CN101851060A - Apparatus for fixing substrate - Google Patents
Apparatus for fixing substrate Download PDFInfo
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- CN101851060A CN101851060A CN201010149246A CN201010149246A CN101851060A CN 101851060 A CN101851060 A CN 101851060A CN 201010149246 A CN201010149246 A CN 201010149246A CN 201010149246 A CN201010149246 A CN 201010149246A CN 101851060 A CN101851060 A CN 101851060A
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- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention relates to an apparatus for fixing a substrate, which makes the substrate deform to a desired shape and is fixable. A carrying plate (2) is mounted to cover a substrate supporting surface (15) of an attracting hole (12) and arranges pressure-reducing chambers (11a-11c) communicated with the attracting hole (12) to be a vacuum pump P in negative pressure; then, the inside of the pressure-reducing chambers (11a-11c) has a dissimilar negative pressure and the attractive force of the attracting hole (12) is locally dissimilar by adjusting the opening of adjusting valves (Va, Vb, Vc); the substrate is deformed to be attracted and fixed on the carrying plate (2). Here, in a viewpoint that the substrate is smoothly deformed to a desired shape, it is ideal that the thickness of the elastic porous member is in a range of 0.1-5mm; the elasticity of the elastic porous member is in a ranged of 10-25N/mm2; and the porosity of the elastic porous member is 20-50%.
Description
Technical field
The present invention relates to a kind of apparatus for fixing substrate, particularly relate to a kind of device with the negative-pressure adsorption fixing base.
Background technology
In the past, as the method for cutting off brittle substrates such as glass substrate or ceramic substrate, use presses on the brittle substrate that is fixed as smooth state by the sword of the cutter that will be made of diamond etc. and makes and relatively move, the line that formation is made of vertical slight crack, afterwards, make vertical slight crack all stretch the method for cutting off substrate according to the necessary shear strength that applies toward the thickness direction of substrate.In addition, recently, the method that forms line with laser beam irradiation also is used gradually.
Desire to make the vertical slight crack that constitutes line to deepen, the occasion of use cutter must increase the pressing force to substrate, and the occasion of use laser must increase the irradiation output or the delaying sweep speed of laser beam.Yet,, easily produce fine breach or shorten the work-ing life of slight crack and cutter in substrate if increase the pressing force of cutter.In addition, if increase the irradiation output of laser beam, may produce the damage that heating causes in substrate surface, if delaying sweep speed, working (machining) efficiency can reduce.
At this point, there is motion making the technology (for example with reference to patent documentation 1) of ruling under the state of curved substrate to deepen vertical slight crack.
[patent documentation 1] Japanese kokai publication hei 7-323384 communique
Yet, be to be formed with on the microscope carrier of specific curved surface to keep substrate in the motion technology, so must use microscope carrier respectively corresponding to the curved surface state of substrate.
Summary of the invention
The objective of the invention is to, providing and do not exchange microscope carrier can be shape and the fixable apparatus for fixing substrate of being hoped with base plate deformation just.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of apparatus for fixing substrate according to the present invention's proposition, possess: have base station, the elasticity porous member that is installed as covering aforesaid base plate seating surface that is formed with the substrate seating surface that attracts hole or attraction groove, the attraction means that make the inside generation negative pressure of aforementioned attraction hole or attraction groove, surface adsorption fixing base at aforementioned elasticity porous member, the negative pressure part that makes aforementioned attraction hole or attract the inside of groove to produce is different, so that the deformable of absorption fixed aforesaid base plate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid apparatus for fixing substrate, the thickness of wherein aforementioned elasticity porous member are the scope of 0.1～5mm.
Aforesaid apparatus for fixing substrate, the spring rate of wherein aforementioned elasticity porous member are the scope of 10～25N/mm2.
Aforesaid apparatus for fixing substrate, the void content of wherein aforementioned elasticity porous member are 20～50% scope.
Aforesaid apparatus for fixing substrate, the void content of wherein aforementioned elasticity porous member are 20～50% scope.
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, apparatus for fixing substrate of the present invention has following advantage and beneficial effect at least: with apparatus for fixing substrate of the present invention, the elasticity porous member is installed as the attraction means that cover the substrate seating surface that is formed with the attraction hole or attracts groove and the inside generation negative pressure that makes aforementioned attraction hole or attract groove is set, makes aforementioned attraction hole or attract the inside of groove to produce local different negative pressure.That is, owing to make the magnetism part that produces by aforementioned attraction hole or attraction groove different, so can be the shape of being hoped with surface adsorption fixed base plate deformation in the elasticity porous member.By this, needn't prepare a plurality of microscope carriers as in the past corresponding to each curve form.
In sum, the invention provides that not exchange microscope carrier can be shape and the fixable apparatus for fixing substrate of being hoped with base plate deformation just.The present invention has obvious improvement technically, and has tangible positively effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technique means of the present invention, and can be implemented according to the content of specification sheets, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the generalization longitudinal diagram of an embodiment of demonstration apparatus for fixing substrate of the present invention.
Fig. 2 is the orthographic plan of base station of the apparatus for fixing substrate of Fig. 1.
Fig. 3 uses Fig. 1 apparatus for fixing substrate to cut off the block diagram of the occasion of substrate for showing.
Fig. 4 is the stereographic map of an embodiment of the line of the use laser beam that shows the brittle substrate after the bending among the view 3B.
Fig. 5 is the generalization figure of the case of bending of the brittle substrate among demonstration Fig. 3 C.
1: base station 2: mounting plate (elasticity porous member)
S: stationary platen (apparatus for fixing substrate) 11a, 11b, 11c: underpressure chamber (attraction means)
12: attract hole 13: communicating pores
14: pipe connecting 15: the substrate seating surface
16: attract groove 50: brittle substrate
52: line 53: vertical slight crack
LB: laser beam Va, Vb, Vc: adjust valve
Embodiment
Reach technique means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of apparatus for fixing substrate, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Fig. 1 shows the generalization vertical cross section of an embodiment of apparatus for fixing substrate of the present invention.Stationary platen (apparatus for fixing substrate) the S rough segmentation that shows at this figure is base station 1 and 22 members of mounting plate (elasticity porous member).In the inside of base station 1 in the paper vertical direction being formed with 3 elongated underpressure chamber 11a～11c.Substrate seating surface 15 on base station 1 is formed with a plurality of attractions hole 12 with specific interval, these attract holes 12 be communicated in underpressure chamber 11a～11c one of them.In addition, be formed with communicating pores 13 respectively in the bottom surface of each underpressure chamber 11a～11c.At this communicating pores 13 another square end that a square end is connected in the pipe connecting 14 of vacuum pump P is installed.In the way of pipe connecting 14, be provided with and adjust valve Va, Vb, Vc.In addition, the underpressure chamber is not limited to 3.
Fig. 2 shows the orthographic plan of base station 1.In Fig. 2 A the substrate seating surface 15 of base station 1 in length and breadth alignment arrangements a plurality of attractions hole 12 is arranged.Certainly, attract the configuration in hole 12 to be not limited thereto.Produce identical magnetism in the attraction hole 12 that is communicated in identical underpressure chamber, as described later,, can make curved substrate by each underpressure chamber is changed magnetism and makes the attraction part of substrate different.Fig. 2 B forms at substrate seating surface 15 to attract groove 16 to replace attracting hole 12, also brings into play same action effect in the occasion of this kind example.
In Fig. 1, on the substrate seating surface 15 of base station 1, mounting plate 2 is installed.It is also harmless to establish adhesion agent layer between substrate seating surface 15 and mounting plate 2.This mounting plate 2 is to be made of porous member, comes the mild expansion of magnetism band in self-gravitation hole 12 to reach the surface of mounting plate 2.In addition, because mounting plate 2 has elasticity, so mounting is in the possibility that is deformed into of the crooked equal thickness direction of the substrate of mounting plate 2.
The local different mild expansion of magnetism band of desiring the hole of self-gravitation in the future 12 reaches the surface of mounting plate 2, and the void content of mounting plate 2 is that 20～50% scope is more satisfactory, and thickness is that the scope of 0.1～5mm is more satisfactory.In addition, desire easily and high precision is carried out the distortion that the bending etc. of substrate is hoped, spring rate is 10～25N/mm
2Scope more satisfactory, better is 18～22N/mm
2Scope.As this kind mounting plate, have the foaming amine ethyl formate rubber of continuous air bubbles or sintered porous matter resin etc. and can be suitable for using.In addition, have the occasion of the porous material of continuous air bubbles in use, the physical attractiveness that covers for the mounting plate 2 beyond the part that brittle substrate 50 is arranged in mounting does not take place more satisfactory.
At the stationary platen S of this kind formation, after the air of each underpressure chamber 11a～11c is discharged by pipe connecting 14 by vacuum pump P, underpressure chamber 11a～11c decompression, air sucks from attracting hole 12.By the decompression degree of adjusting underpressure chamber 11a～11c according to the aperture of adjusting valve Va, Vb, Vc, the 12 groups of suction pressure changes separately in the attraction hole that each underpressure chamber 11a～11c is communicated with can make the brittle substrate 50 that attracts to be fixed in mounting plate 2 be changed to the shape of being hoped.The number of underpressure chamber 11a～11c and indefinite, it is various making number how can make the change of shape of brittle substrate 50 more more.In addition, desire to make brittle substrate 50 to be deformed into concave shape or convex form needs 3 underpressure chamber at least.
Fig. 3 shows that the stationary platen S that is used in Fig. 1 demonstration cuts off the block diagram of the occasion of brittle substrate.Surperficial mounting brittle substrate 50 at the mounting plate 2 of stationary platen S.Afterwards, make vacuum pump P (in Fig. 1 diagram) starting (Fig. 3 A).Though vacuum pump can be located at each underpressure chamber 11a～11c respectively,, 1 vacuum pump be set and make toward pipe connecting 14 differences of each underpressure chamber 11a～11c more satisfactory from avoiding equipment enlarging, heavy quantized viewpoint.From the traffic attraction of each underpressure chamber 11a～11c is to adjust with the adjustment valve Va the way of being located at pipe connecting 14, Vb, Vc.
By make adjust valve Va big with the aperture of adjusting valve Vc, make the aperture of adjusting valve Vb little, than many from the traffic attraction of underpressure chamber 11b, it is bigger than the magnetism in the attraction hole 12 that is communicated in underpressure chamber 11b with the magnetism in the attraction hole 12 of underpressure chamber 11c to be communicated in underpressure chamber 11a from the traffic attraction of underpressure chamber 11a and underpressure chamber 11c.By this, brittle substrate 50 central parts on the mounting plate 2 are bent upwards and are convex form.
Secondly, the most outstanding part (crest line part) of the substantial middle portion of the brittle substrate 50 after bending is to substrate surface approximate vertical irradiating laser light beam LB (Fig. 3 B).Again simultaneously as shown in Figure 4, make hold after nozzle 37 is ejected to the laser beam irradiation zone as the water of cooling medium near.By to brittle substrate 50 irradiating laser light beam LB, with less than melt temperature in thickness direction heating brittle substrate 50, brittle substrate 50 is about to thermal expansions.At this moment, because the elasticity porous member of brittle substrate 50 by mild expansion be attracted,, and be center generation stress under compression with the point of irradiation so substrate deformation is suppressed and can't expand.After heating,, brittle substrate 50 is shunk produce tensile stress immediately with the surface of water cooling brittle substrate 50.By the effect of this tensile stress, be that starting point forms vertical slight crack 53 along cutting off preset lines 51 in brittle substrate 50 with not shown starting point slight crack.In addition, become convex form by making brittle substrate 50 be bent into line formation face side, in the line formation face generation tensile stress of brittle substrate 50, so the 53 easier formation of vertical slight crack.
By laser beam LB and cooling jet 37 are relatively moved according to cutting off preset lines 51, vertical slight crack 53 stretches and forms line 52 in brittle substrate 50 afterwards.In the occasion of this example, be to be fixed under the state of specific position, by stationary platen S being moved and brittle substrate 50 being moved at laser beam LB and cooling jet 37.Certainly, it is also harmless under the state of fixing brittle substrate 50 laser beam LB and cooling jet 37 to be moved.Or make brittle substrate 50 and laser beam LB and cooling jet 37 both sides move also harmless.
Laser beam LB is not particularly limited as used herein, and the degree of depth of the vertical slight crack that is formed by the material of brittle substrate 50 or thickness, desire etc. suitably decision get final product.Brittle substrate is the occasion of glass substrate, is fit to use the laser beam at big wavelength 9～11 μ m of the absorption of glass baseplate surface.This kind laser beam can be enumerated carbon dioxide laser.The shot shape to substrate of laser beam is more satisfactory at the elongated elliptical shape of the direction that relatively moves of laser beam, and the illumination length L of the direction that relatively moves is the scope of 10～60mm, and irradiating width W is that the scope of 1～5mm is more satisfactory.
Can enumerate water or alcohol etc. from the cooling medium of cooling jet 37 ejections.In addition, the brittle substrate 50 after use is cut off can not produce dysgenic scope, and it is also harmless to be added with additives such as interface promoting agent.The amount of blowing of cooling medium is generally the scope of 1～2ml/min.With the cooling of the substrate that carries out of cooling medium, from the viewpoint of chilling with the substrate of laser beam heating, so-called water notes (water jet) mode that water and gas (being generally air) are sprayed is more satisfactory.With cooling medium cooled zones is that the toroidal or the elliptical shape of major diameter 1～5mm degree is more satisfactory.In addition, cooled region is more satisfactory with the distance 5～30mm degree between the central point of relatively move direction rear, cooled region and the heating region that are formed on the laser beam heating region.
The relative moving speed of laser beam LB and cooling jet 37 is not particularly limited, and the degree of depth of the vertical slight crack 53 that is obtained by desire etc. suitably decision get final product.Generally make speed of relative movement slow more, the vertical slight crack 53 of formation is just dark more.Usually, relative moving speed is hundreds of mm/sec degree.
In addition, the formation of line 52 is not limited to utilize the irradiation person of laser beam LB, and it is also harmless certainly to use marking knife to form line 52.But be the occasion that a time step stretches the vertical slight crack 53 of line 52 with the irradiation of laser beam LB, but the simplification that forms the figure chopping up apparatus and more satisfactory of will also being used at the laser beam LB that an inferior step is used rule.
As above way, after brittle substrate 50 forms line 52, increase the aperture of adjusting valve Vb, reduce and adjust valve Va and the aperture of adjusting valve Vc.By this, from the traffic attraction of underpressure chamber 11b than many from the traffic attraction of underpressure chamber 11a and underpressure chamber 11c, the magnetism in attraction hole 12 that is communicated in underpressure chamber 11b is bigger than the magnetism in the attraction hole 12 that is communicated in underpressure chamber 11a and underpressure chamber 11c, and brittle substrate 50 central parts on the mounting plate 2 are bent into concave shape (with Fig. 3 C).
Afterwards, the line 52 of the brittle substrate 50 after bending irradiating laser light beam LB once again.As shown in Figure 5, become concave shape by the irradiation side that makes brittle substrate 50 be bent into laser beam LB, irradiation side and opposite sides at laser beam LB produce tensile stress, so even stretch toward the substrate thickness direction for the little brittle substrate 50 of linear expansivity also can make vertical slight crack 53 really.As long as vertical slight crack 53 extends to the opposite sides of brittle substrate 50 or near opposite sides, brittle substrate 50 just cuts off by this.Otherwise, during the opposite sides of vertical slight crack 53 no show brittle substrates 50,, vertical slight crack 53 is stretched gets final product along line 52 reirradiation laser beam LB.In addition, brittle substrate 50 is applied external stress cut off and also can because of necessary.
In addition, after brittle substrate 50 forms line 52, making line formation face by the pros and cons counter-rotating that makes brittle substrate 50 is downside, with the part irradiating laser light beam LB corresponding to line 52 of line formation face opposing face, the vertical slight crack 53 of line 52 is stretched.But so the step that must brittle substrate 50 be reversed in the method increase with Fig. 3 demonstration is more satisfactory from the edge line 52 irradiating laser light beam LB as shown in Figure 5 such as point of production efficiency.
The object that cuts off as above explanation is a brittle substrate, for example can enumerate glass substrate or ceramic substrate, single crystal silicon substrate, sapphire substrate etc.Apparatus for fixing substrate of the present invention for example can be fit to be used in panel such as liquid-crystal display and make the field.
With apparatus for fixing substrate of the present invention, different by making by the magnetism part that attracts the hole or attract groove to produce, can be the shape of being hoped with base plate deformation.By this, needn't prepare a plurality of microscope carriers as in the past, so be useful corresponding to each curve form.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (5)
1. apparatus for fixing substrate, possess: have base station, the elasticity porous member that is installed as covering aforesaid base plate seating surface that is formed with the substrate seating surface that attracts hole or attraction groove, the attraction means that make the inside generation negative pressure of aforementioned attraction hole or attraction groove, surface adsorption fixing base at aforementioned elasticity porous member is characterized in that:
The negative pressure part that makes aforementioned attraction hole or attract the inside of groove to produce is different, so that the deformable of absorption fixed aforesaid base plate.
2. apparatus for fixing substrate according to claim 1, the thickness that it is characterized in that wherein aforementioned elasticity porous member is the scope of 0.1～5mm.
3. apparatus for fixing substrate according to claim 1 and 2, the spring rate that it is characterized in that wherein aforementioned elasticity porous member is 10～25N/mm
2Scope.
4. apparatus for fixing substrate according to claim 1 and 2, the void content that it is characterized in that wherein aforementioned elasticity porous member are 20～50% scope.
5. apparatus for fixing substrate according to claim 3, the void content that it is characterized in that wherein aforementioned elasticity porous member are 20～50% scope.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-081253 | 2009-03-30 | ||
| JP2009081253A JP2010232603A (en) | 2009-03-30 | 2009-03-30 | Substrate fixing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101851060A true CN101851060A (en) | 2010-10-06 |
| CN101851060B CN101851060B (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010149246.7A Expired - Fee Related CN101851060B (en) | 2009-03-30 | 2010-03-30 | Apparatus for fixing substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010232603A (en) |
| KR (1) | KR101228977B1 (en) |
| CN (1) | CN101851060B (en) |
| TW (1) | TWI451523B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2010232603A (en) | 2010-10-14 |
| KR101228977B1 (en) | 2013-02-01 |
| CN101851060B (en) | 2014-04-16 |
| TWI451523B (en) | 2014-09-01 |
| KR20100109448A (en) | 2010-10-08 |
| TW201112351A (en) | 2011-04-01 |
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