EP2255939A3 - Breaking apparatus and breaking method - Google Patents

Breaking apparatus and breaking method Download PDF

Info

Publication number
EP2255939A3
EP2255939A3 EP10164119A EP10164119A EP2255939A3 EP 2255939 A3 EP2255939 A3 EP 2255939A3 EP 10164119 A EP10164119 A EP 10164119A EP 10164119 A EP10164119 A EP 10164119A EP 2255939 A3 EP2255939 A3 EP 2255939A3
Authority
EP
European Patent Office
Prior art keywords
substrate
breaking
broken
locked
subsequently
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10164119A
Other languages
German (de)
French (fr)
Other versions
EP2255939A2 (en
Inventor
Kazuya Maekawa
Katsunori Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of EP2255939A2 publication Critical patent/EP2255939A2/en
Publication of EP2255939A3 publication Critical patent/EP2255939A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

A substrate is held on a table 22, and the substrate is caused to project beyond a lateral side of the table 22 and is positioned by a positioning section 30. Then, that part of the substrate 23 which is located on the table is locked in place by a clamping section 40. Subsequently the substrate is broken along a scribing line, with its projecting part kept pressed from above, by using a breaking unit 50. In this way, a substrate of even smaller size can be precisely broken with ease under uniform application of pressure.
EP10164119A 2009-05-29 2010-05-27 Breaking apparatus and breaking method Withdrawn EP2255939A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009130454A JP5777849B2 (en) 2009-05-29 2009-05-29 Break device and break method

Publications (2)

Publication Number Publication Date
EP2255939A2 EP2255939A2 (en) 2010-12-01
EP2255939A3 true EP2255939A3 (en) 2011-10-19

Family

ID=42668087

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10164119A Withdrawn EP2255939A3 (en) 2009-05-29 2010-05-27 Breaking apparatus and breaking method

Country Status (5)

Country Link
EP (1) EP2255939A3 (en)
JP (1) JP5777849B2 (en)
KR (1) KR101123618B1 (en)
CN (1) CN101898390B (en)
TW (1) TWI385064B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5824231B2 (en) * 2011-04-11 2015-11-25 シャープ株式会社 Braking device
JP5919888B2 (en) * 2012-03-01 2016-05-18 日産自動車株式会社 A cleaving method and a cleaving apparatus for cleaving a permanent magnet body into a magnet piece constituting a field pole magnet body disposed in a rotating electrical machine
EP3041114B1 (en) * 2013-08-29 2019-07-24 Nissan Motor Co., Ltd. Cutting method and cutting device for manufacturing magnet piece constituting magnet body for field pole to be arranged in rotary electric machine
JP2019196281A (en) * 2018-05-09 2019-11-14 三星ダイヤモンド工業株式会社 Substrate dividing device
CN110978298B (en) * 2019-12-21 2021-05-11 北京天成英良石材有限责任公司 Processing machine and processing technology for building curtain wall dry-hanging decorative face stone
JP2021104648A (en) 2019-12-27 2021-07-26 三星ダイヤモンド工業株式会社 Break head and break device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1386891A1 (en) * 2001-04-02 2004-02-04 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
EP1604794A1 (en) * 2002-11-22 2005-12-14 Mitsuboshi Diamond Industrial Co., Ltd. Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
EP1666221A1 (en) * 2003-09-24 2006-06-07 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0919918A (en) * 1995-07-07 1997-01-21 Sony Corp Dividing device
DE19930639B4 (en) * 1999-07-02 2005-01-20 Robert Bosch Gmbh Device for severing a plate-shaped object
JP2001250798A (en) * 2000-03-06 2001-09-14 Sony Corp Method and apparatus for dividing material along scribing line
JP4045716B2 (en) * 2000-04-28 2008-02-13 住友電気工業株式会社 Blade pressure adjusting method and blade pressure adjusting jig for optical fiber cutter
JP4605882B2 (en) * 2000-10-13 2011-01-05 中村留精密工業株式会社 Hard brittle plate break device
JP4502964B2 (en) 2001-04-02 2010-07-14 三星ダイヤモンド工業株式会社 Method for dividing bonded substrates
JP3785378B2 (en) * 2002-04-30 2006-06-14 出光興産株式会社 Lubricating oil composition for automatic transmission
JP2003340793A (en) * 2002-05-17 2003-12-02 Taiheiyo Cement Corp Board dividing apparatus
KR100657197B1 (en) * 2002-11-22 2006-12-14 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for dividing substrate and method for manufacturing substrate using such method
JP4131853B2 (en) * 2003-04-28 2008-08-13 株式会社 日立ディスプレイズ Display device manufacturing method and manufacturing apparatus
JP4258270B2 (en) * 2003-05-15 2009-04-30 日本電気硝子株式会社 Sheet glass manufacturing method and apparatus
TWI220296B (en) * 2003-09-18 2004-08-11 Au Optronics Corp Equidistant splitting apparatus
JP2006321695A (en) * 2005-05-20 2006-11-30 Central Glass Co Ltd Apparatus for splitting plate glass
JP5023547B2 (en) * 2006-04-28 2012-09-12 坂東機工株式会社 Glass plate cutting method and glass plate cutting machine
DE102007001133B4 (en) * 2007-01-05 2008-09-04 Mdi Schott Advanced Processing Gmbh Method and device for breaking thin glass panes
JP5076589B2 (en) * 2007-03-28 2012-11-21 三星ダイヤモンド工業株式会社 Plate material dividing apparatus and plate material dividing method
JP5376282B2 (en) * 2008-03-25 2013-12-25 日本電気硝子株式会社 Glass plate folding method and glass plate folding device
JP2010100476A (en) * 2008-10-23 2010-05-06 Sharp Corp Implement for removing unnecessary glass part, work stand for removing unnecessary part of glass substrate and scrap box for work of removing unnecessary part of glass substrate
JP5228852B2 (en) * 2008-12-01 2013-07-03 セイコーエプソン株式会社 Substrate dividing method and substrate dividing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1386891A1 (en) * 2001-04-02 2004-02-04 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
EP1604794A1 (en) * 2002-11-22 2005-12-14 Mitsuboshi Diamond Industrial Co., Ltd. Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
EP1666221A1 (en) * 2003-09-24 2006-06-07 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method

Also Published As

Publication number Publication date
CN101898390A (en) 2010-12-01
KR20100129222A (en) 2010-12-08
JP2010274573A (en) 2010-12-09
KR101123618B1 (en) 2012-03-22
EP2255939A2 (en) 2010-12-01
JP5777849B2 (en) 2015-09-09
TW201107099A (en) 2011-03-01
CN101898390B (en) 2015-02-04
TWI385064B (en) 2013-02-11

Similar Documents

Publication Publication Date Title
EP2255939A3 (en) Breaking apparatus and breaking method
MX2009008428A (en) Endo-surgical device and method.
EP2082698A3 (en) Kirschner wire clamp
EP3598294A3 (en) Method of manufacturing an article
EP2196857A3 (en) Lithographic apparatus and device manufacturing method
EP2522984A3 (en) Method and apparatus for post-sequestration monitoring and management of carbon dioxide
TWI350211B (en) Liquid crystal dispensing apparatus, and device and method for supplying liquid crystal
EP2226834A3 (en) Method for physical force assisted cleaning with reduced damage
EP2284655A3 (en) Method and apparatus for controlling electronic device using user interaction
EP2319103A4 (en) Piezoelectric device, piezoelectric device manufacturing method, and liquid discharge apparatus
EP2128738A3 (en) Storage apparatus and cooling method for storage apparatus
TWI365175B (en) Method and device for vibration assistant scribing process on a substrate
EP2579012A3 (en) Method and apparatus for measuring residual stresses in a component
EP2750174A3 (en) Bonding apparatus and bonding process method
EP2520937A3 (en) Sample processing apparatus
WO2010124974A3 (en) Needle remover and method for removing a needle
EP2871521A3 (en) A method for bonding a pellicle, and a bonding apparatus used in this method
WO2011050318A3 (en) Method and apparatus for skin stabilization and positioning
EP2265427A4 (en) Method and apparatus for the production of high tenacity polyolefin sheet
WO2011003399A3 (en) Device and method for arranging a component on a component carrier
IL210263A0 (en) Hand - operated pliers
EP2413353A3 (en) Heat sink device and method of repairing semiconductor device
EP2414175A4 (en) Relief printing plate, plate-making method for the relief printing plate and plate-making apparatus for the relief printing plate
WO2011090617A3 (en) Process for removing metals from resid
ATE540169T1 (en) DEVICE FOR USING TECHNICAL DEVICES IN THE UNDERWATER AREA

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20100527

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME RS

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME RS

RIC1 Information provided on ipc code assigned before grant

Ipc: B28D 7/04 20060101ALI20110915BHEP

Ipc: B28D 1/22 20060101AFI20110915BHEP

17Q First examination report despatched

Effective date: 20140723

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20151201