CN101855679B - 透光性电磁波屏蔽构件的制造方法、光滤波器及图像显示装置 - Google Patents
透光性电磁波屏蔽构件的制造方法、光滤波器及图像显示装置 Download PDFInfo
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- CN101855679B CN101855679B CN2008801158477A CN200880115847A CN101855679B CN 101855679 B CN101855679 B CN 101855679B CN 2008801158477 A CN2008801158477 A CN 2008801158477A CN 200880115847 A CN200880115847 A CN 200880115847A CN 101855679 B CN101855679 B CN 101855679B
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- 150000003512 tertiary amines Chemical class 0.000 description 1
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- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明的课题是提供可廉价制造透光性及导电性优异的透明导电性构件的方法。透明导电性构件的制造方法,其包含:(a)在透明基材上通过含还原剂的油墨进行图案印刷,形成含还原剂图案层的工序;其次,(b)在上述含还原剂图案层上,把含有通过还原能形成非电解镀敷催化剂的金属离子的金属离子溶液进行涂布,通过上述还原剂与金属离子的接触,还原该金属离子,形成非电解镀敷催化剂层的工序;然后,(c)在上述非电解镀敷催化剂层上,通过镀敷处理形成导电性金属层的工序。
Description
技术领域
本发明涉及作为在CRT、PDP、测定仪等显示部等上使用的透光性电磁波屏蔽构件的透明导电性构件的制造方法及采用该方法得到的透明导电性构件。详细地说,本发明涉及可廉价制造具有优异的透光性与电磁波屏蔽性的透明导电性构件的方法。
背景技术
目前,作为CRT、PDP、液晶显示器、测定仪等各种显示装置的透光性电磁波屏蔽构件、各种电子装置的透明电极、或透明面状发热体等的透明导电性构件的制造方法,提出了把导电性金属网状物粘贴在透明基材上的方法。然而,采用该方法时,为了得到充分的电磁波屏蔽效果,则产生全部显示画面亮度下降的问题。
另外,提出了在透明基材上采用蒸镀或溅射等形成ITO等透明导电膜的方法(专利文献1)。但是,采用该方法得到的透明导电性构件与透光性优异的金属网状物相比,导电性差。
也还提出了在透明基材上采用镀敷或蒸镀等形成金属薄膜时,采用光刻加工形成金属薄膜网状图案的方法(专利文献2)。但是,采用该方法得到的透明导电性构件,由于用蚀刻法除去导电性优异的大部分金属,既浪费又成本升高。
再有提出了在透明基材上用含非电解镀敷催化剂的膏印刷图案,在该方图案上采用镀敷法形成金属薄膜的方法(专利文献3)。但是,该方法中使用的含非电解镀敷催化剂的膏昂贵,采用该昂贵的膏印刷图案的方法时,不涉及镀敷反应的催化剂不得不发生浪费,既费功夫且成本又高。
专利文献1:特许第2633340号公报
专利文献2:特开2000-137442号公报
专利文献3:特许第3895229号公报
发明内容
本发明要解决的课题
本发明的课题是提供一种可廉价制造透光性及导电性优异的透明导电性构件的方法。
用于解决课题的手段
本发明人等为了解决上述课题进行悉心探讨的结果发现,在透明基材上采用含还原剂的油墨形成图案层后,在该图案层上涂布能形成非电解镀敷催化剂的金属离子的溶液,通过还原该金属离子,形成了已形成图案的非电解镀敷催化剂层,在该非电解镀敷催化剂层上,通过镀敷处理,形成导电性金属层,可极廉价制造透光性及导电性优异的透明导电性构件,完成本发明。
即,本发明涉及下列(1)~(9)中所示的透明导电性构件的制造方法:
(1)透明导电性构件的制造方法,该方法是制造具有透明基材与导电性金属层的透明导电性构件的方法,其特征在于,该方法包含下列工序(a)、(b)及(c):
(a)在透明基材上通过含还原剂的油墨进行图案印刷,形成含还原剂的图案层的工序;
(b)在上述含还原剂的图案层上,把含有通过还原形成非电解镀敷催化剂的金属离子的金属离子溶液进行涂布,通过上述还原剂与金属离子的接触,还原该金属离子,形成非电解镀敷催化剂层的工序;
(c)在上述非电解镀敷催化剂层上通过镀敷处理形成导电性金属层的工序。
(2)按照上述(1)中所述的透明导电性构件的制造方法,其中,上述还原剂是选自由Sn(II)及Fe(II)组成的组中的金属盐。
(3)按照上述(2)中所述的透明导电性构件的制造方法,其特 征在于,上述金属的盐选自由SnCl2、Sn(OH)2、及SnSO4来组成的组。
(4)按照上述(1)~(3)中任何一项所述的透明导电性构件的制造方法,其特征在于,含有通过还原形成非电解镀敷催化剂的金属离子的溶液,为选自由Ag、Au、Pd、Pt、及Rh组成的组中的金属的盐的溶液。
(5)按照上述(4)中所述的透明导电性构件的制造方法,其中,上述金属的盐的溶液为Pd(II)盐或Ag(I)盐的溶液。
(6)按照上述(5)中所述的透明导电性构件的制造方法,其特征在于,Pd(II)盐或Ag(I)盐的溶液为选自由PdCl2、PdBr2、Pd(CH3COO)2、CH3COOAg、AgNO3、及柠檬酸银(I)组成的组中的金属盐的水溶液。
(7)按照上述(1)~(6)中任何一项所述的透明导电性构件的制造方法,其特征在于,上述含还原剂的油墨含有粒状物。
(8)按照上述(1)~(7)中任何一项所述的透明导电性构件的制造方法,其特征在于,上述透明基材为聚对苯二甲酸乙二醇酯膜。
(9)光滤波器(滤光器,optical filter),其采用按照上述(1)~(8)中任何一项所述的方法制造的透明导电性构件。
(10)图像显示装置,其采用(9)中所述的光滤波器。
发明效果
按照本发明,为了在含形成图案的还原剂的油墨层上形成非电解镀敷催化剂层,与采用导电性膏通过蚀刻法形成格子状导电性薄膜时或在形成昂贵的非电解镀敷催化剂层后形成图案时相比,可不浪费昂贵的导电性膏或非电解镀敷催化剂,极廉价地制造透光性及导电性优异的透明导电性构件。
具体实施方式
本发明的透明导电性构件的制造方法,其特征在于,至少含有下列工序(a)、(b)及(c):
(a)在透明基材上通过含还原剂的油墨进行图案印刷,形成含还原剂的图案层的工序(含还原剂图案层形成工序);
(b)在上述含还原剂图案层上,把含有通过还原形成非电解镀敷催化剂的金属离子的金属离子溶液进行涂布,通过上述还原剂与金属离子的接触,还原该金属离子,形成非电解镀敷催化剂层的工序(非电解镀敷催化剂层形成工序);
(c)在上述非电解镀敷催化剂层上通过镀敷处理形成导电性金属层的工序(导电性金属层形成工序)。
1.工序(a):含还原剂的图案层形成工序
在本发明的工序(a)中,在透明基材上通过含还原剂的油墨进行图案印刷,形成含还原剂的图案层。
(1)透明基材
作为本发明中使用的透明基材,可以举出聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚萘乙二醇酯、聚对苯二甲酸乙二醇酯·异丁酸酯共聚物、酞酸·环己二甲醇·乙二醇共聚物等聚酯类树脂,尼龙6等聚酰胺类树脂,聚丙烯、聚甲基戊烯等聚烯烃类树脂,聚丙烯酸酯、聚甲基丙烯酸酯、聚甲基丙烯酸甲酯等丙烯酸类树脂,ABS树脂等苯乙烯类树脂,三乙酰基纤维素等纤维素类树脂,酰亚胺类树脂,聚碳酸酯等构成的膜。
其中,聚对苯二甲酸乙二醇酯、聚萘乙二醇酯等聚酯类膜,由于透明性、耐热性好,成本也便宜,使用是合适的,特别是聚对苯二甲酸乙二醇酯的膜是最合适的。
对透明基板的厚度未作特别限定,通常为10μm~1000μm左右,优选50μm~500μm左右的范围。当厚度过薄时,作为构件的强度过低,当过厚时从重量等考虑存在变成不适用的倾向。
(2)还原剂
作为本发明中使用的还原剂,只要是与能形成非电解镀敷催化剂 层的金属离子接触,该金属离子还原成金属而自己引起氧化反应的物质即可,而未作特别限定,例如,可以采用电化学性比Pb、Sn、Ni、Co、Zn、Ti、Cu等催化剂金属低的金属粒子,或Sn(II)、Fe(II)的盐等。
其中,优选的是采用选自由Sn(II)及Fe(II)组成的组的金属盐,优选的是采用Sn(II)的盐。
作为上述金属盐,可以举出氯化物、硫酸盐、草酸盐、醋酸盐等。更优选的可以举出氯化物或硫酸盐。作为特别优选的金属盐,可以采用选自由SnCl2及SnSO4组成的组中的金属盐。
(3)含还原剂的油墨
作为本发明中使用的含还原剂的油墨(下面称作“含还原剂油墨”),除上述还原剂外,还含有粘合剂树脂及溶剂。另外,在本发明的含还原剂的油墨中,除该粘合剂树脂及溶剂外,还可根据需要配合有机或无机粒子等粒状物、交联剂、其他添加剂等。作为其他添加剂,可以举出粘性调节剂、表面调节剂、分散剂等。
(i)粘合剂树脂
粘合剂树脂,是为了赋予上述油墨适于涂布方法的粘性,提高还原剂成分-透明基材间结合力而配合的。当配合量过少时,含还原剂的图案层的粘合性降低,当过多时,在非电解镀敷催化剂层形成后的镀敷处理工序,镀敷的析出性降低。
作为粘合剂树脂的种类,例如,可以举出聚酯类树脂、丙烯酸类树脂、醋酸乙烯酯、氯乙烯、PVA、PVB等乙烯类树脂、聚氨酯类树脂、聚酰亚胺类树脂、聚酰胺类树脂、酚醛树脂、苯氧基树脂、醇酸树脂等。
其中,优选的是聚酯类树脂或聚氨酯类树脂。作为聚酯类树脂的具体例子,可以举出聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚萘二甲酸乙二醇酯等。其中,特别优选的是聚对苯二甲酸乙二醇酯。
(ii)溶剂
含还原剂油墨的溶剂,是为了溶解粘合剂树脂,赋予该油墨流动性而配合的。适于涂布方法的具有干燥性的溶剂可用1种,或2种以上加以适当组合后使用。
作为所用的溶剂,例如,可以举出水、甲醇、乙醇、异丙醇等醇类,丙酮、甲乙酮、甲基异丁酮、环己酮等酮类,甲苯、二甲苯等芳香族烃类,乙二醇、乙二醇乙醚、乙二醇丁醚、二甘醇、二甘醇乙醚乙酸酯、乙二醇丁醚乙酸酯、丙二醇、丙二醇甲醚、丙二醇甲醚乙酸酯、二丙二醇甲醚等聚亚烷基醇类及其衍生物,乙酸乙酯、乙酸丁酯等乙酸酯类,γ-丁内酯、N-甲基吡咯烷酮、异佛尔酮、二甲基亚砜、二甲基甲酰胺、萜品醇、溶剂油等。
(iii)粒状物
粒状物是为了在涂膜表面形成凹凸,通过固定效果提高与导电性金属层的粘合性而添加的。
作为该粒状物的具体例子,例如,可以举出二氧化硅、氧化铝、二氧化钛、滑石、云母、高岭土、蒙脱石、粘土、硫酸钡、碳酸钙等无机物的粒子,或丙烯酸类聚合物粒子、聚氨酯粒子、聚苯乙烯粒子等有机物的粒子、炭黑等。
对粒状物的粒径未作特别限定,优选采用0.01μm~20μm范围的粒状物。当粒径小于0.01μm时,得不到固定效果,当大于20μm时,导电性金属层得不到均匀性,另外,有时产生厚度过厚时的问题。
(iv)交联剂
交联剂,是为了通过与粘合剂的交联或固化剂彼此的交联提高涂膜强度,提高涂膜粘合性的目的而配合的。例如,可以举出亚甲苯基二异氰酸酯、二苯基甲烷-4,4’-二异氰酸酯、六亚甲基二异氰酸酯、异佛尔酮二异氰酸酯等二异氰酸酯类及其嵌段体,正丁基化蜜胺树脂、异丁基化蜜胺树脂、丁基化尿素树脂、丁基化蜜胺尿素缩聚树脂等氨基树脂类、双酚A型环氧树脂、酚醛清漆型环氧树脂、甲酚清漆型环氧树脂类等环氧树脂类。另外,作为固化促进剂,可以举出二丁基锡二月桂酸酯、叔胺类及其盐、多元酸酐类、咪唑类、二氰基二酰胺、 蜜胺、苯并鸟粪胺、甲磺酸、对甲苯磺酸等。
(v)粘性调节剂
粘性调节剂,是为了防止图案沾污或防止图案垂挂而添加的。作为粘性调节剂,例如,可以举出热解二氧化硅、热解氧化铝、热解二氧化钛、有机膨润土、酰胺蜡类添加剂、加氢篦麻子油类添加剂、多元醇类添加剂、CMC、藻酸钠、聚丙烯酸钠等。
(vi)表面调节剂
表面调节剂,是为了调整油墨对基材的润湿性或调整涂膜的表面状态而配合的。作为表面调节剂,例如,可以举出丙烯酸聚合物类、硅酮类、氟类添加剂。
(vii)分散剂
分散剂,是为了提高油墨分散状态稳定性而配合的。例如,可以举出高分子表面活性剂等。
(viii)配合比
本发明中使用的含还原剂油墨中的还原剂含量,未作特别限定,优选的是相对含还原剂油墨中的固体成分总量为0.1~50重量%、更优选1~30重量%。当还原剂的含量过少时,在形成非电解镀敷催化剂层后的镀敷处理工序,镀敷的析出性降低,当过多时,含还原剂的图案层粘合性有时降低。
对粘合剂树脂的含量未作特别限定,优选相对于含还原剂油墨中的固体成分为5~90重量%,更优选20~70重量%,当粘合剂树脂的含量过少时,含还原剂的图案层粘合性降低,当过多时,在形成非电解镀敷催化剂层后的镀敷处理工序,镀敷的析出性有时降低。
对溶剂的含量未作特别限定,但优选对含还原剂的油墨总量为30~99重量%、更优选50~95重量%。当溶剂的含量过少时,粘度变得过高,印刷变得困难,当过多时,粘度变得过低,印刷有时变得困难。
对粒状物的含量末作特别限定,但优选的是相对含还原剂油墨中的固体成分总量为10~95重量%、更优选30~80重量%。当粒状物 的含量过少时,得不到导电性金属层与含还原剂的图案层粘合性的提高效果,当过多时,在形成非电解镀敷催化剂层后的镀敷处理工序,镀敷的析出性有时降低。
对交联剂的含量未作特别限定,但优选是相对含还原剂油墨中的粘合剂树脂的量与交联剂的总量为5~50重量%、更优选10~30重量%。当交联剂的含量过少时,得不到含还原剂的图案层与透明基材的粘合性提高效果,当过多时,未固化物有时使涂膜强度降低
对粘性调节剂的含量未作特别限定,但优选相对含还原剂油墨总量为0.05~20重量%、更优选0.1~10重量%。当粘性调节剂的含量过少时,得不到防止图案沾污或防止图案垂挂的效果,当过多时,失去流动性,印刷有时变得困难。
对表面调节剂的含量未作特别限定,但优选相对含还原剂油墨总量为0.01~10重量%、更优选0.05~5重量%。当含量过少时,得不到油墨的润湿性提高效果或表面状态的调节效果,当过多时,在形成非电解镀敷催化剂层后的镀敷处理中,镀敷的析出性有时降低。
对分散剂的含量未作特别限定,但优选相对含还原剂油墨中的粒状物为10~200重量%、更优选30~150重量%。当分散剂的含量过少时,油墨的分散状态变差,当过多时,在形成非电解镀敷催化剂层后的镀敷处理中,镀敷的析出性有时降低。
(4)含还原剂图案层的形成
在本发明的工序(a)中,在透明基材上,把上述含还原剂油墨印在所希望的图案上,通过干燥溶剂成分形成含还原剂的图案层。作为印刷法,可以举出平面胶版印刷、凹版胶版印刷、照相凹版印刷、丝网印刷、柔性版印刷(flexographic printing)等。在各种印刷法中,可以采用现有的公知方法。
上述印刷方法中,丝网印刷、照相凹版印刷是优选的。当采用丝网印刷时,作为掩蔽剂用的乳剂厚度优选1~30μm。
在使溶剂成分干燥的工序中作为优选的干燥条件是,干燥温度 20~150℃、干燥时间:5秒~60分钟。
这样得到的含还原剂的图案层的厚度未作特别限定,但优选0.5~15μm。另外,含该还原剂的图案层的图案,可采取条纹状或网状的形状,例如,把三角形、四方形、六角形、八角形等多角形或圆形等多个组合而形成网状。
该图案层的宽度W,优选5~50μm,线与线之间的间隔为100~700μm是优选的。另外,为了消除导电性金属层形成后的波纹,也可施加偏压。当图案层2的宽度W低于5μm时,形成导电性金属层时,导电性不足,不能充分屏蔽电磁波,当宽度W大于50μm时,透光性降低。另外,当线与线之间的间隔低于100μm时,透光性有时降低。当大于700μm时,导电性有时变差。
2.工序(b):非电解镀敷催化剂层形成工序
在本发明的工序(b)中,在含上述还原剂的图案层上,涂布含有通过还原能形成非电解镀敷催化剂的金属离子的金属离子溶液,通过上述还原剂与金属离子的接触,还原该金属离子,形成非电解镀敷催化剂层。
(1)金属离子溶液
本发明中使用的金属离子溶液,含有通过还原能形成非电解镀敷催化剂的金属离子。作为通过还原能形成非电解镀敷催化剂的金属离子,可以举出Ag、Au、Pd、Pt、Rh等金属的离子。其中,特别优选的是Pd(II)、Ag(I)离子。
含这些金属离子的溶液,可以通过金属盐溶于溶液而得到。作为这些金属盐,可以举出氯化物、溴化物、醋酸盐、硝酸盐、柠檬酸盐等。具体的可以举出PdCl2、PdBr2、Pd(CH3COO)2等的Pd(II)盐、CH3COOAg、AgNO3、柠檬酸银(I)等Ag(I)盐、等等。
作为金属离子溶液中使用的溶剂,水是优选的。另外,上述金属离子溶液中的金属盐的浓度,因所用金属盐的种类而异,当采用PdCl2时,配合PdCl2使达到0.01~3g/l的浓度是优选的。另外,为了溶解 金属盐,同时配合盐酸是优选的。作为盐酸的配合比例,例如,35%的盐酸配合达到1~30ml/l左右是优选的。
另外,为了提高金属盐的溶解性,也可在上述金属离子溶液中添加氯化钠、氯化钾、溴化钠、溴化钾等碱金属盐。对这些盐的配合量未作特别限定,但配合达到0.1~10g/l的浓度是优选的。
(2)非电解镀敷催化剂层的形成
上述金属离子溶液,在上述工序(a)形成的含还原剂图案层上涂布,该金属离子溶液中含有的能形成非电解镀敷催化剂的金属离子通过与还原剂接触,该金属离子被还原,变成催化剂金属,在该图案层上形成非电解镀敷催化剂层(催化剂吸附处理)。
对金属离子溶液的涂布方法未作特别限定,可采用浸渍、喷雾等公知的任何一种方法。另外,催化剂吸附处理温度及处理时间未作特别限定,但优选金属离子溶液涂布后于10~100℃(优选30~60℃)静置10秒~60分钟(优选30秒~10分钟),通过金属离子与还原剂接触,金属离子与还原剂充分反应,金属离子被还原。
3.工程(c):导电性金属层形成工序
在本发明的工程(c)中,在上述非电解镀敷催化剂层上通过镀敷处理形成导电性金属层。
(1)镀敷处理
作为镀敷处理中使用的金属,可以采用通常的非电解镀敷处理中使用的铜(Cu)、镍(Ni)、金(Au)、银(Ag)、锡(Sn)、锌(Zn)、或这些的合金。
例如,可以使用非电解Cu镀敷浴、非电解Ni-P镀敷浴、非电解Ni-B镀敷浴、非电解Au镀敷浴等。
(2)导电性金属层
本发明的导电性金属层,为了在印刷了图案的含还原剂的图案层上形成的非电解镀敷催化剂层上形成,可仅在图案印刷部上选择形成。
导电性金属层的宽度W,优选5~50μm,线与线之间的间隔为100~700μm是优选的。另外,为了消除导电性金属层形成后的波纹,也可施加偏压。当导电性金属层2的宽度W低于5μm时,导电性不足,不能充分屏蔽电磁波,当宽度W大于50μm时,透光性降低。另外,当线与线之间的间隔低于100μm时,透光性有时降低。当间隔大于700μm时,导电性有时变差。
导电性金属层的厚度T优选0.1~15μm,并且满足1≤W/T≤500(金属层宽度W、金属层高度T)时,在与其他基材贴合时可以防止气泡的混入。当W/T小于1时,与其他基材贴合时,由于气泡的混入,透光性有时变差,当W/T大于500时,因导电性金属层本身的作用而透光性变差,最易引起导电性金属层的剥离。
因此,在用含还原剂的油墨印刷图案所形成的含还原剂的图案层上,通过催化剂吸附处理形成非电解镀敷催化剂层,然后,进行镀敷处理,在仅印刷部选择地进行的非电解镀敷层上,由于不浪费非电解镀敷催化剂,故大幅度地抑制制造成本。
4.其他工序
在本发明中,通过镀敷处理形成导电性金属层后,再对其进行热处理,提高与膜的粘接强度,或通过氧化或硫化加以黑色化,也可使粘接性或颜色发生变化。
另外,在本发明中,在通过该镀敷处理形成的导电性金属层上,也可根据需要采用镀敷等方法,重叠地形成同样的或其他金属层。
在镀敷时,可以使用通常采用的铜或镍,或这些的合金。另外,可进一步实施非电解镀敷提高导电性,或进一步使这些金属层氧化或硫化加以黑色化等,使导电性或颜色发生变化。通过使导电性金属层黑色化,可使膜的透明性提高。
实施例
下面,通过实施例更详细地说明本发明,但本发明不受这些实施例的限定。还有,以下的各实施例、比较例中得到的透明导电性膜, 用以下的方法进行评价。
(1)导电性金属层的高度T
切取膜的一部分,用切片机沿断面方向切成薄片,用激光显微镜(オリンパス株式会社制造,“LEXT OLS3000”)进行观察、测定。
(2)导电性金属层的宽度W
从透明导电性膜的金属层的面上,用激光显微镜(オリンパス株式会社制造,“LEXT OLS3000”)测定金属层的宽度。
(3)导电性
采用三菱化学株式会社制造的ロレスタAP(四端针法)进行测定。
(4)透过率
采用分光显微镜(大塚电子株式会社制造,MCPD2000),测定波长400~700nm的光(可见光)的透过率。
实施例1(丝网印刷)
(含还原剂的油墨的配制)
把SnCl21份、炭黑(东海カ一ボン制造,ト一カプラツク#5500)10份、聚酯树脂(东洋纺织制造,バイロン270)的30%环己酮溶液33.3份、环己酮25.7份的混合液,以珠粒研磨机进行分散,得到含还原剂的油墨。
(图案层的形成)
在厚度100μm的聚对苯二甲酸乙二醇酯(PET)膜(透光率92%,折射率1.55)表面上,把上述含还原剂的油墨,采用具有乳剂厚15μm、线宽20μm、线间隔200μm的正方形格子图案的的丝网版进行丝网印刷,形成含还原剂的图案层。
(催化剂吸附处理)
形成了图案层的膜,于含PdCl2:0.3g/l、35%HCl:3ml/l的水溶液中,于40℃浸渍2分钟后,通过水洗涤膜进行催化剂吸附处理。
(非电解镀敷处理)
在进行了非电解镀敷处理的膜表面上实施非电解镀敷(非电解镀敷液:奥野制药株式会社制造,OPC-750非电解铜M),得到透明导电性膜。
另外,采用非电解镀敷液(硫酸铜水溶液)实施铜镀敷处理,得到导电性金属层的宽度W为20μm、厚度T为5μm、W/T=4的本发明的透明导电性膜。另外,在该透明导电性膜表面涂布EVA类粘合剂,与具有防反射层的PET膜粘贴在一起。
实施例2(照相凹版印刷)
(含还原剂油墨的配制)
把含SnCl21份、炭黑(东海カ一ボン制造,ト一カプラツク#5500)10份、聚酯树脂(东洋纺织制造,バイロン270)的30%环己酮溶液33.3份、环己酮55.7份的混合液,用珠粒研磨机进行分散,得到含还原剂的油墨。
(图案层的形成)
在厚度100μm的聚对苯二甲酸乙二醇酯(PET)膜(透光率92%,折射率1.55)表面上,把上述含还原剂的油墨,采用具有线宽20μm、线间隔200μm、线深7μm的正方形格子图案的的照相凹版进行照相凹版印刷,形成含还原剂的图案层。
(催化剂吸附处理)
形成了图案层的膜,于含PdCl2:0.3g/l、35%HCl:3ml/l的水溶液中,于40℃浸渍2分钟后,用水洗涤膜进行催化剂吸附处理。
(非电解镀敷处理)
在进行了催化剂吸附处理的膜表面实施非电解镀敷铜(非电解镀敷液:奥野制药株式会社制造,OPC-750非电解铜M),得到透明导电性膜。
另外,采用电解铜镀敷液(硫酸铜水溶液)实施电解铜镀敷处理,得到导电性金属层的宽度W为20μm、厚度T为2μm、W/T=10的本发明的透明导电性膜。另外,在该透明导电性膜表面涂布EVA类粘 合剂,与具有防反射层的PET膜粘贴在一起。
比较例1(催化剂油墨印刷)
在厚度100μm的聚对苯二甲酸乙二醇酯(PET)膜(透光率92%,折射率1.55)表面上,把钯催化剂油墨,采用具有乳剂厚15μm、线宽20μm、线间隔200μm的正方形格子图案的的丝网版进行丝网印刷,得到含非电解镀敷催化剂的图案层。该膜采用与实施例1同样的方法实施非电解镀敷铜处理,得到导电性金属层的宽度W为20μm、厚度T为5μm、W/T=4的透明导电性膜。另外,在该透明导电性膜表面涂布EVA类粘合剂,与具有防反射层的PET膜粘贴在一起。结果汇总于表1。
[表1]
金属层宽 度W | 金属层高 度T | W/T | 导电性 | 透过率 | 制造成本 | |
实施例1 | 20 | 5 | 4 | 0.1Ω/□ | 80 | ○ |
实施例2 | 20 | 2 | 10 | 0.1Ω/□ | 80 | ○ |
比较例1 | 20 | 5 | 4 | 0.1Ω/□ | 80 | × |
产业上的利用可能性
按照本发明,可廉价制造透光性及导电性优异的透明导电性构件。采用本发明的方法制造的透明导电性构件,可用作CRT、PDP、液晶显示器、测定仪等各种显示装置的透光性电磁波屏蔽构件、各种电子设备的透明电极、透明面状发热体等。
Claims (12)
1.透光性电磁波屏蔽构件的制造方法,该方法是制造具有透明基材与导电性金属层的透光性电磁波屏蔽构件的方法,其特征在于,包含下列工序(a)、(b)及(c):
(a)在透明基材上通过含还原剂的油墨进行图案印刷,形成含还原剂图案层的工序;
(b)在上述含还原剂的图案层上,把含有通过还原能形成非电解镀敷催化剂的金属离子的金属离子溶液进行涂布,通过上述还原剂与金属离子的接触,还原该金属离子,形成非电解镀敷催化剂层的工序;
(c)在上述非电解镀敷催化剂层上,通过镀敷处理形成宽度W为5~50μm、厚度T为0.1~15μm、线与线之间的间隔为100~700μm、且满足1≤W/T≤500的导电性金属层的工序。
2.按照权利要求1中所述的透光性电磁波屏蔽构件的制造方法,其中,上述还原剂是选自由Sn(II)及Fe(II)组成的组中的金属的盐。
3.按照权利要求2中所述的透光性电磁波屏蔽构件的制造方法,其特征在于,上述金属的盐选自由SnCl2、Sn(OH)2、及SnSO4组成的组。
4.按照权利要求1所述的透光性电磁波屏蔽构件的制造方法,其中,含有通过上述还原能形成非电解镀敷催化剂的金属离子的溶液,为选自由Ag、Au、Pd、Pt、及Rh组成的组中的金属的盐的溶液。
5.按照权利要求4中所述的透光性电磁波屏蔽构件的制造方法,其中,上述金属的盐的溶液为Pd(II)盐或Ag(I)盐的溶液。
6.按照权利要求5中所述的透光性电磁波屏蔽构件的制造方法,其特征在于,上述Pd(II)盐或Ag(I)盐的溶液,为选自由PdCl2、PdBr2、Pd(CH3COO)2、CH3COOAg、AgNO3、及柠檬酸银(I)组成的组中的金属盐的水溶液。
7.按照权利要求1所述的透光性电磁波屏蔽构件的制造方法,其特征在于,上述含还原剂的油墨含有粒状物。
8.按照权利要求1所述的透光性电磁波屏蔽构件的制造方法,其特征在于,上述透明基材为聚对苯二甲酸乙二酯膜。
9.按照权利要求1所述的透光性电磁波屏蔽构件的制造方法,其中,透明基材为由选自聚酯类树脂、聚酰胺类树脂、聚烯烃类树脂、丙烯酸类树脂、苯乙烯类树脂、纤维素类树脂、酰亚胺类树脂及聚碳酸酯的材料构成的膜。
10.按照权利要求1所述的透光性电磁波屏蔽构件的制造方法,其特征在于,通过选自平面胶版印刷、凹版胶版印刷、照相凹版印刷、丝网印刷、柔性版印刷的印刷方法进行上述工序(a)中的图案印刷。
11.光滤波器,其采用按照权利要求1所述的方法制造的透光性电磁波屏蔽构件。
12.图像显示装置,其采用权利要求11中所述的光滤波器。
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JP5022501B2 (ja) * | 2010-11-04 | 2012-09-12 | 株式会社日本表面処理研究所 | 成形回路部品の製造方法 |
JP5835947B2 (ja) * | 2011-05-30 | 2015-12-24 | セーレン株式会社 | 金属膜パターンが形成された樹脂基材 |
JP5069365B1 (ja) * | 2011-06-30 | 2012-11-07 | 清二 加川 | 近傍界ノイズ抑制フィルム |
CN105121700B (zh) * | 2013-04-12 | 2018-05-25 | 世联株式会社 | 立体导电图案结构体的制造方法及用于其的立体成型用材料 |
CN105934802B (zh) * | 2014-01-28 | 2018-04-17 | 柯尼卡美能达株式会社 | 导电性图案、带导电性图案的基材、带导电性图案的基材的制造方法、在表面具有导电性图案的结构体及该结构体的制造方法 |
US20150309600A1 (en) * | 2014-04-23 | 2015-10-29 | Uni-Pixel Displays, Inc. | Method of fabricating a conductive pattern with high optical transmission, low reflectance, and low visibility |
CN107041079A (zh) * | 2017-05-05 | 2017-08-11 | 北京工业大学 | 一种基于彩色喷墨打印技术的导电线路印刷工艺方法 |
JP6681114B2 (ja) * | 2018-09-11 | 2020-04-15 | 石原ケミカル株式会社 | 導電回路の作製方法及び導電回路 |
WO2020234162A1 (en) * | 2019-05-17 | 2020-11-26 | Fundación Cidetec | Light permeable metallic coatings and method for the manufacture thereof |
CN114269971A (zh) * | 2019-09-25 | 2022-04-01 | 富士胶片株式会社 | 镀敷液、镀敷套装、导电性基板的制造方法 |
US11346000B2 (en) * | 2019-12-03 | 2022-05-31 | Scodix Ltd. | Method for patterning a metal on a substrate and articles comprising same |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1721323A (zh) * | 2004-07-02 | 2006-01-18 | 三星Sdi株式会社 | 制备基底催化剂的方法及利用它制备碳纳米管的方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3873358A (en) * | 1971-11-26 | 1975-03-25 | Western Electric Co | Method of depositing a metal on a surface of a substrate |
BE791374A (fr) * | 1971-11-26 | 1973-03-01 | Western Electric Co | Procede pour realiser un depot metallique a la surface d'un substrat |
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
US4271224A (en) * | 1976-12-26 | 1981-06-02 | Dai Nippon Insatsu Kabushiki Kaisha | Transfer sheet with resist portions |
US4668533A (en) * | 1985-05-10 | 1987-05-26 | E. I. Du Pont De Nemours And Company | Ink jet printing of printed circuit boards |
JP2713054B2 (ja) * | 1992-09-28 | 1998-02-16 | 凸版印刷株式会社 | カラーフィルターの製造方法 |
JPH07235754A (ja) * | 1993-12-27 | 1995-09-05 | Mitsubishi Materials Corp | 微細パターンの形成方法およびペースト |
JP2000269109A (ja) * | 1999-03-16 | 2000-09-29 | Ibiden Co Ltd | 半導体製品加熱用ヒータ |
CA2449358A1 (en) * | 2001-06-04 | 2002-12-12 | Qinetiq Limited | Patterning method |
JP2003165938A (ja) * | 2001-12-03 | 2003-06-10 | Sumitomo Chem Co Ltd | ガラス印刷用インキ組成物 |
JP3895229B2 (ja) * | 2002-08-05 | 2007-03-22 | 住友大阪セメント株式会社 | 透明導電膜の製造方法およびこの方法により製造された透明導電膜 |
US20050006339A1 (en) * | 2003-07-11 | 2005-01-13 | Peter Mardilovich | Electroless deposition methods and systems |
JP2005243499A (ja) * | 2004-02-27 | 2005-09-08 | Fujitsu Ltd | フラットディスプレイパネルの電極形成方法 |
CN100466020C (zh) * | 2004-03-10 | 2009-03-04 | 住友大阪水泥股份有限公司 | 透明层叠体 |
JP4216751B2 (ja) * | 2004-03-25 | 2009-01-28 | 富士フイルム株式会社 | 導電性パターン形成方法及び導電性パターン材料 |
US20060024481A1 (en) * | 2004-07-29 | 2006-02-02 | Eastman Kodak Company | Jet printing of patterned metal |
JP2006269109A (ja) * | 2005-03-22 | 2006-10-05 | Meltex Inc | 導電回路とその形成方法および電子ディスプレイ装置 |
US7410893B2 (en) * | 2005-04-08 | 2008-08-12 | Hewlett-Packard Development Company, L.P. | System and method for depositing a seed layer |
JP2007031577A (ja) * | 2005-07-27 | 2007-02-08 | Fujifilm Corp | グラフトポリマーパターン材料、プラスチック材料、およびそれらの製造方法 |
JP5101026B2 (ja) * | 2005-11-04 | 2012-12-19 | 富士フイルム株式会社 | 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法 |
JP2008258293A (ja) * | 2007-04-03 | 2008-10-23 | Nippon Steel Chem Co Ltd | パターン化導体層の形成方法、回路基板の製造方法および回路基板 |
-
2007
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-
2008
- 2008-11-11 CN CN2008801158477A patent/CN101855679B/zh not_active Expired - Fee Related
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1721323A (zh) * | 2004-07-02 | 2006-01-18 | 三星Sdi株式会社 | 制备基底催化剂的方法及利用它制备碳纳米管的方法 |
Non-Patent Citations (2)
Title |
---|
JP特开2000-269109A 2000.09.29 |
JP特开2007-31577A 2007.02.08 |
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