CN101877324A - Semiconductor chip supplying device - Google Patents
Semiconductor chip supplying device Download PDFInfo
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- CN101877324A CN101877324A CN2010101655708A CN201010165570A CN101877324A CN 101877324 A CN101877324 A CN 101877324A CN 2010101655708 A CN2010101655708 A CN 2010101655708A CN 201010165570 A CN201010165570 A CN 201010165570A CN 101877324 A CN101877324 A CN 101877324A
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Abstract
The invention provides a thimble management device of a semiconductor chip supplying device without adding hardware such as a special sensor on the basis of the existing device and capable of managing the state of the thimble front end. A control device of the semiconductor chip supplying device (10) performs the state management treatment of the deformation state of the thimble (3) and judges whether the thimble (3) is need for exchange or not based on the edge information of the front end state of the thimble (3) obtained by a CCD camera (1) capable of identifying a semiconductor chip C and the preset threshold information.
Description
Technical field
The present invention relates to a kind of semiconductor chip supplying device, it is differentiated with the state of the front end shape of thimble semiconductor chip jack-up.
Background technology
In the manufacturing process of semiconductor chip, the wafer that will stick on the sticking tablet by cutting is divided into a plurality of semiconductor chips, from this sticking tablet, the semiconductor chip after cutting apart is picked up singly, transfer, carry out necessary supply to the position of expectation.At this moment, be posted on the sticking tablet because the semiconductor chip that is supplied to is sticking, so in conventional semiconductor chip feedway, utilize semiconductor chip jack-up with thimble (eject pin) from the back side of sticking tablet with semiconductor chip jack-up, thus, the absorption of the adsorption mouth of pick-up head is carried out easily, singly semiconductor chip is picked up.
Thus, eject pin is in the process with semiconductor jack-up repeatedly, and the shape of its front end can produce distortion such as wearing and tearing or conquassation.That is, the action of common jack-up runs through sticking tablet and with semiconductor chip jack-up by eject pin, if but the front end of eject pin produces distortion such as wearing and tearing or conquassation, and then can't run through sticking tablet, thereby semiconductor chip can't be peeled off fully from sticking card band.If become above-mentioned state, even then utilize adsorption mouth that the center of semiconductor chip is adsorbed, but owing to the influence of sticking tablet causes the offset of semiconductor chip, make and supply with precision and worsen.In addition, also may have the failure of picking up of semiconductor chip, semiconductor chip remains in the situation on the sticking tablet.
In conventional semiconductor chip feedway, utilize distortion such as the wearing and tearing of visual front end to eject pin or conquassation to confirm here.But,, must when semiconductor chip supplying device stops, carrying out by the visual affirmation of carrying out.Thus, for example as shown in open in the patent documentation 1, following technology is proposed: for the state of the front end shape of managing eject pin, along the length direction of eject pin photoelectric sensor on a plurality of side directions that are arranged in eject pin is set, it is used for the change of shape of eject pins such as automatically confirming bending or lose, have or not by photoelectric sensor to be subjected to light, distortion is detected.
Patent documentation 1: the spy of Japan opens flat 06-140497 communique
Summary of the invention
But, in patent documentation 1 in the technology of record,, be difficult in fact detect and wear and tear or the state of front end shapes such as conquassation though can detect jack-up with the crooked of thimble or lose.Thus, be created in can't the stripping semiconductor chip before, the problem that can't confirm state.
In addition, even suppose to utilize the technology of patent documentation 1 can detect the wearing and tearing or the conquassation of front end, also high-precision sensor special must be set, the cost costliness of sensor special, in addition, must around thimble, guarantee that transducer is provided with the abundant space of usefulness.
The present invention is conceived to the problems referred to above and proposes, and its purpose is to provide a kind of semiconductor chip supplying device, and it can differentiate states such as the wearing and tearing of front end of eject pin or conquassation.
In order to solve above-mentioned problem, semiconductor chip supplying device of the present invention has backing-out punch, this backing-out punch has thimble, when the semiconductor supply chip, this thimble is with the back side jack-up of described semiconductor chip from sticking tablet, it is characterized in that having: shooting part (CCD camera or CMOS etc.), it is configured to and can takes from the top to described thimble; Image unit, it utilizes described shooting part that the front end of described thimble is taken, and generates the image information of the described thimble front end that photographs; The marginal information generation unit, it generates the marginal information of the front end shape of described thimble according to described image information; And the thimble judgement unit, it judges whether to need to change thimble based on described marginal information and pre-set threshold information.
According to the thimble management devices of semiconductor chip supplying device involved in the present invention, utilize shooting part that the thimble front end is made a video recording, according to the image information of the thimble front end of taking by this shooting part, generate the marginal information of thimble front end shape.And marginal information and pre-set threshold information by based on this generation can manage the state of thimble, thereby do not need to append hardware such as sensor special, just can the state of thimble front end be managed.
Here, in the thimble management devices of semiconductor chip supplying device involved in the present invention, be preferably, for example, described marginal information generation unit, the area of the marginal portion of described thimble front end is obtained as described marginal information, described thimble judgement unit, when the value of the described marginal information that obtains surpasses the value of described threshold information, the notice of described thimble require is changed in output, and this threshold information is the threshold value that the area of the described marginal portion of described thimble front end is obtained for the area of regulation.According to said structure, be preferably formed and be following structure: in process repeatedly, produce at this front end under the situation of distortion such as wearing and tearing or conquassation, at once this deformation state is notified semiconductor chip jack-up.
In addition, described shooting part, the CCD camera that utilizes the existing device of semiconductor chip supplying device (hardware) promptly semiconductor chip to be discerned, and need not new device.
The effect of invention
As mentioned above,, distortion such as the wearing and tearing of thimble front end or conquassation can be discerned, the replacing of thimble etc. can be before semiconductor chip can't being peeled off, carried out reliably according to the thimble management devices of semiconductor chip supplying device involved in the present invention.
In addition, by utilizing the existing C CD camera that the upper surface of semiconductor chip is made a video recording, thereby can utilize existing device (hardware) that the deformation state of thimble front end is managed, and need not to append hardware such as sensor special.
Description of drawings
Fig. 1 is the oblique view of integral body with semiconductor chip supplying device of thimble management devices involved in the present invention.
Fig. 2 is the block diagram of the formation of explanation thimble management devices involved in the present invention.
Fig. 3 is the flow chart that the thimble condition managing of explanation thimble management devices involved in the present invention is handled.
Fig. 4 is the schematic diagram of the thimble state confirmation action (no wafer) of explanation in thimble management devices involved in the present invention.
Fig. 5 is the schematic diagram of the thimble state confirmation action (have wafer) of explanation in thimble management devices involved in the present invention.
Fig. 6 is the schematic diagram that the semiconductor chip of explanation semiconductor chip supplying device is confirmed action.
Fig. 7 is the schematic diagram of the semiconductor chip absorption action of explanation semiconductor chip supplying device.
Fig. 8 is the schematic diagram of image of the photographic images of expression CCD camera, the thimble that figure (A) expression is new, the thimble of figure (B) expression distortion.
Embodiment
Below, suitably with reference to accompanying drawing, an embodiment of the invention are described.
As shown in Figure 1, this semiconductor chip supplying device 10 has: absorptive table 13, its central portion in framework 11 have circular peristome 12; And wafer loader 14, it is that unit carries sticking tablet S successively with 1 on this absorptive table 13, this sticking tablet S is divided into a plurality of semiconductor chip C with wafer with sticking state and forms (with reference to Fig. 6).In addition,, be provided with the wafer storage portion 40 of a plurality of described sticking tablet S stacked at an end (left side of this figure) of the length direction of framework 11, utilize wafer loader 14 can with after the sticking tablet S that supplies be transported on the described absorptive table 13.
Be provided with wafer fixed part 15 on absorptive table 13, it is used for from the attached maintenance sticking tablet of following side draught S.In addition, in the peristome 12 of absorptive table 13, be furnished with the backing-out punch 2 that can carry out lifting and transfer movement, on the top of this backing-out punch 2, removably add and be provided with the thimble 3 that jack-up is used, this thimble 3 vertically erects, and front end is sharp-pointed.In addition, above absorptive table 13, additional downwards CCD (the Charge Coupled Device) camera 1 that is provided as shooting part, it is used to discern the upper surface of semiconductor chip C.With CCD camera 1 be configured in described thimble 3 directly over, CCD camera 1 and backing-out punch 2 links with same XY mobile device 20, based on regulated procedure, suitably moves to necessary position on the absorptive table 13 along X-axis and Y direction integratedly.
And, above absorptive table 13, dispose the pick-up head 4 that can carry out lifting and transfer movement, on this pick-up head 4, be provided with adsorption mouth 5, its be used for 1 be unit, the semiconductor chip C that sticks on the described sticking tablet S is adsorbed.This pick-up head 4 is driven by the XY mobile device 20 different XY mobile devices 30 that linked with CCD camera 1 and backing-out punch 2.Thus, in order to adsorb semiconductor chip C with pick-up head 4 liftings to the assigned position of sticking tablet S, the transfer movement that utilizes described XY mobile device 30 to stipulate.In addition, wafer fixed part 15 and adsorption mouth 5 are connected with not shown vacuum pump.
And, this semiconductor chip supplying device 10, as shown in Figure 2 shown in the block diagram, has control device 50, the each several part of these control device 50 control semiconductor chip supplying devices 10, and the thimble 3 that is arranged on the above-mentioned backing-out punch 2 is discerned, be used to manage the thimble condition managing processing of its state by execution, thereby become with the structure of thimble management devices.
In detail, this control device 50 has following parts and constitutes as shown in Figure 2: CPU 54, and its control program based on regulation is controlled computing and entire system; Storage device 56 and ROM 57, they store the control program of CPU 54 and management information form described later etc. in advance at the storage area of regulation; RAM 58, and it is used for storing the data of reading from this storage device 56 and ROM 57 etc. and at the required operation result of the calculating process of CPU 54; And interface 52, its with respect to the XY mobile device 20 that includes semiconductor chip supplying device 10 and CCD camera 1 at interior external device (ED), carry out the I/O of data, above-mentioned parts are that bus 53 is connected to each other by the holding wire that is used to transmit data, and can transmitting and receiving data.And CPU 54 makes the thimble condition managing programming start of the regulation in the regulation zone that is stored in above-mentioned storage device 56 or ROM 57, handles according to the thimble condition managing shown in the flow chart of this program execution 3.
Below, at length this thimble condition managing is handled describing.
Handle if carry out the thimble condition managing, then as shown in Figure 3, at first, jump to step S100.In step S100, judge whether current time is the T constantly of corresponding and predefined regulation with certain interval (timing of identification), when being judged to be regulation moment T (being), jump to step S102, be judged to be (denying) when not being, becoming regulation constantly before standby in step S100.In addition, this predefined regulation is T constantly, is the access times of running time, thimble 3 of semiconductor chip supplying device 10 with due regard to and wafer replacing time etc. and set.
And, in step S102,, utilize 1 pair of thimble 3 front end of CCD camera to take at afore mentioned rules moment T, promptly every certain interval, obtain its image information (image unit).
Here, above-mentioned CCD camera 1 is positioned at the position relative with the top of thimble 3, utilizes above-mentioned XY travel mechanism 20 to move to X-axis and Y direction integratedly with backing-out punch 2.Thus,, in this semiconductor chip supplying device 10, make a video recording, and can utilize this CCD camera that the front end of thimble 3 is made a video recording to shown in Figure 5 as Fig. 4 by 1 pair of semiconductor chip of CCD camera.In addition, as shown in Figure 4, can on the relative position of CCD camera 1, not have the state (for example changing the timing of wafer) of wafer to take down, in addition, as shown in Figure 5, can under the state that has wafer on the relative position of CCD camera 1, take yet.
Then, in step S104, the image information that obtains is stored in the storage area, jumps to step S200.In step S200, by in the image information that obtains the edge image of thimble front end being separated from background noise, thereby whether the edge image of judging the thimble front end is included in the image information.And, when judgement comprises the edge image of thimble front end (be), jump to step S202, when judgement was not (denying), the timer of in step S201 regulation moment T being used resetted, and made to handle to turn back to step S100.
In step S202, according to the above-mentioned image information that obtains, the actual coordinate of the outline portion of the edge image of calculating thimble front end, and, the area of the part that will be surrounded by the actual coordinate of this edge contour calculates as marginal information, and with its storage (marginal information generation unit).As the generation method of this marginal information, for example, based on the image information that obtains, utilize known profile to detect processing and be separated into background image and edge image, and, carry out known coordinate transform etc., export the edge image after the corrections such as inclination of thimble front end face.And,, the numeric data of representing the coordinate at thimble front end face edge is calculated as marginal information based on the edge image after this correction.
Then, jump to step S204, based on the marginal information of above-mentioned thimble front end face, searching, managing information form (threshold information memory cell) has judged whether to surpass defined threshold corresponding in the management information form.And, under the situation of the value that has surpassed pre-set threshold information, jump to step S206, in the display frame of semiconductor chip supplying device 10, display requirement is changed the notice (management information of thimble state deteriorating) (thimble judgement unit) of thimble 3.
As the threshold value here, for example, be set at the area of thimble 3 front end faces and the corresponding value of area of regulation, during more than or equal to predefined regulation area, carry out above-mentioned management notification of information at the area by the thimble front end face in the marginal information that obtains of identification photographed images.On the other hand, not surpassing under the situation of defined threshold (area), jump to step S208.
In step S208, judge whether to analyze requirement from guidance panel (not shown) input of operator's operation.And, imported in judgement and to have analyzed (being) when requiring, jump to step S300, judging (denying) when not being, return processing.In step S300, according to time dependent record based on the marginal information of storing before, generate the analysis data of thimble 3 front end faces, analysis data based on this generation, for example as the curve chart of the relation of expression service time of thimble and front end area, display analysis result on display returns to original processing then.
Below, to the action of this semiconductor chip supplying device with and the action effect of the thimble management devices that has describe.
At first, carry out common semiconductor chip at this semiconductor information supply equipment and supply with in the process of action, as shown in Figure 6, with semiconductor chip C conveying on absorptive table 13 (with reference to Fig. 1) of current supply.At this moment, backing-out punch 2 is kept out of the way in peristome 12 (with reference to Fig. 1), in addition, and pick-up head 4 standby above semiconductor chip C.
Then, utilize wafer fixed part 15 (with reference to Fig. 1) side below sticking tablet S to begin to attract, sticking tablet S is remained on the absorptive table 13, as shown in Figure 7, the backing-out punch of keeping out of the way in the peristome 12 (with reference to Fig. 1) 2 is risen, make the thimble 3 on this top run through sticking tablet S, with the back side jack-up of semiconductor chip C height to regulation.
Thus, the whole semiconductor chip C that pays on sticking tablet S that pastes in the back side is stripped from before.Under this state, roughly side by side pick-up head 4 is dropped to semiconductor chip C near surface from the top, by rising the shift action of stipulating once more behind this adsorption mouth 5 absorption semiconductor chip C.Then, backing-out punch 2 is kept out of the way in the peristome 12, removed the attraction of wafer fixed part 15, the semiconductor chip C that utilizes wafer loader 14 to supply with afterwards is transported on the absorptive table 13 from wafer storage portion 40.
Here, as mentioned above, thimble 3 is in repeatedly with semiconductor chip C jack-up, and the shape of its front end can produce distortion such as wearing and tearing or conquassation.That is, the action of common jack-up makes thimble 3 run through sticking tablet S and with semiconductor chip C jack-up, if but thimble 3 front ends produce distortion such as wearing and tearing or conquassation then can't run through sticking tablet S, semiconductor chip C can't be peeled off from sticking tablet S fully.Therefore,,, also cause the offset of semiconductor chip C, make and supply with the precision deterioration owing to the influence of sticking tablet S even then utilize the center of 5 couples of semiconductor chip C of adsorption mouth to adsorb if become above-mentioned state.
Here, the image of the thimble front end that the image unit of CCD camera 1 is caught, shown in Fig. 8 (A), since sharp-pointed at the situation lower front end 3a of new thimble 3, so the edge image of leading section 3a almost can't be discerned.Corresponding, wearing and tearing or conquassation and the thimble 3 that produces distortion are shown in Fig. 8 (B), because its leading section 3a produces distortion, so the area that is surrounded by the marginal portion of leading section 3a increases.
Utilize this situation, in this semiconductor chip supplying device 10, has control device 50 (thimble management devices), it can discern the deformation state of thimble 3, suitably carrying out above-mentioned thimble condition managing by this control device 50 handles, to shown in Figure 5, utilize the front end of 1 pair of thimble 3 of CCD camera to take as Fig. 4.
And, this control device 50 is according to captured image information, generate the marginal information of the front end shape of thimble 3, based on this marginal information and pre-set threshold information, automatically discern the wearing and tearing of thimble 3 front ends, the situation of distortion, can be to the operator notification management information of semiconductor chip supplying device 10.Thus, the operator can promptly discern distortion such as the wearing and tearing of thimble or conquassation.
Promptly, this control device 50, utilize above-mentioned thimble condition managing to handle, at image information from thimble front end 1 input of CCD camera, that observe from the top of thimble 3, the image processing of stipulating, the actual coordinate of edge calculation profile, and the area of the part that the actual coordinate by this edge contour can be surrounded calculates (step S202) as marginal information.And,,, then can directly notify (step S204,206) as management information with it if the wearing and tearing of thimble or distortion surpass defined threshold based on this marginal information that calculates and the information that is stored in the defined threshold in the management information form.
In addition,, then in the notice of the management information of thimble state, generate the essential analysis data, it can be presented at (step S208,300) in the display frame with curve chart etc. if send the analysis requirement from the guidance panel (not shown) of operator operation.Thus, owing to can analyze the variation in time etc. of the variable condition of data tracing thimble front end according to this, so can carry out tighter management.
Thus, in this semiconductor information supply equipment 10,, can improve the stability of supplying with precision owing to always can use the thimble 3 that is higher than certain quality.In addition, can carry out picking up of semiconductor chip C reliably, supply with reliability thereby improve.And, owing to needn't semiconductor chip supplying device 10 be stopped for front end that confirming thimble 3, so improved operating efficiency.In addition, by guaranteeing the quality of thimble 3, can reduce pressure to semiconductor chip C.
And, in this semiconductor chip supplying device 10,,, do not have cost burden so needn't append sensor special owing to can carry out the identification of thimble front end by existing hardware.In other words, except existing device, needn't append hardware such as sensor special, just can the deformation state of thimble front end be managed.
In addition, the thimble management devices of semiconductor chip supplying device involved in the present invention is not limited to above-mentioned execution mode, only otherwise break away from purport of the present invention, can carry out various distortion.
For example, in the above-described embodiment, as the CCD camera, be to describe, but be not limited thereto, so long as can discern semiconductor chip with the example that uses the CCD camera, and the equipment of image information that can obtain the thimble front end of its shooting gets final product, and can use various CCD cameras.For example, as imageing sensor, can use CMOS (having used the semi-conductive solid-state imager of complementary metal oxide film).
In addition,, show the general CCD camera that use is disposed for the upper surface of taking semiconductor chip, but also can be provided for taking the CCD camera of the special use of thimble front end as the CCD camera.
In addition, for example in the above-described embodiment, as marginal information and the threshold value of confirming the thimble front end, be that example with the area of setting the thimble front end describes, but being not limited thereto, as the marginal information and the threshold value of the state that is used to confirm the thimble front end, also can not be the area of thimble front end, but with the diameter of thimble front end as data, can obtain same effect by it is compared.
Claims (3)
1. semiconductor chip supplying device, it has backing-out punch, and this backing-out punch has thimble, and when the semiconductor supply chip, this thimble is characterized in that having with the back side jack-up of described semiconductor chip from sticking tablet:
Shooting part, it is configured to and can takes from the top to described thimble;
Image unit, it utilizes described shooting part that the front end of described thimble is taken, and generates the image information of the described thimble front end that photographs;
The marginal information generation unit, it generates the marginal information of the front end shape of described thimble according to described image information; And
The thimble judgement unit, it judges whether to need to change thimble based on described marginal information and pre-set threshold information.
2. semiconductor chip supplying device as claimed in claim 1 is characterized in that,
Described marginal information generation unit is obtained the area of the marginal portion of described thimble front end as described marginal information,
Described thimble judgement unit, when the value of the described marginal information that obtains surpasses the value of described threshold information, the notice of described thimble require is changed in output, and this threshold information is to make the area of described marginal portion of described thimble front end and the corresponding threshold value of area of regulation.
3. as claim 1 or 2 described semiconductor chip supplying devices, it is characterized in that,
Described shooting part is the CCD camera that the upper surface of above-mentioned semiconductor chip is taken.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009110780A JP2010262982A (en) | 2009-04-30 | 2009-04-30 | Needle management device for semiconductor chip supply device |
| JP2009-110780 | 2009-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101877324A true CN101877324A (en) | 2010-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101655708A Pending CN101877324A (en) | 2009-04-30 | 2010-04-30 | Semiconductor chip supplying device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2010262982A (en) |
| CN (1) | CN101877324A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878315A (en) * | 2017-05-15 | 2018-11-23 | 细美事有限公司 | The method for checking thimble |
| CN111394777A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Method for monitoring ejector pin ejection force for chip coating process |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6049221B2 (en) * | 2012-11-27 | 2016-12-21 | 富士機械製造株式会社 | Die supply device |
| CN109950179B (en) * | 2019-03-26 | 2021-11-09 | 佛山市劲电科技有限公司 | A integration sorting device that is used for damage prevention of chip processing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140497A (en) * | 1992-10-27 | 1994-05-20 | Hitachi Ltd | Pickup device |
| JP2002176079A (en) * | 2000-12-06 | 2002-06-21 | Seiko Epson Corp | Wafer prober with probe card inspecting-cleaning mechanism and probe card inspecting method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4101618B2 (en) * | 2002-07-17 | 2008-06-18 | シャープ株式会社 | Chip pickup method and chip pickup device |
-
2009
- 2009-04-30 JP JP2009110780A patent/JP2010262982A/en active Pending
-
2010
- 2010-04-30 CN CN2010101655708A patent/CN101877324A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140497A (en) * | 1992-10-27 | 1994-05-20 | Hitachi Ltd | Pickup device |
| JP2002176079A (en) * | 2000-12-06 | 2002-06-21 | Seiko Epson Corp | Wafer prober with probe card inspecting-cleaning mechanism and probe card inspecting method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878315A (en) * | 2017-05-15 | 2018-11-23 | 细美事有限公司 | The method for checking thimble |
| CN108878315B (en) * | 2017-05-15 | 2022-04-08 | 细美事有限公司 | Method for checking thimble |
| CN111394777A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Method for monitoring ejector pin ejection force for chip coating process |
| WO2021164115A1 (en) * | 2020-02-19 | 2021-08-26 | 深圳市海铭德科技有限公司 | Method for monitoring ejection force of ejector pin during chip film-plating process |
| CN111394777B (en) * | 2020-02-19 | 2022-02-22 | 深圳市海铭德科技有限公司 | Method for monitoring ejector pin ejection force for chip coating process |
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| Publication number | Publication date |
|---|---|
| JP2010262982A (en) | 2010-11-18 |
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Application publication date: 20101103 |