TWI808357B - Inspection method of semiconductor components - Google Patents

Abstract

A detection device for a semiconductor element, the semiconductor element is suitable for being accommodated in a carrier plate defining a plurality of accommodating grooves, the detection device for the semiconductor element includes a light source unit for emitting a detection light extending along a straight line and passing through a plurality of semiconductor elements, a shooting unit suitable for being arranged at a height interval with the carrier plate, and an analysis unit connected to the shooting unit and detecting the semiconductor elements according to the detection light in the detection image. The present invention also provides a method for testing a semiconductor component, which is to prepare the testing device of the semiconductor component in a preparatory step, use the detection image captured by the shooting unit in an image capturing step, and then determine whether the semiconductor components are accurately placed in the accommodating grooves in an analysis step according to the detection light in the detection image.

Description

Inspection method of semiconductor components

The invention relates to a detection method, in particular to a detection method of a semiconductor element.

Referring to FIG. 1 , a plurality of wafers 2 are placed on a carrier plate 1 defining a plurality of accommodating grooves 100 . During the manufacturing process of the wafers 2 , the susceptor 1 not only serves the simple carrying and transporting function, but also can quickly confirm the quantity and macroscopic abnormalities when the wafers 2 are respectively placed in the holding tanks 100 .

However, most of the current methods for confirming the placement of the wafers 2 on the susceptor 1 are manually visually inspected, and when situations such as missing, overlapping, skewed, etc. are found, they are directly sorted and filled up manually, or even directly ignore a small amount of missing situations. Not only the accuracy and reliability are doubtful, but also the efficiency is very low.

Therefore, the purpose of the present invention is to provide a method that can quickly and accurately complete A testing device and testing method for semiconductor components for automatic testing.

Therefore, in the testing device for semiconductor components of the present invention, a plurality of semiconductor components are adapted to be accommodated on a carrier plate defining a plurality of accommodating grooves, and the containing grooves are arranged in an array along a straight line direction and a traveling direction perpendicular to each other.

The light source unit is used for emitting a detection light suitable for irradiating on the carrier plate, extending along the straight line and passing through a plurality of the semiconductor elements.

A height direction is defined which is perpendicular to the straight line direction and the traveling direction, and the photographing unit is adapted to be spaced apart from the carrier plate along the height direction, and is used to capture at least one detection image of the semiconductor elements irradiated by the detection light.

The analysis unit includes a processing module capable of performing image recognition on the at least one detection image, and judging whether the semiconductor elements are accurately placed in the accommodating grooves according to the detection light in the at least one detection image.

In addition, in the inspection method of the semiconductor element of the present invention, a plurality of the semiconductor elements are suitable for being accommodated on a carrier plate defining a plurality of accommodating grooves, and the accommodating grooves are arranged in an array along a straight line direction and a traveling direction perpendicular to the straight line direction. The detection method of the semiconductor element includes a preparatory step, an image-taking step, and an analysis step.

The preparatory step is to prepare an inspection device for the aforementioned semiconductor element of the present invention.

In the image capturing step, the light source unit emits the detection light suitable for irradiating the carrier plate, extending along the straight line, and passing through a plurality of the semiconductor elements, and the photographing unit captures at least one detection image of the detection light irradiating on the semiconductor elements.

The analysis step is to perform analysis according to the at least one detection image, and judge whether the semiconductor elements are accurately placed in the accommodating grooves according to the detection light in the at least one detection image.

The effect of the present invention is that when the detection light extending along the straight line irradiates the semiconductor elements, as long as any semiconductor element is not properly placed in the corresponding accommodating groove, compared with other semiconductor elements disposed along the straight line and correctly placed, there will be a drop along the height direction. At this time, the detection light on the detection image will also produce a drop difference. Therefore, the analyzing unit can analyze the at least one detection image to accurately and quickly know whether the semiconductor elements are respectively accurately placed in the accommodating grooves.

3: Light source unit

4: Shooting unit

5: Analysis unit

51: Processing module

52:Synthesis module

71: Preliminary steps

72: Image acquisition step

721: the first retrieval sub-step

722: the second extraction sub-step

73: Analysis steps

731:Synthetic substep

8: Semiconductor components

8a: Semiconductor components

8b: Semiconductor components

8c: Semiconductor components

8d: Semiconductor components

9: Carrying plate

90: storage tank

L: straight line direction

A: Direction of travel

H: height direction

P1: The first detection image

P2: The second detection image

Z1: image area

Z2: image area

α: included angle

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: FIG. 1 is a top view illustrating the situation of placing multiple wafers in multiple accommodating grooves of a carrier tray; Fig. 2 is a system configuration diagram, illustrates one of the first device embodiment of the detection device of semiconductor element of the present invention; Fig. 3 is a schematic diagram, illustrates one light source unit of this first device embodiment; Fig. 4 is a block flow chart, illustrates one of the first method embodiment of the detection method of semiconductor element of the present invention; Fig. 5 is a schematic diagram, illustrates the situation that uses this first device embodiment to carry out this first method embodiment; Example; FIG. 8 is a schematic diagram illustrating a first capture substep of an image-taking step of the second method embodiment, and a second capture substep; and FIG. 9 is a schematic diagram illustrating a synthesis substep of an analysis step of the second method embodiment.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to Fig. 2 and Fig. 3, it is one of the detection devices of the semiconductor element of the present invention. In one embodiment of the device, a plurality of semiconductor components 8 to be inspected are suitable for being accommodated on a carrier plate 9 defining a plurality of accommodating grooves 90 , and the accommodating grooves 90 are arranged in an array along a straight line direction L and a traveling direction A perpendicular to each other. The first device embodiment includes a light source unit 3 , a photographing unit 4 suitable for being spaced apart from the carrier plate 9 , and an analysis unit 5 connected to the photographing unit 4 .

The light source unit 3 is used for emitting a detection light suitable for irradiating on the carrier plate 9 , extending along the linear direction L and passing through the plurality of semiconductor devices 8 . Wherein, the detection light emitted by the light source unit 3 is laser light, and as shown in FIG. 3 , the angle α between the detection light and the carrier plate 9 is 15 to 25 degrees, preferably 20 degrees.

Define a height direction H that is perpendicular to the linear direction L and the traveling direction A at the same time. The photographing unit 4 is preferably a photosensitive coupling device (CCD) camera with a pixel size of 5472*3648, with an optical resolution between 20 and 30 microns, and is suitable for being spaced apart from the carrier plate 9 along the height direction H to capture multiple detection images of the semiconductor elements 8 irradiated by the detection light. The photographing range of the photographing unit 4 is mainly the range in which a row of semiconductor elements 8 arranged along the linear direction L can be photographed in accordance with the irradiation of the detection light.

The analysis unit 5 includes a device capable of performing image recognition on the detected images The processing module 51, specifically, the processing module 51 can be an arithmetic processor, capable of performing calculations required for image recognition such as alignment, binarization, grayscale, and the like.

Referring to FIG. 4 together with FIG. 2 , it is a first method embodiment of the inspection method for semiconductor components of the present invention. This first method embodiment includes a preparatory step 71 , an image capturing step 72 , and an analysis step 73 . Wherein, the preparatory step 71 is to prepare the first device embodiment, that is, the first method embodiment is executed in conjunction with the first device embodiment. In practice, the carrying tray 9 will move along the traveling direction A, that is, the preferred implementation of the first method embodiment is to automatically perform detection while the carrying tray 9 is moving along the traveling direction A on the production line to transport the semiconductor elements 8 .

The image capturing step 72 is to make the light source unit 3 emit the detection light adapted to irradiate the carrier plate 9 and extend along the linear direction L, and pass through a plurality of the semiconductor elements 8, and the photographing unit 4 takes a detection image of the detection light irradiating on the semiconductor elements 8.

The analysis step 73 is to perform analysis based on the detection image. As shown in FIG. 5, according to the detection light in the detection image, it can be seen that when the detection light is on the semiconductor elements 8a, 8b, compared with other semiconductor elements 8, there is a drop along the traveling direction A, that is, it can be judged whether the detection light is straight along the linear direction L. Therefore, according to the appearance of the detection light in the detection image, it can be judged whether the semiconductor elements 8 are accurately placed in the accommodating grooves 90 respectively.

Furthermore, in the process of the semiconductor manufacturing process described in this embodiment mode, Placement defects that are more likely to occur include common situations such as missing placement, lamination, warping, skewing, and reverse placement. Among them, for the situations of missed placement, lamination, and warping, that is, there are lower and higher cases along the height direction H, so as long as the normal image range is set in advance, as long as the image is low, it can be judged that it is missing, and if the image is high, it may be lamination or warping. When the placement is skewed, although there may not be a drop in the height direction H, since the semiconductor element 8 placed skewed does not correspond to the shape of the accommodating groove 90, the range of the detection light irradiated may change. Therefore, it can be used to judge the skewed placement, especially if there is a skewed placement and a drop in the height direction H, it will be judged to be abnormal. In addition, for the situation of reverse placement, since the front and back sides of the manufactured semiconductor element 8 will have different roughness, as long as the detection light has a relatively uneven slight fluctuation along the traveling direction A, it can be judged that there is a reverse placement.

Referring to FIG. 6 and FIG. 7 , it is a case of using a second device embodiment of a semiconductor device detection device of the present invention to execute a second method embodiment of a semiconductor device detection method of the present invention. Wherein, the difference between the second device embodiment and the first device embodiment is that the analyzing unit 5 further includes a synthesizing module 52 connected to the processing module 51 and used for superimposing two detection images. The difference between this second method embodiment and the first method embodiment is that the image taking step 72 includes a first sub-step 721 of capturing a first detection image when the detection light is at an initial position of the semiconductor components 8, and a step 721 where the detection light is at the same semiconductor components 8 along the traveling direction. When A is located at a subsequent position behind the initial position, the second capturing sub-step 722 of taking a second detection image.

What should be explained first is that in this second method embodiment, because the movement of the susceptor 9 is coordinated, the photographing unit 4 successively takes two pictures of the semiconductor devices 8 in the same row, so the interval time between the first capturing sub-step 721 and the second capturing sub-step 722 of the photographing unit 4, that is, the shooting interval of two inspection images, must be properly set in advance in accordance with the moving speed of the susceptor 9. In essence, the initial position and the subsequent position are just to make the detection light irradiate the semiconductor elements 8 of a specific row. As the carrier plate 9 moves, the successive positions are as long as the detection light is irradiated on the semiconductor elements 8 in the same row, and the relative positions between the detection light and the semiconductor elements 8 in the same row are different.

Referring to FIG. 8 and FIG. 9 in conjunction with FIG. 7, the analysis step 73 includes a synthesizing sub-step 731 of superimposing the first detection image P1 and the second detection image P2 using the synthesis module 52 on the basis of the part where the detection light is straight along the linear direction L to form a composite image. Specifically, the synthesis module 52 is a hardware part capable of performing synthesis operations in a computer, and a module composed of installed software capable of aligning and superimposing two detected images, and is essentially a non-physical module divided according to data processing modes.

In the analysis step 73, it is judged whether the detection light in the synthetic image is straight along the straight line direction L, and whether the detection light has a direction along the direction of travel. Change to A. Since the composite image has superimposed the part of the image where the detected light does not shift or fall, that is, to further highlight the degree of the detected light shift or fall on the same image using the "approximately normal" part as a reference. As shown in FIG. 9, corresponding to the warped semiconductor element 8c in FIG. 8, two straight lines spaced apart from each other appear in the corresponding image area Z1 in FIG.

To sum up, the inspection device and inspection method of the semiconductor element of the present invention can use the analysis unit 5 to analyze the image taken by the shooting unit 4 by irradiating the inspection light extending along the straight line direction L on the same row of semiconductor elements 8, and judge whether the inspection light has deviation, drop, change, etc. Therefore, can really reach the purpose of the present invention.

But what is described above is only an embodiment of the present invention, and should not limit the implementation scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope covered by the patent of the present invention.

3: Light source unit

4: Shooting unit

5: Analysis unit

51: Processing module

8: Semiconductor components

9: carrying plate

90: storage tank

L: straight line direction

A: Direction of travel

H: height direction

Claims (1)

A method for detecting a semiconductor element, wherein a plurality of semiconductor elements are suitable for being accommodated on a carrier plate defining a plurality of accommodating grooves, and the accommodating grooves are arranged in an array along a straight line direction and a traveling direction perpendicular to the straight line direction, the carrier plate moves along the moving direction, the semiconductor element testing method includes: a preparatory step, preparing a semiconductor component testing device, the semiconductor component testing device includes: a light source unit, used to emit a light suitable for irradiating on the carrier plate, extending along the straight line direction and passing through a plurality of semiconductor components Detecting light, a photographing unit defining a height direction perpendicular to the straight line direction and the traveling direction, the photographing unit is adapted to be spaced apart from the carrier plate along the height direction, and is used to photograph at least one detection image of the semiconductor components irradiated by the detection light, and an analysis unit, connected to the photographing unit, includes a processing module capable of performing image recognition on the at least one detection image, and judging whether the semiconductor components are respectively accurately placed in the accommodating slots according to the detection light in the at least one detection image, and a processing module connected to the processing module and composite module for superimposing two detection images; an image capturing step, causing the light source unit to emit the detection light suitable for irradiating the carrier plate and extending along the linear direction, and passing through a plurality of semiconductor elements, and the photographing unit photographs the detection light irradiated on the At least one detection image on the semiconductor components, wherein the imaging step includes a first capturing sub-step of capturing a first detection image when the detection light is at an initial position of the semiconductor components, and a second capturing sub-step of capturing a second detection image when the detection light is at a subsequent position of the same semiconductor components behind the initial position along the direction of travel; The synthesis sub-step of superimposing into a synthetic image is to judge whether the semiconductor elements are respectively accurately placed in the accommodating slots according to whether the detection light in the synthetic image is straight along the straight line direction and whether the detection light has a change along the traveling direction.

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