CN101888746B - 喷流焊锡槽 - Google Patents
喷流焊锡槽 Download PDFInfo
- Publication number
- CN101888746B CN101888746B CN201010174193.4A CN201010174193A CN101888746B CN 101888746 B CN101888746 B CN 101888746B CN 201010174193 A CN201010174193 A CN 201010174193A CN 101888746 B CN101888746 B CN 101888746B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- scolding tin
- gas
- nitrogen
- jet solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 104
- 239000007789 gas Substances 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims description 53
- 239000011261 inert gas Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 123
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 63
- 238000006213 oxygenation reaction Methods 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 230000033228 biological regulation Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 150000002829 nitrogen Chemical class 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000001802 infusion Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009117666A JP5410835B2 (ja) | 2009-05-14 | 2009-05-14 | 噴流はんだ槽 |
| JP2009-117666 | 2009-05-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101888746A CN101888746A (zh) | 2010-11-17 |
| CN101888746B true CN101888746B (zh) | 2014-07-16 |
Family
ID=43074396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010174193.4A Active CN101888746B (zh) | 2009-05-14 | 2010-05-13 | 喷流焊锡槽 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5410835B2 (enExample) |
| CN (1) | CN101888746B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801809B (zh) * | 2014-01-29 | 2018-09-14 | 气体产品与化学公司 | 用于在焊接期间提供惰性气体的设备和方法 |
| CN108817588A (zh) * | 2018-05-30 | 2018-11-16 | 苏州精美科光电材料有限公司 | 一种管靶贴合方法 |
| JP7249215B2 (ja) * | 2019-06-19 | 2023-03-30 | 株式会社デンソーテン | はんだ付け装置およびはんだ付け装置の制御方法 |
| CN114850714B (zh) * | 2022-04-12 | 2023-08-08 | 深圳市林鑫达智能装备有限公司 | 一种焊接设备 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3420283B2 (ja) * | 1993-06-07 | 2003-06-23 | 株式会社タムラ製作所 | 不活性雰囲気はんだ付け装置における酸素濃度制御方法およびその装置 |
| US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
| JP2000071066A (ja) * | 1998-08-28 | 2000-03-07 | Tokyo Seisan Giken Kk | 窒素パッケージ一体型半田槽 |
| JP2001119134A (ja) * | 1999-10-22 | 2001-04-27 | Nihon Dennetsu Keiki Co Ltd | はんだ付け装置 |
| JP2002057449A (ja) * | 2000-08-11 | 2002-02-22 | Air Liquide Japan Ltd | ガス供給装置およびハンダ付け装置 |
| JP3867511B2 (ja) * | 2001-04-05 | 2007-01-10 | スズキ株式会社 | 部分半田付け装置 |
-
2009
- 2009-05-14 JP JP2009117666A patent/JP5410835B2/ja active Active
-
2010
- 2010-05-13 CN CN201010174193.4A patent/CN101888746B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2000-71066A 2000.03.07 |
| JP特开平6-344176A 1994.12.20 |
| JP特表平9-500238A 1997.01.07 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101888746A (zh) | 2010-11-17 |
| JP2010267785A (ja) | 2010-11-25 |
| JP5410835B2 (ja) | 2014-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |