CN220556587U - Automatic correction device for mechanical arm - Google Patents
Automatic correction device for mechanical arm Download PDFInfo
- Publication number
- CN220556587U CN220556587U CN202321996784.9U CN202321996784U CN220556587U CN 220556587 U CN220556587 U CN 220556587U CN 202321996784 U CN202321996784 U CN 202321996784U CN 220556587 U CN220556587 U CN 220556587U
- Authority
- CN
- China
- Prior art keywords
- wafer
- mechanical arm
- distance
- optical
- analysis unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012937 correction Methods 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 60
- 230000003287 optical effect Effects 0.000 claims abstract description 59
- 238000004458 analytical method Methods 0.000 claims abstract description 20
- 238000004364 calculation method Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000009471 action Effects 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 56
- 238000010586 diagram Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011326 mechanical measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to an automatic correction device for a mechanical arm, which mainly comprises the mechanical arm, wherein an optical photographing mechanism is arranged on the mechanical arm, a wafer storage mechanism is arranged on one side of the mechanical arm, an image information code is arranged on the wafer storage mechanism, the optical photographing mechanism is connected with an optical identification module in an information way, and an information code analysis unit, an object distance analysis unit and a wafer center analysis unit are arranged in the optical identification module. Therefore, a user can shoot an image information code through the optical photographing mechanism to perform the first position correction action of the mechanical arm, then the optical photographing mechanism shoots the wafer to perform focusing action, and the object distance analyzing unit is matched with the wafer center analyzing unit to calculate the distance between the mechanical arm and the wafer center point so as to achieve the second correction effect. Therefore, the quick and accurate correction action is achieved through the method.
Description
Technical Field
The present utility model provides an automatic correction device for a robot arm, which has rapid and accurate correction operation.
Background
Because the structure and fabrication of semiconductor wafers are quite precise, there is also a high demand for storage and transportation. When the wafers are stored, the special storage carrier is used for storing the wafers, so that the wafers are matched with various storage environments, such as vacuum storage or inert gas introduction storage. In addition to the direct carrying of the carrier, the wafer can be opened and taken out during the transportation, but when the wafer is taken out, a mechanical arm is often used for taking out and placing the wafer, so as to prevent the situation of breaking or damaging during the transportation.
However, before the mechanical arm is picked and placed, the distance between the mechanical arm and the wafer carrier is completely positioned, so that the picking and placing actions can be accurately performed, the positioning actions can be classified into automatic or manual modes, and if the mechanical arm is used for man-hour, the relevant distance information can be given to assist a user in performing the positioning actions of the mechanical arm by means of visual inspection or mechanical measurement. If the automated mechanical arm is in the picking and placing process, the mechanical arm can be correctly positioned by utilizing a plurality of sensors matched with various types of measurement.
If the positioning action is not accurate enough, various conditions can be generated when the mechanical arm is taken and placed, and the probability of defective products is improved. However, if the positioning operation is performed correctly, a plurality of sensors are required to cooperate with each other, which increases the cost of use.
Therefore, how to solve the above-mentioned common problems and disadvantages is the direction of research and improvement for the applicant of the present utility model and the related manufacturers in the industry.
Disclosure of Invention
In view of the above-mentioned drawbacks, the applicant of the present utility model has devised an automatic robot correction device that achieves a complete correction operation by a simple mechanism by collecting related data, evaluating and considering the related data through multiple parties, and continuously trying and modifying the related data with years of experience accumulated in the industry.
The main purpose of the utility model is that: the optical photographing mechanism is used to achieve simple and accurate correction effect.
To achieve the above object, the present utility model has a main structure comprising: the device comprises a mechanical arm, a wafer storage mechanism arranged at one side of the mechanical arm, an image information code arranged on the wafer storage mechanism, an optical photographing mechanism arranged on the mechanical arm, an optical identification module of the information connection optical photographing mechanism, an information code analysis unit arranged in the optical identification module, an object distance analysis unit arranged in the optical identification module and a wafer center analysis unit arranged in the optical identification module.
With the above structure, when a user needs to take out the wafer by using the mechanical arm, the mechanical arm can automatically perform the correction operation. Firstly, an image information code is shot by an optical shooting mechanism, and the image information code is analyzed by an information code analysis unit to obtain relevant position information, so that the mechanical arm can perform a first correction operation.
When the first correction operation is performed, the approximate position of the wafer storage mechanism can be known, and at the moment, the optical photographing mechanism is shot and focused on the wafer in the wafer storage mechanism, and then the object distance analyzing unit can be utilized to calculate the wafer distance between the optical photographing mechanism and the wafer through the focal length of the lens in the optical photographing mechanism and the distance between the lens and the photosensitive imaging position in the optical photographing mechanism. After the wafer distance is calculated, the distance between the mechanical arm and the wafer center point is calculated by utilizing the wafer center analyzing unit through the distance between the mechanical arm and the optical photographing mechanism, the wafer distance and the wafer width, so that the second correction action is achieved, the complete correction effect is achieved, and the wafer picking and placing action can be performed.
Therefore, the mechanical arm can quickly and accurately complete the correction action by utilizing the mode, and the correction action can be achieved by utilizing the shooting action only, so that the complete and quick correction action can be achieved with lower cost.
By means of the technology, the problem that the cost is high or the accuracy is poor in a common correction mode can be overcome, and the practical progress of the advantages is achieved.
Drawings
Fig. 1 is a perspective view of a preferred embodiment of the present utility model.
FIG. 2 is a block diagram of a preferred embodiment of the present utility model.
Fig. 3 is a schematic view of a photographing method according to a preferred embodiment of the utility model.
Fig. 4 is a schematic focal length diagram of a preferred embodiment of the present utility model.
FIG. 5 is a schematic diagram of a center calculation according to a preferred embodiment of the present utility model.
Fig. 6 is a perspective view of still another preferred embodiment of the present utility model.
FIG. 7 is a diagram illustrating warpage detection in accordance with another preferred embodiment of the present utility model.
Fig. 8 is a perspective view of a further preferred embodiment of the present utility model.
Fig. 9 is a schematic diagram of a pitch detection according to another embodiment of the present utility model.
Fig. 10 is a perspective view of another preferred embodiment of the present utility model.
Reference numerals:
mechanical arm..1.)
Warpage sensor, 11
Spacing sensor.. 12
Wafer storage mechanism..2.
Image information code 21
Optical photography mechanism..3
Optical recognition module group 4
Information code analysis unit.. 41
Object distance analysis unit..42
Wafer center resolution unit..43
Wafer
Vertical distance..x.
Distance..y.. Y
Wafer distance
Detailed Description
To achieve the above objects and advantages, the present utility model adopts the technical means and structures, and the features and functions of the preferred embodiments of the present utility model are described below in detail with reference to the accompanying drawings so as to be fully understood.
Referring to fig. 1 to 5, which are perspective views and central calculation diagrams of a preferred embodiment of the present utility model, the present utility model includes:
a robot arm 1, taking a robot arm 1 which can be controlled by a computer and is used for taking and placing and driving a wafer as an example;
a wafer storage mechanism 2 provided on one side of the robot arm 1, and taking a storage device for storing wafers as an example;
an image information CODE 21 provided on the wafer storing means 2, and taking QR CODE as an example;
an optical photographing mechanism 3 provided on the robot arm 1, the optical photographing mechanism 3 of the present embodiment being a camera using a Charge-coupled Device (CCD);
an optical recognition module 4 in information connection with the optical photographing mechanism 3 and the mechanical arm 1, and a processor connected with the optical photographing mechanism 3 and receiving photographed pictures is taken as an example;
an information code analysis unit 41 provided in the optical recognition module 4;
an object distance analysis unit 42 provided in the optical recognition module 4; and
The wafer center analyzing unit 43 provided in the optical recognition module 4, the information code analyzing unit 41, the object distance analyzing unit 42, and the wafer center analyzing unit 43 of the present embodiment are exemplified by software in the optical recognition module 4.
The above description can be used to understand the structure of the present technology, and according to the corresponding cooperation of the structure, the present technology can have the advantage of achieving rapid and accurate correction operation with low cost, and the detailed description will be described below.
The user can set the image information code 21 on the wafer storage mechanism 2 first, and when the wafer is to be clamped by the mechanical arm 1, the correction operation is needed first to accurately clamp the wafer in the wafer storage mechanism 2.
Thus, the optical photographing mechanism 3 is utilized to photograph the image information code 21, and the information code analyzing unit 41 in the optical recognition module 4 analyzes the image information code 21 to obtain the relevant position information (such as the relative direction of the wafer storage mechanism 2 to the mechanical arm 1), thereby performing the first correction operation.
When the first correction operation is performed, the approximate position of the wafer storing mechanism 2 can be determined, so that the wafer in the wafer storing mechanism 2 can be photographed by the optical photographing mechanism 3 again and focused on the wafer to be taken out. At this time, the object distance analyzing unit 42 can perform the calculation and analysis by using the thin lens imaging formula (1/o+1/i=1/f), which is a mathematical formula already existing at present.
The calculation method may be matched with the calculation method shown in fig. 4, wherein the distance between the lens in the optical photographing mechanism 3 and the focused object (wafer) is o, the distance between the lens in the optical photographing mechanism 3 and the photosensitive imaging position in the optical photographing mechanism 3 is i, the lens focal length of the optical photographing mechanism 3 is f, the lens focal length (f) of the optical photographing mechanism 3 is data known when the lens is installed or purchased, the distance (i) between the lens in the optical photographing mechanism 3 and the photosensitive imaging position in the optical photographing mechanism 3 is the distance known after focusing, so that the distance o between the lens in the optical photographing mechanism 3 and the focused object (wafer) can be calculated according to the above formula, and the lens is at the forefront end of the optical photographing mechanism 3, therefore the distance between the optical photographing mechanism 3 and the wafer can be directly used, and is defined as the wafer distance o in the present case.
After the wafer distance is calculated, the optical photographing mechanism 3 is directly installed as shown in FIG. 5Is disposed above the robot arm 1, so that the vertical distance x between the optical photographing mechanism 3 and the robot arm 1 can be directly known, and the wafer center analyzing unit 43 can calculate the vertical distance x by the trigonometric function (x) 2 +y 2 ＝o 2 ) The distance y from the robot arm 1 to the edge of the wafer (i.e. the position point where the optical photographing mechanism 3 focuses) is calculated, and since the radius (d) of the wafer is known before capturing, but it is not limited thereto, the radius (d) of the wafer may be read and obtained at the same time when the optical photographing mechanism 3 photographs the image information code 21 to obtain the relevant position information, and then transmitted to the wafer center analyzing unit 43. Thus, the distance between the mechanical arm 1 and the center point of the wafer can be obtained by adding the distance y between the mechanical arm 1 and the edge of the wafer and the radius (d) of the wafer, thereby achieving the second correction effect.
After twice correction, the mechanical arm 1 can automatically calculate the distance between the mechanical arm 1 and the center point of the wafer to perform clamping operation, and the whole correction process can be completed by only using the optical photographing mechanism 3 to match with the image information code 21 and then calculating through the optical identification module 4. Therefore, the effect of saving cost can be achieved through a simple structure, the whole action can be completed by shooting and performing related calculation, and the correction time and efficiency can be greatly improved.
Referring to fig. 6 and 7, a perspective view and a warpage detection schematic diagram of another preferred embodiment of the present utility model are shown, and it can be clearly seen that the embodiment is the same as the above embodiment, and only the warpage sensor 11 is disposed on the robot arm 1, and the warpage sensor 11 of the embodiment is exemplified by a laser sensor.
As can be seen from the above embodiment, the distance from the robot arm 1 to the center of the wafer is calculated, and the distance from the robot arm 1 to the bottom of the wafer storage mechanism 2 can be estimated by only increasing the radius of the wafer W one time, and if the measured length of the wafer W after the laser beam emitted from the warp sensor 11 rebounds is smaller than the above distance, it can be determined that the wafer W blocks the laser path of the warp sensor 11 due to the warp condition, thereby reducing the possibility of breaking due to touching the warp portion when the wafer W is clamped.
Referring to fig. 8 and 9, a perspective view and a schematic diagram of a distance detection according to another preferred embodiment of the present utility model are shown, and it can be clearly seen that the distance sensor 12 is only disposed on the robot arm 1, and the distance sensor 12 of the present embodiment is exemplified by a thin distance sensor.
When the robot arm 1 extends into the wafer storage mechanism 2 to perform the clamping operation, the distance between the robot arm and the upper and lower wafers W can be sensed by the distance sensor 12, so as to prevent the collision caused by too small distance.
Referring to fig. 10 in combination, a perspective view of another preferred embodiment of the present utility model is shown, and it can be clearly seen that the embodiment is the same as the above embodiment in size, and only the pitch sensor 12 and the warpage sensor 11 are provided on the robot arm 1.
Therefore, the mechanical arm 1 can have the effects of warp detection and space detection at the same time, so that the warp sensor 11 and the space sensor 12 can be arranged at the same time, and the safety of the mechanical arm in use is improved.
However, the foregoing description is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the scope of the utility model, and therefore all such modifications and equivalent arrangements as fall within the metes and bounds of the claims, are intended to be embraced by the appended claims.
Claims (5)
1. An automatic correction device for a mechanical arm is characterized by mainly comprising:
a mechanical arm;
the wafer storage mechanism is arranged on one side of the mechanical arm;
an image information code provided on the wafer storing mechanism;
the optical photographing mechanism is arranged on the mechanical arm;
the optical identification module is in information connection with the optical photographing mechanism and the mechanical arm;
the information code analysis unit is arranged in the optical identification module and can analyze the image information code to obtain relevant position information;
the object distance analysis unit is arranged in the optical identification module and is in information connection with the information code analysis unit, and the object distance analysis unit calculates the wafer distance between the optical photographing mechanism and the wafer in the wafer storage mechanism through the focal length of the lens in the optical photographing mechanism and the distance between the lens and the photosensitive imaging position in the optical photographing mechanism; and
And the wafer center analysis unit is arranged in the optical identification module and in information connection with the information code analysis unit, so that the distance between the mechanical arm and the wafer center point is calculated through the distance between the mechanical arm and the optical photographing mechanism, the wafer distance and the width of the wafer.
2. The robot arm automatic correction device according to claim 1, wherein a warp sensor is provided on the robot arm.
3. The robot arm automatic correction device according to claim 1, wherein a pitch sensor is provided on the robot arm.
4. The robot auto-correction device according to claim 1, wherein the object distance analysis unit performs the calculation and analysis by using a thin lens imaging equation.
5. The robot arm auto-correction device according to claim 1, wherein the wafer center analyzing unit calculates a distance between the robot arm and a wafer center point by calculating a trigonometric function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321996784.9U CN220556587U (en) | 2023-07-27 | 2023-07-27 | Automatic correction device for mechanical arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321996784.9U CN220556587U (en) | 2023-07-27 | 2023-07-27 | Automatic correction device for mechanical arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220556587U true CN220556587U (en) | 2024-03-05 |
Family
ID=90050823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321996784.9U Active CN220556587U (en) | 2023-07-27 | 2023-07-27 | Automatic correction device for mechanical arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220556587U (en) |
-
2023
- 2023-07-27 CN CN202321996784.9U patent/CN220556587U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102547106B (en) | Imaging device and formation method | |
| US20110149273A1 (en) | Method and system for measuring a focal length of an optical lens | |
| US20120013727A1 (en) | Cell characterization using multiple focus planes | |
| US8169531B2 (en) | System and method for automatically focusing an optical lens of an image measuring machine | |
| CN101170647B (en) | Method of detecting specific object region and digital camera | |
| US7826737B2 (en) | Image pickup apparatus and focusing method thereof | |
| CN103620341A (en) | Three-dimensional shape measuring device and robot system | |
| CN110561435A (en) | Method, device and system for guiding manipulator and upper computer | |
| CN116773532A (en) | Battery module detection method, device, server and storage medium | |
| JP2008130771A (en) | Component recognition method | |
| CN220556587U (en) | Automatic correction device for mechanical arm | |
| CN103247548A (en) | Wafer defect detecting device and method | |
| CN103808733A (en) | Focusing method of automatic optical detection device | |
| JP2005025417A (en) | Optical information reading device | |
| CN109040724B (en) | Light spot distortion detection method and device of structured light projector and readable storage medium | |
| TWI848391B (en) | Automatic correction device and method for robotic arm | |
| JP3243956U (en) | Robot arm automatic correction device | |
| US20080008381A1 (en) | Coordinate acquisition apparatus for test of printed board, and coordinate acquisition method and program for test thereof | |
| TWI395047B (en) | Automatic focusing method and image capture apparatus using the same | |
| TWI808357B (en) | Inspection method of semiconductor components | |
| CN111447366B (en) | Transportation method, transportation device, electronic device, and computer-readable storage medium | |
| TWM647028U (en) | Automatic correction device of robotic arm | |
| CN112722498B (en) | Automatic two-dimensional code mounting system | |
| EP2339317A2 (en) | Method and System for Evaluating Light Uniformity Through an Optical Lens | |
| TWI449119B (en) | Circuit board placement method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |