (en) * | 2000-03-06 | 2001-09-14 | Sony Corp | Method and apparatus for dividing material along scribing line |
| JP2001311832A (en) * | 2000-04-28 | 2001-11-09 | Sumitomo Electric Ind Ltd | Method for adjusting blade pressure of optical fiber cutter and jig for adjusting blade pressure |
| JP2002121041A (en) * | 2000-10-13 | 2002-04-23 | Nakamura Tome Precision Ind Co Ltd | Method and device for breaking rigid brittle plate |
| JP2004338994A (en) * | 2003-05-15 | 2004-12-02 | Nippon Electric Glass Co Ltd | Manufacturing method of plate glass and its unit |
| CN1735489A (en) * | 2002-11-22 | 2006-02-15 | 三星钻石工业股份有限公司 | Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| CN1741879A (en) * | 2002-11-22 | 2006-03-01 | 三星钻石工业股份有限公司 | Method for dividing substrate and method for manufacturing substrate using such method |
| JP2006321695A (en) * | 2005-05-20 | 2006-11-30 | Central Glass Co Ltd | Apparatus for splitting plate glass |
| JP2008244222A (en) * | 2007-03-28 | 2008-10-09 | Laser Solutions Co Ltd | Plate material dividing device and plate material dividing method |
| CN101426741A (en) * | 2006-04-28 | 2009-05-06 | 坂东机工株式会社 | Glass sheet cutting method and glass sheet cutting machine |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0919918A (en) * | 1995-07-07 | 1997-01-21 | Sony Corp | Dividing device |
| JP4502964B2 (en) | 2001-04-02 | 2010-07-14 | 三星ダイヤモンド工業株式会社 | Method for dividing bonded substrates |
| WO2002081392A1 (en) * | 2001-04-02 | 2002-10-17 | Mitsuboshi Diamond Industrial Co., Ltd. | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| JP3785378B2 (en) * | 2002-04-30 | 2006-06-14 | 出光興産株式会社 | Lubricating oil composition for automatic transmission |
| JP2003340793A (en) * | 2002-05-17 | 2003-12-02 | Taiheiyo Cement Corp | Board dividing apparatus |
| JP4131853B2 (en) * | 2003-04-28 | 2008-08-13 | 株式会社 日立ディスプレイズ | Display device manufacturing method and manufacturing apparatus |
| TWI220296B (en) * | 2003-09-18 | 2004-08-11 | Au Optronics Corp | Equidistant splitting apparatus |
| TW200526384A (en) * | 2003-09-24 | 2005-08-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| DE102007001133B4 (en) * | 2007-01-05 | 2008-09-04 | Mdi Schott Advanced Processing Gmbh | Method and device for breaking thin glass panes |
| JP5376282B2 (en) * | 2008-03-25 | 2013-12-25 | 日本電気硝子株式会社 | Glass plate folding method and glass plate folding device |
| JP2010100476A (en) * | 2008-10-23 | 2010-05-06 | Sharp Corp | Implement for removing unnecessary glass part, work stand for removing unnecessary part of glass substrate and scrap box for work of removing unnecessary part of glass substrate |
| JP5228852B2 (en) * | 2008-12-01 | 2013-07-03 | セイコーエプソン株式会社 | Substrate dividing method and substrate dividing apparatus |
-
2009
- 2009-05-29 JP JP2009130454A patent/JP5777849B2/en not_active Expired - Fee Related
-
2010
- 2010-05-04 TW TW99114279A patent/TWI385064B/en not_active IP Right Cessation
- 2010-05-26 CN CN201010189096.2A patent/CN101898390B/en not_active Expired - Fee Related
- 2010-05-27 EP EP10164119A patent/EP2255939A3/en not_active Withdrawn
- 2010-05-28 KR KR1020100050123A patent/KR101123618B1/en not_active IP Right Cessation
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19930639A1 (en) * | 1999-07-02 | 2001-01-11 | Bosch Gmbh Robert | Method to separate glass ceramic substrates for electronic circuits; involves holding substrate on support, guiding cutting wheel through slit in support to form score line and bending substrate |
| JP2001250798A (en) * | 2000-03-06 | 2001-09-14 | Sony Corp | Method and apparatus for dividing material along scribing line |
| JP2001311832A (en) * | 2000-04-28 | 2001-11-09 | Sumitomo Electric Ind Ltd | Method for adjusting blade pressure of optical fiber cutter and jig for adjusting blade pressure |
| JP2002121041A (en) * | 2000-10-13 | 2002-04-23 | Nakamura Tome Precision Ind Co Ltd | Method and device for breaking rigid brittle plate |
| CN1735489A (en) * | 2002-11-22 | 2006-02-15 | 三星钻石工业股份有限公司 | Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| CN1741879A (en) * | 2002-11-22 | 2006-03-01 | 三星钻石工业股份有限公司 | Method for dividing substrate and method for manufacturing substrate using such method |
| JP2004338994A (en) * | 2003-05-15 | 2004-12-02 | Nippon Electric Glass Co Ltd | Manufacturing method of plate glass and its unit |
| JP2006321695A (en) * | 2005-05-20 | 2006-11-30 | Central Glass Co Ltd | Apparatus for splitting plate glass |
| CN101426741A (en) * | 2006-04-28 | 2009-05-06 | 坂东机工株式会社 | Glass sheet cutting method and glass sheet cutting machine |
| JP2008244222A (en) * | 2007-03-28 | 2008-10-09 | Laser Solutions Co Ltd | Plate material dividing device and plate material dividing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737979A (en) * | 2011-04-11 | 2012-10-17 | 夏普株式会社 | Slicing device and slicing method |
| CN102737979B (en) * | 2011-04-11 | 2014-12-31 | 夏普株式会社 | Slicing device and slicing method |
| CN105580245A (en) * | 2013-08-29 | 2016-05-11 | 日产自动车株式会社 | Cutting method and cutting device for manufacturing magnet piece constituting magnet body for field pole to be arranged in rotary electric machine |
| CN105580245B (en) * | 2013-08-29 | 2017-10-17 | 日产自动车株式会社 | Cut-off method and chopping up apparatus that the field pole configured to being formed in electric rotating machine is manufactured with the magnetite pieces of magnetite body |
| CN110978298A (en) * | 2019-12-21 | 2020-04-10 | 许翠玲 | Processing machine and processing technology for building curtain wall dry-hanging decorative face stone |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201107099A (en) | 2011-03-01 |
| CN101898390B (en) | 2015-02-04 |
| TWI385064B (en) | 2013-02-11 |
| EP2255939A2 (en) | 2010-12-01 |
| JP5777849B2 (en) | 2015-09-09 |
| KR20100129222A (en) | 2010-12-08 |
| EP2255939A3 (en) | 2011-10-19 |
| KR101123618B1 (en) | 2012-03-22 |
| JP2010274573A (en) | 2010-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101898390A (en) | Break-up device and method for dividing | |
| CN102300688B (en) | Substrate breaking apparatus | |
| RU2671239C1 (en) | Method of cutting sheet glass and positioning of cut sheet glass and device for its implementation | |
| TW561134B (en) | Device for cutting brittle substrate, cutting method using the same, cutting system | |
| JP4487201B2 (en) | Substrate cutting method and apparatus | |
| CN102729346B (en) | Breaking device | |
| JP2000198097A (en) | Method for forming stack of small sheet material and processing the same afterward | |
| CN109366241B (en) | Intelligent flexible edge sealing line square system | |
| JP5796774B2 (en) | Cleaving method and apparatus for brittle plate | |
| JP2000198098A (en) | Planer cutter for cutting stacked sheet-like material | |
| CN104249412A (en) | Brittle material base board parting tool and brittle material base board supporting fixture | |
| WO2020129546A1 (en) | Glass plate warpage measurement device and glass plate manufacturing method | |
| TW201633394A (en) | Wafer group, wafer manufacturing device, and wafer manufacturing method | |
| JP3238790U (en) | substrate cutting equipment | |
| EP1177887A3 (en) | Precision device molding machine and method of molding by using it | |
| KR20150022638A (en) | Substrate dividing apparatus | |
| JP5778211B2 (en) | Break device | |
| CN203732336U (en) | Cutting mold for asphalt mixture bending test specimens | |
| KR102385558B1 (en) | Apparatus for processing metal rod | |
| JP5980848B2 (en) | Break device | |
| KR200376429Y1 (en) | Board processing device | |
| KR102385557B1 (en) | Apparatus for cutting, bending, and sorting metal rod | |
| CN211017028U (en) | Slicing device | |
| CN218453725U (en) | PCB board loading attachment | |
| CN115009593B (en) | Be applied to intelligent pile up neatly of panel, packing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20160526 |