CN101877324A - 半导体芯片供给装置 - Google Patents

半导体芯片供给装置 Download PDF

Info

Publication number
CN101877324A
CN101877324A CN2010101655708A CN201010165570A CN101877324A CN 101877324 A CN101877324 A CN 101877324A CN 2010101655708 A CN2010101655708 A CN 2010101655708A CN 201010165570 A CN201010165570 A CN 201010165570A CN 101877324 A CN101877324 A CN 101877324A
Authority
CN
China
Prior art keywords
thimble
semiconductor chip
information
supplying device
marginal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010101655708A
Other languages
English (en)
Chinese (zh)
Inventor
安泽昭伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Publication of CN101877324A publication Critical patent/CN101877324A/zh
Pending legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
CN2010101655708A 2009-04-30 2010-04-30 半导体芯片供给装置 Pending CN101877324A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009110780A JP2010262982A (ja) 2009-04-30 2009-04-30 半導体チップ供給装置のニードル管理装置
JP2009-110780 2009-04-30

Publications (1)

Publication Number Publication Date
CN101877324A true CN101877324A (zh) 2010-11-03

Family

ID=43019843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101655708A Pending CN101877324A (zh) 2009-04-30 2010-04-30 半导体芯片供给装置

Country Status (2)

Country Link
JP (1) JP2010262982A (ja)
CN (1) CN101877324A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878315A (zh) * 2017-05-15 2018-11-23 细美事有限公司 检查顶针的方法
CN111394777A (zh) * 2020-02-19 2020-07-10 深圳市海铭德科技有限公司 一种用于芯片镀膜工艺的顶针顶出力的监测方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083606A1 (ja) * 2012-11-27 2014-06-05 富士機械製造株式会社 ダイ供給装置
CN109950179B (zh) * 2019-03-26 2021-11-09 佛山市劲电科技有限公司 一种用于芯片加工的防损坏的一体化分拣装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140497A (ja) * 1992-10-27 1994-05-20 Hitachi Ltd ピックアップ装置
JP2002176079A (ja) * 2000-12-06 2002-06-21 Seiko Epson Corp プローブカード検査・クリーニング機構付きウエハプローバ及びプローブカード検査方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4101618B2 (ja) * 2002-07-17 2008-06-18 シャープ株式会社 チップピックアップ方法およびチップピックアップ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140497A (ja) * 1992-10-27 1994-05-20 Hitachi Ltd ピックアップ装置
JP2002176079A (ja) * 2000-12-06 2002-06-21 Seiko Epson Corp プローブカード検査・クリーニング機構付きウエハプローバ及びプローブカード検査方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878315A (zh) * 2017-05-15 2018-11-23 细美事有限公司 检查顶针的方法
CN108878315B (zh) * 2017-05-15 2022-04-08 细美事有限公司 检查顶针的方法
CN111394777A (zh) * 2020-02-19 2020-07-10 深圳市海铭德科技有限公司 一种用于芯片镀膜工艺的顶针顶出力的监测方法
WO2021164115A1 (zh) * 2020-02-19 2021-08-26 深圳市海铭德科技有限公司 一种用于芯片镀膜工艺的顶针顶出力的监测方法
CN111394777B (zh) * 2020-02-19 2022-02-22 深圳市海铭德科技有限公司 一种用于芯片镀膜工艺的顶针顶出力的监测方法

Also Published As

Publication number Publication date
JP2010262982A (ja) 2010-11-18

Similar Documents

Publication Publication Date Title
US8688274B2 (en) Robot positioning method and calibration method
JP3694808B2 (ja) ウェハ搬送用ロボットの教示方法および教示用プレート
CN102164718B (zh) 工件取出方法
JP5345869B2 (ja) 部品キットを用いた生産システム
JP6310058B2 (ja) 画像処理装置および基板生産システム
CN101877324A (zh) 半导体芯片供给装置
JP2007313624A (ja) ワーク取り出し装置及び方法
CN100549680C (zh) 用于生产太阳能电池的方法和系统
US20100182487A1 (en) System and method for automatically focusing an optical lens of an image measuring machine
TWI302011B (en) Correcting apparatus for wafer transport equipment and correcting method for wafer transport equipment
CN106393103A (zh) 一种基于机器视觉的阵列式料框自适应取料方法
JP4733001B2 (ja) 部品実装装置、部品実装方法及びプログラム
CN104301600A (zh) 影像处理装置及其控制方法
TW201015062A (en) Method and device for inspecting bad marks on the boards and boards mounting method
JP2003194879A (ja) 半導体素子のテストハンドラの素子搬送装置の作業位置の認識方法
EP3407696B1 (en) Mounting apparatus and image processing method
JP2013197225A (ja) ダイピックアップ装置及びダイピックアップ方法
JP2002002909A (ja) ストッカ用ロボットの教示確認方法
JP6159406B2 (ja) 半導体製造装置及び半導体装置の製造方法
JP4992934B2 (ja) チップ検査装置及びチップ検査方法
JP3298795B2 (ja) リードフレームの搬送データ設定方法
CN220556587U (zh) 机械手臂自动补正装置
KR102062276B1 (ko) 부품 픽업 검사 방법
CN111496906B (zh) 一种基于ccd检测的料带裁切传送方法
EP3531683B1 (en) Image sensor

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20101103